KR101200508B1 - Touch Screen Panel Module Manufacturing Apparatus - Google Patents

Abstract

PURPOSE: A touch screen panel module manufacturing device is provided to enhancing adhesion about a window of a flexible printed circuit board part, thereby increasing quality of a touch screen panel module. CONSTITUTION: A moving stage(200) is installed in a base frame(100) to straightly and repetitively move in a forward and backward direction. A laminating unit(300) adsorbs and fixes a sensor film module and adheres to the window by rolling and pressing a sensor film part of the sensor film module according to straight movement at the back of the moving stage. A compression bonding unit(400) adheres the window by pressing a flexible printed circuit board part of the sensor film module in a state that the moving stage is moved in the straight movement at the back.

Description

Touch Screen Panel Module Manufacturing Apparatus

The present invention relates to a touch screen panel module manufacturing apparatus. More specifically, in the process of adhering the sensor film module and the window of the touch screen panel module, the sensor film part and the FPCB substrate part can be continuously adhered to the window through the laminating unit and the pressure bonding unit, respectively. Since no additional waiting time is required for adhesion, the adhesion to the window of the FPCB substrate area can be enhanced, thereby improving the quality of the touch screen panel module, and the laminating unit and the crimp bonding unit in one device. By continuously arranging and automating, the present invention relates to a touch screen panel module manufacturing apparatus capable of quickly and accurately performing a bonding operation of a sensor film module and a window.

The touch screen panel is an input device for inputting a user's command by selecting instructions displayed on a screen such as a video display device using a human hand or an object. Recently, various weights and thicknesses of terminals are reduced in terminals of various communication devices. Such touch screen panels are widely used to widen the display area.

The touch screen panel is provided on the front of the image display device to convert a contact position in direct contact with a human hand or an object into an electrical signal. Accordingly, the instruction selected at the contact position is received as an input signal. Such a touch screen panel may be replaced with a separate input device that is connected to and operate with a video display device such as a keyboard and a mouse, and thus its use range is further expanded.

1 is a cross-sectional view schematically illustrating a structure of a general touch screen panel.

As shown in FIG. 1, the touch screen panel includes a sensor film 21 receiving a touch input signal, an FPCB substrate 22 coupled to one end of the sensor film 21, and a sensor film 21. ) And the windows 10 disposed on the upper portion of the FPCB substrate 22 are combined to be stacked up and down to form one touch screen panel module 1, and the touch screen panel module 1 displays an image. Is coupled to the upper portion of the separate display panel 30.

The sensing pattern P1 is formed on the sensor film 21 to recognize a user's touch input signal. The sensor film 21 is transparently implemented to secure the transmittance and visibility of the light generated from the display panel 30. It is formed of a transparent electrode material such as Induim Tin Oxide (ITO). This sensor film 21 is composed of an upper ITO film 21-2 and a lower ITO film 21-1.

The FPCB substrate 22 is coupled to the sensor film 21, and the electrode pattern P2 of the FPCB substrate 22 is coupled to be electrically connected to the sensing pattern P1 of the sensor film 21. The FPCB substrate 22 is connected to an external electronic device to transmit and receive electrical signals.

The window 10 is disposed above the sensor film 21 and the FPCB substrate 22 so as to surround the sensor film 21 and the FPCB substrate 22. The window 10 is bonded using a transparent adhesive such as an OCA (Optically Clear Adhesive).

The touch screen panel module 1 is first formed such that the sensor film 21 and the FPCB substrate 22 are connected to each other to form one sensor film module 20, and the sensor film module 20 is formed of a window ( Produced in a manner that is bonded to one side of 10).

When the sensor film module 20 is bonded to the window 10, a transparent adhesive is applied to the sensor film portion 21 to bond the sensor film portion 21 and the window 10 to the FPCB substrate portion 22. Double-sided tape is attached to bond the FPCB substrate portion 22 to the window 10.

As such, the method of manufacturing the single touch screen panel module 1 by bonding the sensor film module 20 and the window 10 is generally performed by using a separate device. After adhering, the process proceeds by manually adhering the FPCB substrate portion 22 and the window 10 using a separate jig or the like.

