KR101190483B1 - Apparatus for clamping a wafer ring and apparatus for boding a die including the same - Google Patents

Abstract

The wafering clamping device includes a stage, a transfer mechanism and a clamping mechanism. The transfer mechanism transfers the wafer ring gripped around the wafer in the horizontal direction and puts the adhesive sheet attached to the lower surface of the wafer sawed into a plurality of dies on top of the stage. The clamping mechanism is mounted on top of the stage and clamps by pressing the wafer ring placed by the transfer mechanism on the side.

Description

A wafer ring clamping device and a die bonding device including the same {APPARATUS FOR CLAMPING A WAFER RING AND APPARATUS FOR BODING A DIE INCLUDING THE SAME}

The present invention relates to a wafer ring clamping device and a die bonding device including the same, and more particularly, to a clamping device for clamping a wafer ring gripped around the wafer with an adhesive sheet attached to a lower surface of the wafer. A bonding apparatus for bonding a plurality of dies sawed from the wafer to a substrate, including.

In general, a semiconductor device includes an adhesive process of attaching a lower surface of a wafer formed of a plurality of dies, which are semiconductor chips, to an adhesive sheet, a sawing process of cutting each wafer attached to the adhesive sheet to individualize each of the dies; The die is separated from the adhesive sheet and manufactured by performing a die bonding process of bonding the die to a substrate on which a circuit pattern is formed, and a molding process of molding the die with an epoxy resin like the substrate.

Among these, the die bonding process clamps a wafer ring that grips the adhesive sheet in a taut state around the wafer at an upper portion of the stage, and then picks up each of the dies of the wafer and bonds them to a substrate to be transferred from an adjacent position. It is carried out through the process.

In this case, the wafer ring is transferred to the stage through a first transfer mechanism for transferring in the horizontal direction to the top of the stage and a second transfer mechanism for transferring in the vertical direction again in the horizontal transfer state, The device is complicated. In addition, since the wafer ring is directly clamped by an operator in a state of being placed on the stage, the clamping process also has an inconvenient problem.

It is an object of the present invention to provide a wafer ring clamping device capable of automatically clamping the placed wafer ring while being able to transfer the wafer ring only in the horizontal direction and place it on the stage.

Another object of the present invention is to provide a die bonding apparatus including the wafering clamping apparatus described above.

In order to achieve the above object of the present invention, a wafer ring clamping device according to one aspect includes a stage, a transfer mechanism and a clamping mechanism.

The transfer mechanism transfers the adhesive sheet attached to the lower surface of the wafer sawed into a plurality of dies in a horizontal direction to transfer the wafer ring gripped around the wafer in the horizontal direction to place it on top of the stage. The clamping mechanism is mounted on the top of the stage, and clamps by pressing the wafer ring placed by the transfer mechanism from the side.

The clamping mechanism is a fixed block fixed to the stage while wrapping one side of the wafer ring placed on the stage, the other side opposite to the one side of the wafer ring facing the fixing block and the fixed block on the stage A moving block coupled to the moving block and the moving block movably coupled to or away from the moving block to move the moving block along the direction so that the fixed block and the moving block pressurize one side and the other side of the wafer ring. It may include a drive unit.

In addition, each of the fixed block and the moving blocks may have first and second insertion grooves into which the wafer ring transported in the horizontal direction is inserted into a portion surrounding one side and the other side of the wafer ring. At this time, the fixed block and the moving block may be configured to have a step higher than the circumference so that one end portions of the first and second insertion grooves facing each other are exposed in the horizontal direction in which the wafer ring is transferred.

Thus, the fixed block and the moving block may be configured such that end portions of the first and second insertion grooves facing each other are separated by a distance of 0.8 times or less than the diameter of the wafer ring.

Meanwhile, the driving unit is adjacent to the spring bar and the at least one spring bar and the stage, which are fastened to one end portions of the fixed block and the moving block facing each other to provide an elastic restoring force for the moving block toward the fixed block. And a driving unit configured to provide a linear driving force to the spring bar in a direction opposite to the elastic restoring force so that the moving block is separated from the fixing block.

In this case, a pair of spring bars and a pair of driving parts may be fastened or mounted to both ends of the fixed block and the moving block facing each other.

Alternatively, the driving unit may further include a hinge unit which hinges the fixed block and the moving block to the other ends opposite to the one ends of the fixed block and the moving block.

The driving unit may have a structure separated from the spring bar such that the fixed block and the moving block clamping the wafer ring are rotatable for alignment of the wafer.

