KR101230914B1 - Photo-detection element embedded light emitting diode package - Google Patents

Abstract

PURPOSE: A light emitting device package with a built-in optical measurement device is provided to easily control brightness by controlling a supply current through the measurement of a light output of a light emitting device. CONSTITUTION: A cavity is formed in a body(110). The upper side of the cavity is partially opened. A light emitting device(120) is arranged in the cavity and emits light through the opened part. A light measuring device(130) measures the intensity of light.

Description

Light-Emitting Device Package with Optical Measurement Device {PHOTO-DETECTION ELEMENT EMBEDDED LIGHT EMITTING DIODE PACKAGE}

The present invention relates to a light emitting device package incorporating an optical measuring device.

In general, a lot of bulbs or fluorescent lights are used as indoor or outdoor lighting, such a bulb or fluorescent lamp has a short life and has to be replaced frequently. In addition, the conventional fluorescent lamp has a problem that excessively decreases the illuminance due to deterioration over the use time.

In order to solve this problem, a light emitting diode (LED), which has excellent controllability, fast response speed, high electro-optical conversion efficiency, long life, low power consumption, high brightness, and emotional lighting, is used. Various types of lighting devices have been developed.

Usually, the above-mentioned light emitting diode is mentioned as a general example of a light emitting element. A light emitting diode is a diode in which energy lost when a combination of injected electrons and an electric field is emitted through light. As the light emitting source constituting the light emitting diode, a compound semiconductor material such as GaAs series, AlGaAs series, GaN series and InGaN series may be used.

In recent years, nitride semiconductors including GaN have attracted attention due to their excellent physical and chemical properties. When the light emitting sources are formed using such nitride semiconductors, light to green, blue, and ultraviolet light can be generated. Such a light emitting diode is packaged in various forms according to its use and is used as a light source in various fields such as a lighting display, a text display, and an image display.

As a light emitting diode package, a plastic package, a ceramic package, a metal package, and a wafer level package (WLP) using a silicon wafer as a package material are used. In wafer-level packages, silicon wafers used in conventional semiconductor IC processes have the potential to contain many semiconductor devices.

There is a demand for a technology capable of controlling the electrical and / or optical characteristics of a light emitting diode by measuring light output from the light emitting device. In addition, there is a need for a technology that can control the light and the output light of the light emitting device by measuring the outside of the light emitting device.

The background technology of the present invention is disclosed in Republic of Korea Patent Publication No. 10-2006-0062716 (2006.12.06).

The embodiment is devised in response to the above-described conventional requirements, and an object thereof is to provide a light emitting device package in which an optical measuring device is incorporated.

The technical objects to be achieved by the present invention are not limited to the above-mentioned technical problems, and other technical subjects which are not mentioned can be clearly understood by those skilled in the art from the description of the present invention .

The light emitting device package according to the embodiment is located on at least a portion of the package body, the light emitting device disposed in the cavity to emit light through the open area, the cavity is formed in at least a portion of the open cavity; It includes an optical measuring device for measuring the intensity of light.

The cavity may have a shape in which at least a portion of the package body is recessed, the package body may include an area protruding around the cavity, and the optical measuring device may be positioned on the protruding area.

The optical measuring device may have a cantilever shape in which only a part of the optical measuring device is positioned on the protruding region, and the rest of the optical measuring device may protrude toward the cavity side.

The light emitting device package according to the embodiment may further include an insulating layer surrounding the package body surface.

The light emitting device package according to the embodiment further includes a first electrode layer and a second electrode layer electrically connected to the light emitting device and electrically insulated from each other, wherein the first electrode layer and the second electrode layer are formed on a surface of the insulating layer. And extend to the first external electrode layer and the second external electrode layer formed on the rear surface of the package body.

The light emitting device package according to the embodiment further includes a third electrode layer and a fourth electrode layer electrically connected to the optical measuring device, wherein the third electrode layer and the fourth electrode layer are formed on a surface of the insulating layer to form the package body. It may extend to the first outer electrode layer and the second outer electrode layer formed on the rear surface.

The optical measuring device may measure an amount of light of at least one of light emitted from the light emitting device and external incident light.

The optical measuring device may include a light absorbing layer, and the optical measuring device and the light emitting device may be electrically insulated from each other.

