KR101266191B1 - Method for manufacturing tube type led lamp and tube type led lamp - Google Patents

Abstract

PURPOSE: A method for manufacturing a tube type LED lamp and the tube type LED lamp are provided to facilitate a bonding process by pressurizing the tube type LED lamp on a PCB substrate. CONSTITUTION: A PCB substrate is inserted into the mounting groove of a heat sink(S100). A pressing jig of the heat sink is pressure-inserted downward. A part of wall of the mounting groove is pressure-transformed to the inner side of the mounting groove. A caulking protrusion piece pressurizes the lateral edge of the substrate. The substrate is fixed to the mounting groove(S200). [Reference numerals] (S100) Insert a PCB substrate into the mounting groove of a heat sink(insertion step); (S200) Pressure-insert a pressure jig of the heat sink downward, pressure-transform a part of wall of the mounting groove adjacent to the lateral edge of the PCB substrate to the inner side of the mounting groove, allow a caulking protrusion piece to pressurize the lateral edge of the PCB substrate, and fix the PCB substrate to the mounting groove(fixing step)

Description

Method for manufacturing tube type LED lamp and tube type LED lamp {Method for manufacturing tube type LED lamp and tube type LED lamp}

The present invention relates to a method for manufacturing a tubular LED lamp and a tubular LED lamp, and more particularly, caulking formed by pressing the upper surface of the heat sink with a press-fit jig in a state where the PCB substrate is inserted into the mounting groove of the heat sink. The method of manufacturing a tubular LED lamp and a tubular LED that can improve the productivity of the product as the assembly of the PCB board is easy and the production time is shortened by mounting the PCB board in such a manner that the protrusions press the side edges of the PCB board. Relates to the lamp.

In general, LEDs (Light Emitting Diodes), which are light emitting diodes, are smaller than conventional lighting sources such as fluorescent and incandescent lamps, have a long lifespan and low power consumption, and thus have high energy efficiency, high brightness, and fast response characteristics. Therefore, lighting apparatuses using such LEDs as light sources have been developed in various forms.

On the other hand, luminaires using the above-described LED as a lighting source are safe from the use of filaments and mercury, unlike incandescent and fluorescent lamps in the future in terms of environmental protection in accordance with various environmental regulations and climate change conventions, and they limit the use of hazardous substances. As there is no carbon dioxide emission restriction, the importance in the lighting industry is increasing as an environmentally friendly future industry.

1 is a cross-sectional view showing a cross-sectional view of a tubular LED lamp according to a conventional example, the conventional tubular LED lamp, a PCB substrate 10 mounted with a plurality of LED chips (L) on one side, the PCB substrate 10 The heat sink 20 is mounted, and the diffusion cover 300 to protect the PCB substrate 10 is configured.

Meanwhile, as a method of mounting the PCB substrate 10 to the heat sink 20, as shown in FIG. 1, the PCB substrate 10 is attached to the heat sink 20 using the double-sided tape 15. The method has been disclosed.

However, this method is not only very difficult to combine the PCB substrate 10 to the heat sink 20 in the correct position, but also has a problem in that the work takes a long time.

In addition, the double-sided tape 15 has a problem that there is a fear that the PCB substrate 10 is separated from the heat sink 20 because the adhesive force decreases over time.

In order to solve the above problems, as shown in FIG. 2, a method of slidingly coupling the PCB substrate 10 to the mounting groove 20h of the heat sink 20 has been developed.

However, in this method, when the size of the mounting groove 20h is smaller than the size of the PCB substrate 10, there is a problem that the sliding coupling itself of the PCB substrate 10 is impossible, and mounting than the size of the PCB substrate 10 If the size of the groove 20h is too large, the PCB substrate 10 is slightly shaken in the mounting groove 20h in a state where the coupling is completed, thereby degrading the quality of the product and reducing the heat dissipation effect of the heat sink 20. There was this.

An object of the present invention for solving the problems according to the prior art, the caulking protrusion formed by pressing the upper surface of the heat sink with a press jig in a state where the PCB substrate is inserted into the mounting groove of the heat sink is the side edge of the PCB substrate By mounting the PCB substrate by pressing the part is easy to combine the PCB substrate as well as the manufacturing time is shortened to provide a method of manufacturing a tubular LED lamp and tube-shaped LED lamp that can improve the productivity of the product.

