JP2006202998A - Optoelectric transducer module and manufacturing method for composite molded form used therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optoelectric-transducer module having an extremely excellent economical efficiency, resisting a high temperature in the case of the mounting of a solder bump for an electrical connection between an optoelectric transducer and a molded form with an electric wiring, having a high mechanical strength, and having a reliability regarding the optoelectric-transducer module packaging the optoelectric transducer and an optically coupled element. <P>SOLUTION: The molded form 3 with a molding lens 3a is mounted on the front of a lightemitter 2 for a surface lightemitter 1, and outgoing beams are extracted as parallel beams L. The electric wiring 4 is provided on a rear side facing the surface light-emitting laser 1 for the molded form 3. Electric pads 5 and 7 are connected by a bump 6, and connected electrically to an intermediate board 9 and a laser driver circuit 8 by the electric pad 10. The molded form 3 is positioned at a printed board with a high accuracy by the solder bump 12, and fixed. A distance H2 up to the top face 3e of the module is made sufficiently larger than that H1 from the surface of the light-emitting section 2 to the upper section of the molding lens 3 and a strength is ensured. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a photoelectric conversion module for entering and exiting light used for optical transmission.

Photoelectric conversion elements, electronic circuit elements, photoelectric conversion element modules that package optical coupling elements, or photoelectric conversion element packages (also referred to as OE-MCM) that become multichip modules are photoelectric conversion elements, optical coupling elements, optical mounting A substrate, a driver electronic circuit element for a light emitting photoelectric conversion element, an amplifying electronic circuit element for a light receiving photoelectric conversion element, a logic electronic circuit element, and a package, a terminal, an MCM substrate, and the like for sealing them all.
In the configuration of a conventional photoelectric conversion element package, a photoelectric conversion element, an electric circuit element, and peripheral components are mounted on the same component (see, for example, Patent Document 1). According to this document, in a photoelectric conversion element package, a component having a connector configuration, and a photoelectric conversion element, an electric circuit element, and peripheral components whose positions are adjusted with respect to the component are molded by a molding member. As a result, it is possible to achieve a smaller size and lower price than a conventional photoelectric conversion element package using hermetic sealing of metal.
In the present invention, the photoelectric conversion element means both an element that converts an optical signal into an electric signal and an element that converts an electric signal into an optical signal.

However, in Patent Document 1, in order to optically couple an external optical fiber and a photoelectric conversion element with high efficiency, high-accuracy optical mounting is required. Therefore, a part of the external optical fiber is directly inserted into a mold member. And the external optical fiber cannot be attached or detached. For this reason, it is difficult to use a solder reflow furnace for electrical joining in mass production for mounting this photoelectric conversion element package on a printed circuit board, and only small-scale production by robot soldering or manual soldering is possible. Furthermore, it cannot be used for a device in which connection work by a connector is indispensable at the time of in-device assembly as in inter-board optical transmission.
Also, instead of inserting this optical fiber, the optical connector can be directly inserted into the mold member and integrated, so that the photoelectric conversion element package and the external optical fiber can be detached.

JP 2000-228555 A

The present invention has been made in view of the above-described problems, and an object of the present invention relates to a photoelectric conversion element module in which a photoelectric conversion element and an optical coupling element are packaged. Is to provide.
More specifically, the first problem of the present invention is that while using materials that are economical as materials and molding costs, it is possible to achieve mounting that is economical with reduced required accuracy and assembly process. The object is to realize a photoelectric conversion element module.
The second object of the present invention is to realize a photoelectric conversion element module that can withstand high temperatures when solder bumps are mounted for electrical connection between a photoelectric conversion element and a molded body having electric wiring.
The third object of the present invention is to realize a photoelectric conversion module having high mechanical strength and reliability.

