KR101334907B1 - Mica heater and manufacturing method therof - Google Patents

Abstract

The present invention relates to a mica heater manufacturing method and a mica heater produced by the method, specifically, by allowing the lamination between the respective lines of the heating element in the mica heater manufacturing process to be laminated on the insulating plate, It does not need to go through the interval adjustment operation between the lines after lamination, the process is made quickly, and relates to a technology that can prevent the occurrence of temperature deviation due to the gap unevenness.
To this end,
A material preparation process for preparing a first insulating plate and a second insulating plate, a heating element, and an auxiliary film, and a first attaching the heating element to the surface of the auxiliary film, wherein the heating lines of the heating element are attached to the auxiliary film with a predetermined interval. Attaching step, a second attaching step of seating and attaching the heating element to the surface of the first insulating plate by moving the auxiliary film, separating step of separating the auxiliary film from the heating element, final lamination of the second insulating plate on the heating element It is characterized by including a lamination process.

Description

Mica heater and its manufacturing method {MICA HEATER AND MANUFACTURING METHOD THEROF}

The present invention relates to a mica heater and a method of manufacturing the same used for heating the wafer during the lamination and deposition of conductors or insulators in the manufacturing process of a semiconductor device, in particular the arrangement interval of the heating terminals in the process of manufacturing the mica heater It relates to a technology that can be produced in a constant state.

In general, in a semiconductor device manufacturing process, conductors such as gold, silver, and aluminum, and insulators such as spin-on-glass (SOG) are applied on a wafer.

This process is carried out through deposition or lamination in vacuum equipment, and in particular, in the deposition process, the temperature of the wafer must be heated and maintained at a certain level, but uniform deposition is performed on the wafer.

To this end, a separate heating device is installed inside the deposition equipment to heat the wafer to a certain level.The heating device includes a heater and an insulator with silicon rubber as an insulator and a resistance wire as a heating element. And a heater of one structure.

Among them, a heater using silicon rubber as an insulator has a disadvantage in that the maximum allowable wattage of power is excessively limited due to a structural problem that the surface heating temperature is high, but a heat dissipation structure must be sufficiently provided.

In addition, heaters using mica as an insulator have a small capacity change according to temperature and have high insulation resistance.

Such a mica heater has a structure arranged in a zigzag form or the like between mica plates in which line-like heating elements are stacked.

At this time, the distance between each line constituting the heating element and the arrangement angle must be constant so that the heating of the mica plate is uniform, so that no temperature deviation occurs for each point.

Conventionally, in the process of manufacturing the mica heater, the heating element is directly grabbed and moved to place on the lower mica plate. In the process of moving and mounting the heating element, the space between lines of the heating element is inevitably disturbed.

Therefore, after the heating element is seated on the mica plate, the process of uniformly adjusting the spacing between the lines of the heating element is performed by hand.

Moreover, in this process, since the mica plate is semi-cured with a binder (prepreg) for bonding with the mica plate to be laminated later, the adhesive force is not formed on the surface of the mica plate.

Therefore, since the heating element on the surface of the mica board easily moves with only a slight external force, it is almost impossible to precisely adjust the spacing between the heating lines.

In other words, the existing mica heater is difficult to implement accurate gap uniformity because the spacing between each line of the heating element is made while the heating element is seated on the mica plate, which is the main cause of temperature deviation on the mica plate.

In addition to these problems, after the completion of the laminated structure between the two mica plates and the heating element, the process of connecting the power line to the heating line end of the heating element.

In this process, some incisions in the upper mica board are connected to the power line with the connection point with the power line among the heating lines exposed. In this case, the lower part of the connection point of the heating line is blocked by the lower mica plate. The power coil of the wire can only be connected in contact with the upper surface of the heating line.

Therefore, in this state, spot welding is impossible and connection is inevitably made through riveting process, which leads to troublesome waste of materials and work. Becomes a factor.

Korea Registration Utility Model No. 0312214 Republic of Korea Patent No. 0553357

The present invention has been proposed to solve the problems of the existing mica heater,

By making it possible to stably stack on the mica plate while maintaining the constant spacing between lines of the heating element during the manufacturing process, there is no need to go through the gap adjustment between lines after lamination, so that the process can be made quickly and the spacing is uneven. It aims to be able to prevent the occurrence of temperature deviation.

