KR101311153B1 - Plating apparatus - Google Patents

Abstract

PURPOSE: A plating processing device is provided to arrange leakage preventing rings on the top and bottom portions of inflow and outflow gates, thereby minimizing leakages of plating solution via the top and bottom portions of the inflow and outflow gates. CONSTITUTION: A plating processing device (1) includes a plating tank (300), an inflow gate (100), and an outflow gate (200). The inflow gate includes a front plate (110), a back plate (150), a pair of vertical rollers, an upper joining plate (160), a lower joining plate (130), and leakage preventing rings. The leakage preventing rings are arranged on joining portions of rotary shafts of the vertical rollers and the upper and lower joining plates. The leakage preventing ring includes an inner ring and an outer ring. The intervals between the inner and outer rings are adjusted by the thickness of a target object so that the interval between the vertical rollers is varied.

Description

Plating Apparatus {PLATING APPARATUS}

The present invention relates to a plating treatment apparatus, and more particularly, to a plating treatment apparatus having an improved structure to minimize the outflow of the plating liquid tank in the vertical direction of the plating liquid.

In a printed circuit board (PCB), a printed circuit is formed in a predetermined pattern on a plate surface. The printed circuit pattern is plated and formed to conduct current.

Such a plating apparatus of a printed circuit board has been disclosed in Korean Patent No. 10-0340425 "Substrate Plating Apparatus".

 Plating of the printed circuit board is performed while the printed circuit board is moved to the plating liquid tank in which the plating liquid is stored. On both sides of the plating liquid tank, an inflow gate and an outflow gate are formed to flow the printed circuit board into the inside and flow out the plated printed circuit board to the outside.

1 is an exploded perspective view showing a conventional structure of the inlet gate 10 in an exploded manner. The conventional inlet gate 10 is a front plate 11, a back plate 13, a pair of side bars 14, a pair of vertical coupling plate 17, and a pair of vertical rollers 15 Is formed. An inlet hole 11a through which the printed circuit board is introduced is formed in the plate surface of the front plate 11, and the printed circuit board introduced into the inlet hole 11a is introduced between the vertical rollers 15, and then the back plate 13 is opened. Guided to the plating liquid tank (not shown).

The conventional inflow gate 10 has a structure in which the plating liquid flows out to the outside through the inflow hole 11a exposed to the outside. The plating liquid leaked to the outside is recovered to the plating liquid tank (not shown) through the recovery pipe.

However, the conventional inflow gate 10 has a problem in that the plating solution flows out through the top and the bottom in addition to the above-described inflow hole 11a and is not recovered and the surroundings are contaminated. That is, there is no means to block the outflow of the plating liquid in the coupling region of the pair of side bars 14 and the upper and lower coupling plates 17, so that a large amount of the plating liquid flows out through the coupling region.

On the other hand, the conventional inlet gate 10 is a pair of vertical roller 15 is fixed to the rotatable position by the coupling hole (15a) is inserted into the coupling shaft (17a) of the upper and lower coupling plate (17). At this time, since the position of the coupling shaft 17a is fixed, the spacing between the pair of vertical rollers 15 is fixed. Therefore, the gap between the vertical rollers 15 does not correspond to the thickness of the printed circuit board, and there is a limit in that it is not compatible with a printed circuit board having various thicknesses.

An object of the present invention is to solve the above-described problem, to provide a plating treatment apparatus having an improved structure to minimize the outflow of the plating liquid in the plating liquid tank in the vertical direction.

Another object of the present invention is to provide a plating treatment apparatus capable of adjusting the interval between vertical rollers according to the thickness of the plated material.

The above objects and various advantages of the present invention will become more apparent from the preferred embodiments of the present invention by those skilled in the art.

The object of the present invention can be achieved by a plating apparatus. Plating treatment apparatus of the present invention, the plating tank in which the plating liquid is accommodated; An inflow gate coupled to one surface of the plating tank to introduce a plating material into the plating tank; It is coupled to the other surface of the plating tank and includes an outlet gate for outflowing the plated material is completed in the plating tank to the outside, the inlet gate is exposed to the outside and the inlet hole is formed; A back plate coupled to the front plate and disposed in the plating tank and having guide holes formed therein; A pair of vertical rollers provided in the front plate and the rear plate and configured to guide the plated material introduced into the inlet hole to the guide hole and to have a rotating shaft protruded up and down; An upper coupling plate and a lower coupling plate coupled to upper and lower portions of the front plate and the rear plate to support the rotating shaft so that the pair of vertical rollers are rotatable; It characterized in that it comprises a leakage preventing ring which is disposed in each of the rotation axis of the vertical roller and the coupling region of the upper coupling plate and the lower coupling plate to prevent external leakage of the plating liquid.

