JP2006173165A - Electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent leakage of resin to the external side of a case on the occasion of protecting or fixing an electronic circuit unit by injecting resin through accommodation of the electronic circuit unit to the case, and also to provide a small-sized electronic apparatus. <P>SOLUTION: The small-sized electronic apparatus is constituted with the electronic circuit unit 10 for accommodating electronic components such as a CPU 8 and a transformer 9 or the like, the case 3 forming therein an accommodating unit 6 for accommodating the electronic circuit unit 10 and a reserving unit 7 including an aperture 2 at the upper surface thereof and a partitioning plate 5 therein, and a resin 11 injected and hardened for protecting or fixing the electronic circuit unit 10 to the accommodating unit 6 for accommodating the electronic circuit unit 10. The partitioning plate 5 is provided with a cut-away unit 4 having the predetermined height from the bottom surface of the case 3 for allowing extra-resin 12 to flow into the reserving unit 7 when the resin 11 injected to the accommodating unit has reached the predetermined amount. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic device in which an electronic circuit unit is housed in a case and resin is injected to protect or fix the electronic circuit unit.

  In electronic equipment, electronic circuit units with electronic components are installed in order to prevent corrosion caused by water intrusion due to water leakage, etc., moisture caused by high-humidity installation environments, or damage due to external vibration or impact. Is stored in a case, and resin is injected into the case to protect or fix the electronic circuit unit.

  When injecting resin, in order to prevent the resin from flowing out of the case, the resin injection amount can be accurately measured, and when the injection amount reaches a predetermined amount, the resin injection is quickly stopped. Resin automatic injection devices have been used.

  However, for example, when injecting resin into a plurality of cases with different amounts of resin injection, such as during high-mix low-volume production or prototyping, if the above device is used, it is necessary to frequently change the setting of the resin injection amount. Since the working efficiency is lowered, many situations have occurred where the resin is manually injected.

  In that case, the decision to stop the injection of the resin is made visually, so if the stop of the injection of the resin is delayed, the resin flows out of the case and adheres to the outside of the case, and the case becomes dirty with the resin. Therefore, it was necessary to add work for removing the adhered resin that caused the appearance to deteriorate.

  For this reason, the electronic device which provided the storage part for storing the resin which flowed out to the outer side of the opening part of a case upper surface is proposed (for example, refer patent document 1).

  As shown in FIG. 9, the electronic device 31 includes a case 33 having an opening 32 on the upper surface, and a housing portion 35 in which the electronic circuit unit 34 is housed is provided in the case 33.

  For example, electronic components such as a connector 36 and a transformer 37 are mounted on the electronic circuit unit 34, and the upper portion of the connector 36 is an opening on the upper surface of the case 33 when the electronic circuit unit 34 is stored in the storage portion 35. It arrange | positions so that it may become above the part 32. FIG.

  Further, when the resin 38 injected into the storage portion 35 for protecting and fixing the electronic circuit unit 34 flows out from the opening 32 on the upper surface of the case 33 to the outside around the entire outer periphery of the case 33, the excess flowed out. A storage portion 40 for storing the resin 39 is attached.

  In the above configuration, after the electronic circuit unit 34 in which the connector 36 and the transformer 37 are mounted is stored in the storage portion 35 of the case 33, the resin 38 is injected into the storage portion 35.

  The injected resin 38 reaches the same height as the opening 32 on the upper surface of the case 33, and the excess resin 39 passes through the opening 32 on the upper surface of the case 33 and flows into the storage portion 40 attached to the outside of the case 33. To do.

  At this time, since the upper surface of the connector 36 is disposed above the upper surface of the case 33, the resin 38 is prevented from flowing into the connector 36, thereby obstructing the cable connection to the connector 36. Can be done without.

  On the other hand, the transformer 37 is in a state of being completely buried in the resin 38 injected into the storage portion 35.

After the inflow of excess resin 39 into the storage unit 40 is confirmed, when a predetermined time elapses after the injection of the resin 38 is stopped, the resin 38 is cured and the electronic circuit unit 34 is protected and fixed.
JP 2001-237557 A

  However, in the electronic device described in Patent Document 1 of the prior art, since the outflow portion of the excess resin in the opening on the upper surface of the case is not specified, the storage portion of the outflowed excess resin is disposed on the entire outer periphery of the case. Therefore, the size of the case becomes large, and it has not been possible to cope with the downsizing of electronic devices.