The tubular LED lamp of the present invention for solving the above technical problem, a PCB substrate mounted with a plurality of LED chips on the upper surface, and a heat sink provided on the upper surface has a mounting groove formed in the longitudinal direction so that the PCB substrate is mounted. A method of manufacturing a tubular LED lamp, comprising: an insertion step of inserting the PCB substrate into a mounting groove of the heat sink; And a caulking protrusion formed by pressing a portion of the wall surface of the mounting groove close to the side edge of the PCB substrate by pressing the press-fit jig of the upper portion of the heat sink downward into the mounting groove. And a fixing step of pressing the part to fix the PCB substrate to the mounting groove.

Preferably, in the fixing step, a portion of both side wall surfaces of the mounting grooves close to the side edges of the PCB substrate are press-formed into the mounting grooves as the press-fit jig downwards, respectively, on the upper sides of the heat sink. Caulking protrusions on both sides formed to press the corner portions of both sides of the PCB substrate may be fixed to the mounting groove the PCB substrate.

Preferably, the one side wall surface of the mounting groove is configured to protrude integrally formed protrusion ribs for pressing the one side corner portion of the PCB substrate, the fixing step, one side edge portion of the PCB substrate is caught off the protruding ribs In a state in which the insertion groove is inserted into the mounting groove so that the press-fit jig is pushed downward only to the upper other side of the heat sink, a part of the other wall surface of the mounting groove close to the side edge of the PCB substrate is pressed into the mounting groove. The deformed caulking protrusion may press the other edge portion of the PCB substrate so that the PCB substrate is fixed to the mounting groove.

Preferably, the press-fit jig may be provided with a press-formed blade formed to be inclined toward the mounting groove side.

Preferably, the mounting groove is formed to a depth greater than the thickness of the PCB substrate, the upper width may be formed in a trapezoidal cross-sectional shape narrower than the lower width.

Meanwhile, a tubular LED lamp including a PCB board having a plurality of LED chips mounted on an upper surface thereof, and a heat sink provided on an upper surface of a mounting groove formed in a length direction to mount the PCB substrate, wherein the mounting groove of the heat sink is provided. The PCB substrate is inserted into the caulking protrusion formed by pressing a portion of the wall surface of the mounting groove close to the side edge of the PCB substrate into the mounting groove to press the side edge portion of the PCB substrate. A tubular LED lamp is disclosed in which a substrate is fixed to the mounting groove.

The present invention as described above, in a state in which the PCB substrate is inserted into the mounting groove of the heat sink, by pressing the upper surface of the heat sink with a press jig to form a caulking protrusion to press the side edge portion of the PCB substrate The mounting of the PCB substrate has the advantage of facilitating the bonding of the PCB substrate.

Specifically, the production time of the product is shortened by fixing the PCB substrate by forming the caulking protrusion in a short time by pressing a predetermined portion of the upper surface of the heat sink with a press-fit jig to form a caulking protrusion, and then release the pressure. There is an advantage that the productivity of the product is improved.

In addition, since the caulking protrusion is fixed by pressing the upper side edge portion of the PCB substrate, there is an advantage that both the lateral flow and the upward flow of the PCB substrate can be prevented.

In addition, as the mounting groove is formed in a trapezoidal cross-sectional shape of which the width of the upper portion is narrower than the width of the lower portion, there is an advantage that the caulking protrusion by pressing the pressing jig can effectively press the side edge portion of the PCB substrate.

In addition, when mounting the PCB substrate by forming a caulking protrusion to press the side edge portion of the PCB substrate, the PCB substrate is permanently and firmly coupled to the heat sink to prevent the PCB substrate from being separated from the heat sink. There is an advantage that it can.

1 is a cross-sectional view showing a cross section of a tubular LED lamp according to a conventional example.
2 is a cross-sectional view showing a cross section of a tubular LED lamp according to another conventional example.
3 is a perspective view showing a tube-shaped LED lamp according to an embodiment of the present invention.
Figure 4a is a cross-sectional view showing a state in which the PCB substrate of the tubular LED lamp according to an embodiment of the present invention is inserted into the mounting groove of the heat sink.
Figure 4b is a cross-sectional view showing a state in which the PCB substrate of the tube-shaped LED lamp according to an embodiment of the present invention is mounted in the mounting groove of the heat sink.
Figure 5 is a perspective view showing a state in which the PCB substrate of the tubular LED lamp according to an embodiment of the present invention is mounted in the mounting groove of the heat sink.
Figure 6a is a cross-sectional view showing a state in which the PCB substrate of the tubular LED lamp is inserted into the mounting groove of the heat sink according to another embodiment of the present invention.
Figure 6b is a cross-sectional view showing a state in which the PCB substrate of the tubular LED lamp is mounted in the mounting groove of the heat sink according to another embodiment of the present invention.
Figure 7 is a perspective view showing a state in which the PCB substrate of the tubular LED lamp according to another embodiment of the present invention is mounted in the mounting groove of the heat sink.
Figure 8 is a flow chart showing the procedure of the manufacturing method of the tubular LED lamp according to an embodiment of the present invention.

