KR101292045B1 - Pcb with heatpipe and manufacturing method thereof - Google Patents

Pcb with heatpipe and manufacturing method thereof Download PDF

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KR101292045B1
KR101292045B1 KR1020110122581A KR20110122581A KR101292045B1 KR 101292045 B1 KR101292045 B1 KR 101292045B1 KR 1020110122581 A KR1020110122581 A KR 1020110122581A KR 20110122581 A KR20110122581 A KR 20110122581A KR 101292045 B1 KR101292045 B1 KR 101292045B1
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South Korea
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heat pipe
circuit board
layer
printed circuit
flexible
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KR1020110122581A
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Korean (ko)
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KR20130056924A (en
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김병호
최유진
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티티엠주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Abstract

본 발명은 히트파이프가 형성된 인쇄회로기판 및 그 제조방법 관한 것으로, 더욱 상세하게는 연성회로기판과 평판형 히트파이프를 고전도절연층(High K Dielectric Layer)을 삽입한 후에 고온압착방법(Hot Press Assy)으로 부착하여, 히트파이프의 상단에 곧바로 연성인쇄회로기판이 형성된 새로운 인쇄회로기판을 제공하여 열확산이 뛰어나면서 에칭액으로부터 히트파이프의 안정성을 확보할 수 있는 히트파이프가 형성된 인쇄회로기판 및 그 제조방법에 관한 것이다.
본 발명에 의하면 고온압착에 의해서 연성회로기판과 히트파이프를 고온압착하여 형성하므로 히트파이프에는 전혀 손상을 주지 않고, 히트파이프와 연성회로기판 사이에 폴리아미드필름이 존재하지 않으므로 열소산효율이 증가하여 실장된 부품에서 발생하는 열을 쉽게 소산시킬 수 있는 등의 효과가 발생한다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board on which a heat pipe is formed and a method of manufacturing the same. More specifically, a high pressure bonding method is performed after inserting a high K dielectric layer into a flexible circuit board and a flat plate heat pipe. Printed circuit board with a heat pipe capable of securing stability of the heat pipe from the etching solution by providing a new printed circuit board having a flexible printed circuit board directly formed on the top of the heat pipe. It is about a method.
According to the present invention, since the flexible circuit board and the heat pipe are formed by high temperature compression by high temperature compression, the heat pipe is not damaged at all, and since the polyamide film does not exist between the heat pipe and the flexible circuit board, the heat dissipation efficiency is increased. Effects such as heat dissipation in the mounted parts can be easily dissipated.

Description

히트파이프가 형성된 인쇄회로기판 및 그 제조방법{PCB WITH HEATPIPE AND MANUFACTURING METHOD THEREOF}Printed circuit board with heat pipe and manufacturing method thereof {PCB WITH HEATPIPE AND MANUFACTURING METHOD THEREOF}

본 발명은 히트파이프가 형성된 인쇄회로기판 및 그 제조방법 관한 것으로, 더욱 상세하게는 연성회로기판과 평판형 히트파이프를 고전도절연층(High K Dielectric Layer)을 삽입한 후에 고온압착방법(Hot Press Assy)으로 부착하여, 히트파이프의 상단에 곧바로 연성인쇄회로기판이 형성된 새로운 인쇄회로기판을 제공하여 열확산이 뛰어나면서 에칭액으로부터 히트파이프의 안정성을 확보할 수 있는 히트파이프가 형성된 인쇄회로기판 및 그 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board on which a heat pipe is formed and a method of manufacturing the same. More specifically, a high pressure bonding method is performed after inserting a high K dielectric layer into a flexible circuit board and a flat plate heat pipe. Printed circuit board with a heat pipe capable of securing stability of the heat pipe from the etching solution by providing a new printed circuit board having a flexible printed circuit board directly formed on the top of the heat pipe. It is about a method.

최근 전자산업기술분야에 있어서는 반도체 직접회로의 집적도의 놀라운 발전과 소형칩 부품을 직접 탑재하는 표면실장기술(SMT)의 발전에 따라 인쇄회로기판의 기술이 많이 발달하고 있다.Recently, in the field of electronic industrial technology, technology of printed circuit boards has been developed with the development of semiconductor integrated circuits and the development of surface mount technology (SMT) for directly mounting small chip components.

