KR101255706B1 - A Cutting Apparatus for Liquid Crystal Display and A Cutting Method of Employing the Same - Google Patents

Abstract

The present invention provides a scribing unit for forming cracks in a unit panel size on a mother panel, and a steam spraying unit, a scribing unit, and steam spraying unit for spraying steam on the mother panel to increase the division force of the unit panel due to cracks. It includes a control unit for controlling the unit, the scribing unit and the steam injection unit provides a liquid crystal display panel cutting device and a cutting method using the same formed integrally.

Scribing, Cutting, Steam Injection

Description

Liquid Crystal Display Panel Cutting Apparatus and Liquid Crystal Display Panel Cutting Method Using The Same {A Cutting Apparatus for Liquid Crystal Display and A Cutting Method of Employing the Same}

1 is a flowchart schematically showing a conventional LCD panel cutting process.

2 is a view schematically showing an LCD cutting device according to an embodiment of the present invention.

3 is a view sequentially showing an LCD cutting method according to an embodiment of the present invention.

4 is a view showing a scribing and steam injection method of the LCD cutting method.

DESCRIPTION OF THE REFERENCE NUMERALS (S)

10: Scribing Unit 11: Cutter

13: holder 15: drive unit

30: steam dispensing unit 31: steam outlet

50: control unit

The present invention relates to a liquid crystal display panel cutting device and a liquid crystal display panel cutting method using the same.

Recently, there is a growing interest in flat panel displays that can reduce the weight and volume of cathode ray tubes. Such a flat panel display includes a liquid crystal display (hereinafter referred to as "LCD"), a plasma display panel (hereinafter referred to as "PDP"), a field emission display (hereinafter referred to as "PDP"). FED ", and electroluminescence (hereinafter referred to as" EL "), and the like, and supply digital signals or analog data to the display panel.

In particular, the liquid crystal display device forms a liquid crystal layer having anisotropic dielectric constant between the upper and lower substrates, which are transparent insulating substrates, and then adjusts the intensity of the electric field formed in the liquid crystal layer to change the molecular arrangement of the liquid crystal material, thereby displaying the liquid crystal layer. It is a display device which expresses a desired image by adjusting the amount of light transmitted to an upper substrate which is a surface. As a liquid crystal display device, a thin film transistor liquid crystal display device (TFT LCD) using a thin film transistor (TFT) as a switching element is mainly used.

The manufacturing method of the liquid crystal display device is largely an array fabrication process for forming an active element, a cell fabrication process for manufacturing a cell in which a liquid crystal material is enclosed between a TFT array substrate and a color filter substrate, and a driving circuit for driving a TFT array and a cell substrate. It can be divided into a module manufacturing process for mounting a furnace.

On the other hand, the LCD panel cutting process is a process of cutting and separating the unit panel size from the mother panel before the cell manufacturing process of the manufacturing process of the liquid crystal display device. Looking at such a process is shown in FIG.

1 is a flowchart schematically showing a conventional LCD panel cutting process.

As shown, the LCD panel cutting process aligns the mother panel by loading it into a scribe device (S1). Then, cracks are formed in the unit panel size to form the mother panel as the LCD unit panel. A scribe to form (S2) to improve the cracking force of the crack by spraying steam to the crack formed on the surface of the mother panel so that the crack can be easily separated into the unit panel by advancing the crack (S3). The mother panel is separated into unit panels using a separation roller and taken out. (S4)

As described above, the LCD panel cutting process according to a series of procedures has a large number of processes, which increases the time required to produce one product.

In addition, the scribe process or the steam spray process is performed only on the panel surface on which the TFT is formed, so that the yield due to the defect is reduced.

Moreover, in the conventional LCD panel cutting process, the scribing process and the steam spraying process are performed separately, thus increasing the manufacturing equipment space required for this, which is not good in the utilization of the space.

Therefore, the technical problem to be achieved by the present invention is to reduce the number of LCD manufacturing process and at the same time reduce the defective rate in the cutting process to improve the production yield.

In addition, another technical problem to be achieved by the present invention is to increase the required manufacturing equipment space efficiency according to the LCD manufacturing process.

Technical problems to be achieved by the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned above will be clearly understood by those skilled in the art from the following description. Could be.