The present invention can be embodied in many other forms without departing from the spirit or main features thereof. Accordingly, the embodiments of the present invention are to be considered in all respects as merely illustrative and not restrictive.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms.

The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

When a component is referred to as being "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but it may be understood that other components may be present in between. Should be.

On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In the present application, the terms "comprises", "having", "having", and the like are intended to specify the presence of stated features, integers, steps, operations, components, Steps, operations, elements, components, or combinations of elements, numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art.

Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, and the same or corresponding components will be denoted by the same reference numerals regardless of the reference numerals and redundant description thereof will be omitted.

In the following description of the present invention, if it is determined that the detailed description of the related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

Tube-shaped LED lamp according to an embodiment of the present invention, as shown in Figure 3, comprises a PCB substrate 100, heat sink 200, diffusion cover 300, the base cap 400.

The PCB substrate 100 is a substrate on which a plurality of LED chips L are mounted on an upper surface thereof, and a positive electrode portion and a negative electrode portion are provided at both ends thereof.

On the other hand, in the tubular LED lamp, a plurality of the PCB substrate 100 may be arranged in series with each other may be configured to be electrically connected to each other.

The PCB substrate 100 is mounted on an upper surface of the heat sink 200, and a mounting groove 200h is formed in a longitudinal direction on the upper surface of the heat sink 200 to mount the PCB substrate 100.

The heat sink 200 serves to dissipate heat by dissipating heat generated from the LED chip L as a matrix of the tubular LED lamp, and is formed of a material having excellent heat transfer and heat dissipation, such as an aluminum alloy.

The diffusion cover 300 is assembled to the heat sink 200 to cover the LED chip (L) of the PCB substrate 100 mounted on the upper surface of the heat sink 200, the LED chip (L) It serves to diffuse so that the emitted color and brightness can be evenly distributed.

The base cap 400 is a component that closes both ends of the tubular LED lamp, and is provided with a power connection pin 410 for receiving external power.

The external power supplied to the power connection pin 410 is supplied to the PCB substrate 100 disposed to be closest to the base cap 400 of the tubular LED lamp.

Meanwhile, a bridge diode (not shown) may be provided on the PCB substrate 100 that receives external power from the base cap 400, and the AC power is connected to the DC power through the bridge diode. The input power may be changed and supplied to the LED chip L of the PCB substrate 100.

Hereinafter, a method of manufacturing the tubular LED lamp configured as described above, specifically, a method of mounting the PCB substrate 100 in the mounting groove 200h of the heat sink 200 will be described.

On the other hand, in the manufacturing method of the present embodiment, the cross-sectional shape of the mounting groove 200h formed on the upper surface of the heat sink 200 is formed in a shape corresponding to the cross-sectional shape of the PCB substrate 100.

Specifically, as shown in Figure 4a, the mounting groove (200h) is formed in a trapezoidal shape of the upper width is narrower than the width of the lower, the forming depth of the mounting groove (200h) is the PCB substrate 100 It is formed with a depth of value greater than its thickness.

Method of manufacturing a tubular LED lamp according to this embodiment, as shown in Figure 8, is made of an insertion step (S100) and a fixing step (S200).

First, in the insertion step, the PCB substrate 100 is inserted into the mounting groove 200h of the heat sink 200. (S100)

Specifically, as shown in FIG. 4A, the bottom surface of the PCB substrate 100 having the plurality of LED chips L mounted thereon may be in close contact with the bottom surface of the mounting groove 200h of the heat sink 200. The PCB substrate 100 is inserted into the mounting groove 200h of the heat sink 200.