In order to achieve another object of the present invention, a die bonding apparatus according to one aspect includes a transfer rail, a wafer clamping unit and a die bonding portion.

The substrate on which the circuit pattern is formed is transferred to the transfer rail. The wafer clamping unit transfers a wafer ring gripped around the wafer in a horizontal direction to a stage disposed adjacent to the transfer rail, and an adhesive sheet attached to a lower surface of the wafer sawed into a plurality of dies in a horizontal direction. And a clamping mechanism mounted on the upper portion and a clamping mechanism mounted on an upper portion of the stage to press and clamp the wafer ring placed by the transfer mechanism on the side. The die bonding unit picks up each of the dies between the transfer rail and the stage and bonds them to the substrate.

According to such a wafer ring clamping device and a die bonding device including the same, the wafer ring gripped around the wafer with the adhesive sheet attached to the lower surface of the wafer is transferred to the stage only in a horizontal direction through one transfer mechanism. After placing, the wafer ring can be clamped by pressing the wafer ring sideways through a clamping mechanism, thereby removing the mechanism for conveying the wafer ring in the vertical direction.

Therefore, the device for transferring the wafer ring can be simply configured, thereby reducing manufacturing cost and installation space, and also conveniently clamping the wafer ring through the clamping mechanism to complete the entire die bonding process. You can proceed efficiently.

1 is a schematic view showing a wafer ring clamping apparatus according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along the line II ′ of FIG. 1.
3 is an enlarged view of a portion A of FIG. 2.
4A to 4C are diagrams illustrating a process of clamping wafer ring using the wafer ring clamping device shown in FIG. 1.
5 is a schematic view showing a wafer ring clamping apparatus according to another embodiment of the present invention.
6 is a schematic view showing a die bonding apparatus according to an embodiment of the present invention.

Hereinafter, a wafer ring clamping apparatus and a die bonding apparatus including the same will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

1 is a schematic view showing a wafer ring clamping device according to an embodiment of the present invention, Figure 2 is a cross-sectional view taken along the line I-I 'of Figure 1, Figure 3 is a portion A of FIG. This is an enlarged drawing.

1 to 3, a wafer ring clamping device 100 according to an embodiment of the present invention includes a stage 200, a transfer mechanism 300, and a clamping mechanism 400.

The wafer ring 10 is placed on the stage 200. The wafer ring 10 grips the adhesive sheet 30 attached to the lower surface of the wafer 20 sawed into a plurality of dies in a taut state around the wafer 20.

Thus, the wafer ring 10 may include an inner ring 12 and an outer ring 14 to grip the adhesive sheet 30 therebetween. In this case, the inner ring 12 and the outer ring 14 are attached to the adhesive sheet 30 in order to prevent damage to other neighboring dies when picking up each of the dies in the die bonding apparatus with reference to FIG. 6 below. Can be gripped in a more inflated state to separate the dies from each other.

In particular, when manufacturing a micro device such as an LED through the dies, the inner ring 12 and the outer ring 14 is the adhesive sheet 30 so as to space the die from each other by about 200 to 300㎛ It can be gripped in an inflated state.

First and second rail plates 600 and 650 may be disposed below the stage 200. The first rail plate 600 includes an x-axis rail 610 configured to extend along the x-axis direction to guide the stage 200 to move in the x-axis direction. In this case, the stage 200 may have a guide portion 210 protruding to be coupled to the x-axis rail 610 at the bottom.

The second rail plate 650 is provided with a y-axis rail 660 elongated along the y-axis direction to guide the stage 200 to move in the y-axis direction. At this time, the lower portion of the first rail plate 600 may have the same configuration as the guide portion 210 to be coupled to the y-axis rail 660.

In addition, a separate driving device (not shown) may be connected to the stage 200 to move the stage 200. Alternatively, each of the x-axis rail 610 and the y-axis rail 660 may directly provide a driving force for the movement of the stage 200.

The transfer mechanism 300 transfers the wafer ring 10 in the horizontal direction, that is, in the x-axis or y-axis direction, and places the wafer ring 10 on the stage 200. In the following embodiment, for convenience of description, the transfer mechanism 300 will be described as transferring the wafer ring 10 in the x-axis direction.

The transfer mechanism 300 includes a ring holder 310 and the ring holder 310 that hold the wafer ring 10 at a position parallel to a position where the wafer ring 10 of the stage 200 is placed. It may include a holder transfer unit 320 is coupled to transfer the ring holder 310 in the x-axis direction.