상기 인쇄회로기판(PCB, Printed Circuit Board)은 회로를 구리패턴으로 형성하고, 하단에 알루미늄판을 형성하여 열확산이 빠르도록 형성하다. The printed circuit board (PCB) is formed to form a circuit in a copper pattern, and to form an aluminum plate at the bottom to fast thermal diffusion.

최근에는 전자산업이 경박단소화가 급속히 이루어져서 종래의 경성 인쇄회로기판보다 구리패턴의 양면에 폴리아미드(Polyamide)를 입힌 연성 인쇄회로기판이 개발되어 사용된다. Recently, in the electronic industry, light and short reduction has been rapidly made, and thus, a flexible printed circuit board coated with polyamide on both sides of a copper pattern has been developed and used rather than a conventional rigid printed circuit board.

상기 인쇄회로기판은 집적도가 높은 부품에서 발생하는 열을 소산시키는 기능을 수행하여야 하는데, 단순히 알루미늄만으로는 열소산능력이 떨어져서 알루미늄판의 하단에 평판형 히트파이프를 부착하거나, 평판형 히트파이트의 상단에 직접 구리패턴을 형성시켜서 제작하고 있다. The printed circuit board must perform a function of dissipating heat generated from a high-integration component. The heat dissipation capacity of aluminum alone is poor, so that a flat heat pipe is attached to the bottom of the aluminum plate or a top of the flat heat pipe. It is produced by forming a copper pattern directly.

상기 평판형 히트파이프에 대한 기술은 대한민국특허청 등록특허공보 제0631050호, 공개특허공보 제2004-0019150 및 등록실용신안공보 제0411135호 등에 개시된 바 있다. The technology for the flat heat pipe has been disclosed in Korean Patent Office Publication No. 0631050, Korean Patent Application Publication No. 2004-0019150, and Utility Model Registration No. 0411135.

그러나, 종래의 히트파이프가 형성된 인쇄회로기판은 다음과 같은 문제점이 있었다. However, the conventional printed circuit board on which the heat pipe is formed has the following problems.

(1) 구리패턴을 형성하기 위해서 에칭액에 넣었을 때 알루미늄성분인 히트파이프의 몸체가 함께 부식된다. (1) The body of the heat pipe, which is an aluminum component, corrodes together when placed in an etchant to form a copper pattern.

(2) 종래의 연성인쇄회로기판의 경우에 열소산을 위한 알루미늄판 혹은 히트파이프에 부착하는 면에 폴리아피드층이 형성되므로 열소산능력이 떨어진다. (2) In the case of a conventional flexible printed circuit board, since the poly-doped layer is formed on the surface attached to the aluminum plate or heat pipe for heat dissipation, the heat dissipation capacity is low.

상기한 문제점을 해결하기 위해서 본 발명은 회로가 형성된 구리층의 상단에 폴리아미드필름층이 형성되고, 상기 폴리아미드필름층의 상단에 피에스알층이 형성되며, 상기 피에스알층의 상단에 금도금층이 형성되고, 상기 금도금층의 상단에 실크스크린층이 형성되는 연성인쇄회로기판과; In order to solve the above problems, the present invention is a polyamide film layer is formed on top of the copper layer on which the circuit is formed, the PS layer is formed on the top of the polyamide film layer, the gold plated layer is formed on the top of the PS layer A flexible printed circuit board having a silk screen layer formed on top of the gold plated layer;

내부에 채널이 형성되고, 채널의 내부에 자동유체가 형성된 평판형 히트파이프로 구성되되, The channel is formed inside, and consists of a flat heat pipe with an automatic fluid formed inside the channel,

상기 히트파이프의 상단에 고전도절연층을 형성하고, 상기 고전도절연층의 상단에 연성회로기판을 올린 다음 고온압착으로 서로 부착하여 형성하는 것을 특징으로 한다.A high conductivity insulating layer is formed on an upper end of the heat pipe, and a flexible circuit board is placed on an upper end of the high conductivity insulating layer and then attached to each other by high temperature bonding.

