KR101328464B1 - Epoxy composition for PCB of LED illuminator and manufacturing method thereof - Google Patents
Epoxy composition for PCB of LED illuminator and manufacturing method thereof Download PDFInfo
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- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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Abstract
본 발명은LED 조명기 PCB기판용 조성물에 관한 것으로 보다 상세하게는 에폭시수지 20~40 중량부, 경화제 수지 13~22 중량부, 난연재 5~25 중량부, 가소성부여제 4~15 중량부, 평균비중이 0.05~1.0인 경량 실리카 5~20 중량부 및 평균입도가 1~50인 실리카 10~30 중량부의 혼합 조성물로 이루어지는 LED 조명기 PCB기판 에폭시 조성물에 관한 것이다. 본 발명을 통하여 기존 실리콘 몰딩재의 문제점을 해결하고 열전도성과 난연성을 부여함으로써LED 조명기의 광효율 증가, 수명연장 등의 효과를 향상시킬 수 있는 LED 조명기 PCB기판용 에폭시 조성물을 제공할 수 있다.The present invention relates to a composition for LED illuminator PCB substrate, more specifically, 20 to 40 parts by weight of epoxy resin, 13 to 22 parts by weight of hardener resin, 5 to 25 parts by weight of flame retardant, 4 to 15 parts by weight of plasticizer, average specific gravity The present invention relates to an LED illuminator PCB substrate epoxy composition comprising a mixed composition of 5 to 20 parts by weight of 0.05 to 1.0 light weight silica and 10 to 30 parts by weight of silica having an average particle size of 1 to 50. Through the present invention, it is possible to provide an epoxy composition for an LED illuminator PCB substrate which can improve the effects of increasing the light efficiency of the LED illuminator, extending the life, etc. by solving the problems of the existing silicon molding material and giving thermal conductivity and flame retardancy.
Description
본 발명은 LED 조명기 PCB기판용 몰딩재에 관한 것이다. 보다 상세하게는, LED 조명기 PCB기판용 에폭시 조성물 및 이의 제조방법에 관한 것이다.The present invention relates to a molding material for LED illuminator PCB substrate. More specifically, the present invention relates to an epoxy composition for LED illuminator PCB substrate and a method of manufacturing the same.
LED(발광다이오드, Light Emitting Diode) 조명기 부품인 PCB(인쇄 회로 기판, printed circuit board)기판의 몰딩 처리에 실리콘 몰딩재가 사용되고 있다. 하지만 실리콘 몰딩재는 고단가, 까다로운 사용조건 등의 이유로 국내에서는 사용이 미비한 실정이다.Silicon molding materials are used for molding processing of PCB (printed circuit board) substrates which are LED (Light Emitting Diode) illuminator components. However, silicone molding materials are inadequately used in Korea due to high cost and demanding usage conditions.
따라서, 국내 LED 조명기내 PCB기판 몰딩 공정의 생략으로 인해 내습 안정성 저하, 내충격 안정성 저하 및 낙뢰 충격에 의한 안정성 저하 등의 문제점이 발생하고 있으며, PCB기판의 높은 발열로 인한 화재가 발생될 수 있다.Therefore, problems such as lowering of moisture resistance stability, lowering impact stability, and lowering of stability due to lightning shock due to the omission of a PCB substrate molding process in a domestic LED illuminator may occur, and a fire may occur due to high heat generation of the PCB substrate.
위와 같은 문제점 때문에 실리콘 몰딩재보다 가격이 저렴하면서 전기적 특성이 우수하고 난연성, 고온시의 체적저항율, 내습성, 내열충격성 및 요변성 등의 특성이 요구되는 몰딩재가 절실히 필요한 실정이며 이러한 내용에 관해서 현재 한국특허 제 10-2004-0051243호, 제 10-2004-0117753호 및 제 10-2006-0008158호에 개시되어 있다. 따라서, 본원 발명의 발명자는 상기의 문제를 해결하기 위하여 본원 발명을 발명하였다. Due to the problems described above, molding materials that are less expensive than silicon molding materials and have excellent electrical characteristics and require properties such as flame resistance, volume resistivity at high temperatures, moisture resistance, thermal shock resistance and thixotropy are urgently needed. It is disclosed in Korean Patent Nos. 10-2004-0051243, 10-2004-0117753, and 10-2006-0008158. Therefore, the inventor of the present invention invented the present invention to solve the above problems.