The ring holder 310 may be coupled to a holder rail 330 that is elongated in the x-axis direction to guide the transfer. In addition, the holder transfer part 320 may be connected to the holder rail 330 as shown in Figure 1 to provide a driving force for the transfer. Alternatively, the holder transfer part 320 may be directly connected to the ring holder 310.

The clamping mechanism 400 is mounted on the top of the stage 200. The clamping mechanism 400 pressurizes and clamps the wafer ring 10 placed on the upper side of the stage 200 by the transfer mechanism 300.

The clamping mechanism 400 includes a fixing block 410, a moving block 420, and a driving unit 430. The fixing block 410 is fixed to the stage 200 while surrounding one side of the wafer ring 10. The moving block 420 faces the fixing block 410 and moves in a direction closer to or away from the fixing block 410 while wrapping the other side opposite to the one side of the wafer ring 10. Coupled to the stage 200.

For example, the fixed block 410 and the moving block 420 may be provided on the y-axis with respect to the y-axis so that the wafer ring 10 can be entered in the x-axis direction by the transfer mechanism 300. It may be fixed or coupled to the stage 200 to partially wrap the upper side and the lower side.

In this case, the moving block 420 is coupled to the stage 200 to be movable along the y-axis direction. In this case, at least one block rail 422 may be disposed between the moving block 420 and the stage 200 to guide the movement. In this case, the block rails 422 may be spaced apart from each other in order to guide the movement of the moving block 420 to be stable.

In addition, each of the fixed block 410 and the moving block 420 is a wafer ring horizontally transferred in the x-axis direction by the transfer mechanism 300 to a portion surrounding the upper and lower surfaces of the wafer ring 10. 10 may have first and second insertion grooves 412 and 424 inserted therein.

Accordingly, the fixed block 410 and the moving block 420 are exposed in the x-axis direction so that one end portions of the first and second insertion grooves 412 and 424 facing each other are inserted into the wafer ring 10. It is configured to be. To this end, the fixing block 410 and the moving block 420 may be configured such that a portion where the first and second insertion grooves 412 and 424 are formed has a step higher than the surroundings. In this case, each of the first and second insertion grooves 412 and 424 is formed in each of the first and second insertion blocks 414 and 426, respectively, of the fixing block 410 and the moving block 420. Can be coupled to the top.

The driving unit 430 is connected to the moving block 420. The driving unit 430 moves the moving block 420 in the y-axis direction. Specifically, the driving unit 430 moves the moving block 420 away from the fixed block 410 along the y-axis direction so that the driving unit 430 moves away from one ends of the first and second insertion grooves 412 and 424. The wafer ring 10 enters or moves closer to the fixing block 410 so that the fixing block 410 and the moving block 420 press the upper and lower surfaces of the wafer ring 10. You can do that.

At this time, when the distance (g) between the end portions exposed in the x-axis direction of the first and second insertion grooves (412, 424) is less than about 0.8 times the diameter (D) of the wafer ring 10 The distance g between them is so narrow that the moving distance of the moving block 420 by the driving unit 430 is unnecessarily increased, and it is not preferable. When the distance g is equal to the diameter D, the fixed block ( Since the wafer ring 10 may be pulled out while the 410 and the moving block 420 pressurize the upper and lower surfaces of the wafer ring 10, the wafer ring 10 is not preferable.

Thus, the fixed block 410 and the moving block 420 have exposed ends of the first and second insertion grooves 412 and 424 about 0.8 times larger than the diameter D of the wafer ring 10. It is preferable to be comprised so that it may be spaced apart by the small distance g above.

The driving unit 430 may include a spring bar 431 and a driving unit 435. The spring bar 431 is fastened to one ends of the fixing block 410 and the moving block 420 facing each other.

The spring bar 431 is the fixed block 410 and the moving block 420, the moving block 420 is the fixed block in the y-axis direction so as to press the upper surface and the lower surface of the wafer ring 10 A spring 432 that provides an elastic restoring force to be directed to 410.

In detail, the spring bar 431 allows the end of the spring bar 431 to be coupled to the moving block 420 in the state where the bolt-shaped long bar 433 passes through the fixing block 410, and then the spring 432. The one side is fixed by the fixing block 410 on the side opposite to the moving block 420 of the bar 433 based on the fixing block 410, the other side of the head of the bar 433 Fasten to be fixed by (434). Accordingly, the spring 432 may be composed of a compression spring 432 having elasticity to push the fixed block 410 and the head portion 434 to each other to provide the elastic restoring force to the moving block 420. have.

