KR101318365B1 - LED test apparatus - Google Patents

Abstract

The present invention relates to an LED test apparatus, and in particular, the upper module is coupled to the lower module by pressing the upper module equipped with the LED located on the upper part of the lower module on which the printed circuit board is installed to test the LED. The present invention relates to an LED test apparatus.
LED test apparatus according to the present invention is an LED module is mounted, the upper module including a clamp is installed first fixing means; And a lower module provided with a second fixing means, applying power to the LED, and positioned below the upper module, and moving the upper module toward the lower module to fix the first fixing means to the second module. The upper module and the lower module are coupled by fixing to the means.

Description

LED test apparatus

The present invention relates to an LED test apparatus, and in particular, the upper module is coupled to the lower module by pressing the upper module equipped with the LED located on the upper part of the lower module on which the printed circuit board is installed to test the LED. The present invention relates to an LED test apparatus.

In general, devices such as semiconductor chips and LEDs (LEDs) classify good and bad products according to the results of test determination through electrical tests, and ship good quality devices.

Such a test refers to a process in which a device is continuously operated under predetermined test conditions to check whether a stressed device operates normally.

Conventional test apparatus has a problem in that the structure is complicated and cumbersome to manufacture and use.

In addition, the conventional test apparatus has a problem in that the number of LEDs that can be inspected at a time is small, and therefore, a considerable time is required for the LED test, thereby reducing work efficiency.

The present invention has been created to solve the problems of the prior art as described above, by facilitating the coupling and separation of the upper module and the lower module by a simple fastening structure, it is possible to increase the ease of use, a number of LED at a time It is an object of the present invention to provide an LED test device that can increase the efficiency of test work by making it easy to test.

LED test apparatus according to an embodiment of the present invention for achieving the above object is an LED module is mounted, the upper module including a clamp is installed a fixing hole as a first fixing means; And a lower module positioned at a lower portion of the upper module, wherein a clamp insertion hole through which the clamp passes is formed, and a second fixing means moving left and right in the clamp insertion hole is installed, and power is applied to the LED. And coupling the upper module and the lower module by moving the upper module toward the lower module to fix the fixing hole to the second fixing means in the clamp insertion hole.

At this time, the upper module is a tray on which the LED is mounted; And a cover installed on the tray, wherein the clamp is formed in a straight line from the bottom edge of the cover to the bottom.

On the other hand, the lower module is a printed circuit board; A supporter positioned on the printed circuit board and having the second fixing means disposed on a side thereof; And a pogo pin extending upward from the printed circuit board to protrude through the support.

At this time, the clamp insertion hole is formed in a straight line from the top to the bottom of the support.

In addition, the support is formed with a fastening hole extending from the outer surface of the support to the clamp insertion hole side, a fastening groove is formed on the side of the support extending from the clamp insertion hole and facing the fastening hole, 2 The fixing means is located across the clamp insertion hole, the fastening hole and the fastening groove.

At this time, the second fixing means is the body of the flat plate having a central hole in the center; A spring installed on a surface of the body facing the fastening groove; And a protrusion protruding from the surface on which the spring is installed to the central hole.

In addition, the second fixing means may further include a guide installed between the support and the body to guide the movement of the body.

In this case, one of the surfaces of the body, which faces the surface on which the spring is installed, is exposed to the outside through the fastening hole, the spring is fixed in the fastening groove, and the center hole is the clamp insertion hole and the fastening hole. And the protrusion is located in the clamp insertion hole.

In addition, the clamp is inserted through the central hole, the width of the central hole located in the clamp insertion hole is formed smaller than the width of the clamp.

LED test apparatus according to another embodiment of the present invention for achieving the above object is an LED module is mounted, the upper module including a clamp is installed first fixing means; And a lower module provided with a second fixing means, applying power to the LED, and positioned below the upper module, wherein the upper module moves toward the lower module to fix the first fixing means to the second module. A groove formed in the outer surface of the clamp, the first fixing means coupling the upper module and the lower module by fixing to the means; A spring installed in the groove; And a head installed at the end of the spring.

