KR101161396B1 - Light emitting diode - Google Patents

Light emitting diode Download PDF

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Publication number
KR101161396B1
KR101161396B1 KR1020040102293A KR20040102293A KR101161396B1 KR 101161396 B1 KR101161396 B1 KR 101161396B1 KR 1020040102293 A KR1020040102293 A KR 1020040102293A KR 20040102293 A KR20040102293 A KR 20040102293A KR 101161396 B1 KR101161396 B1 KR 101161396B1
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KR
South Korea
Prior art keywords
light emitting
substrate
electrode
emitting chip
emitting diode
Prior art date
Application number
KR1020040102293A
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Korean (ko)
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KR20060063189A (en
Inventor
이건영
이정훈
Original Assignee
서울반도체 주식회사
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Priority to KR1020040102293A priority Critical patent/KR101161396B1/en
Publication of KR20060063189A publication Critical patent/KR20060063189A/en
Application granted granted Critical
Publication of KR101161396B1 publication Critical patent/KR101161396B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body

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Abstract

The present invention relates to a light emitting diode, and provides a light emitting diode using a heat conductive resin as a heat sink. The light emitting diode of the present invention may be configured as a heat sink that directly emits heat generated from a light emitting chip, and may also be configured by coupling a heat sink made of a thermally conductive resin to a housing.

As a result, the heat of the light emitting chip can be effectively discharged to the outside, and a heat sink made of a thermally conductive resin formed with a reflective structure can be used to effectively radiate the heat generated by the light emitting chip to the outside and improve the brightness of the light. It works.

LED, Heat Sink, Fever, Electrode, Light Emitting Chip

Description

Light emitting diodes

1 to 4 are cross-sectional views of light emitting diodes according to the present invention.

5 and 6 are schematic views of a light emitting diode according to the present invention.

FIG. 7 is a cross-sectional view taken along line II ′ of FIG. 5;

8 is a cross-sectional view taken along the line II-II 'of FIG.

<Explanation of symbols for main parts of the drawings>

10 light emitting chip 20 substrate

25 housing 30 first electrode

31 positive electrode 32 anode connection pad

40: second electrode 41: negative (-) electrode

42: pad for cathode connection 50: heat sink

60: molding part 70: first wire

80 second wire 90 condensing optical lens

The present invention relates to a light emitting diode, and more particularly, to a light emitting diode using a heat conductive resin as a heat sink.

Generally, a light emitting diode refers to a device that receives an electrical signal and outputs the light as light. The light emitting diode is mounted on a printed circuit board on which an electrode receiving the electrical signal is formed, and then a molding part encapsulating the light emitting chip is formed. Manufacture.

The brightness of the above-described light emitting diode is proportional to the current applied to the light emitting chip, and the current applied to the light emitting chip is proportional to the heat emitted by the light emitting chip. In order to brighten the brightness of the light emitting diode, a high current must be applied, but the light emitting chip is damaged due to heat emitted from the light emitting chip, thereby causing a problem in that a high current cannot be applied indefinitely. In other words, when the current applied to the light emitting chip is increased, the heat emitted by the light emitting chip is increased.

Accordingly, many studies have been conducted to reduce the heat emitted by the light emitting chip. As a result, in Korean Patent Laid-Open Publication No. 2002-0089785, a predetermined heat dissipation hole is made to reduce the heat emitted by the light emitting chip. In Korean Patent Laid-Open Publication No. 2003-0053853, the LED is enclosed by a predetermined metal plate and used as a heat sink. The device is designed to reduce the heat dissipated.

As described above, the heat emitted from the light emitting chip through the predetermined heat dissipation hole and the metal plate may be emitted to the outside, thereby protecting the light emitting chip and improving the brightness of the light emitting diode.

However, when a predetermined heat dissipation hole is drilled under the light emitting chip, external impurities may be added due to the heat dissipation hole to damage not only the light emitting chip but the entire light emitting diode.                         

In addition, when a predetermined slug or a metal plate is used as a heat sink, the molding part uses an epoxy resin and adds a separate slug and a metal plate to the device, so that when combined with a molding part encapsulating a light emitting chip, the metal and epoxy resin interface A problem arises in that a predetermined air layer is formed or a bond between two materials is raised, and the manufacturing process of the light emitting diode is complicated.

Therefore, in order to solve the above problem, the present invention can effectively radiate heat of the light emitting chip to the outside by using a thermally conductive resin as a heat sink, and can produce a light emitting diode without using a separate slug and a metal plate, thereby increasing the volume. It is an object of the present invention to provide a light emitting diode which is very small and small and can be easily applied to various electronic devices.