Therefore, the apparatus for manufacturing the touch screen panel module 1 may not be fully automated, resulting in an increase in product defect rate and a long process time during the manufacturing process. In particular, the sensor film part 21 may be formed of a transparent adhesive. In this state, the sensor film module 20 is transported in a separate jig to bond the FPCB substrate portion 22 to the window 10 in a state of being bonded to the window 10, so that a certain time elapses in this process. There was a problem that the double-sided tape attached to the substrate portion 22 is damaged or the adhesive strength is weakened so that the adhesive strength between the FPCB substrate portion 22 and the window 10 is lowered.

The present invention is invented to solve the problems of the prior art, an object of the present invention is to laminate the sensor unit and the FPCB substrate portion in the process of bonding the window and the sensor film module of the touch screen panel module and the bonding unit, respectively By adhering to the window continuously through, the additional waiting time for the adhesion of the FPCB substrate portion is not required, thereby enhancing the adhesion to the window of the FPCB substrate portion, thereby improving the quality of the touch screen panel module. It is to provide a touch screen panel module manufacturing apparatus that can be improved.

It is another object of the present invention to continuously bond and automate a laminating unit and a crimp bonding unit in one device, which can respectively attach a sensor film portion and an FPCB substrate portion of a sensor film module to a window, thereby adhering the sensor film module to a window. It is to provide a touch screen panel module manufacturing apparatus that can perform a task quickly and accurately.

The present invention is a touch screen panel module manufacturing apparatus for manufacturing a touch screen panel module form by attaching a sensor film module coupled to the FPCB substrate on one end of the sensor film receiving a touch input signal to one surface of the window, the base frame; A movable stage mounted to the base frame to linearly reciprocate in the front-rear direction by a separate stage driving unit, and the window mounted and fixed on an upper surface thereof; A laminating unit formed to adsorb and fix the sensor film module, wherein the laminating unit adheres to the window by rolling pressing the sensor film portion of the sensor film module as the moving stage linearly moves backward; And a crimp bonding unit configured to press the FPCB substrate portion of the sensor film module to adhere to the window in a state in which the moving stage is linearly moved backwards.

The apparatus may further include a controller configured to control an operating state of the stage driving unit, the laminating unit, and the crimp bonding unit, wherein the control unit is configured by the crimp bonding unit in a state where the sensor film portion is adhered to the window by the laminating unit. The stage driving unit, the laminating unit, and the crimp bonding unit may be controlled to attach the FPCB substrate to the window.

On the other hand, the laminating unit is disposed on the upper portion of the base frame and the moving plate moved up and down by a separate vertical transfer drive; The sensor film portion of the sensor film module is formed to be vacuum adsorption in the form of a part of the rear projecting, adsorption is rotatably coupled to the operation plate to achieve a first inclination angle and a second inclination angle to move up and down with the operation plate plate; And an actuating plate positioned at a rear side of the adsorption plate so as to roll and press the rear end of the sensor film portion of the sensor film module vacuum-adsorbed to the adsorption plate while the adsorption plate is rotated to achieve the second inclination angle. And a pressure roller rotatably coupled to the pressure roller, wherein the sensor film portion of the sensor film module adsorbed to the suction plate is linearly moved to the pressure roller as the movement stage is linearly moved backward in the state in which the operation plate is moved downward. It may be configured to be bonded to one surface of the window pressed by the movement stage.

In addition, the pressing bonding unit is a pressure plate which is located in the rear of the laminating unit and disposed in parallel with the moving stage; And a pressurizing feed driver for vertically moving the pressurizing plate, and the pressurizing plate moves downward by the pressurizing feed driving unit while pressing the FPCB substrate portion of the sensor film module while the moving stage is linearly moved backward. It may be configured to adhere to the window.

In this case, the pressing plate may be formed of a flexible material.

In addition, the pressure transfer drive unit is coupled to a separate support bracket to be positioned above the base frame; And a piston rod moving up and down linearly by the cylinder, and the pressure plate may be configured to be coupled to the piston rod to move up and down.

According to the present invention, in the process of adhering the sensor film module and the window of the touch screen panel module, the FPCB substrate part can be continuously adhered to the window through the laminating unit and the crimp bonding unit, respectively. Since no additional waiting time is required for the adhesion of the FPCB substrate, the adhesion to the window can be enhanced, thereby improving the quality of the touch screen panel module.