At this time, the upper module is a tray on which the LED is mounted; And a cover installed on the tray, wherein the clamp is formed in a straight line from the bottom edge of the cover to the bottom.

In addition, the lower module may include a printed circuit board; A supporter positioned on the printed circuit board and having the second fixing means disposed on a side thereof; And a pogo pin extending upward from the printed circuit board to protrude through the support.

In addition, the support is formed in a straight line from the top of the support to the clamp insertion hole through which the clamp passes, the second fixing means is a groove extending from the clamp insertion hole to the support is formed, the head is To the groove.

An upper module including a clamp to which an LED test apparatus LED according to another embodiment of the present invention for achieving the above object is mounted and a first fixing means which is a groove formed on an outer surface thereof is installed; And a clamp insertion hole through which the clamp passes, a second fixing means is installed, power is applied to the LED, and a lower module positioned below the upper module, and the upper module is moved toward the lower module. The upper module and the lower module are coupled by moving and fixing the first fixing means to the second fixing means.

At this time, the upper module is a tray on which the LED is mounted; And a cover installed on the tray, wherein the clamp is formed in a straight line from the bottom edge of the cover to the bottom.

In addition, the lower module may include a printed circuit board; A supporter positioned on the printed circuit board and having the second fixing means disposed on a side thereof; And a pogo pin extending upward from the printed circuit board to protrude through the support.

At this time, the clamp insertion hole is formed in a straight line from the top to the bottom of the support.

In addition, the second fixing means includes a groove extending from the clamp insertion hole to the support; A spring installed in the groove; And a head installed at the end of the spring, and the groove is coupled to the head.

A mounting groove for mounting the LED is formed on the upper surface of the tray, and a first through hole extending downward is formed at a lower end of the mounting groove, and the pogo pin passes through the first through hole to connect with the LED. .

A heat sink is further installed in the mounting groove, and a portion of the heat sink extends downward to penetrate the tray.

In this case, a second through hole corresponding to the first through hole is formed in the heat sink, and the pogo pin passes through the first and second through holes to be connected to the LED.

A first coupling means may be further formed on a lower surface of the tray, and the first coupling means may be a groove formed inside the tray or a protrusion protruding from the tray.

A transmission part through which light emitted from the LED is transmitted may be formed on the cover upper surface to correspond to the mounting groove.

The support is formed with a third through hole formed in a straight line from the bottom of the support to the top, the pogo pin is connected to the LED through the first and third through holes.

The support is formed with a third through hole formed in a straight line from the bottom of the support, the pogo pin is connected to the LED through the first through the third through hole.

A second coupling means coupled to the first coupling means is further formed on the support, and the second coupling means may be a groove formed inside the support or a protrusion protruding from the support.

The protrusion may be a spring or a shape wrapped with a spring on the outside.
The apparatus may further include a pogo pin protection member positioned between the upper module and the lower module.
The tray is a pressing groove formed on the upper surface; A press spring installed vertically from the tray in the press groove; And it may include a pressure plate installed on the pressure spring.
In addition, the cover may have a pressing protrusion formed at a position corresponding to the pressing groove.

Therefore, the upper module equipped with the LED and the lower module on which the printed circuit board is installed can be coupled and separated using a simple fastening structure, thereby increasing convenience of use.

In addition, since a plurality of LEDs can be installed in a single LED test device or a plurality of LED tests can be tested, a plurality of LEDs can be easily tested at a time, thereby improving test efficiency.