In the invention according to claim 1, a molded body made of a polymer-containing material having a photoelectric conversion element, an electric wiring joined to the electrode of the photoelectric conversion element, and an optical coupling element that performs optical coupling with the photoelectric conversion element; In the photoelectric conversion module including the electrical joint portion, the optical coupling element is a lens, and the exit surface of the lens is closer to the photoelectric conversion element than the upper surface of the module, and the distance from the photoelectric conversion element is substantially equal to the lens diameter. It is set apart from the above, and a lens hole is formed between the module upper surface and the lens exit surface.
According to a second aspect of the present invention, in the photoelectric conversion module according to the first aspect, at least the lens portion of the molded body is made of a material that is transparent to the wavelength of light used in the photoelectric conversion element. It is characterized by that.

According to a third aspect of the present invention, in the photoelectric conversion module according to the second aspect, the lens is convex toward the upper surface of the module.
According to a fourth aspect of the present invention, in the photoelectric conversion module according to the first or second aspect, the wavelength of light used for the photoelectric conversion element in a lens hole formed between the module upper surface and the lens exit surface. On the other hand, a substantially transparent resin material is filled.

According to a fifth aspect of the present invention, in the photoelectric conversion module according to the fourth aspect, the lens is convex toward the upper surface of the module, and the refractive index of the resin material filled in the lens hole is that of the molded body. It is smaller than the refractive index.
According to a sixth aspect of the present invention, in the photoelectric conversion module according to the fourth aspect, the refractive index of the resin material that is concave toward the module upper surface and that fills the lens hole is greater than the refractive index of the molded body. It is characterized by being large.

According to a seventh aspect of the invention, in the photoelectric conversion module according to any one of the first to sixth aspects, a transparent cover member is disposed on the uppermost surface of the photoelectric conversion module.
According to an eighth aspect of the present invention, in the photoelectric conversion module according to any one of the first to seventh aspects, the molded body is a composite molded body in which the first and second molded bodies are integrated. The first molded body is made of a polymer-containing material that is opaque to the wavelength of light used in the photoelectric conversion element, has high heat resistance, and has low thermal expansion, and has a through hole in a portion facing the photoelectric conversion element. The second molded body is made of a transparent material integrated with the first molded body, and the lens is integrally formed.

The invention according to claim 9 is the photoelectric conversion module according to claim 8, wherein the first molded body is made of a material opaque to the wavelength of light used for the photoelectric conversion element.
In invention of Claim 10, in the manufacturing method of the said composite molded object of the photoelectric conversion module of Claim 8 or 9, among the 1st or 2nd molded objects, one molded object shape | molded previously. However, it is characterized in that it also serves as a part of a mold for the other molded body to be molded later.

According to the present invention, it is possible to realize a photoelectric conversion element module that can be mounted with excellent economic efficiency by using a material that is excellent in economic efficiency as a material and a molding cost, while reducing the precision and assembly process. Because it is based on molding technology, it can be manufactured in large quantities at low cost.
Regardless of the position of the lens integrally molded with the molded body, the thickness of the molded body can be arbitrarily set, the mechanical strength of the photoelectric conversion module molded body can be increased, and the module reliability is improved. To do.