According to one embodiment, the upper coupling plate and the lower coupling plate, each of the coupling plate body formed with an oval rotation axis receiving hole; It includes a ring seating surface is formed extending from the outer periphery of the rotation axis receiving hole of the coupling plate body radially inward in a predetermined area is seated the leakage preventing ring.

According to one embodiment, the leakage preventing ring, the inner ring for receiving the rotating shaft therein; An outer ring formed spaced apart from the inner ring; The inner ring and the outer ring is connected to each other and a plating solution is accommodated on the upper surface includes a leakage preventing plate for preventing the leakage of the plating liquid.

According to one embodiment, the interval between the inner ring and the outer ring is adjusted differently according to the thickness of the plated material can be varied the spacing between the pair of vertical rollers.

According to one embodiment, the outlet gate is formed in the same structure as the inlet gate.

Plating treatment apparatus according to the present invention can minimize the leakage of the plating liquid by placing a leakage preventing ring to prevent leakage in the upper and lower portions of the inlet and outlet gates.

In addition, the plating treatment apparatus according to the present invention is provided with a variable spaced interval between the vertical rollers formed of a plastic material to minimize the outflow of the plating liquid and can actively correspond to the thickness of the plated material.

1 is an exploded perspective view illustrating the structure of a conventional inlet gate;
2 is a schematic diagram schematically showing the structure of a plating apparatus according to the present invention;
Figure 3 is a perspective view showing the structure of the inlet gate of the plating treatment apparatus according to the present invention,
Figure 4 is an exploded perspective view showing an exploded structure of the inlet gate of the plating treatment apparatus according to the present invention,
5 is a cross-sectional view showing a cross-sectional configuration of the inflow gate of the plating treatment apparatus according to the present invention.

In order to fully understand the present invention, preferred embodiments of the present invention will be described with reference to the accompanying drawings. The embodiments of the present invention may be modified into various forms, and the scope of the present invention should not be construed as being limited to the embodiments described in detail below. The present embodiments are provided to enable those skilled in the art to more fully understand the present invention. Therefore, the shapes and the like of the elements in the drawings can be exaggeratedly expressed to emphasize a clearer description. It should be noted that in the drawings, the same members are denoted by the same reference numerals. Detailed descriptions of well-known functions and constructions which may be unnecessarily obscured by the gist of the present invention are omitted.

Figure 2 is a schematic diagram showing the configuration of the plating treatment apparatus 1 according to the present invention, Figure 3 is a perspective view showing the assembled state of the inlet gate 100 of the plating treatment apparatus 1, Figure 4 is an inflow It is an exploded perspective view which decomposes the structure of the gate 100. FIG.

As shown, the plating treatment apparatus 1 according to the present invention is coupled to one side of the plating solution tank 300 in which the plating solution B is accommodated therein, and the plating material A is coated with the plating material A. The inlet gate 100 to be introduced into the tank 300, and the outlet gate 200 is coupled to the other side of the plating solution tank 300 to the outside of the plating material (A ') plating is completed to the outside. .

Here, the plated material (A) may be various types in which plating is formed in a predetermined pattern on a surface including a printed circuit board.

The plating solution B is provided with an electrolytic solution having high conductivity, and the plated material A is formed on the surface of the plating solution B by electroplating. In addition, a circuit pattern is formed on the surface through an etching process or an etching process that leaves only necessary portions.

Although not shown in the drawing, components for the electroplating method may be provided inside the plating solution tank 300.

The inflow gate 100 is coupled to one side of the plating liquid tank 300 to introduce the plating material A into the plating liquid tank 300. The inlet gate 100 has a front plate 110 disposed toward the outside as shown in FIG. 4, a back plate 150 coupled to a rear surface of the front plate 110, a front plate 110 and a back plate. The upper coupling plate 160 and the lower coupling plate 130 coupled to the upper and lower sides of the 150 and the front plate 110 and the back plate 150 are provided in the interior to guide the plated material A to the inside. A pair of vertical rollers (120, 120a), and vertical rollers (120, 120a) and the upper and lower coupling plates 130, 160 is disposed between the leakage preventing ring 140 to prevent the external leakage of the plating solution.

The front plate 110 is disposed toward the outside to introduce the plated material A into the pair of vertical rollers 120 and 120a. The front plate 110 includes a flat plate-shaped front plate body 111 and a coupling bar 113 formed to protrude to the rear surface of the front plate body 111 to be coupled to the rear plate 150.