1 shows an LED test apparatus according to a first embodiment of the present invention.
2 is a plan view of a second fixing means according to the first embodiment of the present invention.
3 and 4 are views for explaining the coupling and separation of the upper module and the lower module according to the first embodiment of the present invention.
5 illustrates an LED test apparatus according to a second embodiment of the present invention.
6 shows an LED test apparatus according to a third embodiment of the present invention.
7 shows an LED test apparatus according to a fourth embodiment of the present invention.
8 is a combined state diagram of a single LED test apparatus according to a first embodiment of the present invention.
FIG. 9 illustrates a state in which the LED test apparatus of FIG. 8 is arranged in a large number.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. Here, the embodiments of the present invention are provided to sufficiently convey the technical spirit of the present invention to those skilled in the art, and the present invention is not limited to the embodiments described below, and may be embodied in other forms.

In addition, in the description of the present invention, terms defined are defined in consideration of functions in the present invention, and should not be interpreted to limit the technical components of the present invention. The terms '2' and 'third' are used to describe different components, and are used to distinguish one component from other components.

Meanwhile, hereinafter, a case in which a single LED is mounted will be described as an example, but a plurality of LEDs may be mounted in the test apparatus, and it is obvious that the present embodiment is applied in the same manner.

1 is a view showing an LED test apparatus according to a first embodiment of the present invention, Figure 2 is a plan view of a second fixing means according to a first embodiment of the present invention, Figures 3 and 4 are the first of the present invention 5 is a view for explaining the coupling and separation of the upper module and the lower module according to an embodiment, Figure 5 shows an LED test apparatus according to a second embodiment of the present invention, Figure 6 is a third embodiment of the present invention FIG. 7 is a view illustrating an LED test apparatus according to a fourth embodiment of the present invention, and FIG. 8 is a diagram illustrating a combined state of a single LED test apparatus according to the first embodiment of the present invention. FIG. 9 illustrates a state in which the LED test apparatus of FIG. 8 is arranged in a large number.

1 shows an LED test apparatus according to a first embodiment of the present invention.

Referring to FIG. 1, the module test apparatus according to the first embodiment of the present invention includes an upper module 100 in which an LED 10 is mounted and a clamp 50 in which a first fixing means 51 is installed, The second fixing means 240 is installed, and applies power to the LED 10, and includes a lower module 200 located below the upper module 100.

In this case, a printed circuit board 210 that is electrically connected to the LED 10 to apply power to the lower module 100 is installed, and the upper module 100 and the lower module 200 are coupled to each other. The test for the LED 10 is performed by applying power to the LED 10 through the printed circuit board 210.

At this time, the first fixing means 51 is a fixing hole, the first fixing means 51 is coupled to the second fixing means 240, and the configuration of the second fixing means 240 will be described later. .

The clamp 50 may be formed in a straight line from the lower end of the cover 120 of the upper module 100, the lower end of the clamp 50 is preferably formed to be tapered.

When the lower end of the clamp 50 is formed to be tapered, the friction between the clamp 50 and the second fixing means 240 when the clamp 50 passes the second fixing means 240. By reducing the movement of the clamp 50 can be smoothly.

The combination of the upper module 100 and the lower module 200 moves the upper module 100 toward the lower module 100 to move the first fixing means 51 to the second fixing means 240. And the upper module 100 and the lower module 200 are separated from each other by the first fixing unit 51 from the second fixing unit 240. This is done by moving the module 100 upwards.

The upper module 100 is formed to be stably coupled with the lower module 200 to receive the power from the printed circuit board 210 so that the LED 10 can emit light.

The upper module 100 includes a tray 110 on which the LED 10 is mounted and a cover 120 installed on the tray 110 to isolate the LED 10 together with the tray 110. In this case, the clamp 50 may be installed at the lower edge of the cover 120.

The tray 110, in detail, a mounting groove 111 on which the LED 10 is mounted is formed on an upper surface of the tray 110, and a first through hole extending downward in a lower end of the mounting groove 111. 112 is formed, and the mounting groove 111 and the first through hole 112 are connected.

At this time, the configuration for applying power to the LED 10 through the first through hole 112, for example, the pogo pin 230 in the present embodiment passes through and is connected to the LED 10.

In addition, a heat sink 130 may be further installed in the mounting groove 111, in detail, a lower portion of the mounting groove 111, and when the heat sink 130 is installed, the LED 10 may include the heat sink. 130 is located on.