The optical measuring device may be any one of a photoconductor measuring device, a semiconductor junction measuring device, and a metal-semiconductor junction measuring device.

According to the embodiment, the light output generated from the light emitting device can be measured to effectively compensate for the optical and / or electrical properties of the light emitting device. Accordingly, it is possible to provide a light emitting device package having uniform light emitting characteristics.

According to an embodiment, a light emitting device package capable of controlling optical and / or electrical characteristics of a light emitting device by measuring a light output of the light emitting device and adjusting a supply current may be provided.

In addition, according to the embodiment, it is possible to provide a light emitting device package that can sense the brightness information of the outside of the light emitting device to flexibly adjust the operation and brightness of the light emitting device according to the external brightness information.

In addition, the embodiment can provide a silicon wafer level LED package.

1 is a perspective view showing the configuration of a light-emitting device package with a light measuring device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line AA ′ of FIG. 1.
3 is a cross-sectional view taken along the line BB ′ of FIG. 1.
4 is a cross-sectional view taken along the line CC ′ of FIG. 1.
FIG. 5 is an enlarged view of a corner including the optical measuring device of FIG. 1. FIG.

Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings. However, the accompanying drawings are only described in order to more easily disclose the contents of the embodiments, the scope of the present invention is not limited to the scope of the accompanying drawings will be readily understood by those of ordinary skill in the art. Could be.

1 is a perspective view of a light emitting device package according to an embodiment, FIG. 2 is a sectional view taken along the line A-A 'of FIG. 1, FIG. 3 is a sectional view taken along the line B-B' of FIG. 1, FIG. 5 is an enlarged view of a corner including the optical measuring device of FIG.

As shown in FIG. 1, the light emitting device package 100 of the present invention may include a package body 110, a light emitting device 120, and an optical measuring device 130.

The package body 110 may have a cavity formed at an upper portion thereof in at least a portion thereof. In this case, the cavity 111 may be recessed so that the light emitting device 120 may be disposed. Thus, the package body 110 may include an area protruding around the cavity 111. The optical measuring device 130 may be located on a protruding area around the cavity 111. In this case, the opening of the cavity 111 may be open in the light emitting direction of the light emitting device 120.

The package body 110 may be formed of a silicon wafer or the like. In addition, although the package body 110 is illustrated as having a rectangular parallelepiped shape in FIG. 1, the package body 110 may have any polyhedral form.

The surface shape of the cavity 111 may be polygonal, circular, elliptical, or the like so that the light emitting device 120 may be disposed in the cavity 111. The cavity 111 may be formed through a dry etching and / or a wet etching process for the package body 110, but may also be formed by other methods.

The insulating layer 112 may surround the package body 110. The insulating layer 112 may include electrical insulation between the package body 110 and the light emitting device 120, electrical insulation between the package body 110 and the photometric device 130, and the package body 111 and the electrode layers 114, 116, and the like. And for electrical isolation from 115, 117, 132 and 134. The insulating layer 112 may be formed of an insulating material such as silicon oxide (for example, SiO ₂ ), silicon nitride (for example, Si ₃ N _4, etc.), aluminum nitride (AlN), silicon carbide (SiC), or the like. Can be.

As the light emitting device 120, a light emitting diode (LED) may be used. For example, it may be a colored light emitting diode or a light emitting diode emitting ultraviolet rays, but any device capable of emitting light may be used as a light emitting element. The light emitting device 120 may be attached to the cavity 111 with an adhesive. The adhesive may comprise a conductive material. The package body 110 and the light emitting device 120 are insulated by the insulating layer 112. Although only one light emitting device 120 is illustrated in the drawing, two or more light emitting devices 120 may be disposed.

The light emitting device package according to the embodiment includes a first electrode layer 114 and a second electrode layer 116 electrically connected to the light emitting device 120. 1 to 3, the light emitting device 120 is formed on the first electrode layer 114, so that the light emitting device 120 and the first electrode layer 114 are electrically connected to each other. In addition, it is illustrated that the light emitting device 120 and the second electrode layer 116 are electrically connected by a wire. However, this is merely an example, and the first electrode layer 114 and / or the second electrode layer 116 may be electrically connected to the light emitting device 120 through wires and other means.

