KR101182685B1

KR101182685B1 - Waterproof apparatus for solid state relay

Info

Publication number: KR101182685B1
Application number: KR1020100080542A
Authority: KR
Inventors: 이종민
Original assignee: 한국단자공업 주식회사
Priority date: 2010-08-19
Filing date: 2010-08-19
Publication date: 2012-09-25
Also published as: KR20120017753A

Abstract

The present invention relates to a watertight device for an electronic relay. In the present invention, the housing 50 has an inner space 52 formed therein, the inner space 52 is opened to the upper and lower portions of the housing 50. A support end 54 is formed around the inner surface of the housing 50, and a buffering space 56 is formed in the support end 54 to open toward the lower portion of the housing 50. The buffering space 56 is formed around the inner surface of the housing 50 along the support end 54. A printed circuit board 60 is seated on a lower surface of the support end 54. The printed circuit board 60 is supported by the lower cover 62 in the housing 50 and seated on the support end 54. Is installed. An injection hole 64 is formed through the center of the lower cover 62 to inject a molding liquid into a space between the lower cover 62 and the printed circuit board 60. As the buffering space 56 is formed in the present invention, the molding liquid leaked through the space between the printed circuit board 60 and the inner surface of the housing 50 is transferred to the outside of the support end 54. Will not be.

Description

Watertight apparatus for solid state relay

The present invention relates to an electronic relay, and more particularly, to a watertight device for an electronic relay that prevents water from penetrating from the outside to a printed circuit board provided inside the electronic relay.

Relays are like switches, which control higher voltages and currents with lower DC voltages. The relay was conventionally made using the principle of electromagnets. In other words, when the coil is wound around the iron core and current flows therethrough, it becomes an electromagnet to generate a magnetic field, and the iron piece provided to be movable near the iron core on which the coil is wound is moved to the magnetic field so that a switching action occurs. As such, a relay that is operated by winding a coil around an iron core to make a kind of electromagnet is called a mechanical relay.

1 and 2 show a perspective view and a cross-sectional view of a recently developed electronic relay. The electronic relay shown in FIGS. 1 and 2 is not already known and is made during the research of the electronic relay.

Looking at its configuration, the housing 10 is made of a hexahedral shape and insulating synthetic resin forms a skeleton and an appearance. The inner space 12 formed inside the housing 10 is open to the upper and lower portions of the housing 10. A support end 14 is formed on an inner surface of the inner space 12 of the housing 10. The support end 14 is formed to surround the inner surface of the inner space 12 with a predetermined width. A hook hole 16 is drilled in the lower portion of the housing 10. The hooking jaw 23 of the lower cover 22 to be described below is hooked to the hook hole 16.

The printed circuit board 18 is installed in the inner space 12 of the housing 10. The printed circuit board 18 is installed in close contact with the bottom surface of the support end 14 in the internal space 12. The printed circuit board 18 is supported by the terminal plate 20 and the lower cover 22 which will be described below on the lower surface of the support end 14 to maintain a close contact.

The hanger 23 of the lower cover 22 with the terminal plate 20 and the lower cover 22 seating the terminal 26 on the lower portion of the printed circuit board 18 in the housing 10. ) Is hooked and installed to the hook hole 16 of the housing 10. The terminal plate 20 is coupled to the printed circuit board 18 in a state in which the terminal 26 is temporarily assembled. The lower cover 22 shields the lower portion of the housing 10 so that the printed circuit board is not affected by the external environment.

An injection hole 24 is formed in the lower cover 22 to inject molding liquid into the space between the lower cover 22 and the printed circuit board 18. As the injection hole 24, the molding liquid is injected after the printed circuit board 18, the terminal plate 20, the lower cover 22, and the terminal 26 are installed in the housing 10.

Such an electronic relay has the following problems.

In the process of injecting and filling the molding liquid between the printed circuit board 18 and the lower cover 22 through the injection hole 24 of the lower cover 22 of the printed circuit board 18 and the support end 14 There is a problem that the molding liquid leaks to the area A shown in FIG. 2 through the gap. Therefore, in the process of injecting the molding liquid, the worker had to uncomfortable to remove the molding liquid in the A region before the molding liquid solidified.

Accordingly, an object of the present invention is to solve the problems of the prior art as described above, so that the molding liquid supplied to one side of the printed circuit board installed in the housing of the electronic relay can be delivered to the other side edge of the printed circuit board. will be.

