KR101319749B1

KR101319749B1 - Light source device, and backlight, exposure apparatus and exposure method using the same

Info

Publication number: KR101319749B1
Application number: KR1020100128033A
Authority: KR
Inventors: 스스무 이시다; 도시오 데로우찌; 히데까즈 데즈까
Original assignee: 가부시키가이샤 히다치 하이테크놀로지즈
Priority date: 2009-12-16
Filing date: 2010-12-15
Publication date: 2013-10-17
Also published as: CN102182954B; KR20110068920A; JP2011128290A; CN102182954A; TW201143164A; TWI438942B

Abstract

A light source device in which the optical axis of the light emitting element and the optical axis of the optical component are accurately aligned on the substrate is realized at low cost.
The light source device of the present invention has the following configuration. The board | substrate 4 has the 1st electrode pad 411 and the 2nd electrode pad 412, The light emitting element 2 has the package which has the light output surface 21 and the 3rd electrode pad 26, and the said package The light emitting element chip accommodated in the inside of an optical component has the lens part 31, the pedestal part 32, and the bonding surface 33 formed in the pedestal part 32, and the lens part 31 is a light emitting element. The light emitting surface 21 of (2) is covered, and the first electrode pad 411 formed on the substrate 4 and the third electrode pad 26 formed on the light emitting element 2 are joined by solder 10. The 2nd electrode pad 412 formed in the board | substrate 4 and the bonding surface 33 formed in the pedestal part 32 of the optical component are joined by the solder 10.

Description

LIGHT SOURCE DEVICE, AND BACKLIGHT, EXPOSURE APPARATUS AND EXPOSURE METHOD USING THE SAME}

The present invention relates to a light source for illumination, and more particularly, to a light source device using LED as a light source, a backlight such as a liquid crystal display device using the same, an exposure apparatus, and an exposure method.

The light source module used for the light source device requires high-precision alignment and fixing between the LED on the substrate and the lens. In the prior art, the alignment aligns the optical axis of the LED and the optical axis of the lens by using a method of aligning the external shape of the LED fixed to the substrate and the position alignment guide of the lens unit, and then fixing the lens using an adhesive or solder. How to do was taken. In this method, since a lot of tact and cost are required for optical axis alignment and fixing of the lens, there is a problem that the productivity is lowered and the cost is increased.

In addition, as an example of a method for easily performing a high-precision alignment, an optical assembly structure and a method as shown in FIG. 12 (cross section) and FIG. 13 (top view) are disclosed in "Patent Document 1". The optical subassembly 10 includes a solder ball group 100 arranged in a ring shape formed on the substrate 4. The ring-shaped solder ball group 100 forms a female snap fitting member for accommodating the male snap fitting member. The solder ball group 100 is deposited on the circular solder pad 101 on the substrate 4.

The lens cap 102 is provided on the substrate 4 from above the die 103. The lens cap 102 is made of an optical material such as a heat-resistant optical material, and the lens cap 102 is a hollow cylindrical shape having a base 104 and a cylindrical outer surface 105. The base 104 includes a lens 106 (for example a collimator lens) on its surface side and / or a lens 107 (for example a converging lens) on its back side.

The cylindrical outer surface 105 forms a male snap fitting member to be accommodated by a female snap fitting member formed by the ring-shaped solder ball group 100. By these snap fitting members, the lens cap 102 is held on the substrate 4 so that the lenses 106/107 are aligned with the die 103. It is said that the lens cap 102 is fitted with the solder ball group 100 so that the outer surface 105 can be provided.

According to the optical subassembly 10 structure of this patent document 1, since the solder pad 101 is a member defined by photolithography, the solder ball 100 can be arrange | positioned correctly. In addition, the geometric center of each solder ball 100 is arrange | positioned near the geometric center of the solder pad 101. FIG. In the case where a plurality of solder balls 100 are used as an alignment reference, the difference between the solder balls and the solder pads is averaged, whereby the lens cap can be aligned with high precision and the lens cap can be held on the substrate.