In addition, by laminating and automating the laminating unit and the crimp bonding unit which can respectively attach the sensor film portion and the FPCB substrate portion of the sensor film module to the window, the adhesion of the sensor film module and the window can be quickly and quickly performed. There is an effect that can be done correctly.

1 is a cross-sectional view schematically showing a structure of a general touch screen panel;
2 is a side view schematically showing the configuration of a touch screen panel module manufacturing apparatus according to an embodiment of the present invention;
3 is a perspective view schematically illustrating a configuration of a laminating unit of a touch screen panel module manufacturing apparatus according to an embodiment of the present invention;
4 is a perspective view schematically showing a configuration of a crimp bonding unit of a touch screen panel module manufacturing apparatus according to an embodiment of the present invention;
FIG. 5 is a functional block diagram schematically showing a controller related configuration of a touch screen panel module manufacturing apparatus according to an embodiment of the present invention; FIG.
6 to 10 is a diagram illustrating an operation state of the touch screen panel module manufacturing apparatus according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to designate the same or similar components throughout the drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

2 is a side view schematically showing the configuration of a touch screen panel module manufacturing apparatus according to an embodiment of the present invention, Figure 3 is a configuration of a laminating unit of the touch screen panel module manufacturing apparatus according to an embodiment of the present invention 4 is a perspective view schematically illustrating a configuration of a crimp bonding unit of a touch screen panel module manufacturing apparatus according to an embodiment of the present invention, and FIG. 5 is an embodiment of the present invention. FIG. Is a functional block diagram schematically illustrating a control unit related configuration of a touch screen panel module manufacturing apparatus.

In the touch screen panel module manufacturing apparatus according to an embodiment of the present invention, the sensor film module 20 having the FPCB substrate 22 coupled to one end of the sensor film 21 is adhered to one surface of the window 10 to form a single device. An apparatus manufactured in the form of a touch screen panel module 1 includes a base frame 100, a moving stage 200, a laminating unit 300, and a crimp bonding unit 400.

First, the touch screen panel module 1 includes a sensor film 21 receiving a touch input signal, an FPCB substrate 22 coupled to one end of the sensor film 21, as described with reference to FIG. 1. The sensor film 21 and the window 10 disposed on the upper portion of the FPCB substrate 22 are configured to be stacked to be stacked up and down, and the sensor film 21 and the FPCB substrate 22 are connected to each other to be connected to one sensor. After forming to form the film module 20, such a sensor film module 20 is manufactured in a manner that is bonded to one surface of the window (10).

When the sensor film module 20 is bonded to the window 10, a transparent adhesive (not shown) is applied to the sensor film portion 21 to bond the sensor film portion 21 and the window 10 to the FPCB substrate portion. A double-sided tape (not shown) is attached to the 22 to bond the FPCB substrate portion 22 to the window 10.

Touch screen panel module manufacturing apparatus according to an embodiment of the present invention is the sensor film module 20 by the laminating unit 300 and the pressing bonding unit 400 in a state in which the window 10 is seated and fixed to the moving stage 200. ) Is sequentially bonded to the window 10.

The base frame 100 forms a basic structure of the entire apparatus, and the guide rail 110 is mounted on the upper surface of the base frame 100 in the front and rear directions, and the moving stage 200 is moved forward and backward along the guide rail 110. It is configured to move in a straight line.

The movement stage 200 is mounted to the base frame 100 to linearly reciprocate in the front and rear directions by a separate stage driver 230, and is configured to linearly move along the guide rail 110 of the base frame 100. The moving stage 200 is configured so that the window 10 is seated and fixed on an upper surface, and a separate angle adjusting device 210 is provided below the moving stage 200 to finely adjust the placement angle of the moving stage 200. Can be mounted.

The stage driving unit 230 for linearly reciprocating the moving stage 200 is disposed in the inner space of the base frame 100, as shown in FIG. 2, and is driven with the driving pulley 231 spaced apart from each other in the front-rear direction. A pulley 232, a transfer belt 233 wound at both ends of the driving pulley 231 and the driven pulley 232, and a driving motor 234 for rotationally driving the driving pulley 231. Can be. At this time, a separate connection bracket 220 is coupled to the lower portion of the movement stage 200, and the connection bracket 220 is coupled to the transfer belt 233 so that the movement stage 200 together with the transfer belt 233 is provided. It may be configured to move.

