KR101332369B1 - Method for applying soldering material on conductive pillar of wafer and apparatus thereof - Google Patents

Abstract

A method for applying a soldering material on the conductive pillar of a wafer includes a step for providing a soldering material furnace with an upper opening part, loading a melted soldering material in the soldering material furnace, and connecting the soldering material furnace to an input source, a step for providing a plate to the upper opening part and forming holes in the plate, a step for forming soldering material bumps by using the upper hole the soldering material of the input source, a step for performing a size analysis step by providing a visual device, a step for providing a work piece and forming conductive fillers on the work piece, moving the plate against the work piece, and making the conductive filler face a soldering bump, and a step for making the conductive filler touch the soldering material bump and arranging the soldering material bump on the conductive filler. [Reference numerals] (S101) Providing a soldering material furnace with an upper opening part, loading a melted soldering material in the soldering material furnace, and connecting the soldering material furnace to an input source;(S103) Providing a plate to the upper opening part and having, a plate has multiple drilling and multiple first location mark;(S105) Forming multiple soldering material bumps projected in plate by using pressure to pressurize melt soldering material source into drilling through upper opening part and plate;(S107) performing a size analysis step by providing a visual device and stopping pressurizing the pressure source when the size of soldering material bumper reaches predetermined value;(S109) Providing a work piece and forming conductive fillers on the work piece, moving the plate against the work piece, and making the conductive filler face a soldering bump;(S111) Making the conductive filler touch the soldering material bump and arranging the soldering material bump on the conductive filler

Description

TECHNICAL FIELD OF THE INVENTION A method for manufacturing a solder joint material applied to a conductive filler of a wafer, and a device therefor {METHOD FOR APPLYING SOLDERING MATERIAL ON CONDUCTIVE PILLAR OF WAFER AND APPARATUS THEREOF}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method for manufacturing a soldering material applied to a conductive filler of a wafer, and more particularly, to a soldering material applying method applied to a conductive filler on a wafer, and a soldering material applying device thereof.

Portable multimedia products and portable mobile devices tend to be lighter, thinner, and smaller in appearance, and the circuit board area of electronic products is smaller but of great value. In addition, since the volume of the chip can be effectively reduced by the 3D IC, the miniaturization manufacturing process attracts attention.

3D IC is a chip three-dimensional stacked integration mode, the integration of 3D space on a large number of chips, the biggest feature is the chip of different functions, properties, after the pre-fabrication of the three-dimensional stacked integration of the chip By proceeding to effectively shorten the length of the metal conductor and connecting line electrical resistance, and further reduce the chip area. Small volume, high integration, high efficiency, low power consumption, fast heat dissipation and excellent cost. And at the same time, it meets the light and light weight of digital electronics. Generally speaking, the above-described connection technology includes Through-Si Via, TSV technology, and Direct Bond Interconnect (DBI) technology, and TSV technology mainly fills metals in micro holes to achieve electrical conduction. DBI technology is an oxide bonding technology. Nickel metal is bonded on a TSV hole made of metal such as copper, tungsten, or aluminum, and a perfect plane is formed between oxide and metal to create a high reliability and strength bond.

In addition, splicing techniques using copper pillar bumps are also applied in the manufacturing process of 3D ICs, the main feature of which is to fabricate a plurality of highly precise copper fillers on a substrate. For example, the diameter is about 15 to 20um, the spacing is about 30 to 40um, the height is about 20 to 30um, and the copper filler is used as the conducting spindle to greatly increase the capacity and reliability of signal transmission.

However, a soldering material must be applied on the copper filler and subsequent connection work is carried out. However, due to the fineness of the copper filler, the above soldering material coating operation is quite difficult. Currently, the manufacturer produces soldering (tin) particles with a particle diameter of 10-20um, and the solder (tin) particles are randomly dispersed on the rubber material to form rubber, and the rubber is placed on the substrate to solder (tin). The particles are suitably placed on the copper filler, and finally the solder (tin) particles are melted and molded on the copper filler through heating of a special stand. The fine solder (tin) particles described above will then have a significantly higher material cost due to the difficulty of fabrication, and will also adhere to the rubber but will not be transferred to the solder (tin) particles on the solder material, there is no way to use them and the overall manufacturing process cost is important. It is difficult to control the management of materials.