Patent Document 1: Japanese Patent Application Publication No. 2005-321772

However, in this structure, since the lens cap is fitted in the solder ball group, there is a problem that the fixing strength to the substrate is not necessarily sufficient. As a method of improving the fixing strength in this structure, there is a method of increasing the fitting stress to the lens cap, but there is a reliability problem such that the lens cap is deformed at that time and the characteristics of the lens are deteriorated or the lens cap is broken. . Another problem arises in that correct alignment cannot be performed due to deformation from the spherical shape of the solder ball or deformation of the lens cap due to an increase in the fitting stress.

This invention solves the said conventional problem, and provides the LED light-emitting device which can perform optical axis alignment of a light emitting element and a lens by a simple method, and an LED light source device using the same. Specific means are as follows.

(1) A light source device in which a light emitting element and an optical component are disposed on a substrate, wherein the substrate has a plurality of first electrode pads and a plurality of second electrode pads, and the light emitting element has a light emitting surface and a plurality of third electrodes. A package having an electrode pad, wherein the package has a light emitting element chip, a wiring pattern, and a wire connecting the light emitting element and the wiring pattern therein, and the plurality of third electrode pads are electrically connected to the wiring pattern. And optically connected to the wiring pattern, wherein the optical component has a lens portion, a pedestal portion, and a plurality of bonding surfaces formed on the pedestal portion, and the lens portion is formed of the light emitting element. A plurality of first electrode pads formed on the substrate and the plurality of third electrode pads formed on the light emitting element are respectively joined by solder, The generated light source device characterized in that the plurality of joint surfaces and the plurality of second electrode pads formed on the base portion of the optical component is bonded by solder.

(2) When the area of the first electrode pad in the portion joined with the solder is SA and the area of the third electrode pad is SB, SA = SB (1 ± 0.2) The light source device as described in (1).

(3) When the area of the second electrode pad in the portion joined with the solder is SC and the area of the bonding surface formed in front of the pedestal is SD, SC = SD (1 ± 0.2). The light source device according to (1).

(4) The light source device according to any one of (1) to (3), wherein the lens and the pedestal are integrally formed.

(5) The light source device according to any one of (1) to (3), wherein the optical component has a structure in which a cutout is formed in the pedestal and the lens is fitted into the cutout. .

(6) An exposure apparatus having a light source unit having a plurality of light source devices, an optical system for controlling an optical path of light from the light source unit, and a table on which a workpiece is loaded and movable in at least one direction, each of the plurality of light source devices Silver is comprised by the light source apparatus as described in (1), The exposure apparatus characterized by the above-mentioned.

(7) The exposure apparatus according to (6), wherein the plurality of light source devices in the light source unit are cooled by a water cooling jacket.

(8) An exposure method using an exposure apparatus for exposing a workpiece coated with a photosensitive agent through a mask, wherein the exposure apparatus includes a light source unit having a plurality of light source devices and an optical path for controlling light paths of light from the light source unit. An exposure apparatus having a table on which a system and a work piece are mounted and movable in at least one direction, wherein each of the plurality of light source devices is configured by the light source device according to claim 1.

(9) When the time of the exposure process which exposes the said workpiece | work is set to t1, and in the said exposure process, when the light emission time of the said some light source device is set to t2, it is t2 <t1 to (8) characterized by the above-mentioned. Described exposure method

(10) A backlight comprising a light emitting element, the light emitting element and an optical component disposed on a substrate, wherein the substrate has a first electrode pad and a second electrode pad, and the light emitting element includes a light emitting surface and a third electrode pad. And a light emitting element chip housed inside the package, wherein the optical component has a light guide plate, a pedestal portion, and a bonding surface formed on the pedestal portion, and a side surface of the light guide plate is the light emitting surface of the light emitting element. And light emitted from a main surface of the light guide plate, wherein the first electrode pad formed on the substrate and the third electrode pad formed on the light emitting element are bonded by solder, and the second electrode pad formed on the substrate And the joining surface formed on the pedestal portion of the optical component are joined by soldering.

