KR101338231B1 - Probe film, probe unit including the same, and manufacturing method of the same - Google Patents

Abstract

The embodiment of the present invention is a probe film mounted on a probe unit applying a test signal through an electrode pad of an object to be tested and provides the prove film comprises; a film layer; multiple bumps formed on one side of the film layer by corresponding to the electrode pad of the object to be tested; and a signal line which is formed on the other side of the film layer and is connected to one among the multiple bumps through a contact hole penetrating the film layer by corresponding to the multiple bumps.

Description

Probe film, probe unit including the same, and method for manufacturing the probe film {probe film, probe unit including the same, and manufacturing method of the same}

The present invention relates to a probe film, a probe unit including the probe film, and a method of manufacturing the same, and is used to conduct electrical property inspection on a semiconductor integrated circuit or a flat panel display before a packaging process. The present invention relates to a probe unit, a probe film connecting the electrode pad and the probe unit, and a method of manufacturing the probe film.

In general, a semiconductor integrated circuit is formed as a chip on a wafer and then becomes a semiconductor package through a packaging process. At this time, in order to improve the yield of the semiconductor package, it is common to conduct an electrical property test on the semiconductor integrated circuit in the form of a chip before packaging the semiconductor chip.

In addition, a flat panel display such as a liquid crystal display (LCD) or the like includes a flat panel display panel including a plurality of cells driven at respective luminance. That is, the flat panel display panel is a finished product through a packaging process. At this time, in order to improve the yield of the device, it is common to perform an inspection to check whether the flat panel is defective before modularizing the flat panel.

As described above, in the electrical characteristic inspection of the semiconductor chip or the flat panel display panel before the packaging process, the probe unit is electrically connected to the semiconductor chip or the flat panel panel to apply a test signal and recognize a response to the test signal. Probe units are mainly used.

Korean Laid-Open Patent Publication No. 10-2012-0015770 (name of the invention: a method of manufacturing a probe film for a probe block, publication: February 22, 2012) is electrically connected to each electrode pad of a semiconductor chip or a flat panel display panel. A probe unit equipped with a probe film is disclosed.

The conventional probe film includes a plurality of bumps in contact with each electrode pad to be inspected, and a signal line layer connected to the plurality of bumps, wherein the signal line layer extends from the plurality of bumps on the same surface as the plurality of bumps. It is formed in the form.

However, as the probe unit is driven, foreign matter or particles may be generated whenever the bump contacts the electrode pad. In this case, the signal line layer of the thin film exposed to the electrode pad together with the bump may be easily damaged by foreign matter or particles due to contact between the bump and the electrode pad. Therefore, the reliability of a probe film fell and there existed a problem of short lifetime.

An embodiment of the present disclosure can prevent the signal line layer from being easily damaged by foreign matter or particles that may occur whenever the bump contacts the electrode pad of the inspection object, and thus may improve reliability and lifespan. It provides a method for manufacturing, and a probe unit comprising a probe film.

In order to achieve the above object, an embodiment of the present application is a probe film mounted on the probe unit for applying a test signal for testing through the electrode pad of the inspection object, the film layer; A plurality of bumps formed on one surface of the film layer corresponding to the electrode pad to be inspected; And a signal line layer formed on the other surface of the film layer and connected to at least one of the plurality of bumps through contact holes penetrating through the film layer corresponding to the plurality of bumps. .

In addition, a method of manufacturing a probe film mounted on a probe unit applying a test signal for a test through an electrode pad to be inspected, the method comprising: providing a sacrificial substrate; Forming a plurality of bumps on one surface of the sacrificial substrate; Forming a film layer on one surface of the sacrificial substrate to cover the plurality of bumps; Forming a plurality of contact holes penetrating the film layer corresponding to the plurality of bumps; Forming a conductive layer on the film layer to cover the plurality of contact holes; Patterning the conductive layer to form a signal line layer connected to at least one of the plurality of bumps through the plurality of contact holes; And removing the sacrificial substrate to form the probe film.

In addition, a probe film prepared by the method for producing a probe film; A tension plate disposed on the signal line layer of the probe film; And it further provides a probe unit comprising a peak body for supporting the tension plate.

Probe film according to an embodiment of the present application is connected to at least one of the plurality of bumps through a contact hole formed in the film layer, a plurality of bumps formed on one surface of the film layer and the other surface of the film layer through the film layer And a signal line layer.