FIG. 1 is a diagram for explaining a first embodiment of the present invention.
In the figure, reference numeral 0 is a photoelectric conversion module, 1 is a photoelectric conversion element, 2 is a light emitting part, 3 is a molded body made of a polymer-containing material, 4 is an electrical wiring, 5 is an electrode pad, 6 is a bump such as solder or gold. 7 is an electrode pad, 8 is a laser drive circuit, 9 is an intermediate substrate, 10 is an electrode pad, 11 is a bump, 12 is a bump, 13 is a printed circuit board, 14 is a heat transfer member, 15 is a lens hole, and H1 is a light emitting surface. The distance from the lens to the upper surface of the lens, H2 represents the distance from the light emitting surface to the upper surface of the molded body.
The case of a surface emitting laser (= VCSEL) is shown as the photoelectric conversion element 1, and the light emitting portion 2 of the surface emitting laser is a region at the center of the element. In the figure, the surface emitting laser 1 is shown as a cross-section of a part of the surface emitting laser 1 arranged in an array at a predetermined pitch in a direction perpendicular to the paper surface.
The molded body 3 covers the upper part of the surface emitting laser 1. On the molded body 3, the electrical wiring 4 provided on the inner surface, the molded lens 3a as an optical coupling element, the electrode pad 5 on the upper surface of the surface emitting laser element, and the bumps 6 of solder, gold, etc. are used. The protrusion 3b for connecting to the electrode pad 7 is integrally provided on the protrusion 3b. Corresponding to the array arrangement of the surface emitting lasers 1, the same number of molded lenses 3 a are arranged in an array at the same pitch.
The surface-emitting laser 1 is bonded to the molded body protrusion 3 b and the small-diameter bump 6. Further, the laser drive circuit 8 is connected to the electrode pad 10 on the intermediate substrate 9 by the bump 11 at the protrusion 3c at another location, and is electrically connected to the laser drive circuit 8.
The intermediate substrate 9 is connected to the printed circuit board 13 via the bumps 12 and exchanges signals with the signal processing circuit. The molded body 3 is also physically fixed to the printed circuit board 13 by the bumps 12 in the protrusion 3d. Further, in order to smoothly dissipate the surface-emitting laser 1 as necessary, a heat transfer member 14 is inserted between the element back surface of the surface-emitting laser 1 and the intermediate substrate 9 as necessary to generate heat from the laser element. 9 may dissipate heat.
The outgoing beam from the surface emitting laser 1 is collimated by a molding lens 3 a integrated with the molded body 3 and is emitted as a parallel beam L. The parallel beam L is closely connected to an optical fiber connector with a lens (not shown) to the molded body 3, and is coupled to the optical fiber by the lens in the connector and transmitted to the outside.

In the case of normal molding, the upper surface of the molded lens 3a and the other surface 3e of the molded body 3 are molded at substantially the same height. However, in the present invention, both are remarkably different.
Since the optical fiber array that optically couples with the photoelectric conversion element is usually 250 μm pitch, it is arranged in a one-dimensional direction to optically couple the optical fiber array and the photoelectric conversion element without using an extra element such as a pitch conversion element. The arrangement pitch of the molded lenses 3a and the photoelectric conversion elements in the array is usually set to 250 μm. When the molded lenses 3a are arranged closely in the arrangement direction, the diameter of each lens is substantially the same as the arrangement pitch of the optical fiber array.
When the arrangement pitch of the array is determined, the dimensions from the photoelectric conversion element to the lens surface are naturally determined, and the distance H1 between the light emitting surface and the lens surface of the surface emitting laser 1 which is a photoelectric conversion element is about 500 μm. Therefore, when the upper surface of the lens 3a and the upper surface 3e of the molded body 3 are substantially the same (H1≈H2), the thickness of the molded body is about 500 μm (0.5 mm). Even if a polymer-containing material is used as the molded body 3, the mechanical strength is not ensured if the thickness is thin, and the optical connector is mechanically coupled to the photoelectric conversion module to transmit light to the optical fiber, or When receiving light, the photoelectric conversion module is deformed, the optical arrangement is shifted, and the optical coupling efficiency is deteriorated.

