KR101350953B1 - Base unit of semiconductor testing device - Google Patents

Abstract

assignment
A base unit of a semiconductor test apparatus is provided, while supporting a contact load and providing a mechanism that does not interfere with the auto leveling operation.
Solution
A taper block formed on an upper side of the unit for fixing the probe card, the base unit main body and the base unit main body, which are disposed in a downward direction of the base unit main body and which can change the inclination with respect to the base unit main body, and which have slopes on both sides thereof; In the tapered block, a pair of plates that are linearly movable along the guide formed in the inclined direction of the tapered block, the pair of plates are connected to each other by elastic means, each plate is tapered with a stop means for the guide, A base unit of a semiconductor test apparatus, formed at a position in contact with an inclined surface of a block, and provided with rotation means rotating in a movement direction.

Description

BASE UNIT OF SEMICONDUCTOR TESTING DEVICE

 TECHNICAL FIELD This invention relates to the base unit of a semiconductor test apparatus. Specifically, It is related with the mechanism which supports the contact load received at the time of contact with a device under test.

In the manufacturing process of a semiconductor device, the semiconductor test apparatus is used in order to test the performance, a function, etc. of a semiconductor device. In the semiconductor test apparatus, a base unit mounted on a test head is connected to a probe card mounted on a prober to test a device under test (DUT: Device Under Test).

3 is a diagram schematically showing a configuration of a conventional base unit. In this drawing, the base unit main body 300 is held by a test head (not shown) located in the upper direction of the drawing, and the top plate 310 is attached to an unshown prober located in the lower direction of the drawing. It is maintained by

The ring 320 is a unit for fixing the detachable probe card 200 and is fixed to the top plate 310. On the upper surface of the ring 320, a tapered block 330 is formed in which a slope is formed in the left and right directions of the drawing.

The lower surface of the base unit main body 300 is provided with the wedge 350 which moves to the left and right between the base unit main body and the taper block 330 by the cylinder 340. As shown in FIG. The cylinder 340 and the wedge 350 are provided with one pair corresponding to the slope of the taper block 330, and the operation | movement of the cylinder 340 is the drive control part 360 based on the control signal from an external sequencer etc. Is carried out by

As shown in FIG. 3, when the wedge 350 is located in the center direction by the cylinder 340, the wedge 350 contacts the taper block 330 and the base unit main body 300, and the device to be tested and It is possible to support the contact load applied to the probe card 200 by the base unit main body 300 at the time of contact. Without this mechanism, as shown in FIG. 4, when a contact load is received, the probe card 200 is deformed, and the contact height of the probe card 200 is deformed, so that the probe card and the device under test cannot be contacted normally. do.

On the other hand, at the time of auto leveling of the probe card 200, as shown in FIG. 5, the wedge 350 is moved outward by the cylinder 340 so that the inclination of the top plate 310 may be changed. Thereby, the contact state of the wedge 350 and the taper block 330 is canceled | released, and the top plate 310 can move, and it can adjust the inclination. Here, as shown in FIG. 6, in order to make the device under test 212 mounted on the wafer chuck 211 and the probe card 200 parallel, the inclination of the top plate 310 is determined by the prober. It is an operation to adjust.

Japanese Unexamined Patent Publication No. 2010-50437

In the mechanism shown in FIG. 3, when the friction coefficient of the contact point of the taper block 330 and the wedge 350 is small, the wedge 350 will fall out when trying to support a contact load. On the other hand, when the friction coefficient of the contact point of the taper block 330 and the wedge 350 is large, the wedge 350 will not fall out at the time of auto leveling which needs to move the wedge 350 outward, and it will be smooth. This will interfere with the leveling operation. Therefore, the control of the coefficient of friction at the point of contact of the taper block 330 and the wedge 350 is important, but it is generally difficult to appropriately adjust the coefficient of friction.

In addition, when the inclination of the top plate 310 is changed by auto leveling, the top plate 310 and the base unit main body 300 do not become parallel, and the slope of the wedge 350 and the slope of the tapered block 330 coincide. There is also a problem that the contact load cannot be supported well.

Therefore, an object of the present invention is to provide a mechanism in which a base unit of a semiconductor test apparatus supports a contact load and does not interfere with the auto leveling operation.

In order to solve the above problems, the base unit of the semiconductor test apparatus of the present invention is fixed to the base unit main body and the probe card, which is disposed in the downward direction of the base unit main body and which can change the inclination with respect to the base unit main body. A tapered block formed on an upper portion of the unit and having slopes on both sides thereof, and a pair of plates linearly moved along a guide formed in an inclined direction of the tapered block in a lower portion of the base unit. The plates are connected to each other by elastic means, and each plate is provided with a stop means for the guide and a rotation means formed at a position in contact with a slope of the tapered block and rotating in the direction of movement. It is done.

Here, when changing the inclination with respect to the base unit main body of the unit which fixes the said probe card, the drive control part which cancels the said stop means and operates the said stop means after completion | finish of a change of inclination can be further provided.

In addition, the tapered block is in addition to the slopes on both sides, the slopes are formed in both directions perpendicular to each other, and in the lower portion of the base unit, linear movement is possible along the second guide formed in the direction orthogonal to the guides. Further comprising a pair of second plates, the pair of second plates being connected to each other by second elastic means, each plate comprising: a stop means for the second guide and a second of the tapered block It may be provided in the position which contacts the slope in the guide direction, and may be provided with the rotating means which rotates in the said moving direction.

