KR101218569B1 - Apparatus for depositing thin film - Google Patents

Abstract

 The present invention provides a thin film deposition apparatus comprising a reaction chamber, a deposition source in the reaction chamber, a substrate seating member in the reaction chamber, and a temperature controller installed inside the substrate seating member. The temperature control device is a cooling device, characterized in that it comprises a cooling line for circulating the inside of the substrate seating member and the cooling line, and a cooling control device installed outside the reaction chamber. The thin film deposition apparatus according to the present invention cools the substrate mounting member to which the substrate to be deposited is coupled to quickly and uniformly control the temperature of the substrate to be deposited to prevent damage to the deposited film deposited on the substrate to be deposited and to prevent changes in the deposition film properties. Can be. In addition, by protecting the deposited film deposited on the substrate to be deposited, there is an advantage that can improve the performance and reliability of the product using the same.

Chamber, Deposition Process, Thin Film Deposition Equipment, CVD, Deposition Crucible

Description

Thin film deposition apparatus {Apparatus for depositing thin film}

1 and 2 is a schematic cross-sectional view showing a conventional thin film deposition apparatus.

3 is a schematic diagram showing a first embodiment according to the present invention;

4 and 5 are cross-sectional views showing an example of a cooling line formed in the substrate seating member of the first embodiment.

6 is a schematic diagram showing a second embodiment according to the present invention;

7A and 7B are cross-sectional and cross-sectional perspective views showing the housing and the drive shaft of the second embodiment;

8 and 9 are cross-sectional views showing examples of cooling lines formed in the substrate seating member of the second embodiment.

10 is a schematic diagram showing a third embodiment according to the present invention in which the deposition source, the substrate to be deposited, and the mask are erected vertically;

Fig. 11 is a schematic diagram showing a fourth embodiment according to the present invention in which the deposition source is located above the substrate to be deposited;

<Explanation of symbols for the main parts of the drawings>

1, 10, 11 substrate mounting member 2, 12 substrate to be deposited

3, 13: mask 4, 14: fixed clip

5, 15: evaporation crucible 6, 16: reaction chamber

7, 17: hot wire 8, 18: feedthrough

9, 19: wire 20: cooling line

21: first cooling line 22: second cooling line

23: cooling fluid supply line 24: cooling fluid exhaust line

30: cooling control device 40: drive shaft

41 housing 42: cooling fluid supply pipe

43: cooling fluid exhaust pipe 44: cooling fluid supply hole

45: cooling fluid exhaust hole 46: annular port

47: discharge hole 48: discharge annulus

50: sealing device 51: flange portion

52: O-ring

The present invention relates to a thin film deposition apparatus, and more particularly, to a thin film deposition apparatus for controlling the temperature of the substrate to be deposited to protect the deposition source deposited on the substrate to be deposited.

The process of depositing the evaporation source is widely used to deposit organic materials for pattern formation in the manufacture of liquid crystal displays (LCDs) or semiconductor wafers, and coating or electronic circuit patterns as well as liquid crystal display devices or semiconductor wafers. It is also widely used in the manufacturing process of various products requiring formation.

1 and 2 is a schematic view showing a conventional thin film deposition apparatus.

Referring to the drawings, a conventional thin film deposition apparatus includes a substrate seating member 1 having a structure capable of linear movement or rotational movement, a substrate 2 to be bonded to the bottom surface of the substrate seating member 1, A mask 3 coupled to the bottom of the deposition substrate 2, a fixing clip 4 for fixing the substrate mounting member 1, the substrate 2 and the mask 3 to be deposited, and a heating wire 7 inside the wall. It is configured to include a deposition crucible (5) for evaporating the deposition source (D) contained in the inside is deposited on the substrate 2 to be deposited.

Each component is isolated from the outside by the reaction chamber 6 so that the evaporated deposition source D can be effectively deposited on the substrate 2 to be deposited, and the heating wire 7 provides a feedthrough. It is configured to receive power by an electric wire 9 which is connected to the outside of the reaction chamber 6 through a circuit.

