KR101356297B1 - 접합 요소를 포함하는 감지 장치 - Google Patents

접합 요소를 포함하는 감지 장치 Download PDF

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Publication number
KR101356297B1
KR101356297B1 KR1020137013017A KR20137013017A KR101356297B1 KR 101356297 B1 KR101356297 B1 KR 101356297B1 KR 1020137013017 A KR1020137013017 A KR 1020137013017A KR 20137013017 A KR20137013017 A KR 20137013017A KR 101356297 B1 KR101356297 B1 KR 101356297B1
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South Korea
Prior art keywords
sensing
sensing device
junction
bonding
measuring device
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Expired - Fee Related
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KR1020137013017A
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English (en)
Korean (ko)
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KR20130072262A (ko
Inventor
브라이언 앨런 엥글
크리스 대니얼 와그너
매튜 잉코
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제너럴 일렉트릭 캄파니
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Assigned to 암페놀 코포레이션 reassignment 암페놀 코포레이션 권리의 전부이전등록 Assignors: 제너럴 일렉트릭 캄파니
Assigned to 암페놀 서모메트릭스 인코포레이티드 reassignment 암페놀 서모메트릭스 인코포레이티드 권리의 전부이전등록 Assignors: 암페놀 코포레이션
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00Measuring or testing not otherwise provided for
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007Fluidic connecting means
    • G01L19/0038Fluidic connecting means being part of the housing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08Protective devices, e.g. casings
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/04Means for compensating for effects of changes of temperature, i.e. other than electric compensation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/26Oils; Viscous liquids; Paints; Inks
    • G01N33/28Oils, i.e. hydrocarbon liquids
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/26Oils; Viscous liquids; Paints; Inks
    • G01N33/28Oils, i.e. hydrocarbon liquids
    • G01N33/2888Lubricating oil characteristics, e.g. deterioration

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Food Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
KR1020137013017A 2010-11-22 2011-11-22 접합 요소를 포함하는 감지 장치 Expired - Fee Related KR101356297B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/951,330 2010-11-22
US12/951,330 US8261618B2 (en) 2010-11-22 2010-11-22 Device for measuring properties of working fluids
PCT/US2011/061836 WO2012071409A1 (en) 2010-11-22 2011-11-22 Sensing device comprising a bonding element

Publications (2)

Publication Number Publication Date
KR20130072262A KR20130072262A (ko) 2013-07-01
KR101356297B1 true KR101356297B1 (ko) 2014-01-28

Family

ID=45401158

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137013017A Expired - Fee Related KR101356297B1 (ko) 2010-11-22 2011-11-22 접합 요소를 포함하는 감지 장치

Country Status (6)

Country Link
US (1) US8261618B2 (https=)
EP (1) EP2643672B1 (https=)
JP (2) JP2013543136A (https=)
KR (1) KR101356297B1 (https=)
CN (1) CN103314284B (https=)
WO (1) WO2012071409A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102261637B1 (ko) * 2020-01-14 2021-06-07 주식회사 현대케피코 압력센서 체결구조

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9658178B2 (en) 2012-09-28 2017-05-23 General Electric Company Sensor systems for measuring an interface level in a multi-phase fluid composition
US9538657B2 (en) 2012-06-29 2017-01-03 General Electric Company Resonant sensor and an associated sensing method
US9536122B2 (en) 2014-11-04 2017-01-03 General Electric Company Disposable multivariable sensing devices having radio frequency based sensors
US10914698B2 (en) 2006-11-16 2021-02-09 General Electric Company Sensing method and system
US9589686B2 (en) 2006-11-16 2017-03-07 General Electric Company Apparatus for detecting contaminants in a liquid and a system for use thereof
US8542023B2 (en) 2010-11-09 2013-09-24 General Electric Company Highly selective chemical and biological sensors
US10598650B2 (en) 2012-08-22 2020-03-24 General Electric Company System and method for measuring an operative condition of a machine
DE112013004129T5 (de) 2012-08-22 2015-05-21 General Electric Company Drahtloses System und Verfahren zum Messen einer Betriebsbedingung einer Maschine
US9027410B2 (en) * 2012-09-14 2015-05-12 Sensata Technologies, Inc. Hermetically glass sealed pressure sensor
US10684268B2 (en) 2012-09-28 2020-06-16 Bl Technologies, Inc. Sensor systems for measuring an interface level in a multi-phase fluid composition
WO2016134114A1 (en) 2015-02-18 2016-08-25 Ti Group Automotive Systems, Llc Level sensor
WO2017095619A1 (en) * 2015-12-01 2017-06-08 Maxim Integrated Products, Inc. Systems and methods for correcting lag between sensor temperature and ambient gas temperature
DE102017223177A1 (de) 2017-12-19 2019-06-19 Conti Temic Microelectronic Gmbh Druckmesseinheit und Anschlussbaueinheit für ein Kraftfahrzeug-Getriebe.
FR3119834B1 (fr) * 2021-02-17 2025-02-14 Cent Rech Archit Indu Nautiques Systeme generateur de portance et bateau muni d’un tel systeme