  On the other hand, if the capacity of the reservoir is reduced in order to cope with the downsizing of electronic equipment, if excess resin flows out from a part of the upper surface of the case and flows into the reservoir, the viscosity of the resin causes the resin to enter the reservoir. Work to remove excess resin that has flowed out from the reservoir before it spreads over the entire reservoir and adheres to the outside of the case, causing deterioration of the appearance due to dirt on the case Had to be added, leading to a decline in productivity.

  In addition, since the excess resin flows into the storage portion while flowing over the opening on the upper surface of the case, the resin remains in the raised state as shown in FIG. 9 in the opening on the upper surface of the case. When the residual resin had to be removed, the productivity was further deteriorated.

  The present invention solves such a conventional problem, and an object thereof is to provide a small electronic device in which resin does not flow out of the case.

  In order to achieve the above object, the present invention forms an electronic circuit unit on which electronic components are mounted, and a storage portion and a storage portion for storing the electronic circuit unit by providing an opening on the upper surface and providing a partition plate inside. A case and a resin injected to protect or fix the electronic circuit unit in the storage unit storing the electronic circuit unit, and when the resin injected into the storage unit in the partition plate reaches a predetermined amount Further, a notch portion having a predetermined height from the bottom surface of the case for allowing excess resin to flow into the storage portion is provided.

  With this configuration, when the amount of resin injected into the storage portion reaches a predetermined amount, it is possible to achieve an effect that excess resin can flow into a storage portion provided in a part of the case.

  The present invention provides a storage part for allowing excess resin to flow in when part of the resin injected in order to protect or fix the electronic circuit unit stored in the case reaches a predetermined amount. There is an effect that a small electronic device can be provided.

  An embodiment of the present invention includes an electronic circuit unit on which an electronic component is mounted, a case in which an opening is provided on the upper surface and a partition plate is provided therein to store an electronic circuit unit and a storage part is formed, And a resin that is injected and cured to protect or fix the electronic circuit unit in the storage unit that stores the electronic circuit unit, and the resin injected into the storage unit into the partition plate is excessive when a predetermined amount is reached. A cutout portion having a predetermined height is provided from the bottom surface of the case for allowing a resin to flow into the storage portion.

  Thereby, since the storage part into which excess resin flows in is provided only in a part of the case, a small electronic device can be provided.

  The notch may be provided at a predetermined height lower than the opening on the upper surface of the case.

  In this case, the excess resin can flow into the storage portion from a notch provided at a predetermined height lower than the opening on the upper surface of the case, so that the resin does not flow out of the case. Therefore, an electronic device including a case with high productivity and a clean appearance can be provided.

  Further, the cutout portion may be provided at a predetermined height lower than an upper part of an electronic component that is mounted on the electronic circuit unit housed in the housing portion and cannot be embedded in the resin.

  As a result, for example, when an electronic component such as a connector that cannot inject a resin above a predetermined height is mounted on an electronic circuit unit, the electronic component is prevented from being buried with the resin, and the resin is injected. It is possible to provide an electronic device that can use an electronic component without hindrance later.

  Further, an electronic component partition plate may be provided around the electronic component mounted on the electronic circuit unit, and an upper portion of the electronic component partition plate may be provided at a predetermined height higher than the notch portion.

  As a result, among the electronic components mounted on the electronic circuit unit, the periphery of the electronic component having a predetermined height higher than that of other electronic components such as a transformer is surrounded by the electronic component partition plate, and the inside of the electronic component partition plate is By injecting the resin into the storage portion, the resin can be injected only at the height necessary for protecting and fixing the electronic component and around the electronic component, so that waste of the resin can be prevented.

  A second partition plate provided at a predetermined distance from the partition plate; a first storage portion in contact with the storage portion via the partition plate in the storage portion divided by the second partition plate; A second storage portion in contact with the first storage portion via the partition plate, the second partition plate having a predetermined height that is higher than the notch portion of the partition plate and lower than the opening portion of the upper surface of the case. You may make it provide the 2nd notch part with.

  As a result, the electronic circuit unit on which the electronic component having a low height is mounted is stored in the first storage section, and the electronic circuit unit on which the electronic component having a high height is mounted is stored in the second storage section. By doing so, it is possible to individually inject a resin corresponding to the height required for protecting and fixing each electronic circuit unit, so that waste of the resin can be prevented.