According to the present invention, the optical axis of light emitting elements such as LEDs and the optical axis of optical parts such as lenses can be easily and precisely aligned, and a high-performance light source device can be manufactured at low cost.

In addition, in the manufacturing process, it is possible to mount light emitting elements such as LEDs and optical components together on the substrate using a conventional solder reflow process, so that it is not necessary to introduce new manufacturing equipment. For this reason, manufacturing cost can be held down.

In addition, since the optical component and the light emitting element such as the LED can be installed on the substrate by the reflow process at the same time, the manufacturing time is greatly shortened. In addition, even when mounting a large number of light emitting elements such as LEDs and optical components on a substrate, the solder reflow step is carried out in a batch so that the optical axes can be aligned, and thus the time required for the alignment of the axes can be significantly shortened.

BRIEF DESCRIPTION OF THE DRAWINGS Sectional drawing which shows the structural example in 1st Example of the LED light source device of this invention.
2 is a perspective view of the LED 2 according to the first embodiment.
3 is a cross-sectional view of the optical component 3 in the first embodiment.
4 is a top view of the optical component 3 in the first embodiment.
5 is an explanatory view of a junction of a first embodiment of the present invention.
6 is a cross-sectional view showing a configuration example in a second embodiment of the LED light source device of the present invention.
7 is a top view illustrating a configuration example in the second embodiment.
8 is a cross-sectional view showing a configuration example in a third embodiment of the LED light source device of the present invention.
9 is an overall view of an exposure apparatus according to a fourth embodiment of the present invention.
10 is an exposure condition of an exposure apparatus according to a fourth embodiment of the present invention.
11 is a cross-sectional view showing a configuration of a conventional LED backlight module.
12 is a top view showing another configuration of a conventional LED light source device.

EMBODIMENT OF THE INVENTION Below, the light source device of this invention, the backlight device using this light source device, the exposure apparatus, and the exposure method are demonstrated in detail using an Example.

[First Embodiment]

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows the structural example in 1st Example of the LED light source device of this invention. In FIG. 1, the LED light source device 1 includes a lens unit 31 having a lens function disposed so as to cover an LED 2 as a light emitting element and an upper portion of the light emitting surface 21 of the LED 2. And a substrate joined by the solder 10 on the lower surface of the LED 2 and the optical component 3 constituted by the pedestal portion 32 having a bonding surface 33 connected to the substrate by soldering. 4) is provided.

2 shows a perspective view of the LED 2. In the LED 2, an LED element chip 22 having a size of 0.3 mm to 2 mm is accommodated in a package on one side that emits ultraviolet light of 250 nm to 430 nm. The package 24 is made of a ceramic or a mold resin, has a size of 0.5 mm to 20 mm on one side, and has a recess inside, and the LED element chip 22 is fixed to the bottom by solder or an adhesive. The LED element chip 22 is connected to the wiring pattern 25 provided in the package 24 via the Au connection wire 23. The light exit surface of the package 24 is covered with transparent glass, and a hermetic seal is performed.

The back surface of the package 24 has, for example, an LED side electrode pad 26 electrically connected to the wiring pattern 25 by a through hole or the like. One magnitude | size of the LED side electrode pad 26 formed in the back surface of a package is x1 = 1mm, y1 = 6mm, for example in FIG.

The electrode pad 26 may not be electrically connected to the wiring pattern 25. This is provided for the purpose of the so-called heat spreader provided for the purpose of efficiently passing the heat generated by the LED element chip 22.

Although the example of LED of ultraviolet light emission was shown in FIG. 2, it is possible to take the structure similar to FIG. 2 also in visible light emission and infrared light emission LED. Transparent resins, such as silicone, an epoxy, and acrylic, may be enclosed in the recessed part of the package 24.