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According to the present invention, there is provided a light emitting diode comprising: a substrate including an upper surface and a lower surface; First and second electrodes spaced apart from each other on the substrate; A light emitting chip electrically connected to the first electrode and the second electrode; It includes a molding formed over the entire area of the upper surface of the substrate. The first electrode may include an anode connection conductive material vertically extending from an upper surface of the substrate to a bottom surface of the substrate, and a positive electrode formed on an upper surface of the substrate and in contact with an upper end of the conductive material for anode connection. The second electrode includes a negative electrode conductive material vertically from an upper surface of the substrate to a bottom surface of the substrate, and a negative electrode formed on an upper surface of the substrate and in contact with an upper end of the negative electrode conductive material, wherein the light emitting chip Is mounted on at least one of an upper surface of the positive electrode, an upper surface of the negative electrode, and an upper surface of the substrate, and a protruding optical lens for directly placing the light emitting chip is formed integrally on the molding part. And the negative electrode include straight portions parallel to each other, wherein the straight portions are located outside the immediate area of the optical lens.
The substrate may include Al 2 O 3 , and the first electrode and the second electrode may include Cu.
The bottom surface of the substrate may include a portion of the first electrode connected to the conductive material for the anode connection, a portion of the second electrode connected to the conductive material for the cathode connection, and a heat sink additionally included in the substrate.
The substrate may be formed of a material mixed with a thermally conductive resin and a thermal conductivity enhancer.
The thermal conductivity enhancer may include at least one of Al 2 O 3 , MgO, ZnO, SiO 2 , Bn, AlN, SiC, and Si 3 N 4 .
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Like numbers refer to like elements in the figures.

The light emitting diode according to the present invention mounts the light emitting chip 10 on the heat sink in order to directly radiate heat generated from the light emitting chip 10. Herein, the heat sink may preferably use a material having excellent thermal conductivity, and may use a metal material having excellent thermal conductivity and electrical conductivity, or may use a resin having excellent thermal conductivity.

Thermally conductive resin is a material in which a thermal conductivity enhancer having a high thermal conductivity is mixed with a polymer matrix material such as resin and rubber, and the thermal conductivity of the thermally conductive resin is 2W / compared with a general resin having a thermal conductivity of 0.02W / mK to 0.2W / mK. mK to 100 W / mK. This is similar to the thermal conductivity of about 15 W / mK of stainless steel and titanium, and can reach a level of 50 to 100 W / mK, which is the thermal conductivity of magnesium or aluminum, which is a metal alloy for die casting. As the resin, an epoxy resin, a phenol resin, an isocyanate resin, or the like having excellent heat resistance, mechanical strength, and electrical insulation properties is used. In addition, the heat conduction enhancer may be a metal oxide such as aluminum oxide (Al 2 O 3 ), magnesium oxide (MgO), zinc oxide (ZnO), quartz (SiO 2 ), a metal such as boron nitride (BN), aluminum nitride (AlN), or the like. Metal carbides such as nitrides and silicon carbide (SiC), metal hydroxides such as aluminum hydroxide (Al (OH) 3 ), metals such as gold, silver, copper, carbon fibers, graphite and the like. In particular, when Al 2 O 3 or SiO 2 is used, mixing with the resin is easy, and when AlN is used, the heat dissipation efficiency is particularly high. In order to obtain higher thermal conductivity, a thermally conductive resin in which a special thermal conductivity enhancing agent such as surface modified aluminum oxide and spherical cristobalite is added to the epoxy resin may be used. In addition, a reinforcing material such as a glass nonwoven fabric or a ceramic nonwoven fabric may be included in the mixture of such a resin and a thermally conductive reinforcing agent to improve mechanical strength and workability.

In the present invention, the heat emitted from the light emitting chip can be efficiently released using the above-described thermal conductive resin. That is, the substrate 20 is made of a resin having excellent thermal conductivity, and the substrate 20 itself is used as a heat sink. In addition, the separate member may be made of a resin having excellent thermal conductivity and used as the heat sink 50.

1 to 4 are cross-sectional views of light emitting diodes according to the present invention.

As shown in FIG. 1 of the present invention, a light emitting diode includes a substrate 20 which is a heat sink of a thermal conductive resin, a light emitting chip 10 mounted on the substrate 20, and a region in which the light emitting chip 10 is mounted. Excluding the electrodes 30 and 40 formed on the substrate, and the molding unit 60 for encapsulating the light emitting chip (10). A reflector (not shown) may be further included on the substrate 20 to improve luminance of light of the light emitting chip 10.