Next, in the fixing step, a part of the wall surface of the mounting groove 200h close to the side edge of the PCB substrate 100 is pressed into the press-fit jig J of the upper portion of the heat sink 200 downward. The caulking protrusion 210 formed by pressure deformation into the inside of the mounting groove 200h presses the side edge portion of the PCB substrate 100 to fix the PCB substrate 100 to the mounting groove 200h. (S200)

Specifically, as shown in FIG. 4B, as the press jig J is pushed downward on the upper both sides of the heat sink 200, the mounting groove 200h close to the side edge of the PCB substrate 100. A portion of both side walls of the side of the mounting groove (200h) is formed by pressing each side of the caulking protrusion 210 of both sides formed by pressing the respective sides of the side of the PCB substrate 100 by pressing the PCB substrate 100 It is to be fixed to the mounting groove (200h).

As described above, the caulking protrusion 210 is fixed by pressing the upper side edge portion of the PCB substrate 100 in the 'v1' direction and 'v2' direction, respectively, the side of the PCB substrate 100 There is an advantage that both directional flow and upward flow can be prevented.

On the other hand, the press-fit jig (J) is provided with a press-in blade (a) formed inclined toward the mounting groove (200h) side.

Therefore, when press-fitting the press-fit jig J downwardly to the upper both sides of the heat sink 200, a part of the wall surface of the mounting groove 200h adjacent to the side edge of the PCB substrate 100 is inclined. A caulking protrusion 210 may be formed by being deformed inwardly of the mounting groove 200h by the blade a.

On the other hand, the mounting groove (200h) is formed to a depth of a value larger than the thickness of the PCB substrate 100, the upper width is formed in a trapezoidal cross-sectional shape narrower than the width of the lower, the press-fit jig (J) of The caulking protrusion 210 by pressing can effectively press the side edge portion of the PCB substrate 100.

Specifically, when the mounting groove (200h) is formed in a rectangular cross-sectional shape, the deformation of the wall of the mounting groove (200h) has to be made a lot to form the caulking protrusion (210), the mounting groove ( When 200h) is formed in a trapezoidal cross-sectional shape, the wall of the mounting groove 200h is formed to have a predetermined inclined surface, so that the side edge of the PCB substrate 100 may be smaller than the mounting groove 200h of the rectangular cross-sectional structure. It can press the part.

Meanwhile, as illustrated in FIG. 5, the caulking protrusion 210 formed by the press-fit jig J may be formed at predetermined positions, such as both ends and a center portion of the heat sink 200, and caulking at each position. Protruding piece 210 is preferably formed at a time by a plurality of press-fit jig (J), but does not exclude that can be formed sequentially.

Hereinafter, a method of manufacturing a tubular LED lamp according to another embodiment of the present invention.

On the other hand, in the manufacturing method of the present embodiment, the cross-sectional shape of the mounting groove 200h formed on the upper surface of the heat sink 200 is formed in a shape corresponding to the cross-sectional shape of the PCB substrate 100.

Specifically, as shown in Figure 6a, the mounting groove (200h) is formed in a trapezoidal shape of the upper width is narrower than the width of the lower, the forming depth of the mounting groove (200h) is the PCB substrate 100 Is formed to a depth of greater than the thickness of, the one side wall surface of the mounting groove (200h) protruding ribs ('201' of Figure 7) for pressing the one side corner portion of the PCB substrate 100 is integrally formed do.

Method of manufacturing a tubular LED lamp according to this embodiment, as shown in Figure 8, is made of an insertion step (S100) and a fixing step (S200).

First, in the insertion step, the PCB substrate 100 is inserted into the mounting groove 200h of the heat sink 200. (S100)

Specifically, as shown in FIG. 6A, the bottom surface of the PCB substrate 100 having the plurality of LED chips L mounted thereon is in close contact with the bottom surface of the mounting groove 200h of the heat sink 200. The substrate 100 is inserted into the mounting groove 200h of the heat sink 200, but one edge portion of the PCB substrate 100 is not caught by the protruding rib 201 so as not to be detached from the mounting groove 200h. Insert it.