That is, the signal line layer is formed on one surface different from one surface on which a plurality of bumps are formed in the film layer. Therefore, when the plurality of bumps are in contact with the electrode pad of the inspection object, the signal line layer is covered by the film layer and is not directly exposed to the inspection object, unlike the plurality of bumps.

As a result, it is possible to prevent the signal line layer from being easily damaged by foreign matter or particles due to contact between the bump and the electrode pad to be inspected. Therefore, the reliability and lifespan of the probe film can be improved, and by using the probe unit equipped with the probe film, the test cost of the inspection object can be reduced.

1 is a perspective view of a probe unit according to an embodiment of the present disclosure.
Figure 2 (a) is a perspective view of A of Figure 1, Figure 2 (b) is a perspective view of the probe film of Figure 2 (a).
3 is a cross-sectional view taken along line II ′ of FIG. 2B.
Figure 4 is a flow chart showing a method of manufacturing a probe film according to an embodiment of the present application.
5A to 5E, 6A to 6D, 7A, 7B, 8A to 8C, 9A and 9B are process diagrams illustrating a method of manufacturing the probe film of FIG. 4.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "electrically connected" with another part in between . Also, when an element is referred to as "comprising ", it means that it can include other elements as well, without departing from the other elements unless specifically stated otherwise.

First, referring to FIGS. 1 to 3, a probe unit and a probe film mounted thereto according to an embodiment of the present application will be described in detail.

1 is a perspective view of a probe unit according to an embodiment of the present disclosure. 2 (a) is a perspective view of A of FIG. 1, and FIG. 2 (b) is a perspective view of the probe film of FIG. 2 (a). 3 is a cross-sectional view illustrating II ′ of FIG. 2B.

As shown in FIG. 1, the probe unit 100 according to an exemplary embodiment of the present disclosure is connected to an electrode pad of an inspection object (not shown), applies a test signal to the inspection object, and outputs an output signal according to the test signal. By detecting, it is used for the purpose of discriminating whether a test subject has normal electrical characteristics.

The probe unit 100 is mounted with a probe film (not shown) and is connected to an electrode pad of an inspection object through the probe film (not shown).

The probe unit 100 includes a tip portion 110 on which a probe film is mounted on the bottom surface. At this time, the tip portion 110 is easily exposed to the position where the probe unit 100 is disposed, and in the form including a side that is inclined to protrude so that the probe film can be fixed to the electrode pad of the inspection object at an appropriate physical pressure. Is done.

As shown in FIG. 2 (a), the tension plate 111 disposed on the mounted probe film 10 and the peak body 112 supporting the tension plate 111 are disposed on the lower surface of the tip portion 110. Include.

As shown in FIG. 2B, the probe film 10 is formed on the film layer 11, the plurality of bumps 12 formed on one surface of the film layer 11, and the other surface of the film layer 11. The signal line layer 13 is included. Here, each bump 12 has a spacing and a shape corresponding to the electrode pad to be inspected so as to contact the electrode pad to be inspected when the probe unit 100 is driven. For example, the plurality of bumps 12 may be arranged in the form of a matrix of 2 × n in the film layer 11.

3, the signal line layer 13 is connected to at least one of the plurality of bumps 12 through contact holes penetrating through the film layer 11 corresponding to the plurality of bumps 12. do. In exemplary embodiments, a pair of bumps 12 arranged side by side in one column may be commonly connected to one signal line layer 12.

In addition, the probe film 10 may further include an adhesive layer 14 interposed between the film layer 11 and the plurality of bumps 12 to attach the plurality of bumps 12 to the film layer 11. have.

In this case, the film layer 11 may be selected from a polyimide material, and the adhesive layer 14 may be selected from an epoxy material.

The bumps 12 and the signal line layer 13 are each formed of a conductive material. For example, the plurality of bumps 12 and the signal line layer 13 may be selected from any one of Ni, NiCo, NiFe, and NiW.

As such, the probe film 10 according to the exemplary embodiment of the present application includes a signal line layer 13 formed on one surface different from the plurality of bumps 12 of the film layer 11. Accordingly, since the signal line layer 13 is covered by the film layer 11 at the time when the bump 12 and the electrode pad to be inspected are in contact with each other, the signal line layer 13 is covered by the bump 12 and the electrode pad. It can be protected from foreign matter or particles, and can not be easily damaged.

