KR101218356B1 - Multiple copper clad laminate, method for manufacturing the same and method for manufacturing printed circuit board using the same - Google Patents

Abstract

The present invention relates to a multi-stage copper foil laminate, a method of manufacturing the same, and a method of manufacturing a printed circuit board using the same. The copper foil laminate according to an aspect of the present invention includes first and second copper foil films bonded to each other with a release layer therebetween. At least one double copper foil film provided with the said, 3rd copper foil film arrange | positioned above the said double copper foil film, 4th copper foil film arrange | positioned under the said double copper foil film, The said double copper foil film, and the said 3rd copper foil It includes a plurality of insulating films disposed between the film and the fourth copper foil film.

Description

Multi-layer copper clad laminate, method for manufacturing same and printed circuit board manufacturing method thereof {Multiple copper clad laminate, method for manufacturing the same and method for manufacturing printed circuit board using the same}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a copper clad laminate (CCL), and more particularly to a multiple copper clad laminate formed by stacking a plurality of copper foil laminates.

The copper foil laminate is used to manufacture a printed circuit board (PCB), and is coated with a copper film on both sides of an insulating film made of resin. That is, the copper foil laminated plate has a structure laminated | stacked in order of copper foil film / insulation film / copper foil film.

On the other hand, the insulating film disposed between the copper foil film may further include a reinforcing material such as glass fiber in order to reinforce the mechanical and thermal properties. That is, the insulating film may be made of prepreg impregnated with resin in glass fiber or the like.

Recently, a flexible printed circuit board (FPCB) is also manufactured using a copper foil laminate, and a copper foil laminate for manufacturing a flexible printed circuit board uses a flexible polyimide film as an insulating film. .

One aspect of the present invention is to provide a multi-stage copper foil laminate that can be easily separated into a plurality of copper foil laminates.

Another object of the present invention is to provide a method for producing the multi-stage copper foil laminate.

Another object of the present invention is to provide a method for manufacturing a printed circuit board using the multi-stage copper foil laminate.

In order to achieve the above object, the copper foil laminate according to an aspect of the present invention, at least one double copper foil film having a first and a second copper foil film bonded to each other with a release layer therebetween, and the double copper foil film A plurality of third copper foil films disposed on the upper side of the second copper foil film, a fourth copper foil film disposed on the lower side of the double copper foil film, and the second copper foil film and the third copper foil film and the fourth copper foil film. Insulation film.

In addition, in order to achieve the above object, the manufacturing method of the copper foil laminate according to another aspect of the present invention, at least one double copper foil having a first copper foil film and a second copper foil film bonded to each other with a release layer therebetween. An insulating film arranging step of arranging an insulating film on both sides of the film, and a third and fourth copper foil film arranging step of arranging a third copper foil film and a fourth copper foil film to sandwich the double copper foil film and the insulating film therebetween; And crimping the double copper foil film, the insulation film, the third copper foil film, and the fourth copper foil film.

In addition, in order to achieve the above object, a method of manufacturing a printed circuit board according to another aspect of the present invention, the step of providing the multi-stage copper foil laminate, the third copper foil film and the third Forming a circuit pattern on the copper foil film or penetrating the multi-stage copper foil laminate, and separating the first copper foil film and the second copper foil film of the multi-copper laminate.

According to the multistage copper foil laminated board which concerns on one aspect of this invention, a some copper foil laminated board can be easily obtained from one multistage copper foil laminated board.

Moreover, according to the manufacturing method of the multistage copper foil laminated board which concerns on another aspect of this invention, a multistage copper foil laminated board can be manufactured effectively.

In addition, according to the manufacturing method of the printed circuit board using the multi-stage copper foil laminate according to another aspect of the present invention, it is possible to shorten the time required for the manufacturing process of the printed circuit board to improve productivity.

1 is a schematic cross-sectional view of a multi-stage copper foil laminate according to an embodiment of the present invention.
FIG. 2 is a schematic enlarged view of portion II of FIG. 1.
3 is a view schematically illustrating separating the multi-stage copper foil laminate of FIG. 1 into two copper foil laminates.
4 is a schematic cross-sectional view of a multi-stage copper foil laminate according to another embodiment of the present invention.
FIG. 5 is a view schematically showing an apparatus for manufacturing the multi-stage copper foil laminate of FIG. 1.
6A through 6F schematically illustrate a part of a process of manufacturing a printed circuit board using the multi-stage copper foil laminate of FIG. 1.
7A and 7B schematically illustrate a part of a process of manufacturing a printed circuit board using the multi-stage copper foil laminate of FIG. 1.