The deposition source D to which heat is applied and evaporated by the deposition crucible 5 is deposited on the substrate 2 to be deposited according to the pattern of the mask 3. As illustrated in FIG. 1, the substrate 2 is linearly moved so that the deposition source D is evenly deposited on the bottom surface of the substrate 2, or as shown in FIG. 2. The deposition substrate 2 is composed of a rotatable structure.

The temperature of the substrate 2 to be installed inside the reaction chamber 6 is increased due to the high process temperature. Moreover, since the heat applied to the vapor deposition source D is directed toward the substrate 2 to be deposited, the temperature of the substrate 2 to be deposited is easily raised.

However, if the temperature of the substrate 2 to be deposited is too high, there is a problem that the deposited film is damaged. For example, when the substrate to be deposited on which the organic material is deposited is continuously exposed to the heat of evaporation of the evaporation source to increase the temperature of the substrate to be deposited, not only the organic material to be deposited but also the previously deposited organic material may be deteriorated. Or damage it. Therefore, there is a problem in that the properties of the deposited organic material are changed, thereby degrading the performance and decreasing the reliability of the organic EL using the same.

The present invention is to solve the above problems, to provide a thin film deposition apparatus that can properly control the temperature of the substrate to be deposited to prevent damage to the deposited film deposited on the substrate to be deposited and to prevent changes in the deposited film properties The purpose.

Another object of the present invention is to provide a thin film deposition apparatus that can protect the deposited film deposited on the substrate to be deposited to improve the reliability and performance of the product using the same.

In order to achieve the above object, the present invention is a thin film deposition apparatus comprising a reaction chamber, a deposition source in the reaction chamber, a substrate seating member in the reaction chamber and a temperature control device installed inside the substrate seating member. To provide. The temperature control device is a cooling device, characterized in that it comprises a cooling line for circulating the inside of the substrate seating member and the cooling line, and a cooling control device installed outside the reaction chamber.

The cooling apparatus may include one cooling line in the substrate seating member, or may include a plurality of the cooling lines in the substrate seating member. The cooling line may include a first cooling line and a second cooling line which are spirally installed, and a supply end of the first cooling line and a discharge end of the second cooling line are located at the center of the substrate seating member. The discharge end of the first cooling line and the supply end of the second cooling line may be located at the end of the substrate seating member.

The deposition source of the thin film deposition apparatus according to the present invention may be accommodated in a deposition source container, and the deposition source container may have a structure in which one surface is opened to evaporate the deposition source into the reaction chamber. The deposition source may be installed at any one of a lower portion of the substrate seating member, an upper portion of the substrate seating member, or a side portion of the substrate seating member.

The thin film deposition apparatus according to the present invention has a structure in which the substrate to be deposited is rotatable, and may include a temperature control device inside the rotating substrate seating member. That is, the thin film deposition apparatus is connected to the substrate seating member, the drive shaft for rotating the substrate seating member, a housing surrounding the drive shaft, a cooling fluid supply hole and a cooling fluid exhaust hole passing through the side wall of the housing and the cooling And a cooling control device connected through a line, the cooling fluid supply hole, and the cooling fluid exhaust hole. A cooling fluid supply pipe and a cooling fluid exhaust pipe connected to the cooling line and installed inside the drive shaft, a cooling fluid supply hole and a cooling fluid exhaust hole passing through the sidewall of the housing, and the housing corresponding to the cooling fluid supply hole and the cooling fluid exhaust hole. It may include an annular sphere installed along the inner circumference of the and the cooling control device connected to the cooling fluid supply pipe and the cooling fluid exhaust pipe. In addition, a sealing portion may be further included on an upper portion and a lower portion of the annular sphere between the drive shaft and the housing. It may further include a discharge hole for discharging the leakage cooling fluid in the lower portion of the housing and the discharge annulus is installed along the inner circumference of the housing corresponding to the discharge hole, the sealing portion may further include a lower portion of the discharge annulus have.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention in more detail. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Wherein like reference numerals refer to like elements throughout.