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001106545A (ja) 1999-07-30 2001-04-17 Hoya Corp ガラス基板、半導体センサの製造方法および半導体センサ
US7053493B2 (en) * 2004-08-27 2006-05-30 Fujitsu Limited Semiconductor device having stiffener
JP2008070241A (ja) 2006-09-14 2008-03-27 Epson Toyocom Corp 圧力センサ、及びその製造方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553623A (en) * 1978-06-22 1980-01-11 Nissan Motor Co Ltd Semiconductor pressure sensor
US4310357A (en) 1980-05-14 1982-01-12 Nippon Electric Glass Company, Limited Low temperature sealing glass
JPS6117925A (ja) * 1984-07-05 1986-01-25 Hitachi Ltd 圧力センサ
US4743302A (en) 1986-06-06 1988-05-10 Vlsi Packaging Materials, Inc. Low melting glass composition
JPH0355874Y2 (https=) * 1986-02-27 1991-12-13
JPS64432A (en) * 1987-06-23 1989-01-05 Hitachi Ltd Semiconductor pressure transducer
US5186055A (en) * 1991-06-03 1993-02-16 Eaton Corporation Hermetic mounting system for a pressure transducer
US5663109A (en) 1992-10-19 1997-09-02 Quantum Materials, Inc. Low temperature glass paste with high metal to glass ratio
US5334558A (en) 1992-10-19 1994-08-02 Diemat, Inc. Low temperature glass with improved thermal stress properties and method of use
SE516716C2 (sv) * 1994-04-14 2002-02-19 Mks Instr Tryckgivare för mätning av trycket hos en fluid
US5454270A (en) * 1994-06-06 1995-10-03 Motorola, Inc. Hermetically sealed pressure sensor and method thereof
JP2809385B2 (ja) * 1994-11-29 1998-10-08 信越ポリマー株式会社 半導体素子接続用配線基板および半導体素子接続構造
US7109842B1 (en) * 1998-12-07 2006-09-19 Honeywell International Inc. Robust fluid flow and property microsensor made of optimal material
US6401545B1 (en) * 2000-01-25 2002-06-11 Motorola, Inc. Micro electro-mechanical system sensor with selective encapsulation and method therefor
JP2001272295A (ja) * 2000-03-27 2001-10-05 Tadahiro Kato 圧力測定センサ
US20040043479A1 (en) * 2000-12-11 2004-03-04 Briscoe Cynthia G. Multilayerd microfluidic devices for analyte reactions
JP3728623B2 (ja) * 2001-03-02 2005-12-21 日本碍子株式会社 圧電/電歪膜型素子
JP2004071698A (ja) * 2002-08-02 2004-03-04 Hitachi Metals Ltd 半導体パッケージ
EP1642871B1 (en) 2003-06-27 2010-12-01 Yamato Electronic Co., Ltd. Lead-free glass material for use in sealing and, sealed article and method for sealing using the same
US7126255B2 (en) * 2004-04-05 2006-10-24 Ngk Insulators, Ltd. Piezoelectric/electrostrictive film-type device
US7141447B2 (en) * 2004-10-07 2006-11-28 Mks Instruments, Inc. Method of forming a seal between a housing and a diaphragm of a capacitance sensor
TWM264652U (en) * 2004-10-21 2005-05-11 Chipmos Technologies Inc Structure of image sensor package
JP2006147839A (ja) * 2004-11-19 2006-06-08 Ngk Insulators Ltd 圧電/電歪デバイス
JP4963159B2 (ja) * 2004-11-19 2012-06-27 日本碍子株式会社 圧電/電歪デバイス
US8069732B2 (en) * 2007-11-06 2011-12-06 Kulite Semiconductor Products, Inc. Ultra-miniature multi-hole probes having high frequency, high temperature responses
TW200949106A (en) 2008-05-20 2009-12-01 Tatung Co Lead-free sealing material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001106545A (ja) 1999-07-30 2001-04-17 Hoya Corp ガラス基板、半導体センサの製造方法および半導体センサ
US7053493B2 (en) * 2004-08-27 2006-05-30 Fujitsu Limited Semiconductor device having stiffener
JP2008070241A (ja) 2006-09-14 2008-03-27 Epson Toyocom Corp 圧力センサ、及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102261637B1 (ko) * 2020-01-14 2021-06-07 주식회사 현대케피코 압력센서 체결구조

Also Published As

Publication number Publication date
US8261618B2 (en) 2012-09-11
CN103314284A (zh) 2013-09-18
JP2017072587A (ja) 2017-04-13
US20120125115A1 (en) 2012-05-24
EP2643672B1 (en) 2019-10-30
WO2012071409A1 (en) 2012-05-31
EP2643672A1 (en) 2013-10-02
CN103314284B (zh) 2015-04-22
JP2013543136A (ja) 2013-11-28
KR20130072262A (ko) 2013-07-01

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