Hereinafter, a multi-stage copper foil laminate according to an embodiment of the present invention will be described with reference to the drawings.

1 is a schematic cross-sectional view of a multi-stage copper foil laminate according to an embodiment of the present invention, Figure 2 is a schematic enlarged view of a portion II of FIG. 3 is a view schematically illustrating separating the multi-stage copper foil laminate of FIG. 1 into two copper foil laminates.

1 and 2, the multi-stage copper foil laminate 1 according to the present embodiment includes a double copper foil film 100, an insulation film 400, a third copper foil film 200, and a fourth copper foil film 300. Equipped.

The double copper foil film 100 includes a first copper foil film 110, a second copper foil film 120, and a release layer 130.

The first copper foil film 110 is made of a copper (Cu) material, and is made of a thin film having a thickness of several micrometers or tens of micrometers. As illustrated in FIGS. 1 and 2, the upper surface of the first copper foil film 110 is roughly roughened by a method such as oxidation. Therefore, the upper surface of the first copper foil film 110 has a large number of irregularities and has a very large surface area. The lower surface of the first copper foil film 110 is flattened as opposed to the upper surface.

The second copper foil film 120 is bonded to the lower side of the first copper foil film 110, and is made of a copper thin film having a thickness of several micrometers or tens of micrometers, similar to the first copper foil film 110. 1 and 2, the lower surface of the second copper foil film 120 is roughly roughened, and the upper surface is flattened as opposed to the lower surface.

As shown in FIG. 2, the release layer 130 is disposed between the first copper foil film 110 and the second copper foil film 120 to form the first copper foil film 110 and the second copper foil film 120. It is attached to each other detachably. The release layer has a very thin thickness of about 0.1 to 1.0 micrometers, and may be made of a material including chromium (Cr). The release layer 130 has a separation strength of about 30 N / m to 100 N / m, this separation strength prevents the first and second copper foil film (110, 120) is separated by itself, while mechanical strength Corresponds to the degree that can be easily separated by adding.

The insulating film 400 is made of glass fiber and resin such as epoxy impregnated in the glass fiber, and is bonded to the upper and lower surfaces of the double copper foil film 100. Since the upper and lower surfaces of the double copper foil film 100 are roughened, the insulation film 400 attached thereto may be stably bonded to the double copper foil film 100.

Similar to the first and second copper foil films 110 and 120, the third copper foil film 200 is formed of a copper thin film having a thickness of several micrometers or tens of micrometers. The third copper foil film 200 is bonded to the upper surface of the insulating film 400 attached to the upper side of the double copper foil film 100 so as to be disposed above the double copper foil film 100. As illustrated in FIG. 1, the bottom surface of the third copper foil film 200 adhered to the insulating film 400 may be roughened to stably maintain adhesion to the insulating film 400. The upper surface of the third copper foil film 200 is planarized as opposed to the lower surface of the third copper foil film 200 to improve the etching characteristics of the upper surface of the third copper foil film 200.

Like the first to third copper foil films 110, 120, and 200, the fourth copper foil film 300 is made of a copper thin film having a thickness of several micrometers or tens of micrometers. The fourth copper foil film 300 is bonded to the lower surface of the insulating film 400 attached to the lower side of the double copper foil film 100 so as to be disposed below the double copper foil film 100. As illustrated in FIG. 1, an upper surface of the fourth copper foil film 300 adhered to the insulating film 400 may be roughened to stably maintain adhesion to the insulating film 400. The lower surface of the 4th copper foil film 400 is also planarized so that the etching characteristic may be excellent.

Meanwhile, in the present exemplary embodiment, one double copper foil film 100 is disposed between the third and fourth copper foil films 200 and 300, but alternatively, a plurality of double copper foil films 100 may be disposed. For example, as shown in FIG. 4, the multi-stage copper foil laminate 2 includes two double copper foil films 100, a third copper foil film 200, a fourth copper foil film 300, and three insulation layers disposed therebetween. It may be made in the form having a film (400). In addition, the multi-stage copper foil laminate may include three or more double copper foil films 100.