In addition, an end of the bar 433 is not directly coupled to the moving block 420, but is indirectly coupled to the moving block 420 with a guide block 437 fixed to the moving block 420 interposed therebetween. Can be. In this case, the elastic restoring force may be stably provided to the moving block 420 through a sufficient area of the guide block 437.

The driving part 435 is mounted on the stage 200 at a position adjacent to the spring bar 431. The driving unit 435 provides a linear driving force to the spring bar 431 in a direction opposite to the elastic restoring force so that the moving block 420 is separated from the fixing block 410.

In detail, the driving unit 435 pushes the head portion 434 of the bar 433 from the spring bar 431 to move the moving block 420 through the guide block 437 to the fixed block 410. Move away from In this case, the driving unit 435 needs to push the head portion 434 with a force greater than the elastic restoring force of the spring 432 to move the moving block 420.

When the driving unit 435 pushes the head 434, the wafer ring 10 is moved between the fixing block 410 and the moving block 420 by the transfer mechanism 300 in the x-axis direction. A space for entering can be created.

On the other hand, when the linear driving force is released from the driving unit 435, the moving block 420 moves to the fixing block 410 by the elastic restoring force of the spring 432, so that the moving block 410 is the same as the fixing block 410. The upper side and the lower side of the wafer ring 10 are pressed.

For example, the driving unit 435 may be formed of a cylinder that generates a linear driving force by pneumatic or hydraulic pressure. In this case, the driving unit 435 may be mounted to the stage 200 between the pedestal 436 so that the height thereof is disposed at a position parallel to the head portion 434 of the bar 433.

On the other hand, the wafer 20 attached to the adhesive sheet 30 gripped by the wafer ring 10 needs to be aligned in the rotational direction so that each of the dies 40 is picked up at the correct position.

Thus, the fixing block 410 and the moving block 420 clamping the wafer ring 10 may be rotatably connected to the alignment mechanism 500 for alignment. Here, the alignment mechanism 500 may include a motor (not shown) providing a rotational force and a belt (not shown) surrounding the fixing block 410 and the moving block 420 while being connected to the motor. .

In this case, a belt of the alignment mechanism 500 is wound between the fixing block 410, the moving block 420, and the stage 200 to hold the fixing block 410 and the moving block 420 together. Base plate 550 for rotation may be disposed.

In this case, as the driving unit 435 is mounted on the stage 200, the driving unit 435 has a structure separated from the spring bar 431 to allow the fixing block 410 and the moving block 420 to rotate. It is desirable to have.

As such, the wafer ring 10, which is gripped around the wafer 20 with the adhesive sheet 30 attached to the lower surface of the wafer 20, is horizontally aligned along the x axis through one transfer mechanism 300. The wafer ring 10 is vertically transferred and placed on top of the stage 200, and then the upper and lower surfaces of the wafer ring 10 are clamped by pressing the upper and lower surfaces of the wafer ring 10 through the clamping mechanism 400. It can be clamped automatically, removing the mechanism for transporting the tool.

Accordingly, as the device for transferring the wafer ring 10 can be simply configured, the manufacturing cost and the installation space can be reduced, and the wafer ring 10 can be moved through the clamping mechanism 400. Convenient and stable clamping.

Meanwhile, the clamping device 100 may include a second driving unit for moving the moving block 420 to the other ends of the fixing block 410 and the opposite ends of the moving block 420 that face each other. 440 may be installed. Hereinafter, since the second driving unit 440 has the same configuration as the driving unit 430, detailed description thereof will be omitted.

In this case, the moving block 420 may be moved more stably at both ends of the fixed block 410 and the moving block 420 through the driving unit 430 and the second driving unit 440. In addition, any one of them can maintain its movement through the other even if a failure occurs.

Hereinafter, a process of cranking the wafer ring 10 will be described in more detail with reference to FIGS. 4A to 4C.

4A to 4C are diagrams illustrating a process of clamping wafer ring using the wafer ring clamping device shown in FIG. 1.

Referring to FIG. 4A, in order to clamp the wafer ring 10, first, the driving unit 435 of the driving unit 430 is driven to move the moving block through the spring bar 431 and the guide block 437. 420 is spaced apart from the fixed block 410.

In this case, the moving block 420 is stably spaced from the fixed block 410 by driving the second driving unit 440 in the same manner as the driving unit 430. In this case, a space is created between the fixed block 410 and one end of the moving block 420.