In the present embodiment, an example in which the Au connection wires 23 are used for the electrical bonding between the LED element chip 22 and the wiring pattern 25 is shown. However, the electrode faces of the LED element chip 22 face the package side. There is also a case of a so-called flip chip type LED element chip 22.

In FIG. 3, the cross section of the optical component 3 is shown, and the top view of the optical component 3 is shown in FIG. 3 is a cross-sectional view taken along the line A-A of FIG. The optical component 3 is made of a transparent material of transparent resin such as glass, silicone, acrylic, epoxy, or the like. A transparent material refers to the material whose transmittance | permeability is 50% or more with respect to the light emission wavelength of an LED element. Therefore, since the transparent material differs according to the light emission wavelength of an LED element, it is possible to use the material shown above as an optical component.

The optical component 3 is comprised by the lens part 31 which has a lens function, the four pedestal part 32 which supports the lens part 31, and the junction part 33 joined with the board | substrate 4. As shown in FIG. In the optical component 3, the lens portion 31 and the pedestal portion 32 are produced by molding at the same time. The end of the pedestal 32 is covered with a metal (Ni, Ti, Pt, Pd, Au, Ag, Sn, Cu) or the like that can be soldered with a thickness of 0.1 μm or more by film forming means such as plating, vapor deposition, sputtering, or the like. It has a face 33. In the present embodiment, the number of the support pillars of the pedestal 32 is illustrated four cases, but the number of the support pillars is not limited thereto. However, it is preferable that the support column is arrange | positioned in the position with high symmetry in a top view.

The board | substrate 4 is comprised by the multiple layer of base materials, such as glass epoxy, a metal (Cu, Al, Fe), polyimide, etc., and the board | substrate is located in the position where LED electrode pad 26 is arrange | positioned besides wiring on the board | substrate surface. It has the electrode pad 411 and has the board | substrate electrode pad 412 in the position where the bonding surface 33 of the optical component 3 is mounted and fixed. Since the board solder pad 411 and the board solder pad 412 provided on the board | substrate 4 are produced by the photolithographic method, it can be created with a positional precision of about 10 micrometers.

Fig. 5 is an explanatory view of a junction for explaining a method of aligning an optical element according to the first embodiment of the present invention. One configuration example is shown.

The method of aligning the optical axis 27 of the LED and the optical axis 34 of the lens unit includes the electrode pads 26 on the LED side via the solder balls 10 for bonding on the electrode pads 26 of the substrate. At the time of bonding, the substrate side electrode pad 411 and the LED side electrode pad 26 are aligned using the surface tension of the molten solder ball 10, and the substrate side electrode pad 412 and the optical component are aligned. It is characteristic that the alignment of the joining surface 33 of (3) is performed by the self-alignment mounting method.

Positioning accuracy according to the self-alignment effect is 10 when the ratio S1 / S2 of the area S1 of the substrate-side electrode pad 411 and the area S2 of the LED-side electrode pad 26 is within 1 ± 0.2. Position alignment is possible with a precision of μm. Similarly, the alignment accuracy according to the self-alignment effect in the optical component is the ratio (S1 / S2) of the area S1 of the substrate-side electrode pad 412 and the area S2 of the bonding surface 33 of the optical component 3. The same is true for.

Therefore, the alignment accuracy d of the optical axis 27 of the LED 2 and the optical axis 34 of the lens portion 31 of the optical component 3 is 10 µm and the solder ball 10 of the electrode alignment on the substrate. 14 micrometers becomes possible from the square sum square root of the precision of 10 micrometers by the self-alignment effect of ().

In a manufacturing process, since the LED 2 and the optical component 3 can be mounted together on the board | substrate 4 using the conventional solder reflow process, it is not necessary to introduce new manufacturing equipment. For this reason, manufacturing cost can be held down.

In addition, since the optical component 3 and the LED 2 can be installed on the substrate 4 by the reflow process at the same time, the manufacturing time is greatly shortened. Further, even when mounting a large number of LEDs 2 and optical components 3 on the substrate 4, the optical axis alignment can be performed through the solder reflow process in a batch, thereby greatly reducing the time required for the alignment of the axes. It is possible to shorten.