One of the objectives of this invention is providing the coating method of the soldering material of a conductive filler, and its coating apparatus.

According to the present invention, the soldering material is applied to a conductive filler having a very small size, and compared with other current methods, the manufacturing process of the present invention is simpler, mass production is possible, and the cost can be greatly reduced.

An embodiment of the present invention provides a method for applying a solder material of a conductive filler, and includes the following steps.

Step 1: Provide a solder material furnace having an upper opening, load the solder material in the molten state into the solder material furnace, the solder material furnace is connected to the pressure source.

Step 2: Provide a plate in the top opening of the solder material furnace, the plate having a plurality of perforations and a plurality of first orientation marks.

The third step: using the pressure source to press the molten solder material in the molten state through the upper opening and the perforations of the plate to form a plurality of solder bumps protruding from the plate.

Step 4: Providing a visual device to proceed the size analysis step, and when the size of the solder bumps reaches a predetermined value, the pressure source immediately stops pressurizing.

Step 5: Providing a workpiece, forming a plurality of conductive fillers and a plurality of second positioning marks thereon, using the first positioning mark and the second positioning mark to oppose the plate and the workpiece Proceed and direct the conductive fillers to the solder bumps.

Step 6: The conductive fillers are in contact with the solder bumpers, and the solder bumpers are disposed on the conductive fillers.

An embodiment of the present invention further provides a solder coating apparatus for a conductive filler, and includes a soldering material furnace having an upper opening, a soldering material in a molten state in the soldering material furnace, and the soldering material furnace is connected to a pressure source; A plate installed in the upper opening of the solder material furnace, the plate having a plurality of perforations and a plurality of first orientation markings; a vision device and a suction head disposed correspondingly above the plate. .

According to one embodiment of the present invention, the present invention provides a method of manufacturing a soldering material applied to a conductive filler of a wafer, and includes the following steps.

A tin powder supply device having a lower portion is provided, and a powdered solder material is loaded in the tin powder supply device, and the tin powder supply device is connected to a pressure source.

A plate is provided below the lower opening of the tin powder supply device, the plate having a plurality of perforations and a plurality of first orientation marks.

The precision flat plate is moved below the plate, and a plurality of material positioning marks are installed on the top surface of the precision plate, and the plate and the precision plate are opposed to each other by using the first location markings and the material positioning marks. do. ;

A powdered solder material is disposed correspondingly on the top surface of the precision flat plate, through the perforations of the plate.

Provide a sealed chamber to sufficiently protect the gas and move the precision flat into the sealed chamber.

The precision flat plate is heated to allow the soldering materials to form a soldering material bumper in a molten state.

Providing a workpiece, shaping a plurality of conductive fillers and a plurality of second orientation marks thereon, and proceeding opposing the workpiece and the precision flat using the second orientation marks and the warp position markings; Directing conductive fillers to the solder bumper; And

The conductive fillers contact the solder bumpers to move the solder bumpers onto the conductive fillers.

According to another embodiment of the present invention, the present invention further provides an apparatus for applying a conductive filler solder material of a wafer, which is used to add a solder material to a plurality of conductive fillers of a workpiece. This includes:

Tin powder supply device having a lower portion, the powdered solder material is loaded in the tin powder supply device, the pressure source is connected to the powdered solder material.

The plate is installed fluidly below the lower portion of the tin powder supply device, the plate having a plurality of perforations and a plurality of first orientation markings.

It has a precision flat surface, a flat top surface and a heater to heat the top surface, to install a plurality of material orientation markings on the top surface, and to support the powdered solder material passing through the perforations.

A visual device opposes the first positional representation of the plate and the transpositional position representation of the precision flat.

It has a sealed steel chamber, a gas access portion, and accommodates the precision flat and the workpiece.

A suction device, suctions the workpiece, causes the conductive fillers to contact the solder bumpers and transfers the solder bumpers onto the conductive fillers.