Since the test for the LED 10 is performed in a state in which power is applied to the LED 10 to emit light for a long time, a lot of heat is generated from the LED 10 accordingly.

For this reason, the heat sink 130 is installed to dissipate the heat generated by the LED 10 during the test of the LED 10, the heat sink 130 to facilitate the release of the heat to the outside A portion of) may extend downward to penetrate the tray 110.

In addition, although not shown in FIG. 1, a heat dissipation plate connected to a portion extending downward of the heat dissipation plate 130 may be additionally installed to increase a heat dissipation effect.

When the heat sink 130 is installed, a second through hole 131 corresponding to the first through hole 112 formed in the tray 110 is formed in the heat sink 130.

Therefore, a configuration for applying power to the LED 10, for example, the pogo pin 230 in the present embodiment passes through the first and second through holes 112 and 131 to the LED 10. Connect.

In addition, the tray 110 may be further formed with a first coupling means 113 for stable coupling with the lower module 200, the first coupling means 113 is a lower surface of the tray 110 It may be formed at the edge, it may be a groove formed in the tray 110 as in the present embodiment, it may also be a protrusion protruding from the tray 110.

The cover 120 is installed on an upper portion of the tray 110 to isolate the LED 10 mounted on the tray 110, and a transmission part 121 is formed to correspond to the mounting groove 111. The light emitted from the LED 10 passes through the transmission part 121 and is emitted to the outside.

Therefore, the inspector checks the light emitted through the transmission part 121 to determine whether the LED 10 is a good product or a defective product.

The lower module 200 is positioned below the upper module 100 and is coupled to the upper module 100 to apply power to the LED 10 of the upper module 100. It is formed in the form of stably bonding with (100).

The lower module 200 extends upward from the printed circuit board 210, the support 220 positioned on the printed circuit board 210, and the printed circuit board 210 to pass through the support 220. It is provided on the protruding pogo pin 230 and the side of the support 220, and coupled to the clamp 50 includes a plate-shaped second fixing means 240 for fixing the clamp (50).

The printed circuit board 210 is electrically connected to the LED 10 to apply power supplied from an external power source to the LED 10, and the pogo pin 230 on the printed circuit board 210. ) Is installed.

The pogo pin 230 is installed on the printed circuit board 210, and when the upper module 100 and the lower module 200 are coupled to each other, the first and second through holes 112 and 131 are formed. Passed through and connected to the LED 10, and applies power to the LED (10).

The pogo pin 230 may be integrally formed with or separated from the printed circuit board 210.

The support 220 is positioned on the printed circuit board 210, and a third through hole 221 through which the pogo pin 230 passes is formed, and the third through hole 221 is the support 220. ) Is formed in a straight line from the bottom to the top.

In this case, the third through hole 221 is formed in the same vertical line as the first and second through holes 112 and 131, and the pogo pin 230 is formed through the first to third through holes 112, It is possible to connect with the LED 10 by passing through 131 and 221.

On the other hand, when the heat sink 130 is not installed, the pogo fin 230 is connected to the LED 10 through the first and third through holes 112 and 221.

In addition, a second coupling means 222 may be further formed at the upper edge of the support 220 for the stable coupling with the upper module 100, wherein the second coupling means 222 is the first coupling means. 1 is formed at a position corresponding to the coupling means (113).

At this time, the second coupling means 222 may be a protrusion protruding from the support 222 as in the present embodiment, it may also be a groove formed into the support 220.

Thus, as in the present embodiment, the first coupling means 113 may be a groove, the second coupling means 222 may be a protrusion, and optionally, the first coupling means 113 is a protrusion, and the first coupling means 113 may be a protrusion. The two coupling means 222 may be a groove.

In this case, when the first coupling means 113 or the second coupling means 222 are protrusions, the protrusions are coupled to the first coupling means 113 or the second coupling means 222 in the form of grooves, and It may be formed of a spring or a spring wrapped shape to facilitate separation.