  If at least a portion where the resin flows is formed in a corrugated shape with respect to the cutout portion or the second cutout portion, when the resin injected into the housing portion of the case reaches a predetermined amount, a small amount of excess resin is added. Since it can be made to flow out from a notch part one by one, the waste of resin can be prevented further.

  Embodiments of the present invention will be described below with reference to the drawings.

Example 1
As shown in FIGS. 1 and 2, the electronic device 1 includes a case 3 made of a plastic such as polypropylene or polyethylene, or a metal such as aluminum, having an opening 2 on the upper surface. Similarly, a partition plate 5 made of a plastic such as polypropylene or polyethylene, or a metal such as aluminum, provided with a portion 4 is attached, and the case 3 is divided into a storage portion 6 and a storage portion 7 by the partition plate 5.

  The storage unit 6 stores an electronic circuit unit 10 on which electronic components such as a CPU (Central Processing Unit) 8 and a transformer 9 are mounted.

  In addition, the storage unit 6 protects the stored electronic circuit unit 10 from corrosion caused by water intrusion due to water leakage or the like, moisture caused by high-humidity installation environment, or destruction due to external vibration or impact, In order to fix the electronic circuit unit 10, a resin 11 made of epoxy, urethane, silicon, or the like is injected.

  The storage unit 7 is provided to store excess resin 12 that has flowed out of the storage unit 6 when the resin 11 injected into the storage unit 6 reaches a predetermined amount.

  With the above configuration, the electronic apparatus according to the first embodiment will be described with reference to FIGS.

  After the electronic circuit unit 10 on which electronic components such as the CPU 8 and the transformer 9 are mounted is stored in the storage unit 6 provided in the case 3 of the electronic device 1, the resin 11 is injected into the storage unit 6.

  When the injected resin 11 reaches a predetermined amount, it becomes the same height as the notch 4 of the partition plate 5 in the case 3, and when the resin 11 is continuously injected, excess resin 12 passes over the notch 4. It flows into the storage part 7.

  Since the height of the notch 4 is set lower than the height of the opening 2 of the case 3, the injection of the resin 11 may be stopped after the inflow of excess resin 12 into the reservoir 7 is confirmed. Further, since the reservoir 7 can store all of the excess resin 12 that has flowed in, neither the resin 11 nor the excess resin 12 flows out of the case 3.

  For this reason, the appearance of the case 3 can always be kept clean, and no additional work for removing the resin 11 that has flowed out or the excess resin 12 has occurred.

  In addition, since the height of the electronic components such as the CPU 8 and the transformer 9 mounted on the electronic circuit unit 10 is lower than the height of the notch 4, the electronic components such as the CPU 8 and the transformer 9 are all covered with the resin 11.

  When a predetermined time elapses after the injection of the resin 11 is stopped, the resin 11 is cured and the electronic circuit unit 10 is protected and fixed.

  At this time, as described above, since all of the electronic components such as the CPU 8 and the transformer 9 are buried in the resin 11, corrosion caused by water intrusion due to water leakage or the like or moisture due to a high humidity installation environment may occur. There is no damage caused by external vibration or impact.

  The excess resin 12 that has flowed into the reservoir 7 is also cured and fixed in the case 3 in the same manner as the resin 11.

  As described above, according to the first embodiment, the storage unit 7 is provided in a part of the case 3 of the electronic device 1, and the resin 11 injected into the storage unit 6 in which the electronic circuit unit 10 is stored has a predetermined amount. When it reaches, the excess resin 12 can flow only from the notch portion 4 of the partition plate 5 set to a height lower than the height of the opening portion 2 of the case 3 into the storage portion 7. In addition, the resin 11 and the excess resin 12 do not flow out to impair the appearance, and a small electronic device with high productivity can be provided.

(Example 2)
3 and 4, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  The second embodiment basically applies the first embodiment mutatis mutandis, and the difference in configuration from the first embodiment is that the electronic components mounted on the electronic circuit unit 10 are, for example, the CPU 8 and the connector 13. That is, the height of the notch 4 provided in the partition plate 5 is set lower than the upper part of the connector 13.

  With respect to the connector 13, if the resin 11 is injected beyond the height of the connector 13, the resin 11 flows into the connector 13 and connection of a cable or the like becomes impossible. It needs to be set lower.