The front plate body 111 is formed in a plate shape having a predetermined area. The plate surface of the front plate body 111 is formed with a predetermined length in the vertical direction inlet hole 112 for introducing the plated material (A) into the interior. Inlet hole 112 is formed to a minimum thickness corresponding to the thickness of the plated material (A).

Coupling bar 113 is formed to protrude a predetermined height on the back surface of the front plate body 111 is coupled to the back coupling bar 153 of the back plate body 151. The coupling bar 113 and the rear coupling bar 153 are coupled to be in contact with each other, the roller accommodation space 115 is formed between the front plate body 111 and the bowel plate body 151 by the height of each other protruding. The coupling bar 113 and the bowel movement bar 113 are fixed to each other by the first fastening member 117. The first fastening member 117 is coupled to penetrate through the horizontal fastening holes 113b and 153b to maintain the coupled state of the front plate 110 and the back plate 150.

Protruding height of the coupling bar 113 is formed to have a certain length margin than the diameter of the pair of vertical rollers (120, 120a) so that interference does not occur in the rotation of the vertical rollers (120,120a). In addition, the distance between the pair of left and right coupling bars 113 is a value obtained by adding the width w of the diameter of the pair of vertical rollers 120 and 120a and the guide gap (C of FIG. 5) between the vertical rollers 120 and 120a. It is formed by adding a clearance length to.

The pair of vertical rollers 120 and 120a guides the plated material A introduced into the interior through the front plate 110 to the rear plate 150. The pair of vertical rollers 120 and 120a guides the plated material A to slowly flow into the plating solution tank 300 while standing vertically. The pair of vertical rollers 120 and 120a is formed of a plastic material. The pair of vertical rollers 120 and 120a are arranged to be spaced apart from each other by the guide gap C as shown in FIG. 5. The width w of the guide gap C is provided as the minimum length through which the plated material A can be introduced, and is widened by the thickness of the plated material A when the plated material A is introduced.

The vertical rollers 120 and 120a have lower and upper rotation shafts 121 and upper rotation shafts 123 protruding from each other at a predetermined length. The lower rotating shaft 121 and the upper rotating shaft 123 are accommodated in the leakage preventing ring 140. A pair of vertical rollers (120, 120a) is coupled to the upper coupling plate 160 and the lower coupling plate 130 so as to rotate idle, and when the plated material (A) is transferred from the outside to contact the plated material (A) And rotate.

The lower coupling plate 130 is coupled to the lower portion of the front plate 110 and the rear plate 150 to rotatably support the pair of vertical rollers 120 and 120a. The lower coupling plate 130 has a ring seating surface 133 having a predetermined area along the edge of the coupling plate body 131 through which the rotation shaft accommodation hole 132 is formed on the plate surface, and the rotation shaft accommodation hole 132 of the coupling plate body 131. It includes.

Coupling plate body 131 is formed in a cross-sectional shape in the state in which the front plate 110 and the back plate 150 is coupled. As a result, the lower regions of the front plate 110 and the back plate 150 are covered. On the plate surface of the coupling plate body 131, the rotating shaft receiving hole 132 is formed in an elliptical shape. The rotating shaft receiving hole 132 is rotatably accommodated the lower rotating shafts 121 and 123 of the pair of left and right vertical rollers 120 and 120a.

In addition, the rotation shaft receiving hole 132 serves to discharge the plating liquid introduced into the inflow gate 100 to the bottom. The plating liquid flows out inside the roller accommodation space 115 through the rotation shaft receiving hole 132 and is recovered to the plating liquid tank 300. Accordingly, the plating liquid may be prevented from flowing out through the front inlet 112.

The width d of the rotation shaft receiving hole 132 is formed to have a predetermined size with a margin larger than the sum of the diameters of the pair of vertical rollers 120 and 120a. This is because the leakage preventing ring 140 flows left and right inside the rotation axis receiving hole 132 according to the thickness of the plated material (A) and adjusts the size of the guide gap (C) between the pair of vertical rollers (120, 120a) To do this.

A ring seating surface 133 is formed in the lower portion of the rotating shaft accommodation hole 132 in the radially inward direction along the outer circumference. The ring seating surface 133 extends from the predetermined area coupling plate body 131 to seat the leakage preventing ring 140. The width of the ring seating surface 133 is formed to correspond to the width of the leakage preventing ring 140.