Next, the manufacturing method of the multistage copper foil laminated board 1 which concerns on a present Example is demonstrated with reference to drawings.

FIG. 5 is a view schematically showing an apparatus for manufacturing the multi-stage copper foil laminate of FIG. 1. In the present embodiment, a multi-stage copper foil laminate 1 is manufactured using the manufacturing apparatus 3 of FIG. 5 as an example. .

The manufacturing method of the multi-stage copper foil laminated plate 1 according to the present embodiment includes the steps of preparing a double copper foil film 100, arranging an insulating film 400, arranging third and fourth copper foil films 200 and 300, and crimping steps. It includes.

The step of providing the double copper foil film 100 is a step of providing a double copper foil laminate to be used in the manufacture of the multi-stage copper foil laminate (1), in order to manufacture the double copper foil film 100, a release layer on the second copper foil film 120 After the 130 is formed by plating, a method of forming the first copper foil film 110 by plating thereon, or the release layer 130 is formed on the second copper foil film 120 by plating beforehand The method of vacuum-compressing the first copper foil film 110 may be used. The double copper foil laminate 100 manufactured by the above method is wound and disposed on the reel 510 as shown in FIG. 5. The double copper foil film 100 wound on the reel 510 is unwound and fed between the pair of crimping rollers 610.

The insulation film 400 arrangement step is a step of placing the insulation film 400 on each of the upper and lower sides of the double copper foil film 100. In the present embodiment, the pair of insulating films 400 are disposed on both sides of the insulating film 400 and are simultaneously introduced between the pair of pressing rollers 610.

On the other hand, the insulating film 400 is formed by impregnating the resin 420 in the glass fiber 410, for this purpose, the glass fiber 410 wound on the reel 540 is released and introduced into a pair of pressing rollers 610. However, the resin 420 is impregnated into the glass fiber 410 before the glass fiber 410 is introduced between the pair of pressing rollers 610. That is, as shown in 5, before the glass fiber 410 is introduced between the pressing rollers 610, the resin 420 is applied to the glass fiber 410 using the resin ejector 620. The resin 420 is then impregnated into the glass fiber 410 while the glass fiber 410 is introduced between the compression roller 610 via the low temperature roller 650. A resin storage container 630 for storing the resin 420 separated from the glass fiber 410 is disposed below the low temperature roller 650.

Arranging the third and fourth copper foil films 200 and 300 may include arranging the third copper foil film 200 and the fourth copper foil film 300 to sandwich the double copper foil film 100 and the insulating film 400 therebetween. Step. In this embodiment, the third copper foil is wound around the reel 520, 530, and the third copper foil film 200 and the fourth copper foil film 300 are unwound, and the respective copper foils are inserted between the insulating film 400 and the pressing rollers 610. The film 200 and the fourth copper foil film 300 allow the double copper foil film 100 and the insulating film 400 to be sandwiched therebetween. Referring to FIG. 5, the third copper foil film 200 and the fourth copper foil film 300 are introduced into a pair of pressing rollers 610 while contacting the insulating film 400 while passing through the pressing rollers.

When the third copper foil film 200 and the fourth copper foil film 300 are disposed outside the double copper foil film 100 and the insulating film 400, a crimping step is performed. The crimping step is a step of compressing the double copper foil film 100, the insulating film 400, the third copper foil film 200, and the fourth copper foil film 300. In the present embodiment, using the pair of pressing rollers 610, the double copper foil film 100, the insulating film 400, the third copper foil film 200 and the fourth copper foil film 300 disposed therebetween Squeeze. The pressing roller 610 may be maintained at a high temperature so as to pressurize and simultaneously heat the double copper foil film 100, the insulating film 400, the third copper foil film 200, and the fourth copper foil film 300. In this case, the double copper foil film 100, the insulating film 400, the third copper foil film 200, and the fourth copper foil film 300 are melt-compressed with each other while passing through the pressing roller 610.

The double copper foil film 100, the insulating film 400, the third copper foil film 200, and the third copper foil film 300 passing through the pressing roller 610 are put into an oven and cured through a heat treatment process.