Another object of the present invention is to prevent the leakage of the molding liquid from the electronic relay to the outside of the support end between the printed circuit board and the support end.

According to a feature of the present invention for achieving the object as described above, the present invention is seated on the lower surface of the housing and the support end is formed around the inner surface of the inner space, and the support end of the housing A printed circuit board having a switching function, a lower cover inserted into an inner space of the housing to shield a lower portion of the housing and supporting the printed circuit board to be seated at the support end, and a terminal coupled to the lower cover. A plate and a terminal disposed between the terminal plate and the lower cover, one end of which is electrically connected to the printed circuit board, and the other end of the terminal protrudes outwardly through the lower cover. A buffering space is formed between the substrates so that the sealing liquid is filled between the lower cover and the printed circuit board. Some are located in the buffering space.

The buffering space is formed between an inner surface of the housing and a support wall extending downward of the housing along the tip of the support end, and is formed around the inner surface of the housing.

The buffering space is further provided with a reinforcing rib connecting the support wall and the inner surface of the housing.

The terminal plate is positioned in an inner space of the lower cover to support the printed circuit board together with the lower cover.

Injection holes are formed at corresponding positions on the lower cover and the terminal plate, respectively, so that molding liquid is injected into the space between the lower cover and the printed circuit board.

The injection hole formed in the lower cover is preferably formed in the center of the lower surface of the lower cover, a plurality of air discharge holes surrounding the edge of the lower cover is formed.

In the electronic relay watertight apparatus according to the present invention, the following effects can be obtained.

First, in the present invention, a buffering space is formed at a support end on which a printed circuit board is in close contact with the inside of the housing, and the molding liquid injected into the space between the printed circuit board and the lower cover passes through the edge of the printed circuit board to the buffering space. Since it is allowed to enter, there is an effect that it can prevent not only water intrusion from the lower cover side but also water intrusion from the support end.

In the present invention, the molding liquid is prevented from being injected until the support end is prevented due to the buffering space formed at the support end, thereby simplifying the process of manufacturing the electronic relay.

1 is a perspective view showing an external configuration of an electronic relay.
2 is a cross-sectional view showing the internal configuration of the electronic relay shown in FIG.
Figure 3 is a perspective view showing the configuration of an electronic relay employing a preferred embodiment of the watertight apparatus according to the present invention.
4 is a perspective view showing a housing constituting an embodiment of the present invention.
5 is a cross-sectional view showing the main portion of the embodiment of the present invention.

Hereinafter, a preferred embodiment of an electronic relay watertight apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

3 to 5, the housing 50 forms the appearance and skeleton of the electronic relay. The housing 50 is made of an insulating synthetic resin. The housing 50 is formed such that the internal space 52 formed therein in a hexahedral shape as a whole is opened to the upper and lower portions of the housing 50. A hook hole 51 is formed below the housing 50. The hook hole 51 is a part of the hook jaw 66 of the lower cover 62 to be described below is hooked. The hook hole 51 is formed in each of the two facing surfaces of the inner space 52 of the housing 50 in the present embodiment. The hook hole 51 is formed to penetrate the housing 50 in the present embodiment, but may be formed in a groove shape on the inner surface of the housing 50.

An inner space 52 of the housing 50 is provided with a printed circuit board 60, a lower cover 62, a terminal plate 68, and a terminal 72 to be described below. In particular, the space in which they are installed is the lower portion of the support end 54 formed on the inner surface of the inner space 52 of the housing 50. The support end 54 is formed to protrude by a predetermined width surrounding the inner surface of the housing 50. An upper edge of the printed circuit board 60 to be described below is seated on the lower surface of the support end 54. As shown in FIGS. 4 and 5, the support end 54 has a buffering space 56 that is open toward the lower side of the housing 50. The buffering space 56 is formed around the inner surface of the housing 50. The buffering space 56 is a space in which the molding liquid to be described below can be located. The buffering space 56 is formed by recessing a portion of the inner surface side of the housing 50 at the support end 54. In other words, the support wall 57 is disposed along the front end of the support end 54. It is made by projecting toward the lower part of 50. The tip of the support wall 57 is a portion on which the printed circuit board 60 to be described below is supported.

Reinforcing ribs 58 are provided to connect between the support wall 57 and the inner surface of the housing 50. The reinforcing rib 58 is provided in the buffering space 56 to prevent the support wall 57 from bending toward the inner surface of the housing 50.

