KR101319634B1 - 포토마스크용 기판, 포토마스크, 포토마스크의 제조 방법 및 패턴 전사 방법 - Google Patents
포토마스크용 기판, 포토마스크, 포토마스크의 제조 방법 및 패턴 전사 방법 Download PDFInfo
- Publication number
- KR101319634B1 KR101319634B1 KR1020120037850A KR20120037850A KR101319634B1 KR 101319634 B1 KR101319634 B1 KR 101319634B1 KR 1020120037850 A KR1020120037850 A KR 1020120037850A KR 20120037850 A KR20120037850 A KR 20120037850A KR 101319634 B1 KR101319634 B1 KR 101319634B1
- Authority
- KR
- South Korea
- Prior art keywords
- photomask
- pattern
- main surface
- transfer
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 109
- 238000004519 manufacturing process Methods 0.000 title claims description 36
- 238000000034 method Methods 0.000 title claims description 27
- 238000012546 transfer Methods 0.000 claims abstract description 90
- 239000010408 film Substances 0.000 claims description 71
- 230000007261 regionalization Effects 0.000 claims description 17
- 238000005259 measurement Methods 0.000 claims description 15
- 239000012788 optical film Substances 0.000 claims description 11
- 238000000059 patterning Methods 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 5
- 238000011161 development Methods 0.000 claims description 4
- 230000018109 developmental process Effects 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 15
- 230000015572 biosynthetic process Effects 0.000 description 12
- 239000004973 liquid crystal related substance Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 230000009466 transformation Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000036632 reaction speed Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000013518 transcription Methods 0.000 description 1
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- 238000002834 transmittance Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/46—Antireflective coatings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/60—Substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2011-088782 | 2011-04-13 | ||
JP2011088782 | 2011-04-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20120116877A KR20120116877A (ko) | 2012-10-23 |
KR101319634B1 true KR101319634B1 (ko) | 2013-10-17 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020120037850A KR101319634B1 (ko) | 2011-04-13 | 2012-04-12 | 포토마스크용 기판, 포토마스크, 포토마스크의 제조 방법 및 패턴 전사 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5937409B2 (ja) |
KR (1) | KR101319634B1 (ja) |
CN (1) | CN102736402B (ja) |
TW (1) | TWI456269B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5970021B2 (ja) * | 2013-08-20 | 2016-08-17 | Hoya株式会社 | フォトマスクの製造方法、描画装置、フォトマスクの検査方法、フォトマスクの検査装置、及び表示装置の製造方法 |
WO2018020994A1 (ja) * | 2016-07-27 | 2018-02-01 | Hoya株式会社 | マスクブランク用基板の製造方法、マスクブランクの製造方法、転写用マスクの製造方法、半導体デバイスの製造方法、マスクブランク用基板、マスクブランク及び転写用マスク |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050012687A (ko) * | 2003-07-25 | 2005-02-02 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 포토마스크 블랭크용 기판의 선정방법 |
JP2010078769A (ja) | 2008-09-25 | 2010-04-08 | Shin-Etsu Chemical Co Ltd | フォトマスクブランクスの選択方法及び製造方法並びにフォトマスクの製造方法 |
KR20100128260A (ko) * | 2009-05-27 | 2010-12-07 | 주식회사 에스앤에스텍 | 블랭크 마스크 기판, 블랭크 마스크 및 그의 제조 방법 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3627805B2 (ja) * | 2001-04-20 | 2005-03-09 | 信越化学工業株式会社 | フォトマスク用ガラス基板及びその製造方法 |
TWI250133B (en) * | 2002-01-31 | 2006-03-01 | Shinetsu Chemical Co | Large-sized substrate and method of producing the same |
JP4267333B2 (ja) * | 2002-01-31 | 2009-05-27 | 信越化学工業株式会社 | 大型合成石英ガラス基板の製造方法 |
TWI329779B (en) * | 2003-07-25 | 2010-09-01 | Shinetsu Chemical Co | Photomask blank substrate, photomask blank and photomask |
US7608542B2 (en) * | 2005-06-17 | 2009-10-27 | Shin-Etsu Chemical Co., Ltd. | Large-size glass substrate for photomask and making method, computer-readable recording medium, and mother glass exposure method |
JP4362732B2 (ja) * | 2005-06-17 | 2009-11-11 | 信越化学工業株式会社 | フォトマスク用大型ガラス基板及びその製造方法、コンピュータ読み取り可能な記録媒体、並びにマザーガラスの露光方法 |
JP2007054944A (ja) * | 2005-07-25 | 2007-03-08 | Hoya Corp | マスクブランク用基板の製造方法、マスクブランクの製造方法及びマスクの製造方法 |
KR101503932B1 (ko) * | 2005-09-30 | 2015-03-18 | 호야 가부시키가이샤 | 포토마스크 블랭크 및 그 제조 방법, 포토마스크의 제조방법과 반도체 장치의 제조 방법 |
JP5331638B2 (ja) * | 2008-11-04 | 2013-10-30 | Hoya株式会社 | 表示装置製造用フォトマスクの製造方法及び描画装置 |
WO2010061828A1 (ja) * | 2008-11-26 | 2010-06-03 | Hoya株式会社 | マスクブランク用基板 |
JP5823339B2 (ja) * | 2011-04-12 | 2015-11-25 | Hoya株式会社 | フォトマスク用基板、フォトマスク及びパターン転写方法 |
-
2012
- 2012-04-10 JP JP2012089396A patent/JP5937409B2/ja active Active
- 2012-04-12 KR KR1020120037850A patent/KR101319634B1/ko active IP Right Grant
- 2012-04-12 TW TW101113080A patent/TWI456269B/zh active
- 2012-04-12 CN CN201210106975.3A patent/CN102736402B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050012687A (ko) * | 2003-07-25 | 2005-02-02 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 포토마스크 블랭크용 기판의 선정방법 |
JP2010078769A (ja) | 2008-09-25 | 2010-04-08 | Shin-Etsu Chemical Co Ltd | フォトマスクブランクスの選択方法及び製造方法並びにフォトマスクの製造方法 |
KR20100128260A (ko) * | 2009-05-27 | 2010-12-07 | 주식회사 에스앤에스텍 | 블랭크 마스크 기판, 블랭크 마스크 및 그의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
CN102736402B (zh) | 2014-07-23 |
TWI456269B (zh) | 2014-10-11 |
JP2012230369A (ja) | 2012-11-22 |
CN102736402A (zh) | 2012-10-17 |
KR20120116877A (ko) | 2012-10-23 |
TW201245775A (en) | 2012-11-16 |
JP5937409B2 (ja) | 2016-06-22 |
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