Subsequently, the wafer ring 10 is transferred between the fixed block 410 and the moving block 420 from the space in the x-axis direction through the transfer mechanism 300. In this case, the transfer mechanism 300 transfers through the holder transfer part 320 while the ring holder 310 holds one side along the x-axis direction of the wafer ring 10.

Referring to FIG. 4B, the driving block 435 of the driving unit 430 is released, and the fixing block 410 and the moving block are released by elastic restoring force by the spring 432 of the spring bar 431. The 420 clamps the wafer ring 10 by pressing the upper and lower surfaces of the wafer ring 10.

In this case, the driving unit 435 of the driving unit 430 may be maintained in a state separated from the spring bar 431. In this case, the second driving unit 440 releases the driving as in the driving unit 430.

 Referring to FIG. 4C, the ring holder 310 of the transfer mechanism 300 is separated from the wafer ring 10, and the ring holder 310 is opened through the holder transfer part 320. ) And the moving block 420 in the x-axis direction.

Subsequently, the fixing block 410 and the through the alignment mechanism 500 to align the wafer 20 attached to the adhesive sheet (30 in FIG. 3) gripped by the wafer ring 10. The moving block 420 is rotated to align its position. At this time, since the driving unit 435 and the spring bar 431 of the driving unit 430 are separated from each other, rotation of the fixed block 410 and the moving block 420 is interfered by the driving unit 430. Can be prevented.

5 is a schematic view showing a wafer ring clamping apparatus according to another embodiment of the present invention.

In the present embodiment, the same reference numerals are used for the same structures, except that the structures of the other ends opposite to the one ends opposite to the ones in which the driving unit of the fixed block and the moving block are installed are used. The overlapping detailed description will be omitted.

Referring to FIG. 5, the wafer ring clamping apparatus 110 according to another embodiment of the present invention may include one end portion in which the fixing block 710 of the clamping mechanism 700 and the driving unit 730 of the moving block 720 are installed. It includes a hinge portion 750 hingedly connecting the fixed block 710 and the moving block 720 to the other ends.

Accordingly, as the driving unit 730 of the clamping device 100 is driven or released from the one ends, the moving block 720 rotates the hinge part 750 while the wafer is rotated between the one ends. The ring 10 may enter a space or may be clamped by pressing the upper and lower surfaces of the wafer ring 10 like the fixing block 710.

In this case, at least one block rail 732 for guiding the movement of the moving block 720 between the moving block 720 and the stage 200 may be arranged in an arc shape around the hinge portion 750. Can be.

As such, the hinge part 750 is formed at the other ends opposite to the one ends of the fixed block 710 and the driving unit 730 of the moving block 720, thereby as shown in FIGS. 1 to 3. It may have a simpler structure than the wafering clamping device 100 further comprising the illustrated second drive unit (440 of FIG. 1). Therefore, the manufacturing cost of the wafering clamping device 110 can be further reduced.

6 is a schematic view showing a die bonding apparatus according to an embodiment of the present invention.

In this embodiment, the wafering clamping unit has the same configuration as any of the wafering clamping devices shown in Figs. 1 to 3 or 5, and therefore the same reference as the wafering clamping device shown in Figs. Numbers are used, and detailed description thereof will be omitted.

Referring to FIG. 6, a die bonding apparatus 1000 according to an embodiment of the present invention includes a transfer rail 800, a wafer ring clamping unit 100, and a die bonding unit 900.

The substrate 50 on which the circuit pattern is formed is transferred to the transfer rail 800. The transfer rail 800 is disposed long along the y-axis direction. Thus, the transfer rail 800 may be configured in a pair so that the substrate 50 is transferred while supporting both sides of the substrate 50 along the x-axis.

The wafer ring clamping unit 100 is disposed adjacent to the transfer rail 800. Specifically, since the transfer rail 800 is disposed in the y-axis direction, the wafer ring clamping unit 100 is disposed adjacent to the transfer rail 800 in the x-axis direction.

The wafer ring clamping unit 100 is a wafer ring 10 which grips around the wafer 20 an adhesive sheet 30 attached to a lower surface of the wafer 20 sawed by a plurality of dies 40. ) Is clamped through the fixing block 410 and the moving block 420 at the top of the stage 200.

The die bonding unit 900 picks up each of the dies 40 from the wafer 20 and bonds them to the substrate 50 transferred from the transfer rail 800. Accordingly, the die bonding unit 900 may include a die holder 910 and the die holder 910 holding the die 40 to pick up or bond the die 40 to the stage 200 and the substrate. And a bonding rail 920 to guide the transfer between the 50.