In addition, the purpose of the connection process between the heating element and the power line is made easy and stable.

The embodiment of the manufacturing method of the various embodiments of the present invention proposed for this,

A material preparation process for preparing a first insulating plate and a second insulating plate, a heating element, and an auxiliary film, and a first attaching the heating element to the surface of the auxiliary film, wherein the heating lines of the heating element are attached to the auxiliary film with a predetermined interval. Attaching step, a second attaching step of seating and attaching the heating element to the surface of the first insulating plate by moving the auxiliary film, separating step of separating the auxiliary film from the heating element, final lamination of the second insulating plate on the heating element Lamination process.

The first attaching process may include a first adhesive layer forming step of forming a first adhesive layer on the surface of the auxiliary film, and a first adhesive step of attaching one side of the heating element to the surface of the first adhesive layer. .

In addition, in the first bonding step, the heating element has a flat plate shape, and the first attaching step further includes a pattern forming step of forming the heating lines by processing the heating element attached to the first insulating plate after the first bonding step. It may include.

In the second attaching step, a second adhesive layer forming step of forming a second adhesive layer on the surface of the first insulating plate and laminating the auxiliary film on the surface of the first insulating plate to adhere the heating element to the surface of the second adhesive layer. It may include a second bonding step.

In addition, the second attaching step is performed after the second bonding step and further hardens the second adhesive layer so that the heating element is fixed to the surface of the first insulating plate via the second adhesive layer. It may include.

The final attaching process may include forming a third adhesive layer on a surface of the second insulating plate that faces the first insulating plate, and stacking the second insulating plate on the surface of the heating element. It may include a third adhesive step to be bonded to the three adhesive layer.

In addition, the final lamination process is carried out after the third bonding step, and further comprises a second curing step of curing the third adhesive layer so that the heating element is fixed to the second insulating plate via the third adhesive layer. can do.

And a heating element and a power line connecting process performed after the final lamination process, wherein the heating element and the power line connecting process are made by cutting a point corresponding to a connection point between the heating line and the power line of the second insulating plate. Insulation plate cutting step to expose the corresponding point of the heating line, the first bending step of the heating element to bend the connection point by bending a specific point exposed to the outside of the heating line, the power line of the connection point A welding step of welding the contact portion after contacting both sides at the same time may include a second bending step of returning to the original position by bending the heating line reversely.

And the mica heater produced through this manufacturing method,

A first insulating plate and a second insulating plate which are positioned to face each other, and are disposed between the first insulating plate and the second insulating plate, and heating lines are arranged at a predetermined interval, and both sides thereof face each other between the first and second insulating plates. It includes a heating element attached to.

The present invention having these various embodiments,

Since the heating element with a constant interval between each heating line is moved to be attached to the auxiliary film and attached to the first insulating plate, the interval between each heating line of the heating element does not change in the process of being attached to the first insulating plate. As it can be attached in a constant state,

Since the gap adjusting process can be omitted, the overall manufacturing process can be shortened, and the temperature variation caused by the gap unevenness between heating lines can be prevented.

In addition, since the heating element is attached to the auxiliary film in a flat structure state and forms each heating line through separate processing in this state, there is an advantage in that the gap change between heating lines in the bonding process between the heating element and the auxiliary film does not occur.

In addition, in the process of connecting the heating line and the power line, as the connection point is made while bending a specific point of the heating line to lift the connection point, the power line is in contact with the upper and lower surfaces of the heating line at the same time. Since the fixing is made through simple spot welding, the connection process is simplified compared to the existing one.

1 is a process diagram showing the overall manufacturing flow
Figure 2 is an overall exploded perspective view of the heating element before processing
3 to 8 are schematic views showing a first attaching process
9 and 10 are schematic views showing a second attaching process
11 and 12 are schematic diagrams showing a separation process
13 and 14 are schematic views showing the final lamination process
15 to 18 is a schematic diagram showing a power connection process

Hereinafter, specific configurations and effects of the present invention will be described based on the embodiments illustrated in the drawings.

Method of manufacturing the mica heater of the present invention is largely as shown in Figure 1 material preparation step (S100) and the first attachment step (S200), the second attachment step (S300), separation step (S400) and final lamination step ( S500) is configured to include.