Figure 3 is a schematic diagram showing a first embodiment according to the present invention, Figure 4 is a plan sectional view showing a cooling line formed in the substrate seating member of the first embodiment.

Referring to the drawings, the thin film deposition apparatus includes a substrate seating member 10 having a cooling line 20 formed therein, a substrate 12 to be bonded to the bottom surface of the substrate seating member 10, and a substrate 12 to be deposited. And a fixing clip 14 for fixing the mask 13 coupled to the bottom of the substrate, and the substrate mounting member 10, the substrate 12 to be deposited, and the mask 13. A deposition crucible 15 having a concave portion having one surface open to contain the deposition source D to be deposited on the substrate 12 to be deposited on the substrate 12 to be deposited thereon and to evaporate it. The inside of the wall of the deposition crucible 15 is provided with a heating wire 17 to vaporize the deposition source D contained therein and to deposit it on the substrate 12 to be deposited.

The thin film deposition apparatus includes a reaction chamber 16 that isolates the deposition crucible 15 and the substrate to be deposited 12 from the outside. Each component is isolated from the outside by the reaction chamber 16 so that the evaporated deposition source D is effectively deposited on the substrate 12 to be deposited, and the heating wires 17 feed through the feedthrough 18. It is configured to receive power by an electric wire 19 which is connected to the outside of the reaction chamber 16 through a circuit.

A cooling line 20 is formed inside the substrate seating member 10 coupled to the upper surface of the substrate 12, and a cooling fluid supply line 23 connected to both ends of the cooling line 20. It includes a cooling fluid exhaust line 24, which is connected to the cooling control device 30 provided outside the reaction chamber (16). The cooling fluid is circulated from the cooling control device 30 to the cooling line 20 inside the substrate seating member 10 through the cooling fluid supply line 23 and the cooling fluid exhaust line 24. By adjusting the temperature, it is possible to control the temperature of the substrate 12 to be bonded to the bottom of the substrate mounting member 10. In this case, as the cooling fluid, gases such as ammonia, freon, and methyl chloride may be used as well as cooling water. In addition, the temperature of the cooling fluid supplied is preferably a temperature slightly lower than the cooling temperature of the target substrate 12 to be deposited.

4 illustrates an example of a cooling line formed in the substrate seating member 10. The cooling fluid supply line 23 and the cooling fluid exhaust line 24 are centered at both edges of the substrate seating member 10. To be connected to, that is, both ends of the cooling line 20 is formed symmetrically in the center of the two edges of the substrate seating member (10). The shape of the cooling line 20 is formed to sequentially rotate the front surface to cool the substrate seating member 10 quickly and evenly. When the deposition crucible 15 is located at the center, the distance from the deposition crucible 15 is increased. Since the temperature of the nearest central portion easily rises, it is preferable to form the cooling line 20 to preferentially circulate the central portion.

The cooling fluid is supplied from the cooling fluid supply line 23 through one end of the cooling line 20, that is, through the supply end, and moves from one edge of the substrate seating member 10 along the cooling line 20 to the other edge. The other end of the cooling line 20, that is, is discharged to the cooling fluid exhaust line 24 through the exhaust end. Since the cooling line 20 is evenly spread inside the substrate seating member 10, the substrate seating member 10 is uniformly cooled. Therefore, the substrate 12 to be supported by the substrate mounting member 10 is also cooled quickly and uniformly. In the drawing, the cooling fluid moves from one edge portion of the substrate seating member 10 to the other end portion of the substrate seating member 10 along the cooling line 20, but is not limited thereto. It may be moved to the edge portion of the member 10. In this case, of course, the supply end of the cooling line 20 is formed at the center portion of the substrate seating member 10, and the exhaust end of the cooling line 20 is formed at the edge of the substrate seating member 10.