  Due to the difference in configuration, the resin 11 is injected into the storage portion 6 in which the electronic circuit unit 10 is stored. When the injection amount of the resin 11 reaches a predetermined amount, the same as the cutout portion 4 of the partition plate 5 in the case 3. If the injection of the resin 11 is continued, the excess resin 12 passes through the notch 4 and flows into the reservoir 7.

  At this time, as shown in FIG. 4, since the height of the notch 4 is set lower than the height of the connector 13, the resin 11 does not reach the upper part of the connector 13, and the resin 11 does not reach the connector 13. Since it does not flow in, the cable or the like can be connected to the connector 13 without any trouble after the resin 11 is cured.

  As described above, according to the second embodiment, since the resin 11 injected into the connector 13 does not flow in, the connector 13 can be used without any problem after the resin 11 is cured.

(Example 3)
In FIG. 5, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  The third embodiment basically applies the first embodiment mutatis mutandis. Among the electronic components mounted on the electronic circuit unit 10, the difference in configuration from the first embodiment is that of other electronic components. For example, an electronic component partition plate 14 made of a plastic such as polypropylene or polyethylene or a metal such as aluminum is disposed around a transformer 9 or the like having a high predetermined height.

  When the resin 11 is injected into the inside of the electronic component partition plate 14 due to the difference in the above configuration, the resin 11 is first filled inside the electronic component partition plate 14, and when the predetermined amount is reached, from the upper surface of the electronic component partition plate 14. It flows out and flows into the storage unit 6.

  When the resin 11 flowing into the storage unit 6 reaches a predetermined amount, excess resin 12 flows out of the notch 4 of the partition plate 5 into the storage unit, and the injection of the resin 11 is finished.

  At this time, as shown in FIG. 5, the resin 11 is filled in accordance with the height of the transformer 9 by the electronic component partition plate 14 provided around the transformer 9. Resin 11 is filled in accordance with the height of the.

  As described above, according to the third embodiment, even when an electronic component such as the transformer 9 having a predetermined height higher than the CPU 8 is mounted on one electronic circuit unit 10, the electronic component is surrounded around the transformer 9. By providing the partition plate 14, the resin 11 corresponding to the height of the transformer 9 can be injected only around the transformer 9, so that the waste of the resin 11 can be prevented.

Example 4
In FIG. 6, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the fourth embodiment, the first embodiment is applied mutatis mutandis, and the difference in configuration from the first embodiment is that the second partition plate is located at a predetermined distance from the partition plate 5 in the storage unit 6. 15 is attached, and then the storage 6 is divided into a first storage 16 and a second storage 17 by the second partition plate, and the first storage 16 Accommodates an electronic circuit unit 18 on which an electronic component having a predetermined height lower than other electronic components such as the CPU 8 is mounted. The second storage portion 17 stores other electronic components such as the transformer 9. The electronic circuit unit 19 on which an electronic component having a predetermined height higher than the component is mounted is accommodated.

  Further, the second partition plate is provided with a second notch portion 20 having a predetermined height that is higher than the notch portion 5 of the partition plate 4 and lower than the opening 2 at the top of the case 3.

  When the resin 11 is injected into the second storage part 17 due to the difference in the above configuration, the resin 11 is first filled in the second storage part 17 and reaches the first amount when it reaches a predetermined amount. Flows into the storage portion 16 of the main body.

  When the resin 11 is injected into the first storage portion 16 and reaches a predetermined amount, the excess resin 12 from the cutout portion 4 flows out to the storage portion 7 and the injection of the resin 11 is finished.

  At this time, as shown in FIG. 6, the resin 11 is injected in accordance with the heights of the electrolytic circuit unit 18 and the electronic circuit unit 19 because the heights of the notch 4 and the second notch 20 are different. .

  As described above, according to the fourth embodiment, the heights of the resin 11 injected into the first storage unit 16 and the second storage are different because the heights of the cutout 4 and the second cutout 20 are different. Since the height of the resin 11 injected into the portion 17 can be changed, it becomes possible to inject the resin 11 according to the height of the electronic circuit units 18 and 19 to be stored, thereby preventing the resin 11 from being wasted. can do.

(Example 5)
In FIG. 7, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  The fifth embodiment basically applies the first embodiment mutatis mutandis, and the structural difference from the first embodiment is that the shape of the portion where the resin flows out in the notch portion 4 provided in the partition plate 5. Is a wave shape.

  Due to the difference in configuration, when the resin 11 injected into the storage unit 6 reaches a predetermined capacity, excess resin 12 flows out of the cutout 4 and flows out to the storage unit 7.

