KR101275690B1 - Fast curable phenol moulding compound and method for manufacturing the same - Google Patents

Abstract

The present invention relates to a resin comprising: (i) a novolak-type phenolic resin (a) and a high ortho novolak-type phenolic resin (b) having an ortho-bonding / para-bonding ratio of at least 1.0. bookbinder; And ii) an inorganic filler, wherein the resin binder and the inorganic filler are surface-modified by silane coupling, and iii) novolak-type phenolic resin (a) and at least 1.0 ortho (ortho). Mixing a high ortho novolak-type phenolic resin (b) having a) -bond / para-bond ratio to form a resin binder; Ii) mixing an inorganic filler into the resin binder; V) treating the mixture produced in step ii) with a silane coupling agent to perform a silane coupling process; Iii) kneading with heat treatment the mixture produced in step iii); And iii) cooling to room temperature, and then coarsely pulverizing to provide a method for producing a phenol resin molding material. According to the present invention, by improving the compatibility and bonding strength of the resin and the inorganic filler, and by optimizing the high temperature kneading process, it is possible to shorten the curing time to significantly increase the productivity, and to improve the functionality such as physical strength and fluidity.

Description

FAST CURABLE PHENOL MOULDING COMPOUND AND METHOD FOR MANUFACTURING THE SAME

The present invention relates to a method for producing a phenolic resin molding material, and more particularly, to a method for producing a fast-curing phenolic resin molding material capable of improving physical strength and fluidity and the like, and significantly increasing the curing rate, and productivity and The present invention relates to a phenol resin molding material with improved functionality.

Organic-inorganic composite materials such as phenolic resin molding materials are widely used to produce electrical and electronic components having complex shapes of fine size by extrusion and injection thermoforming processes.

The extrusion and injection thermoforming process is performed by heating a molding material composed of a resin serving as a binder, an inorganic filler serving as a filler, and a small amount of a plasticizer, a curing agent, and a release agent to a temperature range near the softening point of the binder resin to make it fluid. Afterwards, the mold is pushed to be filled at every corner with a strong pressure by a extrusion or injection method, and the mold temperature is heated to a high temperature to harden the molding material, thereby producing a final product. Recently, due to the development of the IT industry, such organic and inorganic composite materials have been widely used in various electric and electronic components such as mobile communication and displays.

However, in the conventional method for producing a phenolic resin molding material, since the composite material is manufactured by simple blending of the phenolic resin and the curing agent, the compatibility problem with the inorganic filler occurs, and heat dissipation and functionality are difficult to control. There are problems such as severe shrinkage and deformation during molding. Accordingly, there is a demand for developing a manufacturing technology of a phenol resin molding material capable of expressing high functionality suitable for the characteristics of each applied product for electric and electronic parts, mechanical structures, and home appliances.

In addition, in the production of such highly functional phenolic resin molding materials, it is important to reduce the manufacturing time of the extrusion and injection thermoforming processes to enable mass production. For mass production of phenol resin molding materials, it is necessary to improve the curing rate in the thermoforming process. However, if the addition amount of the curing agent is simply increased to increase the curing rate, the problem of product corrosion by ammonia volatilized from the amine curing agent becomes large even after completion of curing.

In order to shorten the curing time, a manufacturing technique is known in which a curing process is performed using a high ortho phenol resin binder having a nonuniform molecular structure instead of a conventional general phenol resin binder, which has a high curing speed. (Patent Document 1). Moreover, the method of promoting hardening reaction and improving intensity | strength by adding organopolysiloxane to the existing general phenol resin binder is known (patent document 2).

However, in the case of the method of shortening the curing time by simply replacing the existing general phenolic resin binder with the high ortho phenolic resin binder as described above, the curing is completed in the high temperature kneading process performed after mixing and blending in the manufacturing process and demolding the equipment. However, it is difficult to control the process due to difficulty in the manufacturing process due to no emission. In addition, when organopolysiloxane is added to an existing general phenol resin binder and used, there is a problem in that the viscosity is maintained and the molding material in powder state cannot be produced.

Therefore, there is still a need for development of a phenol resin molding material having improved functionality and productivity and a manufacturing method thereof.