The shape of the cooling line 20 is not limited to the bar, and may be configured in various shapes such as a rectangular shape and a circular shape.

FIG. 5 illustrates another cooling line formed in the substrate seating member 10, and two cooling lines 21 and 22 may be formed for a faster and more efficient cooling effect. Of course, in this case, two cooling fluid supply lines 23 and cooling fluid exhaust lines 24 are formed, respectively, and are connected to both ends of each of the cooling lines 21 and 22.

Referring to the drawings, both ends of the first cooling line 21 and the second cooling line 22 are formed symmetrically in the diagonal direction of the substrate seating member 10, respectively. The cooling fluid is supplied through the cooling fluid supply line 23 to evenly cool the 1/2 surface of the substrate seating member 10 along the first cooling line 21 at one end of the diagonal side of the substrate seating member 10. After returning to one end of the diagonal side of the substrate seating member 10 is discharged through the cooling fluid exhaust line 24. At the same time, a cooling fluid is supplied from the other end of the diagonal side of the substrate seating member 10 to cool the 1/2 surface of the substrate seating member 10 evenly along the second cooling line 22 as described above. Therefore, the substrate 12 to be supported by the substrate mounting member 10 is cooled quickly and uniformly.

In the drawing, the two cooling lines 21 and 22 are shown to separately cool different areas of the substrate seating member 10, but the present invention is not limited thereto, and each cooling line may cool the same area of the substrate seating member. . For example, the first cooling line has a spiral shape from the center portion inside the substrate seating member to the edge portion inside the substrate seating member, and the second cooling line is from the edge portion inside the substrate seating member to the center portion inside the substrate seating member. It forms a spiral shape. In the first cooling line, the cooling fluid moves from the center portion of the substrate seating member to the edge portion, and in the second cooling line, the cooling fluid moves from the edge portion of the substrate seating member to the center portion. That is, along the two cooling lines the cooling fluids are moved to cross each other. The temperature difference may occur depending on the location of the cooling line because the temperature rises while the cooling fluid moves along the cooling line. However, as described above, the substrate seating member is formed at a uniform temperature to form a cooling line. The substrate to be supported supported by the member is cooled uniformly.

Thus, by forming one or more cooling lines to control the temperature more quickly and effectively, the number and shape of the cooling lines can be variously configured.

Since the cooling fluid circulates through the cooling fluid supply line 23 and the cooling fluid exhaust line 24, a separate cooling control device 30 may be provided outside the reaction chamber 16 to be isolated from the reaction chamber 16. It does not affect the process in the reaction chamber 16.

In addition, the mask 13, the substrate to be deposited 12, and the substrate mounting member 10 of the thin film deposition apparatus according to the present invention are configured to be movable in the horizontal direction. The cooling fluid supply line 23 and the cooling fluid exhaust line 24 connecting the substrate seating member 10 and the cooling control device 30 are formed to an appropriate length so as not to disturb the movement of the substrate 12 to be deposited. . The deposition source D evaporated by the deposition crucible 15 is deposited on the substrate 12 according to the pattern of the mask 13, and the substrate 12 is horizontal while the deposition source D is evaporated. Moving in the direction, the deposition source D may be evenly deposited on the bottom surface of the substrate 12 to be deposited.

In addition, when the distance between the substrate 12 and the deposition crucible 15 is too far, the deposition efficiency is lowered, and when the distance between the substrate 12 and the deposition crucible 15 is too close, the deposition source ( Since the deposition of D) can be concentrated in one place, it is preferable that the distance between the substrate 12 and the deposition crucible 15 can be adjusted according to the deposition conditions in order to proceed with a more efficient and precise deposition process.