본 발명의 히트파이프가 형성된 인쇄회로기판 및 그 제조방법에 의하면 다음과 같은 효과가 발생한다. According to the printed circuit board on which the heat pipe of the present invention is formed and the manufacturing method thereof, the following effects occur.

(1) 고온압착에 의해서 연성회로기판과 히트파이프를 고온압착하여 형성하므로 히트파이프에는 전혀 손상을 주지 않는다. (1) Since the flexible circuit board and the heat pipe are formed by high temperature compression by high temperature compression, the heat pipe is not damaged at all.

(2) 히트파이프와 연성회로기판 사이에 폴리아미드필름이 존재하지 않으므로 열소산효율이 증가하여 실장된 부품에서 발생하는 열을 쉽게 소산시킬 수 있다.(2) Since there is no polyamide film between the heat pipe and the flexible circuit board, the heat dissipation efficiency is increased, so it is easy to dissipate heat generated in the mounted parts.

도 1은 본 발명의 바람직한 실시예로 형성된 히트파이프가 형성된 인쇄회로기판의 개념도.
도 2는 본 발명의 바람직한 실시예로 형성된 히트파이프가 형성된 인쇄회로기판에 분리전개도. 1 is a conceptual diagram of a printed circuit board having a heat pipe formed according to a preferred embodiment of the present invention.
Figure 2 is a separation development diagram on a printed circuit board having a heat pipe formed according to a preferred embodiment of the present invention.

본 발명은 회로가 형성된 구리층(11)의 상단에 폴리아미드필름층(12)이 형성되고, 상기 폴리아미드필름층(12)의 상단에 피에스알층(13)이 형성되며, 상기 피에스알층(13)의 상단에 금도금층(14)이 형성되고, 상기 금도금층(14)의 상단에 실크스크린층(15)이 형성되는 연성인쇄회로기판(10)과; In the present invention, a polyamide film layer 12 is formed on an upper end of the copper layer 11 on which a circuit is formed, a PSAL layer 13 is formed on an upper end of the polyamide film layer 12, and the PLS layer 13 A flexible printed circuit board (10) having a gold plated layer (14) formed at the top of the upper surface of the metal plate and a silk screen layer (15) formed at the top of the gold plated layer (14);

내부에 채널이 형성되고, 채널의 내부에 자동유체가 형성된 평판형 히트파이프(20)로 구성되되, The channel is formed therein, and consists of a flat heat pipe 20 having an automatic fluid formed therein,

상기 히트파이프(20)의 상단에 고전도절연층(30)을 형성하고, 상기 고전도절연층(30)의 상단에 연성회로기판(10)을 올린 다음 고온압착으로 서로 부착하여 형성한다.The high conductive insulating layer 30 is formed on the top of the heat pipe 20, and the flexible circuit board 10 is placed on the top of the high conductive insulating layer 30 and then attached to each other by high temperature compression.

상기 구리층(11)은 회로를 패턴으로 형성한 것으로, 에칭액으로 패턴을 형성한다. The copper layer 11 is formed by forming a circuit in a pattern, and forms a pattern in an etchant.

상기 폴리아미드필름층(12)은 높은 열안정성과 효과적인 기계적 특성으로 우주항공분야에서 각광받는 소재인 폴리아미드(Polyamide) 필름으로 형성된다. The polyamide film layer 12 is formed of a polyamide (Polyamide) film, a material that is in the spotlight in the aerospace field with high thermal stability and effective mechanical properties.

상기 폴리아미드필름층(12)의 상단에는 피에스알층(PSR, 13)이 형성되는데, 상기 피에스알층(13)은 불필요한 부분에서의 납 부착을 방지하고, 구리층의 표면회로를 외부환경으로부터 보호하기 위해 잉크가 도포된 층이다. A PS layer 13 (PSR) is formed on the top of the polyamide film layer 12. The PS layer 13 prevents lead adhesion from unnecessary portions and protects the surface circuit of the copper layer from the external environment. In order to apply ink.

상기 금도금층(14)은 은으로 도금하는 Au plating 공정에서 생기는 층으로, 일반적인 인쇄회로기판을 제조할 때 처리하는 층이다. The gold plated layer 14 is a layer formed in the Au plating process of plating with silver, and is a layer processed when manufacturing a general printed circuit board.