Patent Document 1: Japanese Unexamined Patent Publication No. 194-345940 Patent Document 2: Japanese Unexamined Patent Publication No. 1994-345971

The present invention is to solve the problems of the prior art as described above, by improving the compatibility and bonding strength of the resin and the inorganic filler, by optimizing the high temperature kneading process, by shortening the curing time to significantly increase the productivity, physical strength and fluidity It is an object of the present invention to provide a fast-curing phenol resin molding material and a method of manufacturing the same that can improve the functionality of such.

The phenol resin molding material of the present invention for solving the above problems is iii) high ortho having a novolak-type phenol resin (a), and an ortho-bonding / para-bonding ratio of 1.0 or more. A resin binder made of a novolac phenol resin (b); And ii) an inorganic filler, wherein the resin binder and the inorganic filler are surface-modified by silane coupling.

In addition, the manufacturing method of the phenolic resin molding material of the present invention is a high ortho novolak having a novolak-type phenolic resin (a) and an ortho-bonding / para-bonding ratio of 1.0 or more Mixing a type phenol resin (b) to form a resin binder; Ii) mixing an inorganic filler into the resin binder; V) treating the mixture produced in step ii) with a silane coupling agent to perform a silane coupling process; Iii) kneading with heat treatment the mixture produced in step iii); And iii) cooling to room temperature, followed by coarsely pulverizing.

Since the molding material according to the present invention has a high curing speed during extrusion or injection molding without additional addition of a curing agent, the one-time working speed is shortened, thereby enabling mass production of thermosetting molded articles having precise shapes.

In addition, the compatibility and bonding strength between the resin and the inorganic filler is increased, and the functional properties such as physical strength and fluidity are improved, and the curing speed is increased to increase the productivity of the phenol molding material, and thus have electric and electronic parts and machines having a complicated shape with a fine size. It can be widely applied to the manufacture of various structural parts, etc., and can be particularly useful as a molding material for bobbins.

Furthermore, according to the present invention, by minimizing the addition of the amine-based curing agent, it is possible to minimize the ammonia volatilization of the thermosetting molded product produced, it is possible to improve the applicability to the IT product consisting of a particularly precise circuit.

In addition, in the present invention, by using a binder in which a heteroatom resin of a high ortho novolak-type phenolic resin is blended with a conventional novolak-type phenolic resin having a high ratio of para bonds, a process for producing a molding material It is easy to combine the advantages of each resin is economical and excellent functionality can be utilized in various applications in various fields.

1 is a graph showing the curing time according to the content of the high ortho phenolic resin according to Example 1.
Figure 2 is a graph showing the bending strength (bending stregth) according to the methanol content according to Example 1.
3 is a graph showing the results of FT-IR analysis of silane-coupled para-type phenol resins.
Figure 4 is a graph showing the results of the FT-IT analysis of the silane-coupled ioso type phenol resin.
5 is a graph showing changes in density values before and after performing a silane coupling process for products of each model of a phenol resin molding material.
FIG. 6 is a graph showing changes in flexural strength values before and after performing a silane coupling process for products of each model of a phenol resin molding material. FIG.
7 is a graph showing changes in tensile strength values before and after performing a silane coupling process for products of each model of a phenol resin molding material.
8 is a graph showing changes in compressive strength values before and after performing a silane coupling process for products of each model of a phenol resin molding material.
FIG. 9 is a graph showing changes in Charpy impact strength values before and after performing a silane coupling process for products of each model of a phenol resin molding material. FIG.
10 is a graph showing changes in Rockwell hardness values before and after performing a silane coupling process for products of each model of a phenol resin molding material.
FIG. 11 is a graph showing changes in fluidity and curing time according to kneader holding time in Example 5. FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The phenolic resin molding material according to an embodiment of the present invention is a high ortho furnace having a novolak-type phenolic resin (a) and an ortho-bonding / para-bonding ratio of 1.0 or more. A resin binder composed of a ballac phenol resin (b); And ii) an inorganic filler, wherein the resin binder and the inorganic filler are surface-modified by silane coupling.

As used herein, "molding" includes extrusion molding and injection molding. In addition, in this specification, "molding material" means a molding material that is molded by a method such as extrusion molding or injection molding to be manufactured into a molded article.

In one embodiment of the present invention, as a binder of the molding material, a hetero resin, that is, a novolak-type phenol resin (a), and a high ortho having a ortho-bond / para-bond ratio of 1.0 or more ortho) a novolac type phenol resin (b).