The present invention has the following beneficial effects: The present invention forms a solder material bumper through a special steel sheet using a solder material in a molten state, and the solder material bumper can be applied on each conductive filler correspondingly. As a result, manufacturing costs are relatively low.

The present invention also uses a method of visual opposition to precisely oppose the workpiece (e.g. wafer) and the steel sheet, and allows each conductive filler phase to uniformly and accurately cover the soldering material to form a short circuit between the conductive fillers. Cannot

1 is an explanatory view showing a soldering material application method of the present invention.
Figure 2a is an exploded view showing the solder material furnace and plate of the present invention.
Fig. 2B is a combination diagram showing a solder material furnace and a plate of the present invention.
3 is an exploded view showing that the workpiece of the present invention is disposed on a plate.
4A is an explanatory diagram showing that the workpiece of the present invention is disposed on a plate.
4B is an explanatory diagram showing that the present invention uses a pressure to mold a solder bumper.
4C is an explanatory diagram showing that the conductive filler of the present invention is in contact with a solder bumper.
4D is an explanatory diagram showing that the solder bumper of the present invention is in contact with the conductive filler.
5 is an explanatory view showing a tin powder supply device, a plate and a precision flat plate of the present invention.
6 is an explanatory view showing a hermetically sealed steel chamber, a workpiece and a precision flat plate of the present invention.
Fig. 7 is a bird's eye view after registration of a soldering material applying device by the conductive filler of the invention.
Fig. 8 is a three-dimensional combination diagram after registration of a soldering material application device by the conductive filler of the present invention.

In order to further clarify the features and technical details of the present invention, reference is made to the following detailed description and drawings. The schemes are provided for reference and explanation only and do not limit the invention.

The present invention relates to a method for manufacturing a soldering material applied to a conductive filler of a wafer and an apparatus thereof. The method of applying the solder material proposed by the present invention forms a solder material coating on a highly precise and considerably smaller conductive filler, thereby lowering the cost of the entire manufacturing process.

[First Embodiment]

1 is a flowchart of the present invention, and the method of applying a solder material of the present invention includes at least the following steps.

Step S101: provide a soldering material furnace 11 having an upper opening 111, wherein the soldering material S (shown in more detail in Figs. 4A to 4D) in the soldering material furnace 11 is shown. (See FIG. 2A and FIG. 2B simultaneously.)

In this step, the present embodiment arranges the molten solder material S in the solder material furnace 11, and the furnace temperature of the solder material furnace 11 is generally equal to the melting point of the solder material. 220 ° C ~ 260 ° C and / or approximately 300 ° C ~ 330 ° C (about the melting point of the soldering material, determine the soldering components directly), 250 ° C is the best, to maintain the fluidity of the soldering material (S). ; In another aspect, the solder material furnace 11 is connected to a pressure source 13, which is used to provide pressure to the solder material S. The solder material S is distributed to a region of low pressure, and in a specific embodiment, the pressure source 13 may be a pump, which is injected into the solder material furnace 11 after gas compression and causes the solder material S to flow. To produce the effect of.

Next, a control valve (not shown) is installed between the solder material furnace 11 and the pump, the control valve may be a throttle and / or a solenoid valve, and the pressure source 13 may be a solder material (S). Control the export pressure.

Step S103: The plate 12 is provided in the upper opening 111 of the solder material furnace 11. In this step, the plate 12 is fixed to the upper opening 111 of the soldering material furnace 11, and controls the flow pattern generated after the soldering material (S) is subjected to the pressure of the pressure source (13). In this specific embodiment, the plate 12 is an electroformed steel sheet, which has a fairly high size stability and under the condition that it contacts the solder material S, the electroformed steel sheet still maintains its size stability. The plate 12 has a plurality of perforations 121 and a plurality of first orientation marks 122. For example, using a processing method, such as etching, electroforming or machining process makes a perforation 121 having a diameter of about 20 μm and a spacing of about 40 μm on the electroformed steel sheet, but the size, spacing, etc. of the perforation 121. Is generally changed based on the size of the subsequent conductive filler.