At least one of the first electrode layer 114 and the second electrode layer 116 may be formed of a single layer and / or a multilayer metal layer. In this case, at least one of the first electrode layer 114 and the second electrode layer 116 may be formed of a metal having high reflectivity in order to increase light emission efficiency of the light emitting device package. In this case, the first electrode layer 114 and the second electrode layer 116 are insulated from each other. An insulating part 118 may be formed between the first electrode layer 114 and the second electrode layer 116.

The first electrode layer 114 and the second electrode layer 116 may be connected to the first outer electrode layer 115 and the second outer electrode layer 117 of the light emitting device package, respectively. The first outer electrode layer 115 and the second outer electrode layer 117 may be formed on the rear surface of the package body 110. The first electrode layer 114 and the second electrode layer 116 extend from the surface of the package body 110 to contact the first external electrode layer 115 and the second external electrode layer 117 formed on the rear surface of the package body 110. Can be.

The first and second external electrode layers 115 and 117 may be electrically and / or mechanically coupled to the substrate wiring when the light emitting device package is mounted on the substrate by a surface mount technology (SMT) process. The first and second external electrode layers 115 and 117 may be made of a metal material having excellent bonding strength with the adhesive. At least one of the first and second external electrode layers 115 and 117 may be formed in a single layer and / or a multilayer.

The optical measuring device 130 may be any one of a photoconductor, a semiconductor junction measuring device, and a metal-semiconductor junction measuring device. For example, the optical measuring device 130 may be formed of a photoconductor, a PN type photodiode, a PIN structure photodiode, an Avalanche photodiode (APD), or a metal semiconductor metal (MSM) structure photodiode. have.

The optical measuring device 130 may be positioned on at least a portion of the package body 110 to measure the intensity of light from the light emitting device 120 and / or the intensity of external light. As shown in FIGS. 1 to 3, when the cavity 111 is formed in the package body 110 in a recessed shape, the optical measuring device 130 may be formed on a protruding area around the cavity 111. Can be.

1 and 2, the optical measuring device 130 may have a cantilever shape in which only a part of the optical measuring device 130 is positioned on the protruding region. In this case, the remaining part of the photometric device 130 may have a shape protruding toward the cavity 111 in which the light emitting device 120 is disposed. As described above, the optical measuring device 130 is positioned at the upper end of the light emitting device 120, that is, in the light emitting direction of the light emitting device 120, so that the light output amount from the light emitting device can be accurately measured.

The optical measuring device 130 may include a light absorption layer 131 and third and fourth electrode layers 132 and 134 electrically connected to the light absorption layer 131. As described above, the package body 110 is surrounded by an insulating layer 112 for electrical insulation between the package body 110 and the photometric device 130. In this case, the insulating layer 112 may increase the light absorption rate of the light absorption layer 131 by reflecting the light emitting device 120 or the external light.

The light absorption layer 131 may be formed by a method such as evaporation, sputtering, epitaxy, or the like. The light absorbing layer 131 may be formed of a material having a high light absorption rate according to the wavelength band emitted from the light emitting device 120. For example, the light absorption layer 131 may include a silicon semiconductor such as silicon, poly-silicon, or amorphous silicon, a nitride semiconductor such as GaN, or the like.

The third and fourth electrode layers 132 and 134 are electrically connected to the light absorption layer 131. At least one of the third and fourth electrode layers 132 and 134 may be formed of a single layer and / or a multilayer metal layer. At least one of the third and fourth electrode layers 132 and 134 may include at least one of titanium (Ti), nickel (Ni), aluminum (Al), gold (Au), and silver (Ag). The third and fourth electrode layers 132 and 134 may be insulated from each other, and the third and fourth electrode layers 132 and 134 may be connected to the first outer electrode layer 115 and the second outer electrode layer 117, respectively.

FIG. 5 is an enlarged view of a corner including the optical measuring device of FIG. 1. FIG. 5 further shows an upper insulating layer 133 for insulating and / or protecting the light absorbing layer 131 on the light absorbing layer 131. The cavity 111 may be formed on the package body 110 through a dry etching and / or a wet etching process by forming a pattern on the insulating layer 112, the light absorption layer 131, and the upper insulating layer 133. Thereafter, an insulating layer 112 for electrical insulation between the light emitting device and the electrode layer is formed in the cavity 111.