For this reason, in the present invention, H2> H1, but H2 is set to several mm in order to ensure the mechanical strength as described above. By adopting this structure, even if the lens exit surface is only about 0.5 mm from the photoelectric conversion element, the upper surface of the molded body can be several mm or more, and an arbitrary dimension can be taken, and the molded body thickness H2 can be increased. Sufficient mechanical strength of the body can be ensured.
The specific thickness is determined by the balance with the width and length of the molded body, which is a design problem. For mechanical strength, it is better to make it thicker, but conversely, if this thickness is too thick, the so-called “sinking” at the time of cooling cannot be ignored in the case of resin molding, causing the lens position to fluctuate. become.
The lens diameter of the molded lens 3a is not necessarily the same as the arrangement pitch, as long as it has a size that can cover the light emitting angle or the light receiving angle of the photoelectric conversion element. In that case, the distance H1 between the light emitting surface and the lens surface may be smaller than 500 μm.
The emission angle of the semiconductor laser is about 30 ° as a full width at half maximum, and a numerical aperture NA of about 0.26 is sufficient to transmit all the light beams having this angle. In this case, H1 is about 1.8 times the lens diameter. Actually, in order to secure the amount of light, a light beam having a wider angle is taken in. Therefore, H1 may be made as small as the lens diameter.
In this way, a large step is inevitably formed between the upper surface 3e and the lens surface, so that a portion between them forms a tapered surface as shown in the figure to form a hollow lens hole 15. The reason for tapering the side surface of the hole is to prevent a part of the emitted light from the light emitting point from being reflected on the side surface and being mixed into the emitted parallel beam L as stray light.
Since the molded body can be directly formed by molding with a polymer-containing material that is transparent to the wavelength of light used in the photoelectric conversion element, the molded body can be integrated with the optical coupling element and the photoelectric element. The role of the mounting substrate structure of the conversion element and the function of mutual positioning of the optical coupling element and the photoelectric conversion element can be provided at the same time.

FIG. 2 is a diagram for explaining a second embodiment of the present invention.
In the figure, reference numeral 16 denotes a filling resin. In addition, in order to avoid complexity, only the main part is attached | subjected to the other code | symbol. The same applies to the following drawings.
If the lens hole 15 is left hollow, when used in a dusty environment or in an environment where condensation occurs, it cannot be easily cleaned when dirt or other material adheres to the lens surface. Problems such as rate reduction occur. Therefore, as shown in the figure, the lens hole 15 is filled with resin so that the hole and the other surface are at least substantially the same surface. Thereby, a highly reliable photoelectric conversion module can be provided. In the case where there is no concern about stray light from the light emitting portion, the lens hole may have a simple cylindrical shape as shown in FIG. However, in practice, not only the lens hole but also a certain degree of surface inclination (draft slope) is necessary due to the die-cutting relationship during molding.
The filling resin 16 can be any resin such as a UV curable resin or a thermosetting resin. An uncured resin may be injected into the lens hole 15 and cured by UV irradiation or heating. However, it is desirable that the refractive index difference between the refractive index of the filling resin and the refractive index of the molded body be as large as possible. This is because if the difference in refractive index is small, a shape having a very small radius of curvature of the lens is required, which makes molding difficult. As shown in the figure, when the molded lens 3 a is a convex lens having a convex shape toward the upper surface of the module, the refractive index of the filling resin must be smaller than the refractive index of the material of the molded body 3. On the contrary, when the refractive index of the filling resin 16 is larger, although not shown, it is necessary to form the molded lens into a concave concave lens facing the upper surface of the module.

FIG. 3 is a diagram for explaining a third embodiment of the present invention.
In the figure, reference numeral 17 denotes a transparent cover member.
In the second embodiment, even if the lens hole 15 is filled with resin, it is necessary to smooth the surface of the filling resin 16 with good flatness so that unnecessary aberration does not occur in the emitted parallel beam. However, smoothing the surface requires a certain level of smoothing technology, which is not easy.
Therefore, in this embodiment, after filling the lens hole with the uncured resin, the transparent cover member 17 having good flatness is loaded on the upper surface of the molded body, and this is irradiated with UV or heated to cure the filled resin and bond the cover member. Can be done at the same time. However, since the filling amount of the uncured resin is accompanied by an error, it is preferable to form a resin escape portion 3 f in the vicinity of the upper portion of the lens hole of the molded body 3. If the filling amount of the resin is slightly larger than the inner volume of the lens hole 15, the excess resin flows into the escape portion 3f, and the flatness of the light transmission portion is not impaired. The escape portion 3f is a groove having a cross section that does not hinder the flow of the resin, and communicates with the outside of the molded body.
By this method, the flatness of the parallel beam exit surface can be easily improved, and the deterioration of the coupling efficiency of the output beam to the optical fiber or the degradation of the coupling efficiency of the incident beam to the light receiving element can be suppressed. it can.
Also in the first embodiment, the cover member 17 is bonded to the upper surface of the molded body to prevent the hollow lens hole 15 from being exposed to the outside air and preventing dust or condensation from the outside air from being generated in the lens hole. You can also. The same applies to the following embodiments.