The high ortho novolak-type phenol resin (b) has an ortho-bond / para-bond ratio of 1.0 or more, more preferably 1.0 to 2.5. This high ortho novolak-type phenolic resin has a fast curing speed, minimizes the addition of a curing agent, shortens the product production time during extrusion or injection molding, and minimizes ammonia volatilization after thermosetting, thus improving productivity and not causing corrosion. There is this.

Novolak-type phenolic resin (a) is a conventional novolak-type phenolic resin that has been used as a molding material, and has more para-bonds than ortho-bonds. Such a novolak-type phenolic resin (a) has the advantages of easy production and high mechanical strength.

In one embodiment, the novolac phenolic resin (a) preferably has an ortho-bond / para-bond ratio of less than 0.2, more preferably less than 0.1.

In the present invention, by using the combination of the novolak-type phenol resin (a) and the high ortho novolak-type phenol resin (b) as a binder of the molding material in this way, the disadvantages of the respective resins as described above are eliminated. You can complement each other and combine the advantages of each.

In one embodiment, the resin binder is preferably composed of 50 to 90% by weight of the novolak-type phenolic resin (a) and 10 to 50% by weight of the high ortho novolic phenolic resin (b) based on the total weight of the resin binder.

The high ortho novolic phenolic resin (b) may exhibit compatibility problems due to non-uniform mixing and fluidity difference caused by the curing rate difference with the novolak-type phenolic resin (a), which is a base material, and is mixed in the above range. desirable.

In particular, when the content of the high ortho novolak-type phenolic resin (b) is less than 10% by weight, the effect of adding the high ortho novolak-type phenolic resin (b) is not shortened or the effect of minimizing the volatilization of ammonia after curing is not exhibited. There is a problem. In addition, when the content of the high ortho novolak-type phenolic resin (b) exceeds 50% by weight, kneader due to the rapid curing rate during the process of mixing the heterogeneous resin with the novolak-type phenolic resin (a), followed by heat treatment and kneading There is a problem that the molding material mixture is hardened in the mold release.

The novolac phenolic resin (a) and the high ortho novolic phenolic resin (b) may be in powder form.

In one embodiment, the resin binder further comprises an alcohol. By containing alcohol, the uniformity and compatibility between resin (a) and (b) contained in a resin binder can be improved.

The alcohol is preferably contained 1 to 10% by weight based on the total weight of the resin binder. If the added amount of alcohol is less than 1% by weight, the viscosity is expressed due to dissolution of the resin by alcohol, and thus, it is difficult to achieve uniform mixing.If the added amount is more than 10% by weight, the resin is excessively dissolved by alcohol, It exists in the liquid phase has a problem that it is difficult to achieve uniform mixing.

The alcohol that can be used in the present invention is not particularly limited, and for example, methanol, ethanol and the like can be appropriately selected and used.

The inorganic filler included in the phenolic resin molding material of the present invention is not particularly limited, and may be appropriately selected from conventional inorganic fillers used in extrusion or injection thermoforming materials. For example, in one embodiment of the present invention, the inorganic filler may be one or more selected from the group consisting of glass fibers, CaCO ₃ , talc, wood powder, feldspar and clay.

The amount of the inorganic filler to be added is not particularly limited and may be depending on the amount of the inorganic filler to be used for the resin in conventional compression or injection molding materials. For example, in one embodiment of the present invention, the inorganic filler may be included in the range of 50 to 150 parts by weight based on 100 parts by weight of the resin binder.

The resin binder and the inorganic filler included in the phenol resin molding material according to the present invention are characterized in that the surface is modified by silane coupling. Surface modification by silane coupling can be achieved by treating the mixture of resin binder and inorganic filler with a silane coupling agent.

As described above, by silane coupling the resin binder and the inorganic filler, the bonding strength of the resin binder and the inorganic filler can be strengthened to improve the mechanical strength and chemical stability of the phenol resin molding material.

The silane coupling agent used for the silane coupling may be selected and used according to the process conditions, etc. among those known in the art, specifically, an amine silane, for example, γ-aminopropyltriethoxysilane may be used. have.