상기 금도금층(14)의 상단에는 글자나 표식을 실크스크린방식으로 인쇄하는 실크스크린층(15)이 형성된다. A silk screen layer 15 is formed on the top of the gold plated layer 14 to print a letter or a mark by a silk screen method.

상기 구리층(11), 폴리아미드필름층(12), 피에스알층(13)층, 금도금층(14) 및 실크스크린층(15)은 연성 인쇄회로기판(10)을 제조하는 공정 후에 생기는 각 층을 나타낸 것이다. The copper layer 11, the polyamide film layer 12, the PS layer 13, the gold plating layer 14, and the silk screen layer 15 may be formed after the process of manufacturing the flexible printed circuit board 10. It is shown.

상기 히트파이프(20)는 평판형으로, 내부에 채널이 형성되고 상기 채널에는 작동유체가 형성된다. The heat pipe 20 is flat, and a channel is formed therein, and a working fluid is formed in the channel.

상기 고전도절연층(30)은 Dielectric (High-K) 층으로 일반적으로 이산화규소(SiO2)를 사용한 얇은 막으로 형성된다. The high conductivity insulating layer 30 is a dielectric (high-K) layer and is generally formed of a thin film using silicon dioxide (SiO 2 ).

상기 히트파이프(20)의 상단에 고전도절연층(30)을 형성하고, 상단에 연성인쇄회로기판(10)을 올린 후에 고온압착하여 고전도절연층(30)으로 인해서 서로 부착되도록 하여 완성한다.
The high conductive insulating layer 30 is formed on the upper end of the heat pipe 20, the flexible printed circuit board 10 is placed on the upper end, and then, the high-temperature pressing is performed to attach the high conductive insulating layer 30 to each other. .

이하, 본 발명의 바람직한 실시예로 형성된 히트파이프가 형성된 인쇄회로기판 및 그 제조방법의 작동 및 효과를 설명하면 다음과 같다. Hereinafter, a description will be given of the operation and the effect of the printed circuit board and the method of manufacturing a heat pipe formed with a heat pipe formed according to a preferred embodiment of the present invention.

상기 히트파이프(20)를 형성하고, 상단에 고전도절연층(30)을 형성시킨다. The heat pipe 20 is formed, and a high conductivity insulating layer 30 is formed on the top.

상기와 같이 고전도절연층(30)을 형성한 히트파이프(20)의 상단에 연성인쇄회로기판(10)을 부착하는데, 이때 고온압착(Hot Press Assy)에 의해서 형성한다. The flexible printed circuit board 10 is attached to the upper end of the heat pipe 20 on which the high conductive insulation layer 30 is formed as described above, and is formed by hot press assembly.

상기 히트파이프(20)와 맞닿는 연성인쇄회로기판(10)의 최하단은 곧바로 구리층(11)이므로 실장된 부품에서 발생하는 열이 곧바로 히트파이프(20)로 전달될 수 있다. Since the lowermost end of the flexible printed circuit board 10 in contact with the heat pipe 20 is a copper layer 11, heat generated from the mounted component may be immediately transferred to the heat pipe 20.

특히, 폴리아미드필름층(12)이 구리층(11)의 하단에는 형성되지 않으므로, 방열효과가 뛰어나다.In particular, since the polyamide film layer 12 is not formed at the lower end of the copper layer 11, the heat dissipation effect is excellent.

또한, 구리층(12)의 형성과 히트파이프(20)의 형성을 따로 하기 때문에 에칭액으로 인해서 히트파이프(20)의 손상을 방지할 수 있다. In addition, since the formation of the copper layer 12 and the formation of the heat pipe 20 are separately performed, damage to the heat pipe 20 can be prevented due to the etching solution.