  At this time, since the shape of the cutout portion 4 is corrugated, excess resin 12 flows out little by little from the corrugated concave portion as shown in FIG.

  Therefore, since the excess resin 12 does not flow out from the notch 4 at a time in a large amount unlike the case where the notch 4 shown in FIG. Waste of the resin 11 can be prevented.

  In the above embodiment, first, in FIG. 5, the electronic component partition plate 14 may be provided for a plurality of electronic components, and the heights of the electronic component partition plates 14 arranged for the plurality of electronic components are respectively set. It may be set according to the height of the electronic component.

  The resin 11 is initially injected into the inside of the electronic component partition plate 14, but may be injected from the storage unit 6.

  Although the 2nd partition plate 15 was provided in order to divide the accommodating part 6 as shown in FIG. 6, you may divide the accommodating part 6 into three or more by providing a partition plate further.

  The sizes of the first storage unit 16 and the second storage unit 17 may be changed according to the sizes of the electronic circuit units 18 and 19 to be stored.

  The resin 11 is initially injected into the second storage unit 17, but may be injected from the first storage unit 16.

  In FIG. 7, the shape of the portion where the resin flows out of the notch 4 is a corrugated shape, but the entire notch 4 may be corrugated, and the resin also flows out from the second notch 19 in FIG. Part or all may be corrugated.

  The corrugated shape may be a straight line (for example, V-shaped) or a curved line (for example, U-shaped), and the number of corrugations is not limited, for example, one V-shaped or U-shaped It may be set to any number as necessary.

  Further, the notch 4 and the second notch 19 are provided in part of the partition plate 5 and the second partition plate 14 respectively. For example, the notch 4 and the second notch 19 are provided over the entire upper side of the partition plate 5 or the second partition plate 14. Also good.

  The electronic apparatus of the present invention can be expected to be applied to various electronic units and electronic devices that require resin injection for protection and fixation.

1 is an exploded perspective view of an electronic device shown in Embodiment 1. FIG. Sectional drawing of the electronic device shown in Example 1 FIG. 3 is an exploded perspective view of the electronic device shown in the second embodiment. Sectional drawing of the electronic device shown in Example 2 Sectional drawing of the electronic device shown in Example 3 Sectional drawing of the electronic device shown in Example 4 The front view of the notch part of the partition plate shown in Example 5 The front view of the notch part of the partition plate shown in Example 1 Cross-sectional view of conventional electronic equipment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic device 2 Opening part 3 Case 4 Notch part 5 Partition plate 6 Storage part 7 Storage part 10, 18, 19 Electronic circuit unit 11 Resin 12 Excess resin 13 Connector 14 Electronic component partition plate 15 2nd partition plate 16 1st Storage portion 17 second storage portion 20 second cutout portion 21 wave shape of cutout portion

Claims (6)

An electronic circuit unit on which electronic components are mounted, a case in which an opening is provided on the upper surface and a partition plate is provided inside to store the electronic circuit unit, a case in which the storage unit is formed, and a storage in which the electronic circuit unit is stored The resin is injected and hardened to protect or fix the electronic circuit unit in the part, and excess resin flows into the storage part when the amount of resin injected into the storage part reaches the predetermined amount in the partition plate. An electronic device in which a notch having a predetermined height is provided from the bottom of the case. The electronic device according to claim 1, wherein the notch is provided at a predetermined height lower than the opening on the upper surface of the case. The electronic device according to claim 2, wherein the cutout portion is provided at a predetermined height lower than an upper portion of an electronic component that is mounted on an electronic circuit unit housed in the housing portion and cannot be embedded in the resin. The electronic component according to claim 2 or 3, further comprising an electronic component partition plate around an electronic component mounted on the electronic circuit unit, wherein an upper portion of the electronic component partition plate is provided at a predetermined height higher than the notch portion. machine. A second partition plate provided at a predetermined distance from the partition plate; a first storage portion that contacts the storage portion via the partition plate in the storage portion divided by the second partition plate; and a second partition A second storage portion that is in contact with the first storage portion via the plate, and the second partition plate has a predetermined height that is higher than the notch portion of the partition plate and lower than the opening portion of the upper surface of the case. The electronic device according to claim 2, further comprising a second cutout portion. 6. The electronic device according to claim 1, wherein at least the portion where the resin flows is formed in a corrugated shape in the cutout portion or the second cutout portion.

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