The amount of the silane coupling agent is preferably 1 to 3% by weight based on the total weight of the resin binder and the inorganic filler from the viewpoint of forming the silane coupling coating layer as a monolayer to enhance the bonding force. When the silane coupling coating layer is formed of a monomolecular layer, it may induce a strong bond between the composite components and have a fluidity suitable for molding. However, when the silane coupling coating layer is formed of a polymolecular layer, the silane coupling coating layer may be inadequate for molding because of its low meltability. Can be.

In one embodiment, the phenolic resin molding material according to the present invention may further include one or more selected from the group consisting of a plasticizer, a curing agent and a releasing agent for the improvement of moldability, acceleration of curing, improvement of mold release.

In addition, in addition to the known additives used in conventional thermoforming materials may be further included.

On the other hand, the manufacturing method of the phenol resin molding material according to another embodiment of the present invention is iii) a high ortho having a novolak-type phenol resin (a) and an ortho-bond / para-bond ratio of 1.0 or more (high ortho) mixing a novolak-type phenol resin (b) to form a resin binder; Ii) mixing an inorganic filler into the resin binder; V) treating the mixture produced in step ii) with a silane coupling agent to perform a silane coupling process; Iii) kneading with heat treatment the mixture produced in step iii); And iii) cooling to room temperature, followed by coarsely pulverizing.

In one embodiment, the step iii) is performed by mixing 50 to 90% by weight of novolac phenolic resin (a) and 10 to 50% by weight of high ortho novolent phenolic resin (b) based on the total weight of the resin binder. Can be.

In one embodiment, in order to improve the homogeneity of inter-resin mixing and inter-resin compatibility, step iii) is performed by mixing for 5 to 50 minutes, preferably about 30 minutes, in a high speed mixer at a rotational speed of 980 to 1100 rpm. It is preferable to make.

Also, in one embodiment, step iii) may further comprise mixing the alcohol to induce uniform mixing. The alcohol is preferably mixed 1 to 10% by weight based on the total weight of the resin binder.

In one embodiment, the alcohol can be mixed by spraying on the resin binder.

In one embodiment, step ii) may be performed by mixing 50 to 150 parts by weight of the inorganic filler with respect to 100 parts by weight of the resin binder.

Further, in one embodiment, step ii) may comprise further mixing one or more selected from the group consisting of plasticizers, curing agents and release agents.

This mixing process can be done using a high speed mixer to ensure uniform mixing.

Next, the mixture produced in step ii) is treated with a silane coupling agent to perform a silane coupling process. As described above, by silane coupling the resin binder and the inorganic filler, the bonding strength of the resin binder and the inorganic filler can be strengthened to improve the mechanical strength and chemical stability of the phenol resin molding material.

The silane coupling agent used for the silane coupling may be selected and used according to the process conditions, etc. among those known in the art, specifically, an amine silane, for example, γ-aminopropyltriethoxysilane may be used. have.

The amount of the silane coupling agent is preferably 1 to 3% by weight based on the total weight of the resin binder and the inorganic filler from the viewpoint of forming the silane coupling coating layer as a monolayer to enhance the bonding force. When the silane coupling coating layer is formed of a monomolecular layer, it may induce a strong bond between the composite components and have a fluidity suitable for molding. However, when the silane coupling coating layer is formed of a polymolecular layer, the silane coupling coating layer may be inadequate for molding because of its low meltability. Can be.

In one embodiment, step iii) is preferably a high temperature kneading by heat-treating the mixture for 10 to 50 seconds at a temperature in the range of 150 ~ 200 ℃.

In such a high temperature kneading step, the holding time is preferably 10 to 60 seconds, more preferably at a temperature of preferably 150 to 200 ° C, more preferably 170 to 190 ° C, and most preferably about 180 ° C. By setting it as 15-35 second, most preferably about 21 second, gas is removed and although it is not fully hardened, the hardening time can be accelerated and the hardening time can be shortened in the hardening process by thermoforming at the time of final extrusion or injection molding.

The high ortho novolak-type phenol resin (b) has an ortho-bond / para-bond ratio of 1.0 or more, more preferably 1.0 to 2.5.

Novolak-type phenolic resin (a) is a conventional novolak-type phenolic resin that has been used as a molding material, and has more para-bonds than ortho-bonds. In one embodiment, it is preferred to have an ortho-bond / para-bond ratio of less than 0.2, more preferably less than 0.1, of the novolak type phenolic resin (a).