In the next step, the soldering material S mainly penetrates the perforations 121 to form the soldering material bumper SP, and then the work piece 2 is opposed to the conductive filler 21 on the work piece 2. The molded solder bumper SP is brought into contact with the molded solder bumper SP, and the solder material bumper SP is transferred onto the conductive filler 21. In this specific embodiment, the workpiece 2 may be a wafer and the conductive filler 21 may be a cylindrical conductive filler, for example, about 15 to 20 um in diameter, about 30 to 40 um in interval, and about 20 to 20 in height. 30um of conductive filler.

However, the following steps S105 to S111 do not have limitations in the manufacturing process sequence, and will be described below only with specific specific implementation procedures.

Step S105: using the pressure source 13 to press the molten solder material S into the perforations 121 through the upper opening 111 and the plate 12 to protrude on the plate 12. The bumper SP is formed. Referring to FIG. 4B, in this step, the pressure applied by the pressure source 13 to the soldering material S transmits the soldering material S through the perforations 121 to form a plurality of soldering material bumpers SP. This makes it possible to make perforations 121 of a particular specification on the plate 12 of the present invention, and to make the solder bumper SP of the last extrusion molding have a predetermined aperture. In other words, the present invention can select and use a specific plate 12, and the molded solder joint material bumper SP can correspond to specifications such as diameter and spacing of the conductive filler 21 on the workpiece 2. .

S107: Provide a visual device (not shown) to proceed with the size analysis step. When the size of the solder material bumper SP reaches a predetermined value, the pressure source 13 stops pressurizing. In the present invention, the visual apparatus has at least two functions of visual discrimination and stereotactic discrimination. In this step, the visual device (eg, CCD) acquires an image of the solder material bumper SP and analyzes the size of the solder material bumper SP. In other words, during the process of pressurizing the pressure source 13 in step S105, the solder material bumper SP may gradually grow, and the visual device may acquire an image of the solder material bumper SP during the growth process, When the result of the analysis confirms that the size of the solder material bumper SP has reached the predetermined value of the setting, the visual device sends out information and controls the pressure source 13 to stop pressurization. At this time, the solder material bumper (SP) can maintain the predetermined value of the size.

Step S109: The work piece 2 faces the plate 12. As shown in Figs. 3A and 3B, the plate 12 has a plurality of first positioning marks 122, the work piece 2 has a plurality of second positioning marks 22, and the work piece 2 is Suction by using the suction head to move upward of the plate 12 and direct the cutting filler 21 on the work piece 2 to the solder bumper SP (refer to FIG. 4B again); In this step, the visual apparatus is used for photographing the first stereotographic notation 122 and the second stereotactic notation 22, the position is determined by using the relative position, and the visual device is determined by reusing the suction unit. Adjust the position of the workpiece 2 relative to the plate 12 according to the analysis result. In other words, the workpiece 2 can penetrate the stereotactic step, and acquire an image of the first stereotographic notation 122 and the second stereotactic notation 22 using a vision device and based on the image analysis result, the plate 12 ) And the work piece 2 are opposed to each other.

In another aspect, the method further comprises a heating step of efficiently moving the solder bumper SP onto the conductive filler 21 and heating the workpiece 2 in this step, wherein the suction head is heated. The later work piece 2 is disposed above the plate 11.

Step S111: The conductive filler 21 is brought into contact with the soldering material bumper SP to move the soldering material bumper SP onto the conductive filler 21. 4C and 4D, after the opposition / orientation, the suction head moves the work piece 2 downward and makes the conductive filler 21 contact the solder material bumper SP; The workpiece 2 has a relatively high temperature after heating so that the solder material bumper SP leaves the solder material S and transitions onto the conductive filler 21. For this reason, each electrically conductive filler 21 can shape | mold the solder joint material bumper SP uniformly.

As a result, the present invention proceeds to apply the welding material to the conductive filler 21 of a very fine size, the soldering material (S) in the dissolved state is relatively inexpensive at cost and the soldering material can also be recovered and used The whole manufacturing process is simple and the cost is low.