In this case, a resin material (not shown) may be formed in the cavity 111. The resin may include a transparent epoxy or silicon material, and phosphors may be added according to embodiments. In this case, the first electrode layer and the second electrode layers 114 and 116 may include a metal material having good adhesion to the resin.

As described above, the light emitting device package according to the present invention may include the optical measuring device 130 to effectively measure the light output from the light emitting device 120. In this case, the electrical and / or optical characteristics of the light emitting device 120 may be compensated using the measured brightness information of the light emitting device 120. For example, light may be uniformly output from the light emitting device 120 by using brightness information of the light emitting device 120 measured by the light measuring device 130. Therefore, the light emitting device 120 of the light emitting device package according to the embodiment of the present invention may have a uniform light emitting property irrespective of changes in device properties.

For example, the optical measuring device 130 may measure the light output of the light emitting device 120 and transmit the light output amount to the light emitting device driver. The light emitting device driver may adjust a supply power or a current applied to the light emitting device by using the light output amount measured by the light measuring device 130. Accordingly, the light emitting device 120 may have electrical and / or optical characteristics desired by the user. For example, the light emitting device 120 may have a uniform light distribution.

In addition, in the case of a light emitting module (not shown) having a plurality of light emitting device packages according to an embodiment of the present invention, the light output of each light emitting device 120 is measured and applied to each light emitting device 120. By controlling the current, the light output characteristics of all the light emitting devices 120 constituting the light emitting module can be maintained uniformly.

In addition, the light emitting device package according to the present invention may include the optical measuring device 130 to measure external light of an environment in which the light emitting device 120 is located. Therefore, the operation and / or the degree of brightness of the light emitting device 120 may be flexibly adjusted according to the brightness of the surrounding environment.

As described above, those skilled in the art to which the present invention pertains will understand that the present invention may be implemented in other specific forms without changing the technical spirit or essential features.

Therefore, the embodiments described above are to be understood in all respects as illustrative and not restrictive, and the scope of the present invention is indicated by the following claims rather than the above description, and the meaning and scope of the claims And all changes or modifications derived from the equivalent concept should be construed as being included in the scope of the present invention.

110: package body 120: light emitting element
130: optical measuring element 111: cavity
112: insulating layer 114, 116: first and second electrode layers
115, 117: First and second external electrode layers
118: insulation section 132, 134: third and fourth electrode layer
133: upper insulating layer 113, 213: light emitting element
114, 214: binder 115, 116, 215: electrode

Claims (9)

A package body on which at least a cavity having an open top is formed;
A light emitting element disposed in the cavity to emit light through the open area; And
Located on at least a portion of the package body includes an optical measuring device for measuring the intensity of light,
The cavity has a shape in which at least a portion of the package body is recessed and the package body includes an area protruding around the cavity,
The optical measuring device is located on the projecting area, the light emitting device package. delete The method of claim 1,
The light measuring device has a cantilever shape in which only a part of the light measuring device is positioned on the protruding region, and the rest of the light measuring device protrudes toward the cavity side. The method according to claim 1 or 3,
The light emitting device package further comprises an insulating layer surrounding the package body surface. 5. The method of claim 4,
Further comprising a first electrode layer and a second electrode layer electrically connected to the light emitting device and electrically insulated from each other,
The first electrode layer and the second electrode layer extends on the surface of the insulating layer and connected to the first external electrode layer and the second external electrode layer formed on the back of the package body, respectively. 5. The method of claim 4,
The optical measuring device includes a light absorbing layer and a third electrode layer and a fourth electrode layer electrically connected to the light absorbing layer,
The third electrode layer and the fourth electrode layer is extended and connected to the first external electrode layer and the second external electrode layer formed on the back of the package body, respectively, the light emitting device package. The method according to claim 1 or 3,
The optical measuring device measures a light amount of at least one of light emitted from the light emitting device and external incident light. The method according to claim 1 or 3,
The light measuring device and the light emitting device is electrically insulated from each other, the light emitting device package. The method according to claim 1 or 3,
The optical measuring device is any one of a photoconductor measuring device, a semiconductor junction measuring device and a metal-semiconductor junction measuring device, the light emitting device package.

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