The electrodes 30 and 40 are composed of first and second electrodes 30 and 40 for connecting to the positive terminal and the negative terminal of the light emitting chip 10. The apparatus further includes first and second wires 70 and 80 for electrically connecting the first and second electrodes 30 and 40 to the light emitting chip 10. It may further include first and second metal wires (not shown) connecting the first and second electrodes 30, 40 to external first and second current input terminals (not shown), respectively. In addition, the light emitting chip 10 may further include a predetermined phosphor for emitting light of a target color.

The molding part 60 may be formed in at least one of an optical lens shape, a flat plate shape, and a shape having predetermined irregularities on the surface.

The substrate 20 uses a resin including a thermally conductive material as a heat sink for dissipating heat generated from the light emitting chip 10. In this case, since the substrate 20 has an insulating property compared to the metal substrate having the insulating film, it is necessary to form a separate insulating film so that the first electrode 30 and the second electrode 40 are electrically disconnected. There is no advantage that the manufacturing process is simplified.

The first and second electrodes 30 and 40 may be formed through a printing technique or by using an adhesive. The first and second electrodes 30 and 40 may be formed of a metal material including copper or aluminum having excellent conductivity, and may be electrically disconnected from each other.

The light emitting chip 10 is preferably mounted on the substrate 20 using silver paste. The molding part 60 may be formed through an injection process using a predetermined epoxy resin. In addition, the light emitting chip 10 may be molded by using a separate mold and then pressing or heat treating the same. It is preferable that predetermined regions of the first and second electrodes 30 and 40 are exposed to the outside of the molding unit 60. Through this, the external current may be applied to the light emitting chip 10 by electrically connecting the first and second electrodes 30 and 40 to an external current input terminal (not shown).

As such, the heat of the light emitting chip 10 may be effectively released by using the substrate 20, which is a heat sink of the heat conductive resin, and thermal stress of the heat sink may be reduced.

The light emitting diode as shown in FIG. 2 of the present invention is mounted on a substrate 20 which is a heat sink of a thermally conductive resin, electrodes 30 and 40 formed on the substrate 20, and a first electrode 30. The light emitting chip 10 and a molding part 60 encapsulating the light emitting chip 10.

The substrate 20 may use heat conductive resin to effectively release heat generated from the light emitting chip 10. The electrodes 30 and 40 are composed of first and second electrodes 30 and 40 for connecting to the positive terminal and the negative terminal of the light emitting chip 10. The light emitting chip 10 is mounted on the first electrode 30 and is electrically connected to the second electrode 40 through the second wire 80.

The first and second electrodes 30 and 40 are formed through a printing technique. The first and second electrodes 30 and 40 are formed of a metal material including copper or aluminum having excellent conductivity, but the first electrode 30 and the second electrode 40 are formed to be electrically disconnected.

As shown in FIG. 3 of the present invention, the light emitting diode includes a substrate 20 which is a heat sink of a thermal conductive resin having a reflective cup 25, a light emitting chip 10 mounted inside the reflective cup 25, and a substrate. 20, the molding unit 60 encapsulating the first and second electrodes 30 and 40 and the light emitting chip 10 formed thereon.

The reflective cup 25 is a region formed by forming a predetermined groove in the central region of the substrate 20 through mechanical processing, and giving a predetermined slope to the side wall surface of the groove. It is preferable to form the reflective cup 25 in a conical shape, and the lower surface thereof is preferably flat because the light emitting chip 10 is mounted.

The apparatus further includes wires 70 and 80 electrically connecting the first and second electrodes 30 and 40 to the light emitting chip 10. It may further include first and second metal wires (not shown) connecting the first and second electrodes 30 and 40 and external first and second current input terminals (not shown), respectively. In addition, a predetermined phosphor for emitting light of a target color may be further included in an area in which the light emitting chip 10 inside the reflection cup 25 is mounted.

The light emitting chip 10 is preferably mounted on the lower surface of the reflective cup 25 using a paste. The electrodes 30 and 40 formed on the substrate 20 are composed of first and second electrodes 30 and 40 for connecting to the positive terminal and the negative terminal of the light emitting chip 10. It is effective to form the first and second electrodes 30 and 40 with a metallic material including copper or aluminum having excellent conductivity. The first and second electrodes 30 and 40 may be formed through a printing technique or by using an adhesive. The molding part 60 may be formed through an injection process using a predetermined epoxy resin. In addition, the light emitting chip 10 may be molded by using a separate mold, and then pressurizing or heat treating the mold. It is preferable that predetermined regions of the first and second electrodes 30 and 40 are exposed to the outside of the molding unit 60.