In addition, a clamp insertion hole 223 through which the clamp 50 passes is formed in the support 220, and the clamp insertion hole 223 is located at a position corresponding to the clamp 50 of the support 220. It is formed in a straight line from the top to the bottom.

In addition, the support 220 is formed with a fastening hole 224 extending from the outer surface of the support 220 to the clamp insertion hole 223, the fastening hole 224 is the clamp insertion hole 223 Connected with

In addition, the support 220 is formed with a fastening groove 225 extending from the clamp insertion hole 223 and formed on the side of the support 220 facing the fastening hole 223, and thus, the The fastening groove 225 is connected to the clamp insertion hole 223.

In this case, the second fixing means 240 coupled to the fixing hole 51 of the clamp 50 to fix the clamp 50 is the clamp insertion hole 223, the fastening hole 224, and the Positioned over the fastening groove 225.

Referring to FIG. 2, the second fixing means 240 is a flat plate that can move from side to side within the clamp insertion hole 223. The body 241 has a central hole 243 formed at the center thereof, and the body ( Spring 245 is installed on the surface of the surface of the 241 facing the fastening groove 225 (hereinafter referred to as 'the first surface of the body') and the first surface of the body to the central hole (243) It consists of a protruding protrusion 247.

In addition, the second fixing means 240 is installed between the support 20 and the body 241, may further include a guide 249 for guiding the movement of the second fixing means 240, The guide 249 is fixed to the support 220.

In this case, a surface facing the first surface on which the spring 245 is installed (hereinafter referred to as a 'second surface of the body') is exposed to the outside through the fastening hole 224, and the spring 245 is It is fixed in the fastening groove 225, the central hole 243 is located across the clamp insertion hole 223 and the fastening hole 224, and the protrusion 247 is located in the clamp insertion hole 223. .

In addition, the width of the center hole 243 positioned in the clamp insertion hole 223 is smaller than the width of the clamp 50.

Meanwhile, the LED test apparatus further includes a pogo pin protection member 300 installed between the upper module 100 and the lower module 200, in detail, between the tray 110 and the support 220. can do.

When the pogo pin protection member 300 is coupled to the lower module 200 by pressing the upper module 100, the pogo pin 230 is prevented from being damaged by the pressure at the time of pressing. And a fourth through hole 310 through which the pogo pin 230 passes, and when the first or second coupling means 113 and 222 are protrusions, a fifth through passages through the protrusions. The hole 320 may further include.

Referring to Figures 3 and 4 looks at the coupling and separation process of the upper module 100 and the lower module 200.

When the upper module 100 and the lower module 200 are coupled to each other, the clamp 50 is inserted through the clamp insertion hole 223, and the clamp 50 is inserted into the central hole (C). 243).

In this case, since the width of the central hole 243 located in the clamp insertion hole 223 is smaller than the width of the clamp 50, the clamp 50 is formed along the tapered surface of the lower end of the clamp. 241, in detail, the protrusion 247 is moved while pushing toward the spring 245, the spring 245 is in a compressed state.

Then, when the fixing hole 51 of the clamp 50 is located in the central hole 243, the body 241 is moved toward the fastening hole 224 by the spring 245 in a compressed state. The protrusion 247 is inserted into the fixing hole 51 of the clamp 50.

Therefore, since the clamp 50 is fixed by the second fixing means 240 in the clamp insertion hole 223, the upper module 100 and the lower module 200 are fixedly coupled.

On the contrary, when separating the upper module 100 and the lower module 200, the second surface of the second fixing means 240 exposed to the outside through the fastening hole 224 of the support 220 Inwardly into the fastening hole 224, the upper module (with the center hole 243 positioned in the clamp insertion hole 223 to have a width sufficient to move the clamp 50). Pull up 100 to separate the clamp 50 from the second fixing means 240.

5 is a view showing an LED test apparatus according to a second embodiment of the present invention.