According to the present invention, in the base unit of the semiconductor test apparatus, a mechanism is provided which supports a contact load and which does not interfere with the auto leveling operation.

BRIEF DESCRIPTION OF THE DRAWINGS The figure which shows typically the structure of the base unit of this embodiment.
2 is a diagram illustrating a state in the auto leveling operation of the base unit of the present embodiment.
3 is a diagram schematically showing a configuration of a conventional base unit.
4 is a view for explaining the problem when there is no mechanism by the cylinder and wedge.
Fig. 5 is a diagram showing a case where the wedge moves outward by a cylinder.
6 is a diagram for explaining an auto leveling operation;

Embodiments of the present invention will be described with reference to the drawings. FIG. 1: is a figure which shows typically the structure of the base unit in this embodiment. In this figure, the base unit main body 100 is held by an unshown test head located upward in the figure, and the top plate 110 is attached to an unshown prober located in the downward direction in this figure. It is maintained by

The ring 120 is a unit for fixing the detachable probe card 200 and is fixed to the top plate 110. On the upper surface of the ring 120, a tapered block 130 having a slope formed in the left and right directions of the present drawing is formed.

On the lower surface of the base unit main body 100, a linear guide 140 is formed in the inclined direction of the tapered block 130, and the pair of plates 150 linearly moving along the linear guide 140 in the left-right direction as shown in the drawing. ) Is provided.

Each plate 150 is connected by a tension spring 154 which is an elastic means, and stops with respect to the linear guide 140 and the linear guide block 151 for performing the movement along the linear guide 140. And a brake 152 functioning as a stop means to operate. The brake 152 can have a structure which fits a linear guide at the time of an operation by air drive, for example.

Moreover, each plate 150 is provided with the roller 153 which rotates in the moving direction of the plate 150 in the position which contacts the slope of the taper block 130. As shown in FIG. The roller 153 functions as a rotation means. The roller 153 can be, for example, wheel-shaped or cylindrical, but may be spherical or the like.

The operation of the brake 152 is performed by the drive control unit 160 based on a control signal from an external sequencer or the like. At the time of auto leveling, the drive control part 160 releases the brake 152, as shown in FIG. 2, and enables the plate 150 to move left and right. Since the pair of plates 150 are intended to move in the central direction by the tension springs 154, the rollers 153 always come into contact with the slopes of the tapered blocks 130.

The drive control unit 160 operates the brake 152 when the auto leveling ends, and fixes the plate 150 to the linear guide 140 so as not to move. When the probe card 200 is brought into contact with the device under test in this state, the contact load applied to the probe card 200 is also transferred to the base unit main body 100 through the roller 153 which is in contact with the tapered block 130. It can be supported so that deformation of the probe card 200 can be prevented.

According to the base unit of this embodiment, by using the roller 153 instead of the conventional wedge 350, the bad influence to the auto leveling by the friction of the wedge 350 and the taper block 130 can be eliminated. In addition, by releasing the brake 152, the auto leveling operation of the top plate 110 becomes possible, and by operating the brake 152, it is possible to support the contact load during contact between the probe card 200 and the device under test. It becomes possible.

In the state where the brake 152 is released, the roller 153 is always in contact with the slope of the tapered block 130 by the tension spring 154, so that it can follow the movement of the top plate 110, In addition, even when the base unit main body 100 and the top plate 110 are not parallel, a contact load can be supported by the base unit main body 100.

In addition, when the stopping force of the brake 152 is made constant, a larger contact load can be supported by smoothing the angle of the slope of the tapered block 130. In the above example, the contact load is transmitted in the direction of the base unit main body 100 at two points where the roller 153 is in contact with the tapered block 130 by using the left and right pair of plates 150. In addition, the inclined surface is also formed in the front-rear direction orthogonal to the left and right slopes of the tapered block, the linear guide is also formed in the front-rear direction orthogonal to the linear guide 140 and connected by a tension spring having the same configuration as the plate 150. By providing a pair of plates, a contact load is received at four points, and a larger contact load can be supported.

100 base unit
110 top plate
120 ring
130 tapered blocks
140 linear guides
150 plates
151 linear guide block
152 brake
153 roller
154 tension spring
160 drive control unit
200 probe cards
211 Wafer Chuck
212 device under test
300 base unit body
310 top plate
320 ring
330 taper block
340 cylinder
350 wedge
360 drive control

Claims (3)

A base unit body;
A tapered block disposed between the base unit main body and the probe card, the taper block including a plurality of first slopes connected to each other and capable of changing an inclination with respect to the base unit main body; And
A first guide disposed below the base unit body and facing the tapered block; And
A pair of first plates that can be linearly moved along the first guide and connected to each other by a first elastic means,
Each of the first plates comprising a first stop means for the first guide and a first rotation means in contact with the first slope of the tapered block and rotating as the first plate moves. Base unit. The method of claim 1,
And a drive control section for releasing said stop means when changing the inclination of said taper block with respect to said base unit main body and operating said stop means after completion of the change of the inclination. 3. The method according to claim 1 or 2,
The tapered block further includes a plurality of second slopes formed to be orthogonal to the plurality of first slopes,
A second guide disposed below the base unit main body and formed to be orthogonal to the first guide;
A pair of second plates that can be linearly moved along the second guide and connected to each other by a second elastic means,
Each of the second plates includes a stop means for the second guide and a second rotation means in contact with the second slope of the tapered block and rotating as the second plate moves. .

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