A reinforcement pillar 59 is formed at an upper end of the inner space 52 of the housing 50. The reinforcement pillar 59 extends up and down along four corners of the inner space 52 of the housing 50. The reinforcement pillar 59 has a rectangular pillar shape in which the cross section is quadrangular in cooperation with the housing 50. A cavity 59 ′ is formed inside the reinforcement pillar 59 to minimize the amount of material forming the housing 50.

The printed circuit board 60 has a circuit pattern formed therein and various components are mounted. The printed circuit board 60 has a switching function to perform a relay function. The upper surface of the printed circuit board 60 is mounted on the support end 54, more specifically, the front end of the support wall 57, and the lower surface is mounted on the lower cover 62 and the terminal plate 68 which will be described below. Supported.

The lower cover 62 serves to shield the lower portion of the housing 50. Therefore, the lower cover 62 is opened to the upper side to form an inner space (not shown) facing the inner space 52 of the housing 50, the overall shape of the housing 50 as a hexahedron It has a dimension that can enter the inner space (52). Most of the lower cover 62 is inserted into the lower portion of the support end 54 of the inner space 52 of the housing 50. Since the specific configuration of the lower cover 62 is not the gist of the present invention, a detailed description of the structure will be omitted. An injection hole 64 is formed in the lower cover 62, and the injection hole 64 is a portion for injecting a molding liquid into a space formed between the printed circuit board 60 and the lower cover 62. .

On the outer surface of the lower cover 62 is formed a protruding hanger 66 at a position corresponding to the hook hole 51 of the housing 50. When the lower jaw 66 is inserted into the housing 50 and the lower cover 62 comes in a position corresponding to the hook hole 51, the hook jaw 66 is hooked to the hook hole 51 so that the lower cover 62 is closed. It serves to be fixed in the housing 50.

The terminal plate 68 is installed in the inner space of the lower cover 62. The terminal plate 68 allows the terminal 72 and the printed circuit board 60 to be electrically connected to each other in a state in which the terminal 72 to be described below is assembled before being coupled with the lower cover 62. That is, when the terminal 72 is soldered to the printed circuit board 60, the relative positions of the plurality of terminals 72 can be maintained accurately and are also preassembled with the printed circuit board 60. . The terminal plate 68 may be made of a material having good heat resistance to withstand the high temperature at the time of soldering. The terminal plate 68 has a plate shape having various concave-convex structures formed on both surfaces thereof, and a structure for the terminal 72 to be assembled and a structure for the printed circuit board 60 to be assembled.

An injection hole 70 is formed in the terminal plate 68 or at a position corresponding to the injection hole 64 of the lower cover 62. The molding liquid is transferred to the printed circuit board 60 through the injection hole 70.

The terminal 72 is made of a conductive metal material. The terminal 72 is made of various shapes, one end of which penetrates the lower cover 62 and protrudes to the outside, and the middle portion of the terminal 72 is seated on the terminal plate 68 and the lower portion of the terminal plate 68. It is located between the covers 62. The other end of the terminal 72 is soldered to the printed circuit board 60 and electrically connected thereto.

Hereinafter, the assembly and use of the watertight device for an electronic relay according to the present invention having the configuration as described above will be described in detail.

First, the electronic relay is assembled. The printed circuit board 60, the lower cover 62, the terminal plate 68, and the terminal 72 installed inside the housing 50 are assembled into one assembly before being assembled into the housing 50. .

To this end, first, the terminal 72 is assembled to the terminal plate 68. The terminal 72 is preassembled using the structure formed in the terminal plate 68, respectively. In this way the relative position between the terminals 72 can be maintained accurately.

Next, the printed circuit board 60 is temporarily assembled to the terminal plate 68. For example, a groove (not shown) is formed in the printed circuit board 60, and a protrusion is formed in the terminal plate 68 so as to be pressed into the groove. When the printed circuit board 60 is installed in the terminal plate 68 as described above, one end of the terminal 72 is inserted into the through hole of the printed circuit board 60 or contacts the pad. Soldering work in this state.

When the soldering of the terminal 72 and the printed circuit board 60 is completed, the lower cover 62 is assembled with the terminal plate 68. The terminal 72 allows the lower cover 62 to penetrate and couple the structure of the terminal plate 68 and the lower cover 62 to each other. In this state, the printed circuit board 60, the lower cover 62, the terminal plate 68, and the terminal 72 become one assembly.