First, the material preparation process (S100) is a process of preparing and preparing the insulating plate 100, the heating element 200, and the auxiliary film 600, which are main components of the mica heater.

Among them, the insulating plate 100 is made of a thin plate shape as shown in Figs. 2 to 4, and has a structure containing mica, which is excellent in heat resistance and heat shock absorption, as a main raw material.

For reference, as the insulating plate 100 is a known heat transfer plate used for a general mica heater, the description of heat resistance conditions and heat transfer data is omitted.

The insulating plate is divided into a first insulating plate 110 and a second insulating plate 120 having the same shape, and the shape and size of the first and second insulating plates 110 and 120 are not limited to the drawings. It can be variously modified according to the application environment of the.

And the heating element 200 is the first heating function of the mica heater, as shown in Figure 2] to [8] during the initial preparation process as a whole metal plate form, while processing through the pattern forming step to be carried out as a whole heating line ( 210 is formed in a structure arranged in a predetermined pattern, such as zigzag form.

The heating element 200 also does not have a big difference in the heating element and the material used in the general mica heater like the insulating plate.

For reference, the heating element 200 may have a uniform temperature distribution over the entire area of the insulating plate in a later heating process only when the interval C between the heating lines 210 processed through the pattern forming step described later is formed uniformly.

In addition, since the heating element 200 requires precise temperature uniformity on the insulating plate as described above, when the resistance change range is large, difficulty in uniform temperature distribution is accompanied, resulting in low aged deterioration of the resistance-temperature coefficient (TCR). TCR is produced to be 100ppm / ℃ or less.

In order to satisfy these conditions, copper-nickel alloys having excellent electrical and heating characteristics can be used to minimize the change in resistance characteristics due to temperature change.

The auxiliary film 600 prepared together with the heating element 200 and the first and second heat sinks 110 and 120 later moves the heating element 200 in the process of attaching the heating element 200 to the first insulating plate 110. The role of the medium and the function of maintaining the spacing of each heating line of the heating element is composed of a structure in which the original plate 610 and the first adhesive layer 620 are laminated.

Among them, the original plate 610 serves as a main body of the auxiliary film, and is formed in a thin transparent plate material made of PET and has a larger area than the heating element so that the whole heating element can be attached smoothly thereafter.

Of course, the material of the disc 610 may be applied to any number of other materials as long as it can satisfy only the requirements such as smooth lamination of the adhesive material described later in addition to the PET material.

In addition, the first adhesive layer 620 serves as an adhesion medium between the disc 610 and the heating element, and is formed in a form in which a silicone-based resin is thinly coated on one surface of the disc 610.

The material of the first adhesive layer is not limited thereto, and various modifications are possible as long as the material has appropriate adhesion and peelability of the heating element.

When the basic form of each component is completed through the material preparation process (S100), the first attaching process (S200) is performed.

The first attaching process (S200) is a process of attaching the heating element 200 to the surface of the auxiliary film 600 in a stacked form, and is divided into a first bonding step S210 and a pattern forming step S220.

The first bonding step (S210) is a point at which substantial attachment is made between the heating element 200 and the auxiliary film 600, and the heating element 200 is seated on the first adhesive layer 620. The 200 is made in such a manner as to adhere to the surface of the auxiliary film 600 by the adhesive force of the first adhesive layer 620.

At this time, the adhesive force of the first adhesive layer 620 is formed such that the heating element 200 is attached to the auxiliary film by self-weight or the like so that its position does not change easily on the surface of the auxiliary film, but through the external force, the heating element and the auxiliary film ( 600) is set at such a level that it can be easily separated.

In addition, the pattern forming step (S220) is a process of processing the heating element 200 in the form of a plate attached to the auxiliary film surface to form each heating line 210, it is made by a general etching method.

In more detail, as shown in FIG. 3, a separate dry film 630 is placed on a plate-type heating element 200 positioned on the auxiliary film 600, and among the dry films 630 as shown in FIG. When the corrosion layer is formed after forming a corrosion layer on the same line as the point between each heating line 210 of the heating element 200, only the point where the corrosion layer is formed in the dry film is removed.

As a result, the dry film may have the same shape as each heating line 210 of the heating element, and the heating element 200 may be exposed between the dry films 630.