Therefore, the heat of the light emitting chip 10 can be effectively discharged to the outside without using a separate slug and a metal plate. In addition, the reflection of the light due to the reflective cup 25 may be maximized, and the heat dissipation of the light emitting chip 10 may be effectively controlled by the substrate 20, which is a heat sink using a thermally conductive resin.

As shown in FIG. 4 of the present invention, the light emitting diode includes a substrate 20 which is a heat sink of a thermal conductive resin having a reflective cup 25, a second electrode 40 formed on the substrate 20, and a second The first electrode 30 is electrically disconnected from the electrode 40 and is electrically mounted on the first electrode 30 formed in the reflective cup 25 and on the substrate 20, and the first electrode 30 inside the reflective cup 25. The light emitting chip 10 and the molding part 60 encapsulating the light emitting chip 10 are included.

Also, a second wire 80 for electrically connecting the second electrode 40 and the light emitting chip 10, and the first and second electrodes 30 and 40 and the external first and second (not shown). The device may further include first and second metal wires (not shown) respectively connecting the current input terminals. In addition, the light emitting chip 10 may further include a predetermined phosphor for emitting light of a target color.

Thermally conductive resins are used as heat sinks to effectively release heat generated in the light emitting chip 10. The first and second electrodes 30 and 40 may be formed through a printing technique or by using an adhesive. It is effective to form the first and second electrodes 30 and 40 with a metallic material including copper or aluminum having excellent conductivity. The first electrode 30 formed in the reflective cup 25 region is preferably formed so as not to interfere with the reflection of light due to the reflective cup 25. That is, it is effective to form a line on the lower predetermined region and one side wall of the reflective cup 25.

The molding part 60 may be formed through an injection process using a predetermined epoxy resin. In addition, the light emitting chip 10 may be molded by using a separate mold and then pressing or heat treating the same. It is preferable that predetermined regions of the first and second electrodes 30 and 40 are exposed to the outside of the molding unit 60.

For this reason, an external current can be applied to the light emitting chip through the first electrode 30 without using a thermally conductive resin as a heat sink of the present invention without using a separate slug and a metal plate.

5 and 6 are perspective views of light emitting diodes according to another embodiment of the present invention, FIG. 7 is a cross-sectional view taken along the line II ′ of FIG. 5, and FIG. 8 is taken along the line II-II ′ of FIG. 6. It is a cross section.

Referring to these drawings, the light emitting diode of the present invention further comprises a heat sink 50 as a separate member is configured to be coupled to the housing 25. As shown in FIG. 5 and FIG. 8, the present invention provides a light emitting diode in which a light emitting chip 10 is mounted on a heat sink 50 and the heat sink 50 is coupled to a housing 25. As the heat sink 50, a resin having excellent thermal conductivity is used. 5 to 8, the mounting portion of the heat sink 50 on which the light emitting chip 10 is mounted is formed in a shape recessed with respect to the reference plane, but may be formed in a plane like in FIGS. 1 and 2.                     

A light emitting chip 10 emitting light according to a voltage, a housing 25 including a through hole, and a first electrode formed in a first area of the housing 25 to transmit an external voltage to the light emitting chip 10. 30, a second electrode 40 electrically separated from the first electrode 30, and formed in a second region of the housing 25 to transmit an external voltage to the light emitting chip 10, and a light emitting chip mounted thereon. The heat sink 50 of the thermal conductive resin coupled to the through-hole of the housing 25 for the heat radiation of the (10). The first region refers to one side wall of the housing 25, a portion of the upper and lower portions between the through hole and the one side wall, and the second region is a side wall opposite to the first region of the housing 25. It refers to a portion of the upper portion and the lower portion between the other side wall opposite to the first region.

The light emitting diode may further include a molding part 60 for protecting the light emitting chip 10. The molding part 60 may be formed in a planar shape, a lens shape as a whole, or may have a lens shape on the planar shape. In addition, the molding part 60 may be formed in a pattern (presnel shape) that can improve the light intensity and brightness of the light emitting chip. That is, the surface may be formed to have a predetermined roughness, and in this case, it may be configured with various types of patterns including wave patterns or blade patterns.