The leakage preventing ring 140 is disposed in the coupling region of the upper and lower coupling plates 130 and 160 and the vertical rollers 120 and 120a to prevent the plating liquid from leaking to the outside. The leakage preventing ring 140 is formed to have a dual structure. The leakage preventing ring 140 includes an inner ring 141 in which the rotating shafts 121 and 123 are accommodated, an outer ring 143 disposed to be spaced apart from the inner ring 141, and an inner ring 141 and an outer ring. It consists of a leak-proof plate 145 connecting 143.

The inner ring 141 is formed to correspond to the diameter of the up and down rotation shafts 121 and 123 of the vertical rollers 120 and 120a to accommodate the up and down rotation shafts 121 and 123 therein. The outer ring 143 is formed to a diameter that can be in contact with the inner circumferential surface of the rotation shaft receiving hole (132).

The leakage preventing plate 145 covers the spaced space between the inner ring 141 and the outer ring 143 so that the plating liquid B remaining in the roller accommodation space 115 is vertical and horizontally rotated with the vertical rollers 120 and 120a. Along the (121, 123) to prevent the outflow of the upper coupling plate 160 and the lower coupling plate 130. That is, the leakage preventing ring 140 fills the free space between the vertical rollers 120 and 120a and the rotation shaft accommodation hole 132 to prevent the plating solution B from flowing out through the rotation shaft accommodation hole 132. The plating liquid B moved along the upper and lower rotary shafts 121 and 123 is accumulated on the upper portion of the leakage preventing plate 145, and the plating liquid B exceeding the height of the leakage preventing ring 140 passes through the inflow hole 112. Will be discharged forward.

The back plate 150 is coupled to the back surface of the front plate 110 to guide the plated material (A) into the plating solution tank (300). The back plate 150 is formed of a back plate body 151, a guide hole 152 formed on the back plate body 151, and a back coupling bar 153 coupled to the coupling bar 113.

The upper coupling plate 160 is coupled to the top of the front plate 110 and the back plate 150 to prevent the upper leakage of the plating liquid. The upper coupling plate 160 has an upper coupling plate body 161, an upper rotation shaft receiving groove 162 formed in a predetermined depth in the upper coupling plate body 161, and an upper step formed on an outer circumference of the upper rotation shaft receiving groove 162. And a ring seating surface 133.

The upper coupling plate 160 has the same configuration as the lower coupling plate 130, but the upper rotation shaft receiving groove 162 is formed in a predetermined depth without penetrating the upper coupling plate body 161. That is, since the upper coupling plate 160 has a sealed shape, the outflow of the plating liquid toward the upper direction is prevented at the source.

Here, the interval adjusting bolts (131a, 161a) are coupled to the side of the upper coupling plate 160 and the lower coupling plate 130, respectively. Spacing adjustment bolts (131a, 161a) is inserted in the side of the upper coupling plate 160 and the lower coupling plate 130 as shown in Figure 5 protrudes into the rotation axis receiving holes (132,162). As a result, the space adjusting bolts 131a and 161a contact and pressurize the leakage preventing ring 140 accommodated in the rotation shaft accommodation holes 132 and 162. The gap between the left and right pair of leakage preventing rings 140 may be adjusted by the pressure of the space adjusting bolts 131a and 161a, and thus the gap between the pair of vertical rollers 120 and 120a may be adjusted. .

Outflow gate 200 is provided on the other side of the plating liquid tank 300 to flow out the to-be-processed substrate (A ') is completed in the plating liquid tank 300 to the outside. The outlet gate 200 is disposed in a direction opposite to each other in the same configuration as the inlet gate 100.

The plating process of the plated material (A) of the plating apparatus 1 according to the present invention having such a configuration will be described with reference to FIGS. 2 to 5.

On one side and the other side of the plating tank 300, the inlet gate 100 and the outlet gate 200 are assembled, respectively. The to-be-plated material A is coupled to a transfer jig (not shown) or the like and transferred to the plating solution tank 300. The tip of the plated material A is introduced through the inlet hole 112 and is transferred between the pair of vertical rollers 120 and 120a. The pair of vertical rollers 120 and 120a are positioned to be spaced apart from each other by the guide gap C, and are widened by the thickness of the plated material A by the inflow of the plated material A. Will rotate.