In addition, in this specification, a solder ball contains not only ball-shaped solder but bump-type, other, lump-shaped solder of various shapes, and includes all types of solder used for flip chip joining. It is.

Moreover, although the example which fixed the solder ball on the electrode pads 411 and 412 on the board | substrate 4 on the board | substrate 4 was shown previously, the bonding surface of the electrode pad 26 on the LED2 side or the optical component 3 is shown. The solder ball 10 may be fixed to 33.

In the above description, the case where one lens portion 31 exists in the optical component 3 is shown. However, in the case where a plurality of lens portions are formed as lens arrays in the portion of the lens portion 31 shown in FIG. Included.

[Second Embodiment]

6 is a cross-sectional view showing a configuration example in the first embodiment of the LED light source device of the present invention. When the optical member 3 shown in FIG. 3 is comprised from the material which mold molding, such as quartz glass, is difficult, processing of the base 32 as shown in 1st Example is difficult. In such a case, it is necessary to configure the pedestal as an individual member.

In the present embodiment, the lens portion 301 of the optical component 30 is made of high melting point glass such as quartz or synthetic quartz, and the pedestal 302 is made of ceramic or metal. Although the lens part 301 shows the one side convex lens in FIG. 6, since a lens shape is designed from the optical limitation of an LED light source device, it does not restrict to a one side convex lens.

The pedestal 302 is made of a metal material composed of iron, copper, brass, titanium, nickel, aluminum, or the like, ceramics such as alumina, aluminum nitride, silicon carbide (SiC), heat-resistant resin, or the like. The pedestal 302 has a cutout portion 302a for fixing the lens 301, and a joining surface 33 joined to the electrode pad 412 and the solder 10 of the substrate 4. The joining surface 33 is joined by forming an alloy layer with a part of the solder 10. As a result, the pedestal 302 can be fixed to the electrode pad 412 of the substrate 4.

Next, the fixing method to the pedestal 302 of the lens 301 will be described.

A predetermined amount of solder balls are loaded on the electrode pad 411 and the electrode pad 412 provided on the substrate 4 by a solder printing process. The LED 2 and the pedestal 302 are temporarily placed in a predetermined position by the mounter.

In addition, the lens 301 is temporarily placed in accordance with the cutout 302a on the pedestal 302.

The solder ball is melted and solidified by a normal reflow process, and the high precision positioning of the LED 2 and the pedestal 302 can be performed by the self-alignment effect.

In the reflow process, above the melting temperature of the solder, since the substrate 4 made of glass epoxy or the like is high temperature, the inter-land distance L is larger than the inter-land distance at room temperature due to thermal expansion.

When the substrate temperature decreases, the solder solidifies, and the pedestal 302 is fixed to the substrate side electrode land position. As the temperature of the substrate 4 decreases, the inter-land distance L on the substrate, which has been widened due to thermal expansion, becomes small, so that the installation distance L2 of the lens is also reduced.

For example, in the case of a glass epoxy substrate, the linear expansion coefficient of glass epoxy is about 30x10 <^-6> / K, when L is 10 mm, and when the maximum reflow temperature is 260 degreeC, at room temperature (20 degreeC), L shrinkage of about 75 μm occurs. The installation distance L2 of the lens is similarly reduced. On the other hand, the quartz glass has a coefficient of thermal expansion of 0.4 × 10 ⁻⁶ / K, so that the change in diameter of the lens 302 having a lens diameter of 10 mm at the maximum reflow temperature and room temperature is about 1 μm. Therefore, a force for fastening the lens 301 by the pedestal 302 is generated in the case of 75 µm-1 µm = 74 µm.

As described above, at room temperature, the lens is sandwiched between the pedestals, whereby fixing is possible. Since a board | substrate does not become above reflow temperature, a position does not shift or a lens falls by the lens 302 thermal expansion.

