KR101282774B1 - Nitride based light emitting diode and method of manufacturing the same - Google Patents
Nitride based light emitting diode and method of manufacturing the same Download PDFInfo
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- KR101282774B1 KR101282774B1 KR1020060070213A KR20060070213A KR101282774B1 KR 101282774 B1 KR101282774 B1 KR 101282774B1 KR 1020060070213 A KR1020060070213 A KR 1020060070213A KR 20060070213 A KR20060070213 A KR 20060070213A KR 101282774 B1 KR101282774 B1 KR 101282774B1
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Abstract
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nitride based light emitting device, and more particularly, to a nitride based light emitting device capable of improving crystallinity and surface properties and a method of manufacturing the same. The present invention is a nitride-based light emitting device, the substrate; It is preferably configured to include a polarity conversion layer located on the substrate.
GaN, polar, substrate, surface, thin film.
Description
1 is a schematic diagram showing a general GaN polarity.
2 is a cross-sectional view showing an embodiment of the present invention.
3 is a schematic view showing the thin film growth of the present invention.
4 is a cross-sectional view showing another embodiment of the present invention.
5 is a schematic diagram illustrating a stacking sequence of the present invention.
6 and 7 are surface photographs of N polarity and Ga polarity, respectively.
8 and 9 are AFM images of N polarity and Ga polarity, respectively.
BRIEF DESCRIPTION OF THE DRAWINGS FIG.
10 substrate 20 nitride control layer
30: polarity conversion layer 40: buffer layer
50: n-type semiconductor layer 51: n-type electrode
60: light emitting layer 70: p-type semiconductor layer
71: p-AlGaN cladding layer 72: p-type electrode
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nitride based light emitting device, and more particularly, to a nitride based light emitting device capable of improving crystallinity and surface properties and a method of manufacturing the same.
Light emitting diodes (LEDs) are well-known semiconductor light emitting devices that convert current into light. In 1962, red LEDs using GaAsP compound semiconductors were commercialized. GaP: N series green LEDs and information communication devices As a light source for a display image of an electronic device.
The wavelength of the light emitted by these LEDs depends on the semiconductor material used to fabricate the LED. This is because the wavelength of the emitted light depends on the band gap of the semiconductor material, which represents the energy difference between the valence band electrons and the conduction band electrons.
Gallium nitride compound semiconductors (Gallium Nitride (GaN)) have attracted much attention in the field of high power electronics development due to their high thermal stability and wide bandgap (0.8-6.2 eV). One reason for this is that GaN can be combined with other elements (indium (In), aluminum (Al), etc.) to produce semiconductor layers that emit green, blue and white light.
Since the emission wavelength can be controlled in this manner, it can be tailored to the characteristics of the material according to the specific device characteristics. For example, GaN can be used to create a white LED that can replace the blue LEDs and incandescent lamps that are beneficial for optical recording.
In addition, in the case of the conventional green LED, it was initially implemented as GaP, which was inefficient as an indirect transition type material, and thus practical pure green light emission could not be obtained. However, as InGaN thin film growth succeeded, high brightness green LED could be realized. It became.
Because of these and other benefits, the GaN series LED market is growing rapidly. Therefore, since commercial introduction in 1994, GaN-based optoelectronic device technology has rapidly developed.
Since the efficiency of GaN light emitting diodes outperformed the efficiency of incandescent lamps and is now comparable to that of fluorescent lamps, the GaN LED market is expected to continue to grow rapidly.
In the GaN semiconductor device described above, a hexagonal sapphire ([0001] direction) substrate is usually used. On the sapphire substrate, GaN crystals having a hexagonal Wurzite structure grow along the c axis of the sapphire substrate.
Figure 1 shows the Wurzite GaN structure formed along the c axis. This structure has no possibility of symmetry in the c-axis direction, i.e., the growth direction, and has the potential to grow a GaN film having two thin crystal growth relationships.
That is, considering a vector of N atoms from GaN atoms, one thin film growth relationship is one in which the vector direction and the growth direction coincide, and the other is a relationship in which the vector direction and the growth direction are different by 180 degrees.
Among these, the polarity of the GaN film having the former thin film growth relation is referred to as Ga polarity and the latter as N polarity. The polarity of GaN film is Ga polarity and N polarity, respectively, by the process of flowing organic metal gas before ammonia gas at the start of thin film growth or nitriding a sapphire substrate with ammonia just before GaN growth using MOCVD method. It is possible to control with.
In particular, the nitriding of the top surface of the sapphire substrate lowered the surface energy by improving the rough surface state of the sapphire substrate and showed that it is effective in improving the growth direction and thin film crystallinity in the nucleation of GaN.
However, GaN thin films grown on nitrided sapphire substrates have a nitrogen-rich surface and thus exhibit hexagonal facet morphology and show a large difference from the flat surface morphology in the case of Ga polarity. There is a need to convert the N polarity to Ga polarity.
When GaN is grown according to the polarity, the surface structure has a difference in crystal growth depending on the polarity of the surface, and brings about a big difference in growth surface shape, defect structure, implantation of impurities, and the like.
Therefore, in the GaN-based thin film manufacturing field, a manufacturing method is required to grow a crystal film that satisfies optimal conditions for growing a high quality semiconductor crystal layer for growing light emitting structures, and in particular, determining and controlling the polarity is very important. Do.
SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a nitride-based light emitting device capable of improving the crystallinity and surface characteristics of a light emitting device using a GaN semiconductor by growing a GaN semiconductor layer having a Ga polarity surface.