Next, the assembly is inserted into the interior space 52 of the housing 50 to be coupled. That is, the assembly is inserted into the inner space 52 through the lower portion of the housing 50. At this time, the hanging jaw 66 of the lower cover 62 is to be hooked to the hook hole 51 of the housing 50. As the hooking jaw 66 is coupled to the hooking hole 51, the assembly including the lower cover 62 is coupled into the housing.

At this time, the upper surface of the printed circuit board 60 is in close contact with the tip of the support wall 57 of the support end 54. This is because the printed circuit board 60 is pushed toward the support wall 57 by the lower cover 62 and the terminal plate 68.

Molding liquid is formed between the lower cover 62 and the printed circuit board 60 through the injection holes 64 and 70 while the assembly including the lower cover 62 is assembled in the housing 50 as described above. Is injected into the space. The molding liquid is cured after a predetermined time after being injected and is fixed in the internal space 52. Since the molding liquid is filled and hardened, water cannot enter the space between the printed circuit board 60 and the lower cover 62 from the outside.

Meanwhile, the molding liquid may pass through a gap between the printed circuit board 60 and the inner surface of the housing 50 when the molding liquid is injected. The molding liquid that passes between the inner surface of the housing 50 and the printed circuit board 60 is located in the buffering space 56. Since the buffering space 56 has a predetermined volume, a relatively large amount of molding liquid may be filled therein. Of course, the molding liquid does not need to be filled in the entire buffering space 56. This is because substantially all of the components are mounted on the surface of the printed circuit board 60 facing the terminal plate 68 side, so that the surface of the printed circuit board 60 seen from the upper part of the housing 50 is a molding liquid. This is because it does not have to be covered.

However, when the molding liquid is filled and cured to some extent in the buffering space 56, even if water penetrates through the gap between the support end 54 and the printed circuit board 60, the buffering space 56 and the molding filled therein. Water cannot be transferred to the opposite side of the printed circuit board 60 by the liquid.

The electronic relay made as described above is installed while being coupled to a terminal provided with the terminal 72 in a car box and the like, and performs power while power is supplied to the car box.

The scope of the present invention is not limited to the embodiments described above, but may be defined by the scope of the claims, and those skilled in the art may make various modifications and alterations within the scope of the claims It is self-evident.

For example, although the lower cover 62 and the terminal plate 68 support the printed circuit board 60 together, the lower cover 62 and the terminal plate 68 may support only the lower cover 62.

In addition, the injection hole 64 of the lower cover 62 is formed near the center of the lower surface of the lower cover, and a plurality of air discharge holes (not shown) are formed to surround the edge of the lower cover 62. Can be. When the molding liquid is injected into the injection hole 64 through the air discharge hole, air existing between the printed circuit board 60 and the lower cover 62 is released to the outside. The presence of the air discharge hole makes it possible to minimize the molding liquid delivered to the buffering space 56.

50: housing 51: hook hole
52: internal space 54: support end
56: buffering space 57: support wall
58: reinforcement rib 60: printed circuit board
62: lower cover 64: injection hole
66: hanger 68: terminal plate
70: injection hole 72: terminal

Claims

A housing in which an inner space is opened up and down and a support end is formed around an inner surface of the inner space;
A printed circuit board mounted on a lower surface of a support end of the housing and having a switching function;
A lower cover inserted into an inner space of the housing to shield a lower portion of the housing and support the printed circuit board to be seated on the support end;
A terminal plate coupled to the lower cover and installed;
A terminal installed between the terminal plate and the lower cover and having one end electrically connected to the printed circuit board and the other end protruding to the outside through the lower cover;
And a buffering space is formed between the support end and the printed circuit board so that a portion of the sealing liquid filled between the lower cover and the printed circuit board is located in the buffering space.

The electronic relay of claim 1, wherein the buffering space is formed between an inner surface of the housing and a support wall extending downward of the housing along the tip of the support end. Watertight device.

The watertight device of an electronic relay of claim 2, wherein the buffering space further includes a reinforcing rib connecting the support wall and the inner surface of the housing.

The watertight device for an electronic relay according to any one of claims 1 to 3, wherein the terminal plate is located in an inner space of the lower cover to support the printed circuit board together with the lower cover.

The watertight apparatus of an electronic relay of claim 4, wherein injection holes are formed in corresponding positions on the lower cover and the terminal plate, respectively, so that a molding liquid is injected into the space between the lower cover and the printed circuit board.

6. The watertight device for an electronic relay according to claim 5, wherein the injection hole formed in the lower cover is formed at the center of the lower surface of the lower cover, and a plurality of air discharge holes surrounding the edge of the lower cover are formed.