The laminating unit 300 is formed to adsorb and fix the sensor film module 20, and rolls and pressurizes the sensor film part 21 of the sensor film module 20 as the moving stage 200 linearly moves backward. It is configured to adhere to the window 10.

The compression bonding unit 400 has the sensor film module 20 in a state in which the moving stage 200 is linearly moved backward so that the sensor film portion 21 of the sensor film module 20 is bonded to the window 10 in the entire area. Press the FPCB substrate portion 22 to adhere to the window 10.

According to such a structure, the window 10 is seated and fixed to the moving stage 200 and the sensor film module 20 is fixed to the laminating unit 300 by adsorption and fixing, and the moving stage 200 is operated together with the operation of the laminating unit 300. ) Is moved backward, the sensor film portion 21 of the sensor film module 20 is adhered to the window 10 by the laminating unit 300, the pressure bonding unit 400 operates in this state, so that the sensor The FPCB substrate portion 22 of the film module 20 is bonded to the window 10.

At this time, the control unit 500 is provided as shown in FIG. 5 to control the operating state of the stage driving unit 230, the laminating unit 300 and the crimp bonding unit 400, the control unit 500 is a laminating unit After the sensor film portion 21 is bonded to the window 10 by the 300, the stage driver 230 and laminating the FPCB substrate portion 22 to the window 10 by the crimp bonding unit 400. The operating state of the unit 300 and the crimping bonding unit 400 is controlled.

Next, the configuration of the laminating unit 300 and the pressing bonding unit 400 will be described in more detail.

2 and 3, the laminating unit 300 is disposed above the base frame 100 and moves up and down by a separate vertical transfer drive 310, and an operation plate 320. It is configured to include a suction plate 330 and the pressure roller 340 coupled to the operation plate 320 to move up and down with.

The operation plate 320 is vertically coupled to the separate support plate 301 at the top of the base frame 100, and is moved up and down by a separate vertical transfer drive 310. The vertical feed driver 310 includes a vertical feed cylinder 311 and a piston rod 312 (see FIG. 6) coupled to and supported by the support plate 301.

The adsorption plate 330 is formed to be vacuum suction in a form in which the sensor film part 21 of the sensor film module 20 protrudes rearwardly. A plurality of vacuum suction holes 331 are formed on the surface of the suction plate 330 for such vacuum suction, and are connected to a separate vacuum suction pump (not shown) so that the sensor film module 20 is operated by the operation of the vacuum suction pump. Fix it by adsorption.

The adsorption plate 330 is coupled to the operation plate 320 is configured to move up and down with the operation plate 320, it is mounted rotatably around a separate rotation bar 351. That is, the rotation bar 351 is rotatably coupled to the operation plate 320, the rotation bar 351 is rotationally driven by a separate rotation drive unit 350, and the adsorption plate 330 is such a rotation bar 351. Combined with) rotates integrally with the rotary bar 351. At this time, the suction plate 330 is configured to be reciprocally rotated so as to form the first inclination angle α1 and the second inclination angle α2 with respect to the horizontal plane (see FIG. 7).

The pressure roller 340 is located at the rear of the suction plate 330 and rotatably coupled to the operation plate 320 to move up and down with the operation plate 320. The pressure roller 340 is a rear end of the sensor film portion 21 of the sensor film module 20 vacuum-adsorbed to the adsorption plate 330 while the adsorption plate 330 is rotated to achieve the second inclination angle α2. It is equipped to roll rolling pressure.

That is, in the state where the suction plate 330 is rotated by the rotation drive unit 350 at the second inclination angle α2, the operation plate 320 moves downward by the vertical transfer drive unit 310, and in this state, the movement stage is performed. When the 200 moves linearly backward, the sensor film portion 21 of the sensor film module 20 adsorbed on the adsorption plate 330 is rolled and pressed sequentially by the pressure roller 340 from the rear end to move the stage ( It is bonded to one surface of the window 10 seated on the 200.

At this time, the rotation driving unit 350 and the vertical feed driving unit 310 is operation controlled by the control unit 500, the stage driving unit 230 for moving the moving stage 200 likewise is also operation controlled by the control unit 500. Through such control, each operation is configured to occur sequentially.