In the present invention, in the production of a phenol resin molding material, by using a resin binder of different resins and further optimizing the silane coupling and high temperature kneading process, the curing speed, physical strength and chemical stability of the phenol resin molding material are significantly improved. You can.

The phenol resin molding material thus prepared may be suitably used for various electrical and electronic components, especially commutators (bobbins) for electrical and electronic products.

Hereinafter, the present invention will be described in more detail by way of examples. However, the following examples are illustrative of the present invention, and the scope of the present invention is not limited to the following examples.

[ Example ]

Example  1: resin binder manufacturer

(1) 50 to 90% by weight of the powdered novolac-type phenolic resin and 10 to 50% by weight of the powdered novolac-type high ortho phenolic resin were mixed, and placed in a high-speed mixer at 980 to 1,100 rpm and maintained for 30 minutes to be uniformly mixed. . Figure 1 shows the curing time according to the content of the high ortho phenolic resin.

(2) In order to improve the uniformity and compatibility in the heterogeneous resin mixing process of (1), methanol was sprayed in a range of 1 to 10% by weight based on the total weight of the resin binder. The injected methanol dissolves the polymer resin and makes it viscous to promote uniform mixing between different resins during mixing in a high speed mixer. 2 is a change in the bending strength value of the molding material according to the content of methanol.

Example  2: Silane  Phenolic Resin and Inorganic Compounds According to Contents Filler Silane  Coupling effect

In order to examine the silane coupling effect of the phenol resin and the inorganic filler according to the silane content, glass fibers were mixed in a 1: 1 ratio (weight ratio) as an inorganic filler to each of the para-type phenol resin and the ioso-type phenol resin, and then methanol The γ-aminopropyltriethoxysilane solution in was added to the mixture at 1, 2, 3, 4 and 5% by weight based on the total amount of the resin binder and the glass fibers to carry out the silane coupling process.

3 and 4 show the results of FT-IR analysis of the silane-coupled para-type phenol resin and the ioso-type phenol resin, respectively.

Referring to FIG. 3, as the silane content increases to 3% by weight, the peak intensity of the functional group on the surface of the para-type phenol resin and the inorganic filler mixture is increased. On the other hand, when the content of silane was increased to 4 and 5% by weight, the intensity of the peak did not increase much. The amine silane used in this experiment is hydrolyzed by reacting with water and at the same time, the amine is attached to the end of the bond, and the -NH peak near 3300cm ^-1 is stronger as the content of silane increases. It is determined that the intensity of the peak is increased by forming a multilayered layer beyond the one formed by the monomolecular layer in the silanol phenol resin and the inorganic filler.

Referring to FIG. 4, as the content of silane increases, the -NH peak near 3300 cm ^-1 appears to be stronger. The peak intensity increased until the silane content was 3% by weight, but the -NH peak near 3300 cm ^-1 did not increase at 4% by weight. As a result of the FT-IR analysis, the peak intensity increased with increasing silane content up to 3% by weight, but afterwards, the peak intensity did not increase anymore, and the peak intensity increased again. It is believed that this is due to the formation of the silane coating.

The fluidity test results of the molding material prepared by kneading, cooling, and coarsely crushing the silane-coupled para-type phenol resin and the inorganic filler mixture as described above are shown in Table 1 below.

Silane content Average flow rate (cm) Remarks 1 wt% 170 Suitable for injection 2 wt% 171 Suitable for injection 3 wt% 170 Suitable for injection 4 wt% 168 Not suitable for injection 5 wt% 165 Not suitable for injection

Generally, the flow rate that can be injection molded is 170 cm. As shown in Table 1, in the silane-coupled phenol resin molding material, the flow length did not decrease as the silane content increased to 3 wt%, but the flow length decreased as the silane content increased to 5 wt%. . This is due to the silane coupling until the silane coating is formed into a monomolecular layer, the bonding force of the molding material is strong and has sufficient fluidity, but when the silane coating is formed into the multimolecular layer, it forms various radicals and rather the fluidity is short. It seems to be lost.