In another aspect, the present invention also provides a solder material applying apparatus, which includes the solder material furnace 11, the plate 12, the visual device, and the suction head. The structure of the brazing material furnace 11 and plate 12 is referred to in its entirety and is not further explained. The visual aid may be a visual aid, which is used to acquire an image of the upper surface of the plate 12 and the workpiece 2 and is located relative to the first stereotactic notation 122 and the second stereotactic notation 22. Proceed with compensation. The visual device may be electrically connected to the suction head, and upon completion of the corresponding position, the visual device may cause the suction filler 12 to contact the solder material bumper SP by moving the workpiece 2 downward. To send out a signal. In addition to the above, the visual device is electrically connected to the pressure source 13, and when the visual device finds that the size of the solder material bumper SP reaches a predetermined value through image analysis, the visual device signals. The pressure source 13 controls the stop of pressurization.

In addition, the soldering material applying apparatus of the present invention further includes a heating device, which can be connected to the soldering material furnace 11 and the work piece 2, and the heating device maintains the furnace temperature of the soldering material furnace 11. It is used to carry out a heating operation on the workpiece 2, and the heating device preferably has a control module having a set heating temperature and a heating time.

[Second Embodiment]

5 and 6, this is an explanatory view of a soldering material applying apparatus of the conductive filler of the present invention.

This solder material application device is used to add the solder material to the plurality of conductive fillers 21 of the work piece 2, the tin powder supply device 16 having the lower opening 160, the plate 12, the precision flat plate 3 ), And the hermetic chamber 4. The workpiece 2 is the same as the above embodiment and will not be described further.

The solder powder (S) in the form of powder is loaded in the tin powder supply device 16, and a pressure source 162 is connected to the tin powder supply device 16. The pressure source 162 is used to provide pressure to the soldering material S, and moves the soldering material S down. The pressure source 162 in this embodiment is a piston. The tin pouch supply device 16 loads tin powder in the prepared work area and is moved to the application work area by an orbital carrier.

The plate 12 is the same as the above embodiment and is an electrocast steel sheet. In this embodiment, the fixing frame 15 is installed to fix the plate 12. Below the lower opening 160 of the tin powder supply device 16, the plate 12 has a plurality of perforations 121 and a plurality of first orientation marks 122.

The precision flat 3 has a flat top surface 32 and a heater H to heat the top surface 32, and a plurality of material positioning representations 322 are installed on the top surface 32. The flat top surface 32 of the precision flat 3 is used to ride the powdered solder material S through the perforations 121. The powdered solder material S forms a solder material bumper S in a molten state through heating.

The precision chamber 4 includes a gas passage portion 420 formed in the first rigid body 41, the second rigid body 42, and the second rigid body 42 to allow the protective gas G to pass therethrough. For example, it passes through formic acid, and the precision chamber 4 is used to receive the precision flat 3 and the workpiece 2. In the precision chamber 4 of the present embodiment, a pair of visual devices 43 are provided, and the first positional representation 122 of the plate 12 and the transpositional orientation representation of the precision flat 3 are 322. ) Conflict.

The precision chamber 4 includes a suction device 48 to suck the work piece 2, to contact the conductive filler 21 to the solder material bumper S, and to conduct the solder material bumper S. It moves and arranges on the pillar 21. The suction device 48 is connected to the movable carrier 46 and moves the workpiece 2 into the ball grid array (BGA) workpiece. The carrier 46 may be a track, a mechanical arm, or the like. Since the front face 32 of the precision platform 3 is made of ceramic, the solder material bumper SP cannot remain on the top surface 32 of the precision platform 3. The work piece 2 is finally as shown in Fig. 4D of the embodiment.

This embodiment may further include a height measuring device 44, and may also be referred to as a vertical coaxial vision module, and is arranged in the precision chamber 4. The height of the workpiece 2 with respect to the precision flat 3 parietal surface 32 is measured when the movable mechanical arm 46 moves the suction device 48. The work piece 2 does not have to hit the precision flat 3, and the distance between them is about 1 mm.

The present embodiment is based on the above-described solder paste material applying apparatus of the conductive filler, and the solder paste material applying method of the conductive filler includes the following steps.

First, a tin powder supply device 16 having a lower opening 160 is provided, and the tin powder supply device 16 is loaded with a solder material S in a powder state, and the tin powder supply device 16 is pressurized. To a circle 162.