At this time, the pair of vertical rollers (120, 120a) is a rotating shaft (121, 123) is accommodated between a pair of leakage preventing ring 140, the leakage preventing ring 140 is a rotating shaft receiving hole 132, there is a clearance space Is placed on. Therefore, when the plated material A is transferred, the pair of vertical rollers 120 and 120a may be moved to the left and right within a predetermined range. Accordingly, when the plated material (A) is not transferred, the pair of vertical rollers (120, 120a) are kept spaced apart at minimum intervals, and when the plated material (A) is transferred, between the vertical rollers (120, 120a) Since the gap is filled, the amount of the plating liquid flowing out into the inlet hole 112 through the vertical rollers 120 and 120a may be minimized.

Here, the leakage preventing ring 140 is provided to be replaceable. According to the thickness of the plated material (A), the gap l between the outer ring 143 and the inner ring 141 of the leakage preventing ring 140 may be used interchangeably. Accordingly, in one plating apparatus 1, the plating materials A having different thicknesses may be plated by minimizing the outflow of the plating liquid.

Meanwhile, the plating liquid introduced into the roller accommodation space 115 in the plating process is moved to the lower coupling plate 130. At this time, since the rotary shafts 121 and 123 and the pair of leakage preventing rings 140 of the vertical rollers 120 and 120a are accommodated in the rotary shaft accommodation holes 132, as shown in FIG. This spillage can also be minimized.

As described above, the plating treatment apparatus according to the present invention may minimize leakage of the plating liquid by disposing a leakage preventing ring to prevent leakage at the upper and lower portions of the inflow gate and the outflow gate.

In addition, the plating treatment apparatus according to the present invention is provided with a variable spaced interval between the vertical rollers formed of a plastic material to minimize the outflow of the plating liquid and can actively correspond to the thickness of the plated material.

The embodiment of the plating treatment apparatus of the present invention described above is merely exemplary, and those skilled in the art will appreciate that various modifications and equivalent other embodiments are possible therefrom. Could be. Therefore, it is to be understood that the present invention is not limited to the above-described embodiments. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims. It is also to be understood that the invention includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

1: plating apparatus 100: inflow gate
110: front panel 111: front panel body
111a: fastening hole 112: inlet hole
113: coupling bar 113a: vertical fastening hole
113b: horizontal fastening hole 115: roller receiving space
117: first fastening member 120: first vertical roller
121: lower rotary shaft 123: upper rotary shaft
120a: second vertical roller 130: lower coupling plate
131: coupling plate body 132: rotation axis receiving ball
133: ring seating surface 135: second fastening member
140: leak prevention ring 141: inner ring
142: shaft insertion hole 143: outer ring
145: leak prevention plate 150: back plate
151: rear plate main body 153: rear coupling bar
160: upper coupling plate 161: upper coupling plate body
162: upper rotation shaft receiving groove 163: upper ring seating surface
165: third fastening member 200: outlet gate
300: plating solution tank

Claims (5)

In the plating treatment apparatus,
A plating tank in which a plating solution is accommodated;
An inflow gate coupled to one surface of the plating tank to introduce a plating material into the plating tank;
It is coupled to the other surface of the plating tank and includes an outlet gate for flowing out the plating material is completed plating in the plating tank to the outside,
The inflow gate,
A front plate exposed to the outside and formed with an inlet hole;
A back plate coupled to the front plate and disposed in the plating tank and having guide holes formed therein;
A pair of vertical rollers provided in the front plate and the rear plate and configured to guide the plated material introduced into the inlet hole to the guide hole and to have a rotating shaft protruded up and down;
An upper coupling plate and a lower coupling plate coupled to upper and lower portions of the front plate and the rear plate to support the rotating shaft so that the pair of vertical rollers are rotatable;
It includes a leakage preventing ring disposed in the rotation axis of the vertical roller and the coupling region of the upper coupling plate and the lower coupling plate, respectively, to prevent external leakage of the plating liquid.
The leak prevention ring,
An inner ring accommodating the rotating shaft therein;
Including the outer ring formed spaced apart from the inner ring,
The spacing between the inner ring and the outer ring is adjusted differently according to the thickness of the plated material to vary the spacing between the pair of vertical rollers.
The method of claim 1,
The upper coupling plate and the lower coupling plate, respectively,
A coupling plate body having an elliptical rotation shaft receiving hole;
And a ring seating surface extending from the outer circumference of the rotation shaft accommodation hole of the coupling plate body in a predetermined area radially inward to seat the leakage preventing ring.
The method of claim 2,
The leak prevention ring,
And a leakage preventing plate connecting the inner ring and the outer ring to each other and having a plating liquid on the upper surface thereof to prevent external leakage of the plating liquid.
delete 4. The method according to any one of claims 1 to 3,
And the outlet gate is formed in the same structure as the inlet gate.

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