In this embodiment, the fixing clip 14 is configured to hold the upper end of the substrate mounting member 10 and the bottom end of the mask 13, but the structure of the fixing clip 14 is not limited to this, but the substrate mounting member ( 10) and a structure capable of fixing the positions of the substrate 12 and the mask 13 to be deposited may be variously changed.

Referring to the drawings the operation of the thin film deposition apparatus having such a configuration is as follows.

First, when the deposition crucible 15 is heated, the deposition source D contained in the deposition crucible 15 is evaporated and deposited on the substrate 12 to be deposited via the mask 13, thereby depositing the substrate 12. At the bottom of the film, a vapor deposition film is formed. Since the mask 13 is formed to be perforated in accordance with a pattern to be formed on the substrate 12, the shape of the deposition film formed on the bottom surface of the substrate 12 may be changed by replacing the mask 13. The substrate mounting member 10, the substrate 12 and the mask 13 positioned on the deposition crucible 15 are moved in a horizontal direction so that the deposition source D is formed on the entire bottom surface of the substrate 12. Evenly deposited.

Simultaneously with the deposition process, the cooling control device 30 injects the cooling fluid through the cooling fluid supply line 23. The injected cooling fluid is transferred to the supply end of the cooling line 20 inside the substrate seating member 10 and moves through the cooling line 20 formed to evenly circulate the inside of the substrate seating member 10. When the continuous injection of the cooling fluid is carried out, the injected cooling fluid moves through the cooling line 20 to cool the deposited substrate 12 bonded to the bottom surface of the substrate seating member 10, and then the cooling line 20 It is discharged to the external cooling control device 30 through the cooling fluid exhaust line 24 connected to the exhaust end. At this time, by continuously injecting the cooling fluid by adjusting the amount and temperature of the cooling fluid, it is possible to control the temperature of the substrate mounting member 10 and the substrate 12 to be deposited. Therefore, it is possible to prevent the deposited film from being damaged due to the high process temperature.

Figure 6 is a schematic view showing a second embodiment according to the present invention, Figures 7a and 7b shows the configuration of the housing and the drive shaft of the second embodiment, Figure 8 is a cooling line formed in the substrate seating member of the second embodiment It is a plan cross-sectional view showing.

Referring to the drawings, the thin film deposition apparatus according to the present embodiment is almost the same as the configuration of the first embodiment, the housing 41 surrounding the outside of the drive shaft 40 rotatable only on the upper portion of the substrate mounting member 11 and the outside thereof. It is configured to enable a rotational movement of the substrate 12 to be deposited, including. As the substrate 12 is rotated, the deposition source D may be more evenly deposited on the bottom surface of the substrate 12.

A cooling line 20 is formed inside the substrate seating member 11 coupled to the upper surface of the substrate 12, which is the cooling control device 30 and the driving shaft 40 provided outside the reaction chamber 16. ) And the cooling fluid injected through the housing 41 may control the temperature of the substrate 12 to be bonded to the bottom surface of the substrate mounting member 11.

The cooling fluid supply pipe 42 and the cooling fluid exhaust pipe 43 are formed in the drive shaft 40 connected to the upper portion of the substrate seating member 11. The side wall of the housing 41 includes a cooling fluid supply hole 44 and a cooling fluid exhaust hole 45 for injecting a cooling fluid, which is a cooling fluid supply pipe 42 and a cooling fluid formed inside the drive shaft 40. It is connected to the exhaust pipe 43, respectively. In addition, the lower ends of the cooling fluid supply pipe 42 and the cooling fluid exhaust pipe 43 of the drive shaft 40 are connected to both ends of the cooling line 20 formed inside the substrate seating member 11, respectively.