본 발명의 히트파이프가 형성된 인쇄회로기판 및 그 제조방법에 의하면 고온압착에 의해서 연성회로기판과 히트파이프를 고온압착하여 형성하므로 히트파이프에는 전혀 손상을 주지 않고, 히트파이프와 연성회로기판 사이에 폴리아미드필름이 존재하지 않으므로 열소산효율이 증가하여 실장된 부품에서 발생하는 열을 쉽게 소산시킬 수 있는 등의 효과가 발생한다.
According to the printed circuit board having the heat pipe of the present invention and a method of manufacturing the same, the flexible circuit board and the heat pipe are formed by high temperature compression by high temperature compression, so that the heat pipe is not damaged at all, and the poly between the heat pipe and the flexible circuit board is reduced. Since there is no amide film, the heat dissipation efficiency is increased, so that the heat generated from the mounted parts can be easily dissipated.

본 발명은 첨부된 도면을 참조하여 바람직한 실시예를 중심으로 기술되었지만, 당업자라면 이러한 기재로부터 후술하는 특허청구범위에 의해 포괄되는 본 발명의 범주를 벗어남이 없이 다양한 변형이 가능하다는 것은 명백하다.While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art without departing from the scope of the invention as defined by the appended claims.

10 : 연성인쇄회로기판 11 : 구리층
12 : 폴리아미드층 13 : 피에스알층
14 : 금도금층 15 : 실크스크린층
20 : 히트파이프 30 : 고전도절연층10: flexible printed circuit board 11: copper layer
12 polyamide layer 13 PS layer
14: gold plated layer 15: silk screen layer
20: heat pipe 30: high conductivity insulating layer

Claims (2)

삭제delete 회로가 형성된 구리층(11)의 상단에 폴리아미드필름층(12)이 형성되고, 상기 폴리아미드필름층(12)의 상단에 피에스알층(13)이 형성되며, 상기 피에스알층(13)의 상단에 금도금층(14)이 형성되고, 상기 금도금층(14)의 상단에 실크스크린층(15)이 형성되는 연성인쇄회로기판(10)과;
내부에 채널이 형성되고, 채널의 내부에 자동유체가 형성된 평판형 히트파이프(20)로 구성되되,
상기 히트파이프(20)의 상단에 고전도절연층(30)을 형성하고, 상기 고전도절연층(30)의 상단에 연성회로기판(10)을 올린 다음 고온압착으로 서로 부착하여 형성하는 것을 특징으로 하는 히트파이프가 형성된 인쇄회로기판의 제조방법.A polyamide film layer 12 is formed on the top of the copper layer 11 having a circuit, a PS layer 13 is formed on the top of the polyamide film layer 12, the top of the PS layer 13 A flexible printed circuit board (10) having a gold plated layer (14) formed thereon and a silk screen layer (15) formed on top of the gold plated layer (14);
The channel is formed therein, and consists of a flat heat pipe 20 having an automatic fluid formed therein,
The high conductive insulation layer 30 is formed on the top of the heat pipe 20, and the flexible circuit board 10 is placed on the top of the high conductive insulation layer 30, and then attached to each other by high temperature compression. The manufacturing method of the printed circuit board with a heat pipe formed into it.
KR1020110122581A 2011-11-23 2011-11-23 Pcb with heatpipe and manufacturing method thereof KR101292045B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060064186A (en) * 2004-12-08 2006-06-13 엘지전자 주식회사 Heat sink structure for printed circuit board
KR20070120251A (en) * 2006-06-19 2007-12-24 티티엠주식회사 Printed circuit board incorporated with heatpipe and manufacturing method thereof
KR20090062590A (en) * 2007-12-13 2009-06-17 주식회사액트 Pad for thermocompression bonding and method for thermocompression bonding cover layer to printed circuit board
KR101164514B1 (en) 2011-04-21 2012-07-10 주식회사 세기하이텍 Micro heat spreader based metal substrate module, and a manufacturing method of the metal substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060064186A (en) * 2004-12-08 2006-06-13 엘지전자 주식회사 Heat sink structure for printed circuit board
KR20070120251A (en) * 2006-06-19 2007-12-24 티티엠주식회사 Printed circuit board incorporated with heatpipe and manufacturing method thereof
KR20090062590A (en) * 2007-12-13 2009-06-17 주식회사액트 Pad for thermocompression bonding and method for thermocompression bonding cover layer to printed circuit board
KR101164514B1 (en) 2011-04-21 2012-07-10 주식회사 세기하이텍 Micro heat spreader based metal substrate module, and a manufacturing method of the metal substrate

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