Example  3: Fast curing  Preparation of Phenolic Resin Molding Material

The total weight of the resin binder prepared in Example 1 was mixed with glass fibers as an inorganic filler in a ratio of 1: 1 (weight ratio), and then a plasticizer, a curing agent, and a releasing agent were respectively added in an amount of 0.7 wt%, 0.8 wt%, 0.7 wt% was added and uniformly mixed using a high speed mixer.

Next, a solution of γ-aminopropyltriethoxysilane in methanol was added to the mixture at 3% by weight based on the total amount of the resin binder and the glass fibers to perform a silane coupling process.

Then, the mixture was uniformly mixed into a kneader, followed by heat treatment in the range of 150 to 200 ° C. to remove volatiles and to have an appropriate thermal fluidity. At this time, the degree of hardening was promoted by maintaining the kneader for 10 to 60 seconds. After such a high temperature kneading step, it was cooled to room temperature and coarsely pulverized to obtain a phenol resin molding material according to the present invention capable of extrusion and injection molding.

Extrusion or injection molding of the molding material of the present embodiment thus obtained can produce a desired final product or part.

Example  4: Silane  Coupling effect

5 to 10 show the measurement results of physical properties according to the silane coupling process for each model of the phenol resin molding material.

Where used / blended characteristics and physical properties of the product for each model of the phenolic resin molding material used for the measurement of the physical properties are shown in Tables 2 and 3.

model name Where to use density
(g / cm3) Absorption rate
(%) Bending Strength (Mpa) Tensile Strength (Mpa) Sari Impact Strength (kJ / ㎡) Compressive strength
(Mpa)
Rockwell Hardness 201 Home Appliance Parts
(Myungsung Chemical) 1.41 0.08 60 46 2.74 209 116 301 Home Appliance Parts
Sulwha Industry 1.40 0.09 60 39 2.59 191 115 302 Electrical Insulation Parts
(Hyosung Hitech) 1.41 0.07 72 44 2.63 207 113 303 Machine parts
(Ivory resin) 1.39 0.09 68 44 2.80 199 112 304 Home Appliance Terminal
(Pungnyeon Hitech) 1.38 0.06 68 38 2.07 208 102 9606 Electric terminal commutator
(Iljin Rectifier) 1.68 0.05 118 55 3.05 174 119

5 to 10, except for the density it can be seen that the overall physical properties are improved by the silane coupling. In the case of density, there was no change in constituent compounding ratio, and there was no change due to silane coupling. In particular, the bending strength, tensile strength, and Charpy impact strength values showed clear improvement in strength values due to silane coupling. In addition, since the silane coupling effect is intended to enhance the bonding force between the resin and the inorganic filler, the silane coupling effect was not large for the model 304 containing a relatively large number of resins to impart fluidity. On the other hand, in the compressive strength, Rockwell hardness, etc., the silane coupling effect was not large, it is determined that the load acts up and down during the experiment.

Example  5: High temperature kneading process  optimization

In the manufacturing process, the curing time and the flow rate of the phenol resin molding material were measured according to the holding time of the high temperature kneading process performed in the kneader, and the results are shown in FIG. 11.

In this high temperature kneading process, the kneader proceeds to some extent while squeezing a mixture of a resin binder and an inorganic filler in a heated state in a range of 150 to 200 ° C., and discharges volatiles to control the curing rate during the final injection process. Volatilization is controlled so as not to occur excessively during injection. By controlling the holding time in the high-temperature kneader, the curing was carried out to some extent to economically add the amount of hyososo phenolic resin and to reduce the curing rate to within 60 seconds.

As shown in FIG. 11, the longer the holding time in the high temperature kneader, the lower the curing time of the phenol resin molding material and the shorter the flow rate, so that the injection is possible and the curing time can be reduced at the same time. The holding time in the chamber should be adjusted. On the basis of a flowable 170 cm of injection, a molding material having a curing time of 60 seconds and a flowability of 170 cm was obtained at a holding time of 21 seconds, and the economical high-oso phenol resin compounding ratio used was 0.25.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments or constructions. Various changes, substitutions and alterations can be made hereto without departing from the spirit and scope of the invention. It will be clear to those who have knowledge.