A plate 12 is provided below the lower portion 160 of the tin powder feeder 16, the plate 12 having a plurality of perforations 121 and a plurality of first orientation marks 122.

The precision plate 3 is moved to the bottom of the plate 2, and a plurality of warp-position markers 322 are installed on the top surface 32 of the precision plate 3, and these first-position markers 122 are provided. And the plate 2 and the precision flat plate 3 are opposed to each other by using these electrodeposition positioning marks 322.

These powdered soldering materials S are perforated through the perforations 121 of the plate 12 and are disposed correspondingly on the top surface 32 of the precision flat plate 3.

 A sealed steel chamber 4 is provided to sufficiently protect the gas, and the precision flat plate 3 is moved into the precision steel chamber 4. The precision flat plate 3 is heated to form these solders S into solder material bumpers SP in a molten state.

A workpiece 2 is provided, and a plurality of conductive fillers 21 and a plurality of second stereotactic marks 22 are formed thereon, using these second stereotactic marks 22 and these transpositional notations 322 above. The work piece 2 and the precision flat plate 3 are opposed to each other and these conductive fillers 21 are directed to these solder material bumpers SP.

These conductive fillers 21 are brought into contact with these solder material bumpers SP to move these solder material bumpers SP on these conductive fillers 21.

Among them, in the step of heating the precision flat plate 3 to form these solder material S into a solder material bumper SP in a dissolved state, the temperature is generally the same as the melting point of the solder material and is 220 ° C. to 260 ° C. And / or between about 300 ° C and 330 ° C.

The protective gas in the hermetic chamber 4 is formic or N2.

In the providing of the workpiece 2, the method further includes the positioning step, and the image of these first positioning notation 122 and these transpositional positioning notation 322 is obtained by using the visual apparatus 43. And the suction head 48 advances the said precision flat plate 3 and the workpiece | work 2 in opposition by the said image analysis result.

In the step of bringing these conductive fillers 21 into contact with these solder material bumpers SP, the method further includes providing a height measuring device 44 to measure a height relative to the top surface 32 of the precision flat plate 3. do.

7 and 8 show a bush diagram and a stereo combination diagram after registration of the coating apparatus by the conductive filler of the present invention. According to the second embodiment, the present invention describes, by way of example, the solder material application device 100 of the conductive filler after registration, and is installed on the stand P. FIG. As shown in Fig. 7, five working areas are divided from the top to the bottom. The first is a tin powder preparation area (A1), the tin powder is loaded into the tin powder supply device 16, and is moved by the X-axis carrier 1Rx moving along the X axis and the Y-axis carrier 1Ry moving along the Y axis. The tin powder also moves the feeder 16 to the lower work area.

The tin powder application working area A2 is mainly an area where the plate 12 installs the perforations 121, and the plate 12 is fixed on the stand P by the fixing frame 15. At the bottom of the plate 12 is a Y-axis moving carrier 3Ry, which is used to move the precision flat 3, which extends to the ball grid array working area A3, which is the lower working area. In other words, the precision flat 3 is designed to move between the tin powder application working area A2 and the ball grid array working area A3. First, the precision flat plate 3 is moved to the tin powder application work area A2, and the work as shown in FIG. 5 is performed, and the tin powder or powder state solder material S passes through the perforations 121 of the plate 12. To the top surface 32 of the precision flat plate 3; Then, the carrier 3Ry is moved using the Y axis and the precision flat plate 3 is moved to the ball grid array working area A3. The tin ball grid array working area A3 mainly moves the precision flats 3 into the hermetic chamber 4 to reach the ball grid array below the workpiece 2. The other side of the sealed steel chamber 4 is a plate acquisition arrangement area A4 and a plate supply area A5, and the workpiece 2 to be processed is disposed in the plate supply area A5. The plate supply part A5 moves the plate carrier 2C to the plate acquisition arrangement area | region A4. Four-axis carriers are provided in the plate acquisition arrangement area A4 of this embodiment, and the X-axis carriers 2Rx, Y-axis carriers 2Ry, R-axis carriers 2Rr and Z-axis carriers 2Rz are respectively represented by the carriers 46, respectively. Include. The X-axis carrier 2Rx is provided with a suction device 48 to obtain the workpiece 2. The workpiece 2 is moved by the visual module V exactly on the top face 32 of the precision platform 3. The visual module V of this embodiment can be fixed at a suitable height to feed the workpiece 2 exactly above the precision platform 3. In addition, the visual module V can also serve as the visual device 43 and the height measuring device 44 simultaneously by the mobile mounting modules 4Rx and 4Ry on the X and Y axes.