The crimp bonding unit 400 is located at the rear of the laminating unit 300, and presses the window 10 and the sensor film module 20 seated on the moving stage 200 on the upper portion of the base frame 100 to press the sensor film. The FPCB substrate portion 22 of the module 20 is bonded to the window 10, which includes a pressure plate 410 and a pressure transfer drive 420 as shown in FIGS. 2 and 4.

The pressure plate 410 is located at the rear of the laminating unit 300 and disposed in parallel with the moving stage 200, and the pressure feed driver 420 is configured to move the pressure plate 410 up and down.

The pressing plate 410 is a state in which the moving stage 200 is moved so that the sensor film portion 21 of the sensor film module 20 is adhered to the window 10 of the moving stage 200 by the laminating unit 300. And downwardly moved by the pressurization transfer driver 420 and pressurizes the FPCB substrate portion 22 of the sensor film module 20. The pressure plate 410 is preferably formed of a soft material such as silicon to mitigate impact in the pressing process.

The pressure feed drive unit 420 includes a cylinder 421 coupled to a separate support bracket 401 to be positioned above the base frame 100, and a piston rod 422 linearly moving up and down by the cylinder 421. And, the pressing plate 410 is coupled to the piston rod 422 is configured to move up and down. In this case, a separate guide bar 411 may be mounted on the pressing plate 410 so that the vertical movement path of the pressing plate 410 may be guided in such a manner that the guide plate 411 penetrates through the support bracket 401. The pressure transfer driving unit 420 is also operation controlled by the control unit 500.

Next, an operation method of the touch screen panel module manufacturing apparatus described above will be described.

6 to 10 is a diagram illustrating an operation state of the touch screen panel module manufacturing apparatus according to an embodiment of the present invention.

As shown in FIG. 6, the touch screen panel module manufacturing apparatus according to the exemplary embodiment of the present invention is briefly displayed, and the movement stage 200 is coupled to the base frame 100 so as to be movable in the front-rear direction, and the base frame The laminating unit 300 is disposed on the upper front side of the 100, and the crimping bonding unit 400 is disposed on the upper rear side of the base frame 100. The window 10 is seated and fixed to the moving stage 200, and the sensor film module 20 is adsorbed and fixed to the adsorption plate 330 of the laminating unit 300. In this case, the sensor film module 20 is coupled to the adsorption plate 330 such that the partial region of the sensor film portion 21 and the FPCB substrate portion 22 protrude backward.

Adsorption plate 330 is coupled to the rotation bar 351 is rotatably coupled by the rotation drive unit 350, as shown in Figure 7 from the first inclination angle (α1) to the second inclination angle (α2) Rotationally driven to achieve.

As described above, in the state in which the adsorption plate 330 is rotated, as illustrated in FIG. 8, the operation plate 320 is moved downward by the up and down transport driver 310, and thus the sensor is fixed to the adsorption plate 330. The rear end of the film module 20 is in contact with the window 10 of the moving stage 200. At this time, the sensor film module 20 is in pressure contact with the window 10 of the moving stage 200 with the rear end of the sensor film part 21 pressed by the pressure roller 340.

In this state, as shown in FIG. 9, when the moving stage 200 moves backward by the stage driving unit 230, the sensor film module 20 is rolled and pressed by the pressure roller 340 and the suction plate 330. Is separated from and adhered to the window 10 of the moving stage 200. At this time, the area of the sensor film module 20 adhered to the window 10 corresponds to the area that is rolled and pressed by the pressure roller 340, which is illustrated in FIGS. 8 and 9. Only the sensor film part 21 is applicable. That is, the FPCB substrate portion 22 of the sensor film module 20 is not rolled by the pressure roller 340, and thus, as shown in the enlarged view of FIG. d) can be maintained in the generated state. This spacing (d) is shown to simplify the description of the operating state rather than occurring in the actual manufacturing process, the FPCB substrate portion 22 of the sensor film module 20 is pressed against the surface of the window 10 It will be in a simple contact rather than a bonded state. Although the FPCB substrate part 22 is rolled and pressed by the pressure roller 340, the pressure is completely pressure-adhered unless the FPCB substrate part 22 is pressurized by the pressure plate 410 of the pressure bonding unit 400 due to the adhesive structure of the FPCB substrate part. It doesn't work.