Hereinafter, the same reference numerals are used for the same components as the first embodiment, and the detailed description will be referred to only the configuration of the first embodiment. Therefore, only different configurations from the first embodiment will be described.

In the LED test apparatus according to the second embodiment of the present invention, a configuration different from that of the LED test apparatus of the first embodiment is in the fastening structure of the clamp 50 and the second fixing means 240.

That is, according to the first embodiment, a fixing hole is formed as the first fixing means 51 in the clamp 50, and the second fixing means 240 having a flat plate shape is fixedly coupled to the fixing hole.

However, according to the second embodiment, the first fixing means 51 ′ formed in the clamp 50 may include a groove 52 formed on the outer surface of the clamp 50 and a spring installed in the groove 52. 53 and the head 54 installed at the end of the spring 53, the second fixing means 240 'formed in the support 220 is the support 220 from the clamp insertion hole 223 The head 54 is positioned at the second fixing means 240 ′.

In this case, the second fixing means 240 ′ may be formed with two grooves facing each other, may be formed along the circumference of the clamp insertion hole 223, and may be variously applied.

Meanwhile, one first fixing means 51 ′ may be formed, but two or more first fixing means 51 ′ may be more stably fixed to the second fixing means 240 ′ as in the present embodiment.

In this case, when the clamp 50 is inserted into the clamp insertion hole 223, the head 54 of the first fixing means 51 ′ is formed on the side surface of the clamp insertion hole 223 ( The spring 53 moves in a compressed state by moving toward the groove 52 by contact with the inner surface of the 230.

Therefore, when the clamp 50 is moved downward and the first fixing means 51 ′ is positioned at a point corresponding to the second fixing means 240 ′, the pressure applied to the spring 53 is reduced. The clamp 50 is no longer moved downward so that the head 54 is coupled to the groove that is the second fixing means 240 ′ by an elastic force.

On the contrary, when the upper module 100 and the lower module 200 are separated, the head 54 moves toward the groove 52 as the upper module 100 is forcibly pulled up to the first 52. The fixing means 51 'is separated from the second fixing means 240'.

Therefore, it is preferable that the second fixing means 240 ′ and the head 54 have a rounded shape to facilitate coupling and separation.

On the other hand, it will be appreciated that the configuration of the second embodiment may be selectively reversed.

That is, as shown in FIG. 6 showing the LED test apparatus according to the third embodiment, the first fixing means 51 ″ is a groove formed inside the clamp 50, and the second fixing means 240 ″. ) Is a groove 242 formed from the clamp insertion hole 223 toward the support 220, a spring 244 installed in the groove 242, and a head 246 installed at the end of the spring 244. It may be configured.

Since the combining and detaching process of the upper module 100 and the lower module 200 of the LED test apparatus according to the third embodiment will be easily understood from the configuration of the LED test apparatus according to the second embodiment, a detailed description thereof will be provided. Omit.

7 is a diagram illustrating an LED test apparatus according to a fourth embodiment of the present invention.

Hereinafter, the same reference numerals are used for the same components as the first embodiment, and the detailed description will be referred to only the configuration of the first embodiment. Therefore, only different configurations from the first embodiment will be described.

In the LED test apparatus according to the fourth embodiment of the present invention, a configuration different from that of the LED test apparatus of the first embodiment is a coupling structure of the tray 110 'and the cover 120'.

According to the third embodiment of the present invention, the pressing groove 114 is formed on the upper surface of the tray 110 ', and the pressing spring 115 is installed vertically from the tray 110' in the pressing groove 114. ) And the pressure spring 115 is provided with a pressure plate 116. At this time, the pressing plate 116 is installed on the upper surface and the side of the pressing spring (115).

On the other hand, the lower surface of the cover 120 'is formed with a pressing protrusion 122 at a position corresponding to the pressing groove 114, the pressing when the tray 110' and the cover 120 'is coupled The protrusion 122 becomes a structure which presses the said press plate 116, and becomes a structure which presses substantially the said tray 110 '.