Claims (24)

Iii) novolak-type phenolic resin (a) having an ortho-bond / para-bond ratio of less than 0.2, and a high having an ortho-bond / para-bond ratio of at least 1.0. Resin binders comprising ortho novolak-type phenol resins (b); And
Ii) includes inorganic fillers,
The resin binder is composed of 50 to 90% by weight of the novolak-type phenol resin (a) and 10 to 50% by weight of the high ortho novolak-type phenol resin (b) based on the total weight of the resin binder,
The resin binder and the inorganic filler is characterized in that the surface modified by the silane coupling
Phenolic Resin Molding Material.
delete The method of claim 1,
The resin binder further comprises an alcohol
Phenolic Resin Molding Material.
The method of claim 3,
The alcohol is contained in 1 to 10% by weight based on the total weight of the resin binder
Phenolic Resin Molding Material.
The method of claim 1,
The resin binder and the inorganic filler surface-modified by the silane coupling are formed by treating a mixture of the resin binder and the inorganic filler with the silane coupling agent.
Phenolic Resin Molding Material.
The method of claim 5,
The silane coupling agent is 1 to 3% by weight based on the total weight of the mixture of the resin binder and the inorganic filler.
Phenolic Resin Molding Material.
The method of claim 1,
The inorganic filler is at least one member selected from the group consisting of glass fiber, CaCO ₃ , talc, wood powder, feldspar and clay.
Phenolic Resin Molding Material.
The method of claim 1,
The inorganic filler is included in the range of 50 to 150 parts by weight based on 100 parts by weight of the resin binder.
Phenolic Resin Molding Material.
The method of claim 1,
The phenol resin molding material further comprises at least one member selected from the group consisting of plasticizers, curing agents and release agents.
Phenolic Resin Molding Material.
The method of claim 1,
The high ortho novolak-type phenol resin (b) has an ortho-bond / para-bond ratio of 1.0 to 2.5.
Phenolic Resin Molding Material.
delete Iii) a novolak phenolic resin (a) having an ortho-bond / para-bond ratio of less than 0.2 and a high ortho having an ortho-bond / para-bond ratio of at least 1.0. (high ortho) mixing a novolak-type phenol resin (b) to form a resin binder;
Ii) mixing an inorganic filler into the resin binder;
V) treating the mixture produced in step ii) with a silane coupling agent to perform a silane coupling process;
Iii) kneading with heat treatment the mixture produced in step iii); And
Iii) co-milling after cooling to room temperature,
The step iii) comprises mixing 50 to 90% by weight of a novolac phenolic resin (a) and 10 to 50% by weight of a high ortho novolic phenolic resin (b) based on the total weight of the resin binder.
Method for producing phenolic resin molding material.
delete The method of claim 12,
The step iii) is performed by mixing for 5 to 50 minutes in a high speed mixer at a rotational speed of 980 to 1100 rpm.
Method for producing phenolic resin molding material.
The method of claim 12,
The step iii) further comprises mixing alcohol.
Method for producing phenolic resin molding material.
16. The method of claim 15,
The alcohol is mixed 1 to 10% by weight based on the total weight of the resin binder
Method for producing phenolic resin molding material.
16. The method of claim 15,
It is mixed by spraying the alcohol to the resin binder, characterized in that
Method for producing phenolic resin molding material.
The method of claim 12,
The inorganic filler is at least one member selected from the group consisting of glass fiber, CaCO ₃ , talc, wood powder, feldspar and clay.
Method for producing phenolic resin molding material.
The method of claim 12,
The step ii) is made by mixing 50 to 150 parts by weight of the inorganic filler with respect to 100 parts by weight of the resin binder.
Method for producing phenolic resin molding material.
The method of claim 12,
Step ii) further comprises mixing at least one member selected from the group consisting of a plasticizer, a curing agent and a release agent.
Method for producing phenolic resin molding material.
The method of claim 12,
In the above iii), the silane coupling agent is added in an amount of 1 to 3% by weight based on the total weight of the resin binder and the inorganic filler.
Method for producing phenolic resin molding material.
The method of claim 12,
Heat treatment in the step iii) is carried out for 10 to 60 seconds at a temperature in the range of 150 ~ 200 ℃
Method for producing phenolic resin molding material.
The method of claim 12,
The high ortho novolak-type phenol resin (b) has an ortho-bond / para-bond ratio of 1.0 to 2.5.
Method for producing phenolic resin molding material.
delete

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