In this state, when the etchant is applied between the dry films 630 as shown in FIG. 5, the exposed points between the dry films of the heating elements 200 are removed while being corroded.

After the dry film is removed, as shown in FIGS. 7 and 8, the heating element has a structure in which each heating line 210 is arranged in a zigzag form at regular intervals rather than in a plate shape.

In this case, the heating element 200 formed as described above has to maintain a constant interval between each heating line 210 to form a uniform heating temperature over the entire area of the insulating plate.

Therefore, as the heating line 210 is formed in the state in which the heating element is attached to the auxiliary film in the state of the first plate as described above, a phenomenon such as a change in spacing between heating lines is prevented in the forming process.

In addition to this method, the heating element 200 may be processed in advance to form a heating line in advance, and then may be subjected to the first adhesive step S210. In this case, each heating line 210 may be subjected to the first adhesive step S210. Conditions that ensure that the gaps between them remain constant should be eliminated.

When the first attaching process (S200) is completed, as shown in FIG. 8, a structure in which the heating elements 200 having a plurality of heating lines 210 are arranged at a predetermined interval is laminated on the surface of the auxiliary film 600. Is completed.

In this state, the second attaching step S300 is performed.

The second attaching process (S300) is a process of attaching and fixing the heating element 200 to the surface of the first insulating plate 110, and again forming a second adhesive layer (S310), a second bonding step (S320), and a first curing step ( 530).

Among the second adhesive layer forming step (S310), the adhesion between the first insulating plate 110 and the heating element before attaching the heating element 200 to the first insulating plate 110 as shown in FIGS. 9 and 10. In the process of forming the second adhesive layer 400 is a medium,

The second adhesive layer 400 is implemented in the form of a thin coating on the entire upper surface of the first insulating plate 110 in the form of a silicone-based resin. Of course, the material of the second adhesive layer is not limited thereto, and any material may be selectively used as long as the material can smoothly and firmly bond the first insulating plate 110, the heating element 200, and the second insulating plate 120.

 In addition, the second bonding step S320 is a time point at which the heating element 200 and the first insulating plate 110 are actually attached to each other, and the auxiliary film 600 having the heating element 200 attached thereto is attached to the second adhesive layer 400. Stacked on the surface, the heating element 200 is positioned between the auxiliary film 600 and the second adhesive layer 400, so that the bottom surface of the heating element 200 is adhered to the surface of the second adhesive layer 400 Is made of.

As a result, the heating element 200 has an upper surface attached to the auxiliary film 600 through the first adhesive layer 620 as shown in FIG. 10, and a lower surface of the heating element 200 through the second adhesive layer 400. 110) attached to the upper surface.

At this time, as described above, since the heating element 200 is attached to the auxiliary film 600 in a state in which the spacing between the heating lines 210 is constantly maintained through the first adhesive step S210, the heating element 200 remains in this state. It is attached to the second adhesive layer 400 and in this process the gap between each heating line 210 is maintained unchanged.

The first curing step (S330), which is performed afterwards, is a process of curing the second adhesive layer 400 so that the heating element 200 can be firmly attached onto the first insulating plate 110. After the high pressure treatment, the second adhesive layer 400 is cured, and in the process, the solid adhesion of the heating element 200 is performed in such a manner as to be implemented.

For reference, the first curing step S330 may not be necessarily performed and may be omitted depending on circumstances.

For example, when the adhesive strength of the second adhesive layer 400 is superior to the adhesive strength of the first adhesive layer 620, the heating element 200 and the auxiliary film 600 which are subsequently processed even if the second adhesive layer 400 is not cured. This is because the heating element 200 is fixed to the first insulating plate 110 by the second adhesive layer 400 in the inter-separation process, and only the auxiliary film 600 can be easily separated from the heating element 200.

When the second attaching process S300 is completed, as shown in FIG. 10, the heating element 200 and the auxiliary film 600 are sequentially stacked on the surface of the second adhesive layer 400.

In this state, the separation step (S400) is performed.

Separation process (S400) is a process of separating the auxiliary film 600 from the heating element 200 as shown in Fig. 11 and 12, the heating element 200 through the second adhesive layer 400 as mentioned above A process of separating only the auxiliary film 600 while the first insulating plate is attached and fixed to the surface of the first insulating plate 110 through the second adhesive layer 400.