LED 조명기 PCB기판용 실리콘 몰딩재의 고단가, 까다로운 경화조건 및 열전도성 등과 몰딩재 미적용 시 전기적, 물리적 충격 및 내습 안정성 저하 등의 문제점을 해결함과 동시에 열전도성을 부여하여 LED 조명기의 광효율 증가, 수명연장 등의 효과를 향상시킬 수 있는 LED 조명기 PCB기판용 에폭시 조성물을 제공하는데에 목적이 있다.Soldering problems such as high unit cost of silicon molding materials for LED illuminator PCB substrates, difficult curing conditions and thermal conductivity, and deterioration of electrical, physical shock and moisture resistance when molding materials are not applied, and at the same time, increase thermal efficiency and increase the light efficiency of LED illuminators. An object of the present invention is to provide an epoxy composition for LED illuminator PCB substrate that can improve the effect of the extension.
일 구체예에서, 전체 조성물의 중량을 기준으로 비스페놀 A 수지 20~40 중량부, 싸이클로알리패틱 아민 13~22 중량부, 수산화알루미늄 5~25 중량부, 다이머산 변성 에폭시 수지 4~15 중량부, 평균비중이 0.05~0.5인 실리카 5~20 중량부 및 평균비중이 2.5~2.7인 실리카 10~30 중량부를 포함하는 LED 조명기 PCB기판용 에폭시 조성물을 제공한다.In one embodiment, 20 to 40 parts by weight of bisphenol A resin, 13 to 22 parts by weight of cycloaliphatic amine, 5 to 25 parts by weight of aluminum hydroxide, 4 to 15 parts by weight of dimer acid-modified epoxy resin, Provided is an epoxy composition for an LED illuminator PCB substrate comprising 5 to 20 parts by weight of silica having an average specific gravity of 0.05 to 0.5 and 10 to 30 parts by weight of silica having an average specific gravity of 2.5 to 2.7.
일 구체예에서, 전체 조성물의 중량을 기준으로 비스페놀 A 수지 20~40 중량부, 싸이클로알리패틱 아민 13~22 중량부, 수산화알루미늄 5~25 중량부, 다이머산 변성 에폭시 수지 4~15 중량부, 평균비중이 0.05~0.5인 실리카 5~20 중량부 및 평균비중이 2.5~2.7인 실리카 10~30 중량부를 혼합하여 LED 조명기 PCB기판용 에폭시 조성물을 제조하는 방법을 제공한다.In one embodiment, 20 to 40 parts by weight of bisphenol A resin, 13 to 22 parts by weight of cycloaliphatic amine, 5 to 25 parts by weight of aluminum hydroxide, 4 to 15 parts by weight of dimer acid-modified epoxy resin, 5 to 20 parts by weight of silica having an average specific gravity of 0.05 to 0.5 and 10 to 30 parts by weight of silica having an average specific gravity of 2.5 to 2.7 are provided to provide a method for producing an epoxy composition for an LED illuminator PCB substrate.
일구체예에서, 전체 조성물의 중량을 기준으로 비스페놀 A 수지 20~40 중량부, 싸이클로알리패틱 아민 13~22 중량부, 수산화알루미늄 5~25 중량부, 다이머산 변성 에폭시 수지 4~15 중량부, 평균비중이 0.05~0.5인 실리카 5~20 중량부 및 평균비중이 2.5~2.7인 실리카 10~30 중량부를 포함하는 조성물을 몰딩한 LED 조명기용 PCB 기판을 제공한다.In one embodiment, 20 to 40 parts by weight of bisphenol A resin, 13 to 22 parts by weight of cycloaliphatic amine, 5 to 25 parts by weight of aluminum hydroxide, 4 to 15 parts by weight of dimer acid-modified epoxy resin, Provided is a PCB substrate for LED illuminator molded with a composition comprising 5 to 20 parts by weight of silica having an average specific gravity of 0.05 to 0.5 and 10 to 30 parts by weight of silica having an average specific gravity of 2.5 to 2.7.
일 구체예에서, 에폭시수지는 특정 효과를 극대화시키기 위해서 도막물성 저하 없이 점도 저하를 통해 작업성 및 저황변성 효과 향상을 목적으로 특정 효과의 부여 및 증대를 시킬 수 있다.In one embodiment, the epoxy resin can be given and increased the specific effect for the purpose of improving the workability and low yellowing effect through the viscosity reduction without lowering the coating properties to maximize the specific effect.
본 발명의 에폭시 조성물은 실리콘 몰딩재의 고단가, 고온경화조건과 몰딩재 미적용 시 내습 안정성 저하, 내충격 안정성 저하 및 낙뢰 충격에 의한 안정성 저하 등의 문제점을 해결할 수 있다. 또한 열전도성과 난연성을 부여함으로써 LED 조명기의 광효율 증가, 수명연장 및 화재 예방의 효과를 얻을 수 있다.The epoxy composition of the present invention can solve problems such as high unit cost of silicone molding material, high temperature curing conditions and lowering of moisture resistance stability when no molding material is applied, impact resistance deterioration and stability deterioration due to lightning strike. In addition, by providing thermal conductivity and flame retardancy, it is possible to obtain the effect of increasing the light efficiency of LED illuminator, extending the life and preventing fire.
