KR101235171B1 - 결함 검출을 위한 방법 및 시스템 - Google Patents

결함 검출을 위한 방법 및 시스템 Download PDF

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Publication number
KR101235171B1
KR101235171B1 KR1020070077450A KR20070077450A KR101235171B1 KR 101235171 B1 KR101235171 B1 KR 101235171B1 KR 1020070077450 A KR1020070077450 A KR 1020070077450A KR 20070077450 A KR20070077450 A KR 20070077450A KR 101235171 B1 KR101235171 B1 KR 101235171B1
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KR
South Korea
Prior art keywords
polarization
reticle
computer
exposure process
aerial image
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Expired - Fee Related
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KR1020070077450A
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English (en)
Korean (ko)
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KR20080012232A (ko
Inventor
사무엘 만간
보리스 골드버그
이샤이 쉬워즈밴드
온 하란
마이클 벤-이샤이
아미르 사기브
Original Assignee
어플라이드 머티리얼즈 이스라엘 리미티드
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Publication of KR20080012232A publication Critical patent/KR20080012232A/ko
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84Inspecting
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95676Masks, reticles, shadow masks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020070077450A 2006-08-01 2007-08-01 결함 검출을 위한 방법 및 시스템 Expired - Fee Related KR101235171B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82105606P 2006-08-01 2006-08-01
US60/821,056 2006-08-01

Publications (2)

Publication Number Publication Date
KR20080012232A KR20080012232A (ko) 2008-02-11
KR101235171B1 true KR101235171B1 (ko) 2013-02-20

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Application Number Title Priority Date Filing Date
KR1020070077450A Expired - Fee Related KR101235171B1 (ko) 2006-08-01 2007-08-01 결함 검출을 위한 방법 및 시스템

Country Status (3)

Country Link
JP (1) JP5308639B2 (https=)
KR (1) KR101235171B1 (https=)
CN (1) CN101451963B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102253595B (zh) * 2010-05-20 2013-04-10 北大方正集团有限公司 一种查找缺陷掩膜版的方法
CN104884945A (zh) * 2012-12-27 2015-09-02 株式会社尼康 检查装置、检查方法、曝光系统及曝光方法、以及元件制造方法
TWI630453B (zh) * 2017-11-22 2018-07-21 牧德科技股份有限公司 投影式複檢機及其校正方法
US11546508B1 (en) * 2021-07-21 2023-01-03 Black Sesame Technologies Inc. Polarization imaging system with super resolution fusion
CN117055307B (zh) * 2023-10-11 2023-12-15 光科芯图(北京)科技有限公司 一种应用于掩模成像的数据处理方法、装置及曝光设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4614427A (en) * 1983-05-20 1986-09-30 Hitachi, Ltd. Automatic contaminants detection apparatus
US20010055416A1 (en) 1997-09-22 2001-12-27 Kabushiki Kaisha Toshiba Defect inspection method and defect inspection apparatus
US6657736B1 (en) * 1999-07-09 2003-12-02 Nova Measuring Instruments Ltd. Method and system for measuring patterned structures
US20050280806A1 (en) 2004-06-16 2005-12-22 Nikon Corporation Surface inspection apparatus, polarization illuminating device and light-receiving device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000206329A (ja) * 1999-01-12 2000-07-28 Toshiba Corp 位相測定方法及びその装置
CN1218171C (zh) * 2001-08-20 2005-09-07 Hoya株式会社 灰调掩模的缺陷检查方法及缺陷检查装置
US6828542B2 (en) * 2002-06-07 2004-12-07 Brion Technologies, Inc. System and method for lithography process monitoring and control
JP2004061915A (ja) * 2002-07-30 2004-02-26 Nikon Corp マスク検査方法及び露光装置
JP2005026527A (ja) * 2003-07-03 2005-01-27 Sony Corp 露光方法および半導体装置の製造方法
US9002497B2 (en) * 2003-07-03 2015-04-07 Kla-Tencor Technologies Corp. Methods and systems for inspection of wafers and reticles using designer intent data
US7265364B2 (en) * 2004-06-10 2007-09-04 Asml Netherlands B.V. Level sensor for lithographic apparatus
US7397552B2 (en) * 2004-09-27 2008-07-08 Applied Materials, Israel, Ltd. Optical inspection with alternating configurations
JP4778755B2 (ja) * 2005-09-09 2011-09-21 株式会社日立ハイテクノロジーズ 欠陥検査方法及びこれを用いた装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4614427A (en) * 1983-05-20 1986-09-30 Hitachi, Ltd. Automatic contaminants detection apparatus
US20010055416A1 (en) 1997-09-22 2001-12-27 Kabushiki Kaisha Toshiba Defect inspection method and defect inspection apparatus
US6657736B1 (en) * 1999-07-09 2003-12-02 Nova Measuring Instruments Ltd. Method and system for measuring patterned structures
US20050280806A1 (en) 2004-06-16 2005-12-22 Nikon Corporation Surface inspection apparatus, polarization illuminating device and light-receiving device

Also Published As

Publication number Publication date
CN101451963B (zh) 2013-02-20
JP2008116909A (ja) 2008-05-22
JP5308639B2 (ja) 2013-10-09
KR20080012232A (ko) 2008-02-11
CN101451963A (zh) 2009-06-10

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