As described above, the cooling fluid supply hole 44 and the cooling fluid exhaust hole 45 are formed in a portion of the side wall of the housing 41 in FIG. 7A. In addition, it is connected to this, and includes an annular sphere 46 is installed to extend along the inner circumference of the housing (41). That is, as shown in FIG. 7B, the cooling fluid supply hole 44 and the cooling fluid exhaust hole 45 are the cooling fluid of the drive shaft 40 through the annular opening 46 formed along the inner circumference of the housing 41. It is installed to communicate with the supply pipe 42 and the cooling fluid exhaust pipe (43). Thus, even if the drive shaft 40 rotates, since the cooling fluid supply hole 44 and the cooling fluid exhaust hole 45 exist in a one-to-one correspondence with the respective annular openings 46, the supply of the cooling fluid is driven by the drive shaft 40. It is always done regardless of its rotation.

The cooling fluid supply hole 44, the cooling fluid exhaust hole 45, and the annular port 46 are installed in the same number so as to correspond one to one with each other. Here, the cooling fluid supply pipe 42 and the cooling fluid exhaust pipe 43 or the cooling fluid supply hole 44 and the cooling fluid exhaust hole 45 corresponding to each annular opening 46 are illustrated as one, It may be more than that for smooth flow.

In the case where the cooling fluid injected between the drive shaft 40 and the housing 41 leaks, a separate drain port may be formed to prevent the cooling fluid from flowing into the reaction chamber 16. This is preferably formed in the lower portion of the cooling fluid supply hole 44 and the cooling fluid exhaust hole 45.

The drain port includes a discharge hole 47 penetrating the side wall of the housing 41, and a discharge annular opening 48 connected to the discharge hole 47 and extending along an inner circumference of the housing 41. . In addition, the discharge hole 47 may be installed by connecting a leak detection sensor and a decompression means for detecting the leakage of the cooling fluid. By mounting the sensor at all times to check the leakage of the cooling fluid, it is possible to effectively prevent the leaked cooling fluid from flowing into the reaction chamber 16.

A plurality of sealing parts 50 are formed between the drive shaft 40 and the housing 41 to prevent leakage of the cooling fluid. The upper and lower portions of the cooling fluid supply hole 44 and the cooling fluid exhaust hole 45, or the lower portion of the discharge hole 47 is provided with a sealing portion 50, it is preferable to use a mechanical seal.

It further includes a flange portion 51 for coupling the housing 41 and the reaction chamber 16, and an O-ring 52 for sealing on the surface where the flange portion 51 and the reaction chamber 16 are connected.

FIG. 8 is a view illustrating a cooling line formed in a substrate seating member. The cooling fluid supply pipe 42 and the cooling fluid exhaust pipe 43 of the drive shaft 40 are connected to a central portion of the substrate seating member 11. If possible, both ends of the cooling line 20 is formed in the central portion of the substrate seating member (11). The shape of the cooling line 20 is configured to sequentially rotate the front surface so as to evenly cool the substrate seating member 11, and when the deposition crucible 15 is located at the center, the distance from the deposition crucible 15 is the closest. Since the temperature of the center portion easily rises, it is preferable to configure the cooling line 20 to preferentially circulate the center portion. Of course, the shape of the cooling line 20 is not limited to the illustrated, and may be configured in various shapes such as a circular shape, a square shape.

9 illustrates another example of a cooling line formed in the substrate seating member, in which two cooling lines are formed for a more efficient cooling effect. In the drawing, the two cooling lines 21 and 22 are shown to separately cool different areas of the substrate seating member 11. However, the cooling lines 21 and 22 are not limited thereto. It may be formed to cool the same region of. Thus, by forming one or more cooling lines to control the temperature more quickly and effectively, the number and shape of the cooling lines can be variously configured.

Since the cooling fluid circulates through the cooling fluid supply pipe 42 and the cooling fluid exhaust pipe 43, a separate cooling control device 30 may be provided outside the reaction chamber 16 to be isolated from the reaction chamber 16, and the reaction chamber It does not affect the process in (16).