As such, the die bonding apparatus 1000 may be configured such that the wafer ring clamping unit 100 may stably hold the wafer ring 10 through the clamping mechanism 400 as described with reference to FIGS. 1 to 3 or 5. By automatically clamping, the overall process of bonding the dies 40 to the substrate 50 can be efficiently carried out.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

10: wafering 20: wafer
30: adhesive sheet 40: die
50: substrate 100, 110: wafer ring clamping device
200: stage 300: transfer mechanism
400, 700: clamping mechanism 410, 710: fixed block
412: first insertion groove 420, 720: moving block
422, 732: block rail 424: second insertion groove
430, 730: drive unit 431: spring bar
432: spring 435: drive unit
440: second drive unit 500: alignment mechanism
600: first rail plate 650: second rail plate
750: hinge portion 800: transfer rail
900 die bonding unit 910 die holder
920: bonding rail 1000: die bonding device

Claims (10)

stage;
A transfer mechanism for transferring a wafer ring gripped around the wafer in a horizontal direction and placing the adhesive sheet attached to the lower surface of the wafer sawed by a plurality of dies on top of the stage; And
The fixed block fixed to an upper portion of the stage while wrapping the one side of the wafer ring placed on the stage by the transfer mechanism, and the other side opposite to the one side of the wafer ring while facing the fixed block; A moving block coupled to the moving block in a direction close to or away from the fixed block and the moving block on the upper part of the stage to move the moving block in the direction so that the fixed block and the moving block are connected to the wafer ring. It includes a clamping mechanism having a drive unit for pressing one side and the other side,
The drive unit,
At least one spring bar coupled to one end of the fixed block and the moving block facing each other to provide an elastic restoring force of the moving block toward the fixed block; And
A wafer ring mounted to the stage adjacent to the spring bar, the wafer ring including at least one driving unit for providing a linear driving force to the spring bar in a direction opposite to the elastic restoring force to move the moving block away from the fixed block; Clamping device. delete According to claim 1, wherein the fixed block and the moving block each has a first and second insertion grooves for inserting the wafer ring transported in the horizontal direction in the portion surrounding one side and the other side of the wafer ring. Wafering clamping apparatus. The method of claim 3, wherein the fixed block and the moving block is characterized in that the one end portion of the first and second insertion grooves facing each other has a step higher than the circumference so as to be exposed in the horizontal direction in which the wafer ring is transported. Wafering clamping device. 5. The wafer ring clamping device according to claim 4, wherein the fixed block and the moving block are configured such that one ends thereof are separated by 0.8 times or more and less than 1 times the diameter of the wafer ring. delete 2. A wafer ring clamping device according to claim 1, wherein a pair of spring bars and a pair of driving portions are fastened or mounted to opposite ends of the fixed block and the moving block. 2. The wafer ring of claim 1, wherein the driving unit further comprises a hinge portion which hinges the fixed block and the moving block to the other ends of the fixed block and the opposite ends of the moving block. Clamping device. The wafering clamping apparatus of claim 1, wherein the driving unit has a structure separated from the spring bar so that the fixed block and the moving block clamping the wafer ring are rotatable for alignment of the wafer. A transfer rail to which the substrate on which the circuit pattern is formed is transferred;
A stage disposed adjacent to the transfer rail;
A transfer mechanism for transferring a wafer ring gripped around the wafer in a horizontal direction and placing the adhesive sheet attached to the lower surface of the wafer sawed by a plurality of dies on top of the stage; And
The fixed block fixed to an upper portion of the stage while wrapping the one side of the wafer ring placed on the stage by the transfer mechanism, and the other side opposite to the one side of the wafer ring while facing the fixed block; A moving block coupled to the moving block in a direction close to or away from the fixed block and the moving block on the upper part of the stage to move the moving block in the direction so that the fixed block and the moving block are connected to the wafer ring. A clamping mechanism having a drive unit for pressing one side and the other side; And
A die bonding unit configured to pick up each of the dies and bond them to the substrate between the transfer rail and the stage,
The drive unit,
At least one spring bar coupled to one end of the fixed block and the moving block facing each other to provide an elastic restoring force of the moving block toward the fixed block; And
And at least one driving unit mounted to the stage adjacent to the spring bar and providing a linear driving force to the spring bar in a direction opposite to the elastic restoring force to move the moving block away from the fixed block. Device.

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