In general terms, the present invention proceeds to apply the solder material to the conductive filler 21 having a very small size, and the solder material in the molten state (SP) is significantly inexpensive and the solder material can also be recovered and used. All manufacturing processes are simple and low cost.

As described above, the present invention is best only to practice the embodiment and is not limited to the patent scope of the present invention, even if there are some technical changes in the description and the present invention is generally included within the scope of the present invention.

11 soldering material furnace
111 upper opening
12 plate
121 perforated
122 First Notation
13 pressure source
2 workpiece
21 challenging filler
22 2nd position notation
S soldering material
SP solder material bumper
S101 ~ S111 manufacturing process steps
15 fixed frame
16 Tin Powder Feeder
160 lower mouth
162 pressure source
3 precision flat
32 top
322 Repositioning
4 sealed chamber
41 Hall 1
42 Hall 2
420 gas passage
43 Visual Aids
44 height measuring device
46 carrier
48 suction device
100 solder material application device
P stand
2C plate carrier
A1 tin powder preliminary preparation area
A2 Tin Powder Coating Work Area
A3 Ball Grid Array Work Area
A4 plate acquisition area
A5 plate feed area
1 Rx X-axis carrier
1Ry Y-axis carrier
2Rx X-Axis Carrier
2Ry Y-axis carrier
2Rr R-axis carrier
2Rz Z-Axis Carrier
3Ry Y axis moving carrier
4Rx, 4Ry Mobile Mount Module
5Ry Plate Trail Track
V visual module

Claims (20)