FIG. 4 is a diagram for explaining a fourth embodiment of the present invention.
In the figure, reference numeral 31 denotes a first molded body, and 32 denotes a second molded body.
In the present embodiment, the molded body is composed of two parts, a first molded body 31 and a second molded body 32, and the first molded body 31 on which the photoelectric conversion element 1 is mounted is the use of the photoelectric conversion element 1. The second molded body 32 that is molded from a polymer-containing material that is opaque to the light wavelength and includes the optical coupling element (molded lens) 32a is a composite integrated molded body that is molded from a transparent polymer-containing material. The other parts are the same as in FIG. Therefore, application of the second embodiment in which the lens hole is filled with resin is also possible.
Also in this case, the photoelectric conversion element and the first molded body are electrically connected with high positional accuracy by bumps via connection positioning protrusions provided on the opaque molded body.
The opaque polymer-containing material of the first molded body includes epoxy materials, polyimide materials, polycarbonate materials used as engineering plastics, polyphenylene sulfide materials, liquid crystal polymer materials, etc. Since a composite material of these and an inorganic filler substance can be used, the heat resistance is high, the coefficient of thermal expansion is relatively close to a semiconductor material such as a photoelectric conversion element, and heat treatment when connecting the photoelectric conversion element with bumps ( The heat resistance in the reflow process) and the generation of stress due to the difference in thermal expansion are suppressed, and highly accurate and highly reliable mounting becomes possible.

The molded lens 32a, which is an optical coupling element, is formed in advance in the through hole portion 31a of the opaque material molded body 31 with a transparent material integrated with the opaque material molded body 31. The optical mounting process between the optical coupling element and the photoelectric conversion element 1 can be eliminated by simply mounting the first molded body 31 made of the molded body once, and the mounting process is simplified. be able to. In addition, since it is integrated with the first molded body using an opaque molding material with excellent heat resistance, it is possible to reduce displacement due to heat deformation during bump mounting, and after electrical connection with the printed circuit board. Bump mounting with a reflow process can be performed as a process.
In the prior art, when a molded lens is separately made of a transparent polymer material, a transparent polymer substrate on which a molded lens is formed after the photoelectric conversion element is bump-mounted on a molded body using an opaque material in advance, or these Another transparent polymer substrate to which the molded lens substrate was bonded was aligned with high accuracy as optical mounting, and then bonded or bonded together, resulting in a very high mounting cost. .