As described above, since the adhesive force of the second adhesive layer 400 is greater than the adhesive force of the first adhesive layer 620 in this state, as shown in FIG. 200, only the auxiliary film 600 is separated from the heating element 200 in a state where it is attached on the first insulating plate 110.

In this process, as shown in the drawing, the first adhesive layer 620 may also be separated from the heating element together with the auxiliary film 600, or the auxiliary film may be separated only while the first adhesive layer is left on the surface of the heating element.

And since the heating element 200 has already been attached to the first insulating plate 110 in a state in which the interval between the heating lines 210 is constantly maintained in the second attaching process (S300) through the auxiliary film 600, Even if the auxiliary film 600 is removed, the heating element 200 is maintained on the first insulating plate 110 without changing the distance between the heating lines 210.

When the auxiliary film 600 is removed, the first adhesive layer 620 and the heating element 200 are sequentially stacked on the surface of the first insulating plate 110 as shown in FIG. 12.

After that, the final lamination process (S500) is performed.

The final lamination process S500 is a step of finally completing the lamination structure of the mica heater by laminating the second insulating plate 120 as shown in FIGS. 13 and 14, and again forming the third adhesive layer S510. And a third bonding step S520 and a second curing step 530.

The third adhesive layer forming step (S510) is a process of forming a third adhesive layer 500, which is an adhesive medium, on the second insulating plate 120 before the second insulating plate 120 is laminated.

The third adhesive layer 500 is formed of a silicone-based resin like the second adhesive layer 400, and is formed in a thin coating form on a lower surface of the second insulating plate 120 facing the first insulating plate 110. .

For reference, the material of the third adhesive layer 500 is not limited thereto and may be selectively applied in various ways as long as the unique function may be sufficiently exhibited.

 In addition, the third bonding step S520 is a process in which the second insulating plate 120 is substantially bonded, and the second insulating plate 120 is interposed between the heating elements 200 as shown in FIGS. 13 and 14. It is made in the form of seating on the insulating plate,

In this process, the upper surface of the heating element 200 is bonded to the third adhesive layer 500 of the second insulating plate 120, and the remaining sections of the third adhesive layer 500 are the first adhesive layer 620 of the first insulating plate. Is bonded with.

The second curing step 530 is performed to harden the third adhesive layer 500 to induce a firm adhesion between the first and second insulating plates 110 and 120 and the heating element 200. It proceeds in a way to be cured in a high temperature and high pressure environment using a separate press device (S330).

When the second curing step 530 is completed, as shown in FIG. 14, the first and second insulating plates 110 and 120 are laminated to each other in a state in which they face each other, and the entire heating element is also formed on both sides thereof. The structure bonded to the two insulating plates 110 and 120 is completed.

As described above, in the process of attaching the heating element on the insulating plate during the manufacturing process of the mica heater, the heating element is formed in a form in which the heating element is transferred to the heating plate in a state that is primarily designed on a separate auxiliary film.

Since it is not necessary to adjust the spacing between the heating elements 210 on the insulating plate again, the entire manufacturing process is simplified, as well as to prevent the uneven heating temperature caused by the change in spacing between heating lines.

After the final lamination process is completed, the power line connection process (S600) is performed.

Power line connection process (S600) is a process of connecting the power supply line 700 for heating the heating element with the heating element 200, the insulating plate cutting step (S610) and the first bending step (S620), welding step It is carried out divided into (S630) and the second bending step (S640).

In the insulating plate cutting step (S610), a portion of the second insulating plate 120 is cut as shown in FIG. 15 to expose a point to be connected to the power line 700 of the heating line 210 of the heating plate 200 to the outside. Proceed.

In addition, the first bending step S620 is performed by bending the end of the heating line 210 exposed to the outside through the insulating plate cutting step S610 as shown in FIG. 16.

At this time, the bending process may be performed manually or using a separate bending mechanism.

Welding step (S630) is a process of actually connecting the power line to the heating line, as shown in Fig. 17 at the same time the power line is in contact with the both sides of the end of the heating line bent and lifted up the spot through the spot (SPOT) welding It is a process of integration.

As such, in the present invention, as the power line is connected in a state in which the heating line is bent, the power line can be in contact with both sides of the heating line end, and thus spot welding is also possible. It becomes possible.