Next, in the fixing step, a part of the wall surface of the mounting groove 200h close to the side edge of the PCB substrate 100 is pressed into the press-fit jig J of the upper portion of the heat sink 200 downward. The caulking protrusion 210 formed by pressure deformation into the inside of the mounting groove 200h presses the side edge portion of the PCB substrate 100 to fix the PCB substrate 100 to the mounting groove 200h. (S200)

Specifically, as shown in FIG. 6B, the heat sink 200 is inserted in the mounting groove 200h such that one side edge portion of the PCB substrate 100 is not caught and separated from the protruding rib 201. As the press-fit jig J is pushed downward only to the other side of the upper side, a part of the other side wall surface of the mounting groove 200h close to the side edge of the PCB substrate 100 is pressurized into the mounting groove 200h. And the caulking protrusion 210 formed to press the other edge portion of the PCB substrate 100 so that the PCB substrate 100 is mounted by the caulking protrusion 210 and the protrusion rib 201. 200h).

As described above, as the caulking protrusion 210 presses and fixes each of the upper corners of the upper side of the PCB substrate 100 in the 'v3' direction, the protrusion ribs 201 may also fix the upper corners of the upper side. Since it is fixed by pressing in the 'v4' direction, there is an advantage that both the lateral flow and the upward flow of the PCB substrate 100 can be prevented.

On the other hand, the shape of the press-fit jig (J) or the trapezoidal cross-sectional shape of the mounting groove (200h) is the same as or similar to the above-described embodiment, detailed description thereof will be omitted.

The tubular LED lamp according to an embodiment of the present invention has been described as an example of a straight-type LED lamp that is not provided with a ballast, but is also applicable to a fixed type LED lamp having a ballast integrally.

Although the present invention has been described with reference to the preferred embodiments thereof with reference to the accompanying drawings, it will be apparent to those skilled in the art that many other obvious modifications can be made therein without departing from the scope of the invention. Accordingly, the scope of the present invention should be interpreted by the appended claims to cover many such variations.

100: PCB substrate 200: Heat sink
300: diffusion cover 400: base cap

Claims (6)

A method of manufacturing a tubular LED lamp comprising a PCB board on which a plurality of LED chips are mounted on an upper surface, and a heat sink provided on an upper surface of a mounting groove formed in a longitudinal direction such that the PCB substrate is mounted thereon.
An insertion step of inserting the PCB substrate into the mounting groove of the heat sink; And
As the press-fit jig of the upper part of the heat sink is pushed downward, a caulking protrusion formed by pressing a portion of a wall surface of the mounting groove close to the side edge of the PCB substrate to the inside of the mounting groove has a side edge portion of the PCB substrate. Method of manufacturing a tubular LED lamp comprising a; fixing step for fixing the PCB substrate to the mounting groove to press.
The method of claim 1,
The fixing step,
As the press-fit jig downwardly presses each of the upper sides of the heat sink, portions of both side wall surfaces of the mounting grooves adjacent to the side edges of the PCB substrate are respectively deformed to the inside of the mounting grooves. A method of manufacturing a tubular LED lamp, characterized in that for pressing the respective side edges of the PCB substrate so that the PCB substrate is fixed to the mounting groove.
The method of claim 1,
One side wall of the mounting groove is configured to protrude integrally formed protrusion ribs for pressing the one side edge portion of the PCB substrate,
The fixing step,
In the state in which one side edge portion of the PCB board is inserted into the mounting groove so as not to be caught by the protruding ribs, the mounting close to the side edge of the PCB board as the press-fit jig is pushed downward only to the other side of the heat sink. Part of the other wall of the groove of the tube-shaped LED lamp, characterized in that the caulking protrusion formed by pressure deformation into the inside of the mounting groove to press the other corner portion of the PCB substrate to be fixed to the mounting groove. Manufacturing method.
4. The method according to any one of claims 1 to 3,
The press-fit jig,
Method of manufacturing a tubular LED lamp characterized in that the press-shaped blade formed inclined toward the mounting groove side.
4. The method according to any one of claims 1 to 3,
The mounting groove,
Formed to a depth of greater than the thickness of the PCB substrate, a method of manufacturing a tubular LED lamp, characterized in that the upper width is formed in a trapezoidal cross-sectional shape narrower than the lower width.
A tube type LED lamp including a PCB board having a plurality of LED chips mounted on an upper surface thereof, and a heat sink provided on an upper surface of a mounting groove formed along a longitudinal direction such that the PCB substrate is mounted thereon.
The PCB substrate is inserted into the mounting groove of the heat sink, and a caulking protrusion formed by pressing a portion of a wall surface of the mounting groove close to the side edge of the PCB substrate into the mounting groove is a side edge portion of the PCB substrate. Tube type LED lamp, characterized in that configured to be fixed to the PCB substrate to the pressing groove.

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