When the LED 10 is mounted in the mounting groove 110, the LED 10 may not come into close contact with the heat sink 130 according to a manufacturing deviation of the LED 10. In this case, heat radiation This will not work properly.

However, when the pressurized structure is formed as in the present embodiment, the cover 120 'may be tightly coupled to the tree 110', and thus the LED 10 is closely attached to the heat sink 130. You can do it.

In addition, the pogo pin 230 and the LED 10 may be in close contact with each other to secure the electrical connection between the pogo pin 230 and the LED 10.

As described above with reference to the drawings illustrating the LED test apparatus according to the present invention, the present invention is not limited to the above embodiments and drawings, the present invention without departing from the spirit of the invention claimed in the claims Various modifications can be made by those skilled in the art, and such modifications fall within the scope of the claims.

10: LED 50: Clamp
51, 51´, 51 ″: first fixing means
52, 242: home
53, 244: spring 54, 246: head
100: upper module 110, 110´: tray
111: mounting groove 112: first through hole
113: first coupling means 114: pressurized groove
115: pressure spring 116: pressure plate
120, 120´: Cover 121: Transmissive part
122: pressure projection 130: heat sink
131: second through hole 200: lower module
210: printed circuit board 220: support
221: third through hole 222: second coupling means
223 clamp insertion hole 224 fastening hole
225: fastening groove 230: pogo pin
240, 240´, 240 ″: second fixing means
241 body
243: center hole 245: spring
247: protrusion 249: guide
300: pogo pin protective member 310: fourth through hole
320: fifth through hole

Claims (30)