Therefore, damage to the signal line layer 13 can be minimized, thereby improving the reliability and life of the probe film 10. In addition, when using the probe unit 100 equipped with the probe film 10 having improved reliability and lifespan, the test cost of the inspection object may be reduced.

Next, with reference to Figures 4, 5a to 5e, 6a to 6d, 7a, 7b, 8a to 8c, 9a and 9b, a method of manufacturing a probe film according to an embodiment of the present application It will be described in detail.

Figure 4 is a flow chart showing a method of manufacturing a probe film according to an embodiment of the present application. 5A to 5E, 6A to 6D, 7A, 7B, 8A to 8C, 9A, and 9B are process diagrams illustrating a method of manufacturing the probe film of FIG. 4.

As shown in FIG. 4, the method of manufacturing a probe film according to an exemplary embodiment of the present disclosure includes preparing a sacrificial substrate (S11), forming a plurality of bumps on one surface of the sacrificial substrate (S12), and a plurality of bumps. Forming a film layer on one surface of the sacrificial substrate to cover (S13), forming a plurality of contact holes penetrating the film layer corresponding to the plurality of bumps (S14), the film layer to cover the plurality of contact holes Forming a conductive layer in (S15), patterning the conductive layer to form a signal line layer connected to at least one of the plurality of bumps through the plurality of contact holes (S16), and removing the sacrificial substrate to remove the probe film Forming step (S17).

As shown in FIG. 5A, a sacrificial substrate 20 is provided. In this case, the sacrificial substrate 20 may be selected from a silicon material (Si). For example, the sacrificial substrate 20 may be a silicon wafer (S11).

As shown in FIGS. 5B and 5C, a plurality of bump via holes 31 corresponding to a plurality of bumps are formed on one surface of the sacrificial substrate 20. That is, the sacrificial substrate 20 is patterned to form a plurality of concave bump via holes 31 on one surface of the sacrificial substrate 20 to correspond to the plurality of bumps. Thus, a sacrificial substrate 21 patterned to include a plurality of bump via holes 21 is formed.

As shown in FIGS. 5D and 5E, a plurality of bumps 12 are formed by stacking conductive materials in the plurality of bump via holes 31 (S12). The conductive material may be selected from any one of Ni, NiCo, NiFe, and NiW.

In this case, although only a plurality of bumps 12 formed of a conductive material filled in the plurality of bump via holes 31 are illustrated in FIG. 5E, a plurality of bump via holes 31 are deposited to form a plurality of bumps 12. It is also possible to form the bump 12.

5B to 5E only illustrate forming a plurality of bumps 12 using the patterned sacrificial substrate 21. Alternatively, by using the photomask formed on the sacrificial substrate 20, It is also possible to form a plurality of bumps 12. That is, the photoresist material layer formed on the sacrificial substrate 20 is patterned to form a photomask including a plurality of bump via holes, and then a conductive material is stacked in the plurality of bump via holes. ) Can be formed.

Next, as shown in FIGS. 6A and 6B, the film layer 11 is formed on one surface of the sacrificial substrate 21 to cover the plurality of bumps 12 (S13).

For example, the film layer 11 may be selected from a polyimide material. In this case, the film layer 14 may be a sacrificial substrate 21 and a plurality of bumps 12 through an adhesive layer 14 formed on one surface thereof. ) May be attached. In this case, the adhesive layer 14 may be selected as an epoxy material.

As illustrated in FIGS. 6C and 6D, a plurality of contact holes 32 penetrating through the film layer 11 are formed corresponding to the plurality of bumps 12 (S14). The plurality of bumps 12 are at least partially exposed by the plurality of contact holes 32.

As shown in FIGS. 7A and 7B, a conductive layer (not shown) is formed in the film layer 11 to cover the plurality of contact holes 32 (S15), and then the conductive layer (not shown) is patterned. A signal line layer 13 connected to at least one of the bumps 12 is formed (S16). The conductive layer (not shown) may be selected from any one of Ni, NiCo, NiFe, and NiW.

In this case, each signal line layer 13 may be connected to a pair of bumps 12 arranged side by side in one column.