After the second bending step (S640) is carried out in a way to be in the original position by bending the end of the heating line in the bending state as shown in FIG.

The above-described features of the present invention can be variously modified and combined by those skilled in the art, but such modifications and combinations proceed in such a manner that the heating element is attached to an insulating plate in a state in which a heating element is designed in a separate auxiliary film during mica heater manufacturing. By doing so, in the process of attaching the heating plate to the insulating plate, it should be determined that it is included in the protection scope of the present invention when it is related to the purpose and configuration of preventing the pattern change of the heating plate and thus preventing the occurrence of temperature deviation.

S100: Material Preparation Process S200: First Attachment Process
S210: forming the first adhesive layer S220: first bonding step
S300: second adhesion process S310: second adhesion layer forming step
S320: second bonding step S330: first curing step
S400: Separation Process S500: Final Lamination Process
S510: third adhesive layer forming step S520: third adhesive step
S530: second curing step S600: power line connection process
S610: insulation plate cutting step S620: first bending step
S630: welding step S640: second bending step
100: insulation plate
110: first insulating plate 120: second insulating plate
200: heating element 210,220,200n: heating line
400: second adhesive layer 500: third adhesive layer
600: auxiliary film 610: disc
620: first adhesive layer 630: dry film
640: etching solution 700: power line

Claims (9)

A material preparation process of preparing a heating element in the form of a first insulating plate and a second insulating plate, an auxiliary film, and a sheet material,
Attaching the heating element to a surface of the auxiliary film, the first attaching process of forming a heating line with a gap by partially heating the heating element,
A second attaching step of moving the auxiliary film to mount and attach the heating element on which the first attaching step is completed to the surface of the first insulating plate;
A separation process of separating the auxiliary film from the heating element in which the second attaching process is completed;
And a final lamination step of laminating the second insulating plate on the heating element having the separation step completed.
In claim 1,
The first attaching step,
A first adhesive step of forming a first adhesive layer on a surface of the auxiliary film and adhering the heating element in the form of a plate on the first adhesive layer,
The dry film is seated on the heating element in the form of a plate, and the point between each heating line to be formed on the heating element in the form of a plate among the dry films is removed, and then an etchant is applied to the removed point to form the heating element in the form of a plate. Pattern forming step to remove the point where the etching solution is applied
Containing
Mica heater manufacturing method.
3. The method of claim 2,
The pattern forming step,
Forming a corrosion layer on the same line between the point between each heating line to be formed on the heating element in the form of a plate of the dry film and irradiating the corrosion light on the corrosion layer to remove only the point where the corrosion layer is formed of the dry film
Mica heater manufacturing method.
4. The method according to any one of claims 1 to 3,
The second attaching step,
A second adhesive layer forming step of forming a second adhesive layer on the surface of the first insulating plate,
A second adhesive step of laminating the auxiliary film on the surface of the first insulating plate to adhere the heating element on which the first attaching process is completed to the surface of the second adhesive layer;
Mica heater manufacturing method comprising a.
5. The method of claim 4,
The second attaching step,
And a first curing step performed after the second bonding step to harden the second adhesive layer so that the heating element is fixed to the surface of the first insulating plate through the second adhesive layer.
The method of claim 5,
The final lamination step,
A third adhesive layer forming step of forming a third adhesive layer on a surface of the second insulating plate facing the first insulating plate;
A third bonding step of laminating the second insulating plate on the surface of the heating element to bond the heating element to the third adhesive layer;
Mica heater manufacturing method comprising a.
The method of claim 6,
The final lamination step,
And a second curing step performed after the third bonding step to harden the third adhesive layer so that the heating element is fixed to the second insulating plate through the third adhesive layer.
In claim 1,
Further comprising a heating element and a power line connection process performed after the final lamination process,
The heating element and the power line connection process,
Insulating plate cutting step of cutting the point corresponding to the connection point between the heating line and the power line of the second insulating plate to expose the corresponding point of the heating line,
First heating step of the heating element bending the specific point of the section exposed to the outside of the heating line to raise the connection point,
A welding step of welding the contact portions after simultaneously contacting the power lines with both sides of the connection point;
A second bending step of returning to the original position by bending the heating line reversely
Mica heater manufacturing method comprising a.
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