5 to 9 are views showing a method for producing a composite molded body according to the fourth embodiment.
In each figure, reference numeral 40 is a composite molded body, 41 is a lower mold, 42 is a first upper mold, 43 is a second upper mold, 44 is a first molded body, and 45 is a second molded body. Show.
FIG. 5 is a view showing a mold for the first molded body. An injection port 41a is provided on the side surface of the lower mold 41, and a through hole is formed in the molded product by a column extending from the upper and lower molds near the center of the mold. The column 42a extending from the first upper mold 42 is preferably a tapered truncated cone. The reason is to prevent an extremely thin portion from being generated when forming the lens portion in a later process. In resin molding, if there is a sudden change in thickness, distortion of the molded product is likely to occur at that position, which is meaningful in preventing it.
In FIG. 6, an opaque polymer composite material is injected from a molding injection port 41a by injection molding or transfer molding to form a first molded body 44.
In FIG. 7, the first upper mold 42 is removed, and the second upper mold 43 is installed at that position. An injection port 43a is provided on the side surface of the second upper mold 43, and a truncated cone-shaped column having a concave tip is suspended substantially at the center, and the tip is formed from the upper surface of the first molded body. It extends to the bottom.
In FIG. 8, a transparent second molded body 45 including a molded lens as an optical coupling element is molded by injecting a transparent material from the injection port 43a. The first molded body 44 serves as a part of the mold, and the portion in close contact with the upper surface is integrated with the injected material.
FIG. 9 shows the composite molded body 40 in a state where all the molds are removed and unnecessary protrusions in the injection port portion are cut away. A composite molded body formed by such a procedure is also referred to as a continuous molded body. When this is mounted on the photoelectric conversion module, the molded lens is disposed on the photoelectric conversion element so as to be positioned in front.

In FIG. 7, since the second upper mold 42 can be positioned with high accuracy between the lower mold 41 and the molds, the second upper mold 42 becomes a mounting substrate for the photoelectric conversion element, and a projection for bonding positioning is formed. The opaque first molded body and the transparent second molded body obtained by integrally molding the optical coupling element can be positioned with high accuracy without the loading process of the optical coupling element.
Accordingly, the mutual position of the photoelectric conversion element and the optical coupling element can be positioned with high accuracy only by connecting and positioning the opaque first molded body to be the mounting substrate and the photoelectric conversion element by mounting using bumps. . Bump mounting has a highly accurate self-alignment effect, and positioning can be performed simply by performing normal electrical mounting (without performing active alignment or the like). In addition, since a plurality of molded bodies can be molded from a single mold, it is easy to mass-produce the molded body and the optical coupling element, and not only the material but also the manufacturing process is very economical. The molding is not limited to injection molding using a thermoplastic resin or the like, and a photo-curing resin, a thermosetting resin, or the like may be used.
Although not shown because it is self-evident, an equivalent composite molded body can be formed even by a molding procedure in which the second upper mold is the lower mold and the whole is turned upside down. However, in this case, the first upper mold is different from that shown in the figure, and the lower mold 41 and the first molded body 44 shown in the figure are combined, and the second upper mold is shown in FIG. It becomes the same shape as the lower mold. In either case, the molded body molded first also serves as a part of the mold for the resin molded later.

FIG. 10 is a diagram for explaining an example of light emitting elements arranged in an array.
The plurality of light emitters 2 are arranged in a line at equal intervals. Although the figure shows an example in which there are five light emitters 2, hundreds may be arranged as necessary.
The pitch and the lens diameter of the molded lenses 3a are substantially the same as the arrangement pitch of the light emitters 2. Therefore, the molded lenses 3a are closely arranged in the arrangement direction, and the lens holes 15 are the same. However, since the lens hole 15 expands upward in the figure, there is no partition between the lens holes.
Even if the partition wall is formed of a transparent material, the incident angle of the light beam from the illuminant 2 with respect to the normal to the partition wall surface is very large, so that it is substantially totally reflected and an effect of preventing crosstalk can be expected.
When the lens diameter of the molded lens 3a is configured to be smaller than the arrangement pitch, it is possible to form a partition between the lens holes. In that case, since the thickness of the partition wall becomes a size corresponding to the difference between the arrangement pitch and the lens diameter, when the difference is too small, the partition wall may not be provided due to a limitation in resin molding.