As described above, the double copper foil film 100, the insulating film 400, the third copper foil film 200, and the third copper foil film 300 are compressed to each other to manufacture the multi-stage copper foil laminate 1. The manufactured multi-stage copper foil laminate 1 may be cut at regular intervals and commercialized in the form of a panel, or may be wound on a reel and commercialized in a roll.

On the other hand, in some cases it may be necessary to change the thickness of the multi-stage copper foil laminate 1, the thickness of the multi-stage copper foil laminate 1, in particular the thickness of the insulating film 400 changes the interval between the pressing roller 610. Can be easily changed.

In addition, in the above-described manufacturing method, the insulating film 400 and the third and fourth copper foil films 200 and 300 are described as being adhered to both surfaces of one double copper foil film 100, but a plurality of double copper foil films laminated differently The insulating film 400 and the third and fourth copper foil films 200 and 300 may be adhered to both surfaces of the 100. In this case, the insulating film 400 is arrange | positioned also between each double copper foil film 100.

As shown in FIG. 3, the multi-stage copper foil laminate 1 manufactured by the above method may be separated into a plurality of copper foil laminates 10 and 20 by mechanically separating the release layer 130. That is, the several copper foil laminated boards 10 and 20 can be obtained from one multi-stage copper foil laminated board 1. As a result, there is an effect of manufacturing a plurality of copper foil laminates (10, 20) at the same time by manufacturing one multi-stage copper foil laminate (1), the time required for manufacturing the copper foil laminates (10, 20) can be shortened and productivity can be improved. have.

Each copper foil laminate 10 and 20 manufactured by separating the multi-stage copper foil laminate 1 undergoes a front-side treatment process for flattening and removing foreign matters on both sides thereof. The remaining release layer 130 adhering to the copper foil laminates 10 and 20 while the front surface treatment is completely removed. Each copper foil laminate 10 and 20 that have undergone a front surface treatment process may be used in the manufacture of a printed circuit board by performing a process such as patterning or drilling.

On the other hand, as a method for manufacturing a printed circuit board, there is also a method of manufacturing a plurality of copper foil laminates (10, 20) by separating the multi-stage copper foil laminate (1) as described above, and then processing each of them. Alternatively, the multi-stage copper foil laminate 1 may be processed first and then separated into a plurality of copper foil laminates 10 and 20.

Hereinafter, an example of a method of manufacturing a printed circuit board by first processing the multi-stage copper foil laminate 1 and then separating the same will be described with reference to the drawings.

6A through 6F schematically illustrate a part of a process of manufacturing a printed circuit board using the multi-stage copper foil laminate of FIG. 1.

6A to 6F, the method of manufacturing a printed circuit board according to the present embodiment is a method of manufacturing a printed circuit board having one circuit layer, and the steps of preparing a multi-stage copper foil laminate 1 are provided. Forming a circuit pattern on the four copper foil films 200 and 300, plating the third and fourth copper foil films 200 and 300, separating the first copper foil film 110 and the second copper foil film 120, and And removing the third and fourth copper foil films 200 and 300.

The step of preparing the multi-stage copper foil laminate 1 is a step of manufacturing the multi-stage copper foil laminate 1 as shown in FIG. 6A according to the manufacturing method of the multi-stage copper foil laminate 1 described above.

Forming a circuit pattern on the third and fourth copper foil films 200 and 300 includes applying, patterning, and etching a photo resist.

Applying the photoresist and patterning step is to apply the photoresist on both sides of the multi-stage copper foil laminate (1), that is, the third copper foil film 200 and the fourth copper foil film 300, and then guide the photoresist through an exposure process As shown in 6B, the step of forming the circuit pattern has a shape. When the photoresist 710 is patterned on the third and fourth copper foil films 200 and 300 in the form of a circuit pattern, etching is performed.

The etching may be performed by etching both surfaces of the multi-stage copper foil laminate 1, that is, the third and fourth copper foil films 200 and 300, to form a circuit pattern. In this step, as shown in FIG. 6C, circuit patterns are formed on both sides of the multi-stage copper foil laminate 1 by removing portions of the third and fourth copper foil films 200 and 300 to which the photoresist 710 is not applied. When the circuit pattern is formed on both sides of the multi-stage copper foil laminate 1, the photoresist 710 is removed.