In order to achieve the above technical problem, the present invention is a nitride-based light emitting device, the substrate; It is preferable to include the polarity conversion layer located on the substrate.
The substrate is preferably nitrided, and in this case, it is preferable that the substrate further includes a nitride control layer for controlling the nitrided surface.
The nitride control layer may be an AlN layer having a thickness of 5 to 10 atomic layers.
The polarity converting layer may be an Al layer of 2 to 10 atomic layers, and optionally, nitride of any one of B, Al, Ga, and In, or any one of Zn, Cd, and Mg, and any of O, S, and Se. One compound can be used.
It is preferable that such polarity conversion layer converts N polarity into Ga polarity.
A buffer layer on the polarity conversion layer; An n-type semiconductor layer on the buffer layer; A light emitting layer on the n-type semiconductor layer; It may be configured to further include a p- type semiconductor layer positioned on the light emitting layer.
In this case, the substrate may be any one of sapphire, GaN, ZnO.
As another aspect for achieving the above technical problem, the present invention provides a method for manufacturing a nitride-based light emitting device, comprising the steps of: nitriding a substrate; Forming an AlN layer on the nitrided substrate; Forming a polarity conversion layer on the AlN layer; It is preferably configured to include the step of growing a GaN layer on the polarity conversion layer.
The AlN layer or the polarity conversion layer may be formed by a migration enhanced epitaxy (MEE) method.
In this case, the polarity conversion layer is preferably made of any one of nitrides of any one of B, Al, Ga, In, Zn, Cd, Mg, any one of O, S, Se, and Al. .
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
As shown in FIG. 2, the light emitting device of the present invention is first nitrided at 1000 to 1150 ° C. on the
The nitriding process of the upper surface of the
In this
As such, the AIN layer formed on the
Thereafter, on the nitride control layer 20, only the TMAl raw material is injected within a temperature range of 550 to 1100 ° C. to form the
The
In addition, the
In addition to the
As shown in FIG. 3, the MEE method is a method of controlling growth to an atomic layer thickness by controlling a shutter of a source material in a vapor deposition method such as MOCVD.
That is, using the AlN layer as an example, Al is delivered by hydrogen gas, which is a carrier gas, using TMAl (tri-methyl aluminum) as a source, and N is also delivered by hydrogen gas, using NH 3 (ammonia) gas as a source. .
At this time, if there is a time interval (a) between the on-off time of each source, during this time, only one atomic layer of each atomic layer is combined with the lower layer and the remaining atomic layer is the carrier gas (H) flowing during this time interval (a). 2 ) to be removed.
Therefore, growth is possible in atomic layer units by a purging time through which only such a carrier gas flows.
The
The
The
After the n-type semiconductor layer 50 is viewed to be exposed in the structure thus grown, the n-
Meanwhile, as shown in FIG. 4, in the state where the
In this case, the
As described above, the structure in which the
Hereinafter, operations of the nitride control layer 20 and the
If the GaN thin film is grown directly on the
When the GaN thin film stacked on the
That is, when a GaN thin film is grown on the
In this case, when the
As described above, the GaN-based semiconductor layer having a Ga polar surface does not bond well with a material that acts as an impurity as compared to the N polar surface, and does not have a hexagonal surface shape that hinders crystal growth. The light emitting structure may be formed of the semiconductor layer.
6 and 7 show surface photographs of GaN thin films having N polarity and Ga polarity, respectively. When the
8 and 9 show AFM images of GaN thin films having N polarity and Ga polarity, respectively.
As described above, the nitride control layer 20 of the present invention can be grown to have a Ga-polar GaN semiconductor layer having excellent crystallinity by increasing the migration effect and forming the
The
In the present invention, the term
As such, the present invention can improve the crystallinity and surface properties of the GaN semiconductor layer to be subsequently grown by providing the
The above embodiment is an example for explaining the technical idea of the present invention in detail, and the present invention is not limited to the above embodiment, various modifications are possible, and various embodiments of the technical idea are all protected by the present invention. It belongs to the scope.
The present invention as described above has the following effects.
First, in growing the GaN thin film constituting the light emitting device it is possible to easily control the polarity of the GaN thin film.
Second, compared to the GaN semiconductor layer having an N polar surface, the GaN semiconductor layer having Ga polarity having excellent crystallinity and surface characteristics without dislocations and defects is possible.
Third, the light emitting device of the GaN semiconductor light emitting device may be improved by forming a light emitting device using the high quality GaN semiconductor layer.
Claims (12)
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KR20040027390A (en) * | 2002-09-25 | 2004-04-01 | 일본국 (지바 다이가꾸쵸) | Device having a nitride group hetero structure and method of manufacturing the same |
KR20050096508A (en) * | 2004-03-31 | 2005-10-06 | 삼성전기주식회사 | Gallium nitride based semiconductor light emitting device |
KR100593912B1 (en) | 2004-06-04 | 2006-06-30 | 삼성전기주식회사 | Gallium nitride based semiconductor light emitting device and fabrication method thereof |
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KR20040027390A (en) * | 2002-09-25 | 2004-04-01 | 일본국 (지바 다이가꾸쵸) | Device having a nitride group hetero structure and method of manufacturing the same |
KR20050096508A (en) * | 2004-03-31 | 2005-10-06 | 삼성전기주식회사 | Gallium nitride based semiconductor light emitting device |
KR100593912B1 (en) | 2004-06-04 | 2006-06-30 | 삼성전기주식회사 | Gallium nitride based semiconductor light emitting device and fabrication method thereof |
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