As the moving stage 200 moves backward in this manner, the sensor film portion 21 of the sensor film module 20 is adhered to the surface of the window 10 by the laminating unit 300. As shown, the pressure plate 410 of the compression bonding unit 400 is moved downward by the pressure feed drive unit 420 to press the FPCB substrate portion 22 of the sensor film module 20, and through this pressing process The FPCB substrate portion 22 is pressure bonded to the window 10.

Accordingly, in the touch screen panel module manufacturing apparatus according to an embodiment of the present invention, in the process of adhering the sensor film module 20 and the window 10, the laminating unit may respectively separate the sensor film portion 21 and the FPCB substrate portion 22. It is possible to continuously adhere to the window 10 through the 300 and the compression bonding unit 400, and thus no additional waiting time for the adhesion of the FPCB substrate portion 22 is required FPCB substrate portion 22 The adhesion to the window 10 of the can be enhanced, and the quality of the touch screen panel module 1 can be improved.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas falling within the scope of the same shall be construed as falling within the scope of the present invention.

100: base frame 110: guide rail
200: moving stage 230: stage driving unit
300: laminating unit 310: vertical feed drive unit
320: working plate 330: adsorption plate
340: pressure roller 350: rotary drive portion
351: rotating bar 400: crimping unit
410: pressure plate 420: pressure transfer drive

Claims (6)

A touch screen panel module manufacturing apparatus for manufacturing a touch screen panel module by bonding a sensor film module having an FPCB substrate coupled to one end of a sensor film receiving a touch input signal to one surface of a window,
A base frame;
A movable stage mounted to the base frame to linearly reciprocate in the front-rear direction by a separate stage driving unit, and the window mounted and fixed on an upper surface thereof;
A laminating unit formed to adsorb and fix the sensor film module, wherein the laminating unit adheres to the window by rolling pressing the sensor film portion of the sensor film module as the moving stage linearly moves backward; And
Press bonding unit for pressing the FPCB substrate portion of the sensor film module in the state in which the moving stage is linearly moved backward to adhere to the window
Touch screen panel module manufacturing apparatus comprising a.
The method of claim 1,
Further comprising a control unit for controlling the operating state of the stage driving unit, laminating unit and the crimp bonding unit,
The control unit controls to control the stage driving unit, the laminating unit, and the crimping unit so that the FPCB substrate portion is adhered to the window by the crimp bonding unit in a state where the sensor film portion is adhered to the window by the laminating unit. Touch screen panel module manufacturing apparatus, characterized in that.
The method of claim 2,
The laminating unit is
An operating plate disposed above the base frame and vertically moving by a separate vertical transfer driving unit;
The sensor film portion of the sensor film module is formed to be vacuum adsorption in the form of a part of the rear projecting, adsorption is rotatably coupled to the operation plate to achieve a first inclination angle and a second inclination angle to move up and down with the operation plate plate; And
Located in the rear of the adsorption plate, in the state in which the adsorption plate is rotated to achieve the second inclination angle to the working plate to roll and press the sensor film portion rear end of the sensor film module vacuum-adsorbed to the adsorption plate Pressure rollers rotatably coupled
The sensor film portion of the sensor film module adsorbed on the adsorption plate is pressed by the pressure roller and seated on the movement stage as the movement stage linearly moves backward in the state in which the operation plate moves downward. Device for producing a touch screen panel module, characterized in that bonded to one side of the window.
The method of claim 2,
The compression bonding unit
A pressure plate positioned behind the laminating unit and disposed in parallel with the moving stage; And
Pressurized conveyance drive unit for moving the pressure plate up and down
The touch screen, wherein the pressing plate is moved downward by the pressure transfer drive in a state in which the movement stage is linearly moved to the rear and press the FPCB substrate portion of the sensor film module to adhere to the window. Panel module making device.
The method of claim 4, wherein
The pressing plate is a touch screen panel module manufacturing apparatus, characterized in that formed of a flexible material.
The method of claim 4, wherein
The pressure feed drive unit
A cylinder coupled to a separate support bracket to be positioned above the base frame; And
Piston rod moving up and down linearly by the cylinder
Includes, The pressing plate is coupled to the piston rod touch screen panel module manufacturing apparatus characterized in that the vertical movement.

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