The plating of the third and fourth copper foil films 200 and 300 may include etching resists formed on both surfaces of the multi-stage copper foil laminate 1, that is, the circuit patterns formed on the third and fourth copper foil films 200 and 300, as shown in FIG. 6D. It is a step of electroplating a metal serving as an etching resist. Au or nickel may be used as the metal serving as the etching resist.

Next, a step of separating the first copper foil film 110 and the second copper foil film 120 is performed. In this step, the first metal layer 110 and the second metal layer 120 are pulled in opposite directions to destroy the release layer 130 therebetween, so that the multi-stage copper foil laminated plate 1 is plural as shown in FIG. 6E. It is a step of separating the copper foil laminate (10, 20).

Next, a step of removing the first and second copper foil films 110 and 120 is performed. This step is to remove the first and second copper foil films 110 and 120, as shown in Figure 6F, an etching process is used in this embodiment. That is, an etching solution is added to each of the copper foil laminates 10 and 20 on which the circuit patterns are formed to remove the first and second copper foil films 110 and 120. In this case, since the circuit patterns formed on the third and fourth copper foil films 200 and 300 are made of a metal serving as an etching resist, for example, metal such as gold or nickel, they are not affected by etching.

Through the above process, a plurality of printed circuit boards having circuit patterns formed on one surface of the insulating film 400 may be simultaneously manufactured. In this embodiment, since a plurality of printed circuit boards are manufactured by simultaneously patterning both sides of the multi-stage copper foil laminate 1 and then separating them, manufacturing time is effectively shortened as compared with the case of etching each copper foil laminate 10 separately. Can be.

Meanwhile, in the above, the manufacturing of a single layer printed circuit board using the multi-stage copper foil laminate 1 has been described, but the multi-stage copper foil laminate 1 according to the present embodiment may be used to manufacture a multilayer printed circuit board. Can be. In particular, after forming a hole penetrating the multi-stage copper foil laminate 1 and then separating the multi-stage copper foil laminate 1, a plurality of copper foil laminates 10 and 20 having a via hole may be simultaneously manufactured. . This will be described with reference to FIGS. 7A to 7B.

FIG. 7A is a view schematically showing the formation of a hole 810 penetrating in the thickness direction in the multi-stage copper foil laminate 1 shown in FIG. 6A, and FIG. 7B is a diagram illustrating separating the multi-stage copper foil laminate having holes formed therein. It is a schematic drawing.

After forming a hole 810 penetrating in the thickness direction in the multi-stage copper foil laminate 1 as shown in FIG. 7A through a drilling process, the multi-stage copper foil laminate in which the holes 810 are formed as shown in FIG. 7B ( Separate 1). The multi-stage copper foil laminate 1 is separated to form a plurality of copper foil laminates 10 and 20, each of which has a hole 810. The hole formed in each copper foil laminated board 10 and 20 corresponds to a via hole.

Next, by fabricating and plating both sides of each copper foil laminate 10 and 20, it is possible to complete the manufacture of a multilayer printed circuit board.

As described above, according to the method of manufacturing the printed circuit board, via holes may be formed in the plurality of copper foil laminates 10 and 20 by one drilling, so that the manufacturing time of the printed circuit board may be effectively shortened.

As mentioned above, although the manufacturing method of the multistage copper foil laminated board 1, the manufacturing method of a multistage copper foil laminated board, and the printed circuit board manufacturing method using the same were demonstrated, this invention is not limited to the above-mentioned embodiment.

For example, in the above embodiment, the insulating film 400 has been described as being manufactured by impregnating the resin 420 in the glass fiber 410. However, the insulating film 400 may be formed of only resin without reinforcing material such as glass fiber. In particular, when the insulating film 400 is made of a flexible polyimide material without a reinforcing material, a plurality of flexible copper clad laminates (FCCL) may be obtained from the multi-stage copper foil laminate 1.

In addition, in the above-described method of manufacturing a printed circuit board, the printed circuit board is manufactured by using the multi-stage copper foil laminate 1 having one double copper foil film 100. However, the printed circuit board is used in the manufacture of a printed circuit board. The multi-stage copper foil laminate 1 may be provided with two or more double copper foil films 100 as shown in FIG. 4.