An upper module having an LED mounted thereon, the upper module including a clamp on which a fixing hole as a first fixing means is installed; And
A clamp insertion hole through which the clamp passes, and a second fixing means movable from side to side within the clamp insertion hole is installed;
And the upper module and the lower module by moving the upper module toward the lower module to fix the fixing hole to the second fixing means in the clamp insertion hole. The method of claim 1,
The upper module may include a tray on which the LED is mounted; And
A cover installed on the tray,
LED clamp is formed in a straight line from the bottom edge of the bottom of the cover. 3. The method of claim 2,
The lower module includes a printed circuit board;
A supporter positioned on the printed circuit board and having the second fixing means disposed on a side thereof; And
LED test apparatus including a pogo pin extending upward from the printed circuit board and protrudes through the support. The method of claim 3, wherein
The clamp insertion hole is an LED test device formed in a straight line from the top to the bottom of the support. The method of claim 3, wherein
The support is formed with a fastening hole extending from the outer surface of the support toward the clamp insertion hole, a fastening groove is formed on the side of the support extending from the clamp insertion hole and facing the fastening hole,
And the second fixing means is positioned across the clamp insertion hole, the fastening hole, and the fastening groove. The method of claim 5, wherein
The second fixing means includes a body of the plate having a central hole in the center;
A spring installed on a surface of the body facing the fastening groove; And
LED test device comprising a protrusion protruding from the surface on which the spring is installed to the central hole. The method according to claim 6,
The second fixing means is installed between the support and the body LED test apparatus further comprises a guide for guiding the movement of the body. The method according to claim 6,
Among the surfaces of the body, the surface opposite to the surface on which the spring is installed is exposed to the outside through the fastening hole.
The spring is fixed in the fastening groove,
The central hole is located across the clamp insertion hole and the fastening hole,
LED protrusion of the protrusion is located in the clamp insertion hole. The method according to claim 6,
The clamp is inserted through the central hole,
LED test apparatus, the width of the central hole located in the clamp insertion hole is formed smaller than the width of the clamp. An upper module having an LED mounted thereon, the upper module including a clamp on which a first fixing means is installed; And
A second fixing means is installed, and applies a power to the LED, and includes a lower module positioned below the upper module,
The upper module is coupled to the upper module and the lower module by moving toward the lower module to fix the first fixing means to the second fixing means,
The first fixing means is a groove formed on the outer surface of the clamp;
A spring installed in the groove; And
LED test apparatus including a head installed at the end of the spring. 11. The method of claim 10,
The upper module may include a tray on which the LED is mounted; And
A cover installed on the tray,
LED clamp is formed in a straight line from the bottom edge of the bottom of the cover. The method of claim 11,
The lower module includes a printed circuit board;
A supporter positioned on the printed circuit board and having the second fixing means disposed on a side thereof; And
LED test apparatus including a pogo pin extending upward from the printed circuit board and protrudes through the support. 13. The method of claim 12,
The support has a clamp insertion hole through which the clamp passes in a straight line from the top to the bottom of the support,
The second fixing means is a groove extending from the clamp insertion hole to the support,
LED test device that the head is coupled to the groove. An upper module including an clamp on which an LED is mounted and including a clamp on which first fixing means which is a groove formed on an outer surface thereof is installed; And
And a clamp insertion hole through which the clamp passes, a second fixing means is installed, a power supply is applied to the LED, and a lower module positioned below the upper module.
LED test apparatus for coupling the upper module and the lower module by moving the upper module toward the lower module to fix the first fixing means to the second fixing means. 15. The method of claim 14,
The upper module may include a tray on which the LED is mounted; And
A cover installed on the tray,
LED clamp is formed in a straight line from the bottom edge of the bottom of the cover. The method of claim 15,
The lower module includes a printed circuit board;
A supporter positioned on the printed circuit board and having the second fixing means disposed on a side thereof; And
LED test apparatus including a pogo pin extending upward from the printed circuit board and protrudes through the support. 17. The method of claim 16,
The clamp insertion hole is an LED test device formed in a straight line from the top to the bottom of the support. 17. The method of claim 16,
The second fixing means includes a groove extending from the clamp insertion hole to the support;
A spring installed in the groove; And
A head installed at an end of the spring,
LED test device that the groove is coupled to the head. The method according to any one of claims 3, 12 or 16,
The upper surface of the tray is provided with a mounting groove for mounting the LED,
The lower end of the mounting groove is formed with a first through hole extending downward,
And the pogo pin passes through the first through hole and connects with the LED. The method of claim 19,
A heat dissipation plate is further installed in the mounting groove, and a portion of the heat dissipation plate extends downward to pass through the tray. 21. The method of claim 20,
And a second through hole corresponding to the first through hole is formed in the heat sink, and the pogo pin passes through the first and second through holes to connect to the LED. The method according to any one of claims 3, 12 or 16,
The first coupling means is further formed on the lower surface of the tray,
And the first coupling means is a groove formed in the tray or a protrusion protruding from the tray. The method of claim 19,
LED test apparatus is formed in the upper surface of the cover in which a transmission portion through which light emitted from the LED is transmitted corresponding to the mounting groove. The method of claim 19,
The support is formed with a third through hole formed in a straight line from the bottom to the top of the support,
And the pogo pin is connected to the LED through the first and third through holes. 22. The method of claim 21,
The support is formed with a third through hole formed in a straight line from the bottom to the top of the support,
And the pogo pin is connected to the LED through the first through third through holes. 23. The method of claim 22,
On the upper portion of the support is further formed a second coupling means for engaging with the first coupling means,
The second coupling means is an LED test device is a groove formed in the support or a protrusion protruding from the support. The method of claim 26,
The projection is a spring or an LED test device having a shape wrapped around the outside of the spring. The method according to any one of claims 1, 10 or 14,
LED test apparatus further comprises a pogo pin protection member positioned between the upper module and the lower module. The method according to any one of claims 2, 11 or 15,
The tray is a pressing groove formed on the upper surface;
A press spring installed vertically from the tray in the press groove; And
LED test apparatus including a pressure plate installed on the pressure spring. 30. The method of claim 29,
The cover is an LED test device is formed with a pressing projection in a position corresponding to the pressing groove.

Images