In the process described above, a new process does not need to be provided for the installation of the lens 301 and the pedestal 302 of the optical component 30, and there is no need of introducing a new device. In addition, alignment of the optical axis of the lens 301 and the optical axis of the LED 2 has a self-alignment effect of the solder ball between the electrode pad of the substrate side electrode pad and the pedestal 302 of the LED 2 as in the first embodiment. It is determined according to, so it is possible to align with high precision.

Third Embodiment

In the third embodiment, the light emitting surface of the LED is the case perpendicular to the electrode pad surface (side view LED). Such an LED light source device can be used, for example, as a backlight of a liquid crystal display device. 8 is a cross-sectional view showing a configuration example in a third embodiment of the LED light source device of the present invention. In FIG. 8, the LED light source device has the board | substrate 4, the LED 20 of the side view type of visible light emission, and the optical member 310. As shown in FIG.

The optical component 310 has a light guide plate 311, a pedestal portion 312, and a bonding portion 313. The light guide plate 311 is a member for surface illumination that has a function of light propagating light emitted from the LED 20 from the incident surface to the inside, and emitting light from one surface side in a predetermined direction.

The light incident surface of the light guide plate 311 needs to be aligned to the direction position where the amount of light introduced from the LED 20 is maximized. In FIG. 8, the light exit surface of the LED 20 is disposed toward the light incident surface side of the light guide plate 311. Light from the LED 20 incident from one side of the light guide plate is emitted evenly from the upper surface (main surface) of the light guide plate 311. In addition, a reflective layer is formed on the lower surface of the light guide plate 311 to direct light incident from the LED 20 toward the upper surface of the light guide plate 311.

The bonding surface 313 provided on the LED 20 and the pedestal portion 312 is precisely formed on the electrode pad 411 or the electrode pad 412 provided on the substrate 4 by the self-alignment effect of the solder 10. Position is determined. The pedestal part 312 is provided with a recess for fixing the end of the light guide plate 311, and the light guide plate 311 is fixed to the recess. Thereby, accurate position alignment of the light incident surface of the light guide plate 311 and the light emitting surface of the LED 20 is possible.

FIG. 8 shows a case where the backlight thus formed is used as the backlight of the liquid crystal display device. In FIG. 8, an optical film 710 such as a diffusion film is disposed on the light guide plate 311 of the backlight, and a liquid crystal display panel 700 is disposed thereon.

[Fourth Embodiment]

9 is a diagram showing a schematic configuration of an exposure apparatus according to a fourth embodiment of the present invention. The light source unit 500 that emits light is composed of a plurality of light source devices 1A, and each light source device 1A is provided in the water cooling jacket 501 in order to efficiently radiate heat. The wiring provided on the connection board | substrate of each light source device 1A is connected to the lighting power supply 502 which supplies electric power through a harness. The arrangement or inclination angle of the light source device 1A is designed so that the light emitted from the light source device 1A can be incident on the integrator 503 efficiently.

Light emitted from the integrator 503 is irradiated to the workpiece 506 to which a photosensitive agent such as a resist is applied through the collimator mirror 504 and the mask 505 so that the pattern formed on the mask 505 is formed by the workpiece ( 506 is exposed to the photosensitive agent. The table 600 loads a workpiece and is movable in at least one direction.

The exposure conditions to the light source device at the time of exposure are shown in FIG. In FIG. 10, 507 is an exposure time, 508 is an unexposed time, and 509 is an exposure process time. The exposure process in the exposure machine includes the time 508 that is not exposed, such as carrying in the workpiece, fixing the workpiece to a predetermined position, aligning the mask and the workpiece, exposing, releasing the workpiece, and carrying out the workpiece. do. The exposure step 509 requires 10 to 120 seconds, but the time 507 when light is actually exposed to the workpiece is approximately 1 to 10 seconds.