상기 구성에 따른 조성물의 특징을 보이는 배합구성 내용을 실시예를 통하여 하기와 같이 상세히 설명하였다. Formulation content showing the characteristics of the composition according to the above configuration was described in detail as follows.
실시예Example 1. One. LEDLED 조명기 Illuminator PCBPCB 기판 에폭시 조성물의 제조 Preparation of Substrate Epoxy Compositions
하기 표 1의 제조예에 따라 이루어진 조성물로 각각LED 조명기 PCB 기판에 몰딩 후 20~30℃에서 2시간 또는 40℃에서 4시간 조건에 경화하여 몰딩하였다.The molding according to the composition according to the preparation example of Table 1 after molding on the LED illuminator PCB substrate was cured and molded for 2 hours at 20 ~ 30 ℃ or 4 hours at 40 ℃.
상기 제조예에서, 제조예 8은 다이머산 변성 에폭시 수지, 평균비중 0.05 내지 0.5인 실리카((주)에스에이씨, 경량 실리카) 및 평균비중 2.5 내지 2.7인 실리카(한국 반도체 재료, 메가-실 C 시리즈)가 조성에서 빠져 있고, 제조예 9, 10, 및 11에서는 각각 평균비중 0.05 내지 0.5인 실리카, 평균비중 2.5 내지 2.7인 실리카 및 수산화알루미늄이 빠져있음을 알 수 있다.
In the above production example, Preparation Example 8 is a dimer acid-modified epoxy resin, silica (SM Co., Ltd., light weight silica) having an average specific gravity of 0.05 to 0.5 and silica (Korean semiconductor material, Mega-sil C series with an average specific gravity of 2.5 to 2.7) ) Is missing from the composition, and in Production Examples 9, 10, and 11, it can be seen that silica having an average specific weight of 0.05 to 0.5, silica having an average specific weight of 2.5 to 2.7, and aluminum hydroxide are missing.
실시예2Example 2 . . LEDLED 조명기 Illuminator PCBPCB 기판 에폭시 조성물의 효능 확인 Confirmation of the Efficacy of Substrate Epoxy Compositions
2-1. 조성물의 액상물성 및 2-1. Liquid properties of the composition and 도막물성Physical Properties 시험결과 Test result
[표 1] 제조예와 같은 조성물에 대한 액상물성 및 도막물성 시험결과를 [표 2]에 표시하였다. Table 1 shows the results of the liquid physical properties and the coating film properties of the composition as shown in Table 2.
업
성production
work
castle
시험항목 규격Test Item Standard
(1)점도: 20,000 ~ 100,000 cps (25) (KS M 3331), 규격 만족 시 O(양호)로 표시하고, 불만족 시 X(불량)로 표시함.(1) Viscosity: 20,000 ~ 100,000 cps (25) (KS M 3331), marked as O (good) when satisfied with the specification, and X (bad) when dissatisfied.
(2)요변성(Thixotropic index): 4.0 ~ 7.0 (25) (KS M 3331), 규격 만족 시 O(양호)로 표시하고, 불만족 시 X(불량)로 표시함.(2) Thixotropic index: 4.0 to 7.0 (25) (KS M 3331), marked as O (good) when satisfied with the specification, and X (bad) when dissatisfied.
(3)침전성 및 저장성: 120℃에서 4시간 또는 80℃에서 3일간 방치한 경우, 침전물 없을 시 O(양호)로 표시하고, 침전물 발생 시 X(불량)로 표시함.(3) Precipitability and shelf life: When left for 4 hours at 120 ° C or 3 days at 80 ° C, it is indicated by O (good) when there is no precipitate, and by X (bad) when precipitate is generated.
(4)소포성: 경화물 도막 표면 육안으로 확인하여, 경화물 기포 미발생 시 O(양호)로 표시하고, 기포 발생 시 X(불량)로 표시함.(4) Anti-foaming property: The surface of the cured product coating film is visually checked and marked with O (good) when no bubble of the cured product is generated and X (defect) when bubbles are generated.
(5)경도: 60~80 (Shore D) (KS M 3015), 규격 만족 시 O(양호)로 표시하고, 불만족 시 X(불량)로 표시함.(5) Hardness: 60 ~ 80 (Shore D) (KS M 3015), marked as O (good) when satisfied with the specification, and X (bad) when dissatisfied.