The mask 13, the substrate 12 and the substrate mounting member 11 of the thin film deposition apparatus according to the present invention are capable of rotational movement and evenly deposit the deposition source on the bottom of the substrate 12 to be deposited. Irrespective of this, the substrate mounting member 11 may be cooled by the drive shaft 40, the housing 41, and the cooling control device 30 connected to the substrate mounting member 11, thereby increasing the temperature of the substrate 12. Can be controlled. In addition, the distance between the substrate 12 and the deposition crucible 15 is preferably adjustable according to the deposition conditions for more efficient and precise deposition process.

Referring to the operation of the thin film deposition apparatus having such a configuration, it is almost the same as the case of the first embodiment, the second embodiment only the cooling line 20 inside the cooling control device 30 and the substrate seating member (11) Due to the different connection configurations of the cooling fluids, the moving path of the cooling fluids is different. Simultaneously with the deposition process, the cooling fluid is injected through the cooling fluid supply hole 44 of the housing 41. The injected cooling fluid is injected into the cooling fluid supply pipe 42 through the annular port 46 formed along the inner circumference of the housing 41 including the cooling fluid supply hole 44. The cooling fluid injected into the cooling fluid supply pipe 42 is delivered to the supply end of the cooling line 20 formed in the substrate seating member 11, and the cooling line 20 is formed to circulate evenly in the substrate seating member 11. Will go through. When the continuous injection of the cooling fluid is performed, the injected cooling fluid moves through the cooling line 20 to cool the deposited substrate 12 bonded to the bottom surface of the substrate seating member 11, and then the cooling line 20 It moves to the cooling fluid exhaust pipe 43 connected to the exhaust end and is discharged to the external cooling control device 30 through the cooling fluid exhaust hole 45 of the housing 41. At this time, by continuously injecting the cooling fluid by adjusting the amount and temperature of the cooling fluid, it is possible to control the temperature of the substrate mounting member 11 and the substrate 12 to be deposited. Therefore, it is possible to prevent the deposited film from being damaged due to the high process temperature.

FIG. 10 is a schematic view showing a third embodiment according to the present invention in which the substrate seating member, the substrate to be deposited, and the mask are vertically erected.

When the substrate seating member 10, the substrate to be deposited 12, and the mask 13 are configured to stand vertically, the cooling line 20 is formed inside the substrate seating member 10 coupled to the substrate 12 to be deposited. ) Is formed and includes a cooling fluid supply line 23 and a cooling fluid exhaust line 24 which are connected from both ends of the cooling line 20, which are provided outside the reaction chamber 16. ) The substrate is seated by controlling the temperature by circulating the cooling fluid through the cooling fluid supply line 23 and the cooling fluid exhaust line 24 from the cooling control device 30 to the cooling line 20 inside the substrate seating member 10. The temperature of the substrate 12 to be bonded to the member 10 may be controlled.

The substrate seating member 10, the substrate 12 to be deposited, and the mask 13 may be configured to move in a vertical direction so that the deposition source may be evenly deposited on the substrate 12. The cooling fluid supply line 23 and the cooling fluid exhaust line 24 connecting the substrate seating member 10 and the cooling control device 30 are formed to an appropriate length so as not to disturb the movement of the substrate 12 to be deposited. .

The shape of the substrate seating member 10 may be configured to be capable of rotating as well as horizontal movement, and may be freely changed according to the user's convenience and deposition conditions. In addition, the distance between the substrate 12 and the deposition crucible 15 is preferably adjustable according to the deposition conditions.

Fig. 11 is a schematic diagram showing a fourth embodiment according to the present invention in which the deposition source is located above the substrate to be deposited.

The thin film deposition apparatus according to the present invention can be configured such that the deposition crucible 15 is located above the substrate 12 to be deposited. The present embodiment includes a rotatable drive shaft 40 and a housing 41 surrounding the outside of the substrate mounting member 11 coupled to the lower surface of the substrate 12 to form the substrate 12. It is configured to enable rotational movement. As the driving shaft 40 rotates, the deposition source may be more evenly deposited on the substrate 12 to be deposited.