LCD cutting device according to an embodiment of the present invention for achieving the above-described technical problem is to spray the scribing unit and the mother panel to form a crack in the unit panel size to the mother panel of the unit panel by the crack And a control unit for controlling the steam spraying unit, the scribing unit, and the steam spraying unit for increasing the splitting force, wherein the scribing unit and the steam spraying unit are integrally formed.

The scribing unit and the steam injection unit may be plural. The cutter is preferably a laser or a diamond wheel.

LCD cutting method according to an embodiment of the present invention is the step of aligning the mother panel to the cutting device by aligning, forming a crack by using a cutter for each unit panel on the mother panel and scribing step, and the unit panel by the crack Steam injection step of injecting steam to increase the splitting force of, scribing and steam injection is performed in the same space line.

In addition, the LCD cutting method according to an embodiment of the present invention may further include a step of separating the mother panel for each panel after the steam spraying step.

The cutter is adjustable in angle to the mother panel face.

Scribing and steam spraying can be done on and under the mother panel at the same time.

Specific details of other embodiments are included in the detailed description and the drawings. Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. Like reference numerals refer to like elements throughout.

Hereinafter, an LCD cutting apparatus and an LCD cutting method according to an embodiment (s) of the present invention will be described in detail with reference to the accompanying drawings.

2 is a view schematically showing an LCD cutting device according to an embodiment of the present invention.

As shown, the LCD cutting device of the present invention is a scribing unit 10 for forming cracks in a unit pixel size on a mother panel (not shown) and steam on a mother panel in which cracks are formed. Control the steam dispensing unit (30), the scribing unit (10) and the steam injection unit (30) to advance the crack by spraying, and to increase the dividing force of the unit panel by the crack And 50.

That is, the LCD cutting device is formed by forming the scribing unit and the steam spray unit in one piece.

The scribing unit 10 includes a cutter 11 for forming a crack directly on the mother panel, a holder 13 for fixing and supporting the cutter, and a driving unit 15 for operating the cutter. . The cutter 11 may be a diamond wheel, or may be a laser having a short wavelength. In this case, when the cutter is a diamond wheel, the driving unit included in the scribing unit may be a driving motor.

Although not shown in the drawing, the steam dispensing unit 30 includes a heater for supplying steam therein, and fixes and supports a steam ejection port 31 which ejects the generated steam to a crack portion of the mother panel. It comprises a holder 33.

The scribing unit 10 and the steam spray unit 30 may be formed in plural so that the mother panel can be operated from above and below. In this case, the control unit 50 for controlling the scribing unit 10 and the steam spraying unit 30 may be a single unit, and a plurality of scribing units 10 and the steam spraying unit 30 may correspond to the number of the scribing unit 10 and the steam spraying unit 30. It may be made of.

The controller 50 may independently control the scribing unit and the steam spraying unit, respectively. For example, the controller may be a steam generated by a heater or an azimuth angle with respect to the mother panel of the cutter provided in the scribing unit. The temperature and the like can be controlled independently.

This is to proceed with the cutting process under the appropriate conditions because the surface of the panel in which scribing and steam is injected when the cracks are formed on the top and bottom of the mother panel is different. Accordingly, the defective rate during the cutting process can be reduced. In general, one side of the mother panel is the side on which the TFT element is formed and the other side is the side on which the color filter is formed.

In the LCD cutting device according to the embodiment of the present invention as described above, the scribing unit 10 and the steam spray unit 30 are integrated to reduce the size of the equipment according to the LCD cutting process, thereby increasing the utilization of space. Will be.

In addition, when the cutting process is performed using the LCD cutting device, the Tact Time can be reduced than before, thereby improving production efficiency or productivity.

Hereinafter, a method of cutting from a mother panel to a unit panel (LCD) using the LCD cutting device of the present invention will be described.

3 is a view sequentially showing an LCD cutting method according to an embodiment of the present invention.

As shown, in the LCD cutting method according to an embodiment of the present invention, the mother panel is first loaded and aligned in a scribe device (S1 ').

Thereafter, scribing to form a crack at a predetermined position so that the mother panel can be separated into a unit panel size, and subsequently spray steam to the crack portion of the mother panel to improve the division force of the unit panel. ')

Scribing and steam injection may proceed simultaneously on the top, bottom of the mother panel 100, as shown in FIG. The scribing and steam spraying processes are performed by the liquid crystal display panel cutting device in which the scribing unit and the steam spraying unit are integrated, and thus, are performed in the same space line.