(6)유리전이온도(glass transition temperature): 40 ~ 60℃(DSC), 규격 만족 시 O(양호)로 표시하고, 불만족 시 X(불량)로 표시함.(6) Glass transition temperature: 40 ~ 60 ℃ (DSC), marked as O (good) when satisfied with the specification, and X (bad) when dissatisfied.
(7)열전도성: 0.5 ~ 3.0 W/mk. (ASTM D 5470), 규격 만족 시 O(양호)로 표시하고, 불만족 시 X(불량)로 표시함.(7) Thermal conductivity: 0.5 ~ 3.0 W / mk. (ASTM D 5470), marked as O (good) if satisfied, and X (bad) if not satisfied.
(8)난연성: V-0 ~ V-1 상당. (UL-94), 규격 만족 시 O(양호)로 표시하고, 불만족 시 X(불량)로 표시함.(8) Flame retardant: V-0 ~ V-1 equivalent. (UL-94), marked as O (good) when satisfied with the specification, and X (bad) when dissatisfied.
(9)저황변성: 육안으로 확인하여 O(양호)로 표시하고, 불만족 시 X(불량)로 표시함(KS M 3026).(9) Low yellowing: visually identified as O (good) and unsatisfactory as X (bad) (KS M 3026).
사기 제조예의 시험결과를 보면 제조예 1~6 조성물은 [표 2]와 같이 양호한 결과가 나타내었다. 따라서, 제조예 8 내지 11과 같이 특정 구성성분이 없거나, 제조예 7과 같이 상대적 중량비에 따라 그 효과가 다름을 알 수 있다.
Looking at the test results of the fraudulent production example, the production examples 1 to 6 showed good results as shown in [Table 2]. Accordingly, it can be seen that there is no specific component as in Preparation Examples 8 to 11, or that the effect is different depending on the relative weight ratio as in Preparation Example 7.
2-2. 조성물의 효과 비교2-2. Comparison of the effects of the composition
다음은 상기 제조예에서 설명한 조성물과 기존에 사용중인 실리콘을 LED 조명기 PCB기판용으로 사용한 경우 특성을 비교하였다. Next, when the composition described in the manufacturing example and the existing silicon in use for the LED illuminator PCB substrate was compared characteristics.
제조예 1 내지 6의 조성물로 LED 조명기 PCB 기판을 몰딩 후 20~30℃에서 2시간 조건에 경화시켜 몰딩하였다. 비교예는 메틸비닐 실리콘, 옥타메틸 사이클로테트라실록산, 헥사메틸 사이클로트리실록산 및 탄산칼슘으로 구성된 실리콘 몰딩재를 LED 조명기 PCB 기판에 몰딩 후, 100℃에서 2시간 조건에 경화하여 몰딩하였다.The LED illuminator PCB substrate was molded with the composition of Preparation Examples 1 to 6 and cured under 20 hours at 20 to 30 ° C. for molding. Comparative example A silicone molding material consisting of methylvinyl silicon, octamethyl cyclotetrasiloxane, hexamethyl cyclotrisiloxane and calcium carbonate was molded on an LED illuminator PCB substrate and then cured and molded at 100 ° C. for 2 hours.
상기 [표 3] 비교 시험결과와 같이, 본원발명의 제조예 1 내지 6를 LED 조명기 PCB기판에 사용한 경우, 비교예보다 점도가 낮고 상온경화형으로 작업성이 우수하였다. 또한 상기 조성물의 경화물에서도 난연성 및 열전도성에서 우수한 특성을 가지게 되어 LED 조명기의 기능을 더욱 향상시키는 것으로 나타났다.
As shown in the comparative test results of Table 3, Preparation Examples 1 to 6 of the present invention were used for LED illuminator PCB substrates, and were lower in viscosity than the comparative examples and were excellent in workability at room temperature curing. In addition, the cured product of the composition also has excellent properties in flame retardancy and thermal conductivity was shown to further improve the function of the LED illuminator.
이상에서 본 발명은 기재된 실시예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 자명하며, 이러한 변형 및 수정은 특허 청구범위에 속할 수 있다.
Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made within the technical scope of the present invention, and such modifications and modifications may belong to the claims.
Claims (6)
20 to 40 parts by weight of bisphenol A resin, 13 to 22 parts by weight of cycloamine amine, 5 to 25 parts by weight of aluminum hydroxide, 4 to 15 parts by weight of dimer acid-modified epoxy resin, and an average specific gravity of 0.05 to 20 parts by weight based on the total weight of the composition. PCB substrate for LED illuminator molding a composition comprising 5 to 20 parts by weight of 0.5 silica and 10 to 30 parts by weight of silica having an average specific gravity of 2.5 to 2.7.
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