In the above embodiment, a molded lens has been described as an example of the optical coupling element. However, the present invention is not limited to this, and a diffractive lens, a micro Fresnel lens, or the like that can be formed by molding may be used.
The photoelectric conversion element (surface emitting laser, light receiving element) can be applied to a single element or an array element in which a plurality of elements are arranged in an array on the same substrate.
The array arrangement direction when the array element is applied is a direction perpendicular to the paper surface in each of FIGS.
In addition, the description has been made by taking a surface emitting laser as an example of the laser, but the present invention is not limited to this, and an edge emitting semiconductor laser or a surface emitting or edge emitting LED may be used.
In the composite molded body, the material of the first molded body can be formed of a transparent body when there is no need to block stray light from the surroundings when the photoelectric conversion element is a light emitter.

It is a figure for demonstrating the 1st Embodiment of this invention. It is a figure for demonstrating the 2nd Embodiment of this invention. It is a figure for demonstrating the 3rd Embodiment of this invention. It is a figure for demonstrating the 4th Embodiment of this invention. It is a figure which shows the preparation methods of the composite molded object of 4th Embodiment. It is a figure which shows the preparation methods of the composite molded object of 4th Embodiment. It is a figure which shows the preparation methods of the composite molded object of 4th Embodiment. It is a figure which shows the preparation methods of the composite molded object of 4th Embodiment. It is a figure which shows the preparation methods of the composite molded object of 4th Embodiment. It is a figure for demonstrating an example of the light emitting element arranged in the array form.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Photoelectric conversion element 2 Light emission part 3 Molded object 4 Electrical wiring 8 Laser drive circuit 9 Intermediate board 13 Printed circuit board 16 Filling resin 17 Cover part

Claims (10)

  Photoelectric conversion comprising a photoelectric conversion element, an electric wiring joined to the electrode of the photoelectric conversion element, a molded body made of a polymer-containing material having an optical coupling element that performs optical coupling with the photoelectric conversion element, and an electric junction portion In the module, the optical coupling element is a lens, the exit surface of the lens is closer to the photoelectric conversion element than the upper surface of the module, and is set apart from the photoelectric conversion element by a distance equal to or greater than the lens diameter, A photoelectric conversion module, wherein a lens hole is formed between the module upper surface and the lens exit surface.   2. The photoelectric conversion module according to claim 1, wherein at least the lens portion of the molded body is made of a material transparent to a wavelength of light used for the photoelectric conversion element.   The photoelectric conversion module according to claim 2, wherein the lens is convex toward the upper surface of the module.   3. The photoelectric conversion module according to claim 1, wherein a resin material substantially transparent to a wavelength of light used in the photoelectric conversion element is formed in a lens hole formed between the upper surface of the module and the lens emission surface. A photoelectric conversion module characterized by being filled.   5. The photoelectric conversion module according to claim 4, wherein the lens is convex toward an upper surface of the module, and a refractive index of a resin material filled in the lens hole is smaller than a refractive index of the molded body. A photoelectric conversion module.   5. The photoelectric conversion module according to claim 4, wherein the lens is concave toward an upper surface of the module, and a refractive index of a resin material filled in the lens hole is larger than a refractive index of the molded body. A photoelectric conversion module.   7. The photoelectric conversion module according to claim 1, wherein a transparent cover member is disposed on the uppermost surface of the photoelectric conversion module.   8. The photoelectric conversion module according to claim 1, wherein the molded body is a composite molded body in which the first and second molded bodies are integrated, and the first molded body is heat resistant. Is made of a polymer-containing material having a high thermal expansion, a hole structure serving as a through hole is provided in a portion facing the photoelectric conversion element, and the second molded body is a transparent body integrated with the first molded body A photoelectric conversion module made of a material, wherein the lens is integrally formed.   The photoelectric conversion module according to claim 8, wherein the first molded body is made of a material that is opaque with respect to a wavelength of light used for the photoelectric conversion element.   The method for producing the composite molded body of the photoelectric conversion module according to claim 8 or 9, wherein, among the first or second molded bodies, one molded body that has been molded first is the other molded body that is molded later. A method for producing a composite molded body, which also serves as a part of a mold for the molded body.

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