Therefore, in the present invention, the scribing process and the steam spraying process, which are independently performed in separate spaces during the cutting process for forming a conventional LCD unit panel, may be performed at once in the same space, so that space utilization may be achieved even when manufacturing the unit panel. Cutters used for scribing on mother panels, ie cutters that form cracks directly on the mother panel, have different orientation angles at the top and bottom with respect to the mating surface of the mother panel. For example, the direction angle of the cutter forming the cracks at the top of the mother panel may be fixed at 90 ° with respect to the mating face with the mother panel, and the direction angle of the cutter forming the cracks at the bottom of the mother panel is the bottom surface. It can be freely adjusted to fit the side of the motherboard. In addition, during steam injection, the amount of steam injected into the cracks formed on the upper and lower portions of the mother panel, the temperature of the steam, and the like may be independently adjusted.

At this time, the amount of steam or the temperature of the steam is adjusted according to the surface characteristics of the mother panel to which steam is injected. For example, when steam is injected to the crack formed on the mother panel under the same conditions, if the crack propagation at the upper part is larger than the crack propagation at the lower part, the amount of steam supplied from the upper part is supplied. Make it bigger. This is to reduce the failure rate when separating the unit panel by equalizing the crack propagation speed on the top and bottom of the panel.

Thereafter, the mother panel is separated out for each unit panel by using a breaking roller (S3 ').

Thereafter, in some cases, polishing may be performed by applying heat to remove defects of microcracks of the cut unit panel surface or to further reinforce the unit panel.

When polishing, it is desirable to heat-treat the cutting surface of the defective unit panel to a temperature above the softening point, in whole or in part, using a torch or the like.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand.

Therefore, it should be understood that the above-described embodiments are provided so that those skilled in the art can fully understand the scope of the present invention. Therefore, it should be understood that the embodiments are to be considered in all respects as illustrative and not restrictive, The invention is only defined by the scope of the claims.

The liquid crystal display panel cutting device and the cutting method using the same according to the present invention made as described above can reduce the production failure rate by scribing and steam spraying the mother panel on the upper and lower portions during the liquid crystal display panel cutting process.

In addition, the liquid crystal display panel cutting device and the cutting method using the same according to the present invention can improve production efficiency or productivity by simultaneously performing a scribing and steam spraying process.

Claims (12)

A scribing unit for forming cracks in a unit panel size on the mother panel; A steam spraying unit for spraying steam on the mother panel to increase the splitting force of the unit panel by the crack; And It includes a control unit for controlling the scribing unit and the steam injection unit, The scribing unit and the steam spray unit are integrally formed, and the operation of the scribing unit and the steam spray unit is simultaneously performed at the upper and lower portions of the mother panel, and at one of the upper and lower portions of the mother panel. If the crack propagation is greater than the crack propagation in other areas of the upper and lower portions of the mother panel, the amount of steam supplied from the other area is greater than the amount of steam supplied from the one area. Cutting device. The method of claim 1, The scribing unit A cutter for directly forming a crack in the mother panel; A holder for fixing and supporting the cutter; And And a driving unit for operating the cutter. The method of claim 1, The steam injection unit comprises a heater for supplying steam; A steam jet port for spraying the steam to the mother panel crack portion; And And a holder for fixing and supporting the steam spout. The method of claim 1, And a plurality of scribing units and steam injection units. 3. The method of claim 2, And the cutter is a laser or a diamond wheel. Loading and aligning the mother panel in the cutting device; a scribing step of forming a crack in the mother panel using a cutter in a unit panel size; And Steam injection step of cutting by spraying steam in order to increase the division force of the unit panel by the crack, The scribing and steam spraying are performed in the same space line, the scribing and steam spraying are simultaneously performed at the upper and lower portions of the mother panel, and crack propagation at one of the upper and lower portions of the mother panel is The method of cutting a liquid crystal display panel when the crack propagation in other areas of the upper and lower parts of the mother panel is greater than the amount of steam supplied from the other area. The method according to claim 6, And after the steam spraying step, separating the mother panel into unit panels. 8. The method of claim 7, And separating the unit panel by heat-treating and polishing the cutting surface of the unit panel after separating the unit panel. The method according to claim 6, And the cutter is capable of adjusting an angle with respect to a surface of the mother panel. delete The method according to claim 6, And said scribing comprises a laser or a wheel. The method according to claim 6, And controlling the amount of steam or the temperature of the steam independently in the upper and lower portions when simultaneously steaming the upper and lower portions of the mother panel.

Images