In addition, the present invention may be embodied in various forms within the scope of the technical idea.

One … Multi-stage copper foil laminate 10, 20... Copper foil laminate
100 ... Double copper foil film 110. 1st copper foil film
120... Second copper foil film 130. Release layer
200 ... Third copper foil film 300... 4th copper foil film
400... Insulation film

Claims (11)

Release layer made of a material containing Cr, having a separation strength of 30 N / m to 100 N / m;
A first copper foil film attached to one surface of the release layer;
A second copper foil film attached to the other surface of the release layer;
An insulation film laminated on each of the first copper foil film and the second copper foil film;
A third copper foil film laminated on the insulating film laminated on the first copper foil film; And
And a fourth copper foil film laminated on the insulating film laminated on the second copper foil film.
The first to fourth copper foil film,
The surface in contact with the insulating film is roughened,
The laminated structure of the said 1st and 2nd copper foil film, the said insulation film, and the said 3rd and 4th copper foil film is a multistage copper foil laminated board which consists of an up-down symmetry structure centering on the said release layer. delete delete delete The method of claim 1,
The insulation film,
With fiberglass,
The multi-stage copper foil laminated board containing resin impregnated with the said glass fiber. An insulation film arrangement step of disposing an insulation film on both sides of at least one double copper foil film having a first copper foil film and a second copper foil film bonded to each other with a release layer interposed therebetween;
3rd and 4th copper foil film arrangement | positioning steps which arrange | position a 3rd copper foil film and a 4th copper foil film so that the said double copper foil film and the said insulation film may be interposed;
And crimping the double copper foil film, the insulation film, the third copper foil film, and the fourth copper foil film.
The release layer,
It consists of a material containing Cr and has a separation strength of 30 N / m to 100 N / m,
The first to fourth copper foil film,
The surface in contact with the insulating film is roughened,
The laminated structure of the said 1st and 2nd copper foil film, the said insulating layer, and the said 3rd and 4th copper foil film is a manufacturing method of the multistage copper foil laminated board which consists of an up-down symmetry structure centering on the said release layer. The method according to claim 6,
The pressing step,
The double copper foil film, the insulating film, the third copper foil film and the fourth copper foil film is a step of feeding and pressing between a pair of crimping rollers, the manufacturing method of a multi-stage copper foil laminate. Claim 8 was abandoned when the registration fee was paid. The method of claim 7, wherein
The pressing step,
A method for producing a multi-stage copper foil laminate, which is a step of pressing while heating with the pair of pressing rollers. Claim 9 has been abandoned due to the setting registration fee. The method according to claim 6,
The insulation film,
With fiberglass,
The manufacturing method of the multistage copper foil laminated board containing resin impregnated with the said glass fiber. The method according to claim 6,
The double copper foil film is made of a plurality,
The manufacturing method of the multistage copper foil laminated board in which an insulation film is arrange | positioned between the said double copper foil films. At least one double copper foil film having a first copper foil film and a second copper foil film bonded to each other with a release layer interposed therebetween, a third copper foil film disposed to be spaced apart below the double copper foil film, and the double copper foil film Providing a multi-stage copper foil laminate comprising a fourth copper foil film disposed to be spaced apart from above and a plurality of insulating films disposed between the double copper foil film, the third copper foil film, and the fourth copper foil film;
Forming a circuit pattern in the third copper foil film and the fourth copper foil film of the multi-stage copper foil laminate and forming a hole penetrating the multi-stage copper foil laminate; And
Separating the first copper foil film and the second copper foil film of the multi-stage copper foil laminate;
The release layer of the said multi-stage copper foil laminated board,
It consists of a material containing Cr and has a separation strength of 30 N / m to 100 N / m,
The first to fourth copper foil films of the multi-stage copper foil laminate,
The surface in contact with the insulating film of the multi-stage copper foil laminate is roughened,
Fabrication of a printed circuit board characterized in that the laminated structure of the first and second copper foil film, the insulating layer, and the third and fourth copper foil film of the multi-stage copper foil laminated plate has a vertically symmetrical structure around the release layer. Way.

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