In the exposure machine using the conventional mercury lamp light source, since the temperature of a lamp fluctuates immediately after electricity supply to a mercury lamp, output brightness is not stabilized. It takes about 30 minutes for the lamp to stabilize. Therefore, in the conventional exposure process, the mercury lamp should always be energized and turned on in order to stabilize the emitted light intensity. However, in the LED light source, since the emitted light intensity is stabilized within a few milliseconds immediately after energization, in the exposure step, only the exposure time is supplied to the LED light source, so that the power consumption of the exposure machine can be significantly reduced.

1: LED light source device
2: LED
3, 30: optical components
4: substrate
10: solder ball
20: LED
21: Outgoing surface
22: LED element chip
23: Au connection wire
24: Package
25: wiring pattern
26: electrode pad
27: LED optical axis
31: lens unit
32: pedestal
33: joint surface
34: optical axis of the lens unit
301: lens unit
302: pedestal
302a: infeed
310: optical components
311 light guide plate
312: pedestal
313: junction
411 and 412: substrate side electrode pads
500: light source module group
501: cooling jacket
502: lighting power
503: integrator
504: collimator mirror
505: mask
506: work piece
507: exposure time
508: time that is not exposed
509 exposure time
d: position alignment precision
L: distance between lands

Claims

It is a light source device which arrange | positioned the light emitting element and the optical component on the board | substrate,
The substrate has a plurality of first electrode pads and a plurality of second electrode pads,
The light emitting element has a package having a light emitting surface and a plurality of third electrode pads,
The package has a light emitting element chip, a wiring pattern, and a wire connecting the light emitting element and the wiring pattern therein,
The plurality of third electrode pads include those electrically connected to the wiring patterns and those not electrically connected to the wiring patterns,
The optical component has a lens portion, a pedestal portion, and a plurality of bonding surfaces formed on the pedestal portion,
The lens unit covers the light emitting surface of the light emitting element,
The plurality of first electrode pads formed on the substrate and the plurality of third electrode pads formed on the light emitting device are respectively bonded by solder,
The said 2nd electrode pad formed in the said board | substrate, and the said joining surface formed in the said base part of the said optical component are joined by soldering, The light source apparatus characterized by the above-mentioned.

The method of claim 1,
When the area of the first electrode pad in the portion joined with the solder is SA and the area of the third electrode pad is SB, SA = SB (1 ± 0.2). .

The method of claim 1,
When the area of the second electrode pad in the portion joined with the solder is SC and the area of the bonding surface formed in front of the pedestal is SD, SC = SD (1 ± 0.2), Light source device.

4. The method according to any one of claims 1 to 3,
The said optical component WHEREIN: The said light source and the said base part are formed integrally, The light source apparatus characterized by the above-mentioned.

4. The method according to any one of claims 1 to 3,
The said optical component WHEREIN: The notch part is formed in the said pedestal part, and has a structure which the said lens was inserted in the said notch part, The light source apparatus characterized by the above-mentioned.

It is an exposure apparatus which has a light source part which has a some light source device, the optical system which controls the optical path of the light from the said light source part, and the table which loads a workpiece | work and moves at least in one direction,
Each of the said light source apparatus is comprised by the light source apparatus of Claim 1, The exposure apparatus characterized by the above-mentioned.

The method according to claim 6,
The said some light source apparatus in the said light source part is cooled by the water cooling jacket, The exposure apparatus characterized by the above-mentioned.

It is an exposure method which exposes the workpiece | work with application | coating with a photosensitive agent through a mask using an exposure apparatus,
The exposure apparatus is an exposure apparatus including a light source unit having a plurality of light source devices, an optical system for controlling an optical path of light from the light source unit, a table on which a workpiece is loaded and movable in at least one direction,
Each of the said plurality of light source devices is comprised by the light source device of Claim 1, The exposure method characterized by the above-mentioned.

9. The method of claim 8,
T2 <t1, when the time of the exposure process which exposes the said workpiece | work is made into t1, and the light emission time of the said some light source device is set to t2 in the said exposure process, It is characterized by the above-mentioned.

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