Providing a solder material furnace having an upper opening, loading the solder material in a molten state into the solder material furnace, and connecting the solder material furnace to a pressure source;
Providing a plate in said top opening of said solder material furnace, said plate having a plurality of perforations and a plurality of first stereomarkers;
Using the pressure source to form a plurality of solder material bumpers that project the molten solder material into the plate through perforations of the upper opening and the plate;
Providing a visual device to perform a size analysis step, and when the size of the solder bumpers reaches a predetermined value, the pressure source stops pressurizing;
Providing a workpiece, molding a plurality of conductive fillers and a plurality of second positioning marks on the work piece, and advancing the plate and the workpiece in opposition using the first positioning mark and the second positioning mark, Directing the conductive filler toward the solder bumper; And,
And contacting the conductive filler with the solder material bumper to move the solder material bumper onto the conductive filler. The method of claim 1,
And a furnace temperature of the solder material furnace in the step of providing the solder material furnace having the top opening is applied to the conductive filler of the wafer having the same melting point of the solder material. 3. The method of claim 2,
In the step of providing the solder material furnace having the upper opening, the pressure source is a pump, the manufacturing method of the solder material is applied to the conductive filler of the wafer to install a control valve between the solder material furnace and the pump. The method of claim 1,
In the step of providing the workpiece, a heating step for heating the workpiece and a suction head are used to place the workpiece after heating on the plate and to direct the conductive filler to the solder bumper. A method of manufacturing a soldering material applied to a conductive filler of a wafer further comprising the step. 5. The method of claim 4,
In the step of providing the workpiece further comprises a positioning step, by using the visual device to obtain an image of the first stereo notation and the second stereo notation, the suction head is the plate by the image analysis result of the plate And a solder joint material applied to a conductive filler of a wafer having the workpiece as opposed to each other. Soldering material furnace with top opening;
A plate installed at the upper opening of the solder material furnace; And,
A conductive filler solder material applying device comprising a visual device and a suction head installed corresponding to an upper portion of the plate,
A solder material in a molten state is loaded in the solder material furnace, the solder material furnace is connected to a pressure source,
The plate has a plurality of perforations and a plurality of first orientation marks.
Apparatus for applying conductive filler solder material to a wafer. The method according to claim 6,
And a temperature of the solder material furnace is about the same as the melting point of the solder material. The method according to claim 6,
And the pressure source is a pump, and a control valve is further provided between the solder material furnace and the pump. The method according to claim 6,
And a visual device is a conductive filler solder material application device for a wafer that electrically connects the pressure source and the suction head. The method according to claim 6,
And a heating device connected to the solder material furnace and the workpiece. Providing a tin powder supply device having a lower opening, loading a solder material in a powder state into the tin powder supply device, and connecting the tin powder supply device to a pressure source;
Providing a plate beneath the lower opening of the tin powder supply device, the plate having a plurality of perforations and a plurality of first orientation marks;
Moving the precision flat plate to the bottom of the plate, and installing a plurality of material positioning marks on the top surface of the precision flat plate, and proceeding to oppose the plate and the precision flat plate using the first position marking and the material positioning mark. ;
Transmitting the powder solder material into the perforation of the plate so as to correspond to the top surface of the precision flat plate;
Providing a hermetically sealed chamber that sufficiently protects a gas, wherein the precision flat plate is moved into the hermetically sealed chamber;
Heating the precision flat to form the solder material into a solder material bumper in a molten state;
Providing a work piece, forming a plurality of conductive fillers and a plurality of second positioning marks on the work piece, and using the second positioning mark and the warping positioning mark to oppose the work piece and the precision flat plate, Directing the conductive filler toward the solder bumper; And,
Contacting the conductive filler with the solder bumper, and transferring the solder bumper onto the conductive filler, wherein the solder filler is applied to the conductive filler of the wafer. 12. The method of claim 11,
Heating the precision flat to form the soldering material into a soldering material bumper in a molten state, the temperature of which is applied to the conductive filler of the wafer having the same melting point as the soldering material. 12. The method of claim 11,
A method for producing a solder joint material applied to a conductive filler for a wafer wherein the protective gas of the hermetic chamber is formic acid or nitrogen. 12. The method of claim 11,
In the step of providing the work piece, the heated work piece is heated above the precision flat plate using a heating step and a suction head for heating the work piece, and the conductive filler is directed to the solder material bumper. A method of manufacturing a soldering material applied to a conductive filler of a wafer further comprising a step to make. 15. The method of claim 14,
In the providing of the workpiece, the method may further include a positioning step, wherein an image of the second positioning mark and the all-position positioning mark is obtained by using a visual apparatus, and the suction head is configured to perform the precision based on the image analysis result. A method for producing a solder joint material that is applied to a conductive filler of a wafer that runs on a flat surface and the workpiece in opposition. 12. The method of claim 11,
In the step of contacting the conductive filler to the solder material bumper, providing a height measuring device to apply the conductive filler of the wafer to measure the height of the workpiece relative to the top surface of the precision flat. Tin powder supply device for loading the solder material of the powder form and having a lower opening and connected to the pressure source;
A plate having a plurality of perforations and a plurality of first orientation marks, the plate being movable below the lower opening of the tin powder supply device;
A precision flat surface having a flat top surface and a heater to heat the top surface, wherein the top surface is provided with a plurality of material positioning markings and rides through the perforated powder form solder material;
A visual device for opposing the first stereotactic representation of the plate and the transposition stereoscopic representation of the precision flat;
An airtight steel chamber having a gas passage and accommodating the precision flat plate and the workpiece;
A suction device for sucking the workpiece, bringing a conductive filler into contact with the solder material bumper, and transferring the solder material bumper onto the conductive filler.
Electroconductive filler solder material coating apparatus of the wafer used to apply the soldering material to the plurality of conductive fillers of the workpiece. 18. The method of claim 17,
The plate is a conductive filler solder material coating apparatus for a wafer made of a steel sheet. 18. The method of claim 17,
The top surface of the precision flat plate is a conductive filler solder material coating apparatus of a wafer made of a ceramic material. 18. The method of claim 17,
And a height measuring device for measuring a height of the work piece corresponding to the height of the top surface of the precision flat plate.

Images