Subsequently, as illustrated in FIGS. 8A and 8B, the portion 21a of the patterned sacrificial substrate 21 is polished until the plurality of bumps 12 are exposed. In this case, a chemical mechanical polishing process (CMP) may be used to polish the portion 21a of the patterned sacrificial substrate.

As shown in FIG. 8C, the other part 21b of the patterned sacrificial substrate 21 remaining between the plurality of bumps 12 is removed. In this case, a part of the adhesive layer 14 attached to the other part 21b of the sacrificial substrate may also be removed.

As a result, all of the sacrificial substrates 21 are removed (S17).

9A and 9B, the probe film 10 including the film layer 11, the plurality of bumps 12, and the signal line layer 13 is manufactured.

The probe film 10 manufactured by the above process includes the signal line layer 13 formed on the other surface of the bump 12 of the film layer 11, and thus, between the bump 12 and the electrode pad. Damage to the signal line layer 13 due to foreign matter or particles due to contact can be minimized, thereby improving reliability and lifespan.

Probe unit 100 equipped with the probe film 10 can increase the replacement cycle of the probe film 10, it is possible to reduce the time and cost required for the test of the inspection object.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

100: probe unit 110: distal end
111: tension plate 112: peak body
10: probe film 11: film layer
12: bump 13: signal line layer
14: adhesive layer
20: sacrificial substrate 21: patterned sacrificial substrate
31: bump via hole 32: contact hole

Claims (13)

In the method for manufacturing a probe film mounted on a probe unit for applying a test signal for a test to the electrode pad of the inspection object,
Preparing a sacrificial substrate;
Forming a plurality of bumps on one surface of the sacrificial substrate;
Forming a film layer on one surface of the sacrificial substrate to cover the plurality of bumps;
Forming a plurality of contact holes penetrating the film layer corresponding to the plurality of bumps;
Forming a conductive layer on the film layer to cover the plurality of contact holes;
Patterning the conductive layer to form a signal line layer connected to at least one of the plurality of bumps through the plurality of contact holes; And
Removing the sacrificial substrate to form the probe film. The method of claim 1,
Forming the plurality of bumps
Forming a plurality of bump via holes corresponding to the plurality of bumps on one surface of the sacrificial substrate; And
Stacking a conductive material in the plurality of bump via holes to form the plurality of bumps. The method of claim 1,
In the step of forming the film layer,
And a method of manufacturing a probe film by attaching the film layer to one surface of the sacrificial substrate through an adhesive layer disposed between one surface of the sacrificial substrate and the film layer. The method of claim 3, wherein
The film layer is selected as the polyimide material,
The adhesive layer is a method of manufacturing a probe film is selected from the epoxy material. The method of claim 1,
Removing the sacrificial substrate is
Polishing the other surface of the sacrificial substrate until the plurality of bumps are exposed; And
Etching a portion of the sacrificial substrate remaining between the plurality of bumps. The method of claim 1,
In preparing the sacrificial substrate,
And the sacrificial substrate is selected from a silicon material. The method of claim 1,
In the forming of the plurality of bumps, the plurality of bumps are selected from any one of Ni, NiCo, NiFe, and NiW,
In the step of forming the signal line layer, the signal line layer is a method of manufacturing a probe film selected from any one of Ni, NiCo, NiFe and NiW. In the probe film mounted on the probe unit for applying a test signal for a test to the electrode pad of the inspection,
A film layer;
A plurality of bumps formed on one surface of the film layer corresponding to the electrode pad to be inspected; And
A signal line layer formed on the other surface of the film layer and connected to at least one of the plurality of bumps through a contact hole penetrating the film layer corresponding to the plurality of bumps,
And the plurality of bumps and the film layer are formed on a sacrificial substrate patterned to correspond to the plurality of bumps. The method of claim 8,
A probe film further comprising an adhesive layer interposed between the film layer and the plurality of bumps to attach the plurality of bumps to the film layer. The method of claim 9,
The adhesive layer is a probe film selected from the epoxy material. The method of claim 8,
And the film layer is selected from polyimide material. The method of claim 8,
The bumps and the signal line layer,
A probe film each selected from Ni, NiCo, NiFe, and NiW. In the probe unit for applying a test signal for a test to the electrode pad of the inspection object,
Probe film according to any one of claims 8 to 12;
A tension plate disposed on the signal line layer of the probe film; And
Probe unit including a peak body for supporting the tension plate.

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