A cooling line 20 is formed inside the substrate seating member 11, which is injected through the cooling control device 30 provided outside the reaction chamber 16, the drive shaft 40, and the housing 41. By circulating the fluid, the temperature of the substrate 12 to be bonded to the substrate mounting member 11 can be controlled.

The shape of the substrate seating member 11 may be configured in a form capable of horizontal movement as well as rotational movement, and may be freely changed according to the user's convenience and deposition conditions. In addition, the distance between the substrate 12 and the deposition crucible 15 is preferably adjustable according to the deposition conditions.

As described above, the technical gist of the present invention can be applied to the thin film deposition apparatus having various structures.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

The thin film deposition apparatus according to the present invention cools the substrate mounting member to which the substrate to be deposited is coupled to quickly and uniformly control the temperature of the substrate to be deposited to prevent damage to the deposited film deposited on the substrate to be deposited and to prevent changes in the deposition film properties. Can be. In addition, by protecting the deposited film deposited on the substrate to be deposited, there is an advantage that can improve the performance and reliability of the product using the same.

Claims (13)

Reaction chamber; A substrate seating member disposed in the reaction chamber and on which a substrate is seated; A cooling line formed in the substrate seating member and configured to circulate a cooling fluid; A driving shaft connected to the substrate seating member and rotating the substrate seating member; A housing surrounding the drive shaft; An annular sphere installed along an inner circumference of the housing to supply a cooling fluid to the cooling line; And a drain port formed in the housing to prevent a cooling fluid from flowing into the reaction chamber. delete The method of claim 1, A cooling fluid supply hole and a cooling fluid exhaust hole formed to penetrate the side wall of the housing and communicating with the annular opening; And And a cooling control device connected to the cooling line, the cooling fluid supply hole, and the cooling fluid exhaust hole to adjust a temperature of the substrate seating member. The method of claim 3, wherein It is connected to the cooling line, and includes a cooling fluid supply pipe and a cooling fluid exhaust pipe installed inside the drive shaft, The annular sphere is a thin film deposition apparatus is installed along the inner circumference of the housing corresponding to the cooling fluid supply hole and the cooling fluid exhaust hole. The method of claim 1, Thin film deposition apparatus further comprises a sealing portion in the upper and lower portions of the annular sphere between the drive shaft and the housing. The method of claim 1, The drain port may include a discharge hole passing through the side wall of the housing; And The thin film deposition apparatus is connected to the discharge hole, including a discharge annulus is installed along the inner circumference of the housing. The method of claim 6, Thin film deposition apparatus further comprises a sealing portion under the discharge annulus. The method of claim 1, A deposition source corresponding to the substrate seating member in the reaction chamber; The deposition source is accommodated in a deposition source container, the deposition source container is a thin film deposition apparatus, characterized in that the one surface is opened so that the deposition source is evaporated into the reaction chamber. 9. The method of claim 8, The deposition source is a thin film deposition apparatus, characterized in that installed on any one of the lower portion of the substrate seating member, the upper portion of the substrate seating member or the side of the substrate seating member. The method of claim 1, Thin film deposition apparatus characterized in that the one cooling line is formed in the substrate seating member, or a plurality of the cooling line is formed by dividing the substrate seating member. The method of claim 1, The cooling line includes a first cooling line and a second cooling line which are spirally installed, and a supply end of the first cooling line and a discharge end of the second cooling line are located at the center of the substrate seating member. Thin film deposition apparatus, characterized in that the discharge end of the cooling line and the supply end of the second cooling line is located at the end of the substrate mounting member. 9. The method of claim 8, A mask disposed between the deposition source and the substrate, the mask having perforations formed to correspond to the pattern to be formed on the substrate; Thin film deposition apparatus comprising a fixing clip for coupling the substrate and the mask (mask) placed on the substrate mounting member. 13. The method of claim 12, And depositing a pattern on the substrate by evaporating and depositing the deposition source on the substrate through the perforation of the mask.

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