In addition, the light emitting diode of the present invention may further include a light collecting optical lens 90 on the molding unit 60, as shown in FIG. The molding part 60 may be formed on the light emitting chip 10 to protect the light emitting chip 10 by extruding a thermosetting polymer resin. The light converging optical lens 90 may be formed integrally with the molding part 60. In other words, it is effective to form the lens 90 in the center of the optical unit by extruding the thermosetting polymer resin and to produce the integrally with the thermosetting polymer resin extrusion molded part that protects the light emitting chip 10.

In addition, the light emitting diode of the present invention electrically connects the first wire 70 electrically connecting the light emitting chip 10 and the first electrode 30 to the light emitting chip 10 and the second electrode 40. It further comprises a second wire (80).

The first electrode 30 includes a positive electrode connection pad 32 connected to an external positive electrode terminal (not shown), and a positive electrode 31 connected to the positive electrode connection pad 32. The anode connection pad 32 is formed in a predetermined region of the side wall portion and the lower portion of the housing 25. In order to facilitate connection with the positive electrode terminal, the side wall portion of the housing 25 may be recessed to form the positive electrode connection pad 32 in the recessed interior. It is effective to reduce the electrical resistance by forming a plurality of positive electrode connection pads 32 to increase the contact area between the positive electrode terminal and the positive electrode 31. The positive electrode 31 may be formed in a predetermined region above the housing 25 and may be electrically connected to the light emitting chip 10 through the first wire 70. The predetermined region refers to an upper portion of the region in which the anode connecting pad 32 is formed.

The second electrode 40 includes a negative electrode connection pad 42 connected to an external negative electrode terminal (not shown) and a negative electrode 41 connected to the negative electrode connection pad 42. The negative electrode connection pad 42 may be formed in a predetermined region of the side wall and the lower side opposite to the side wall of the housing 25 in which the first electrode 30 is formed. In order to facilitate connection with the negative electrode terminal, the side wall portion of the housing 25 may be recessed to form a negative electrode connection pad 42 in the recess. It is effective to reduce the electrical resistance by forming a plurality of negative electrode connection pads 42 to widen the contact area between the negative electrode terminal and the negative electrode 41. The negative electrode 41 may be formed in a predetermined region above the housing 25 and may be electrically connected to the light emitting chip 10 through the second wire 80. The predetermined region refers to the upper portion of the region where the negative electrode connection pad 42 is formed.

All components of the first and second electrodes 30 and 40 described above are formed of a thermally conductive material including a metal.

The light emitting diode described above uses a thermally conductive resin having excellent thermal conductivity as the heat sink 50 for dissipating heat, and is mounted in the through-hole of the substrate 20 by using an insert injection method.

In addition, the heat sink 50 of the thermal conductive resin may be formed in a structure in which the light emitting chip 10 may be mounted on a plane, and the luminance and the light collecting ability of the light emitted from the light emitting chip 10 may be improved.

For example, the heat sink 50 of the thermally conductive resin of the present invention has an upper cylinder having a diameter larger than that of the lower cylinder and the lower cylinder having a diameter and width similar to the diameter and width of the through hole as shown in FIGS. 5 and 6. It is configured as, but to have a recessed region of the truncated conical shape from the upper portion of the upper cylinder to a predetermined region of the lower cylinder. The conical recessed region described above serves as a reflector reflecting light of the light emitting chip 10. Accordingly, the truncated recessed region may be formed to have a slope of 30 to 60 ° to improve the brightness and the light collecting ability of the light. In addition, the light emitting chip 10 may be mounted under the truncated recessed region.                     

As described above, the light emitting diode of the present invention uses heat conductive resin as a heat sink to effectively dissipate heat generated from the light emitting chip and reduce stress caused by heat generation of the LED.

In addition, as described above, the heat-conducting resin is used as the heat sink in the light emitting diode to effectively dissipate heat emitted from the light emitting chip. However, the heat dissipation effect can be further enhanced by additionally combining an external heat sink.

The light emitting diode package of the present invention is not limited to the above-described embodiment, but may be applied and formed in various ways.

As described above, the light emitting diode of the present invention can effectively emit heat generated from the light emitting chip 10 by using the heat sink 50 using the thermally conductive resin, can improve the manufacturing process, and also has the structure of the light emitting diode. It can be formed thin. In addition, the heat sink 50 may be formed in a reflective structure to improve light emission efficiency of the light emitting chip 10, and an optical lens 90 may be formed on the thermosetting polymer resin to increase light intensity.

As described above, the present invention forms a light emitting diode including a heat sink of a thermally conductive resin, thereby effectively dissipating heat of the light emitting chip to the outside without using a separate slug and a metal plate.

In addition, by using a heat sink formed of a reflective structure it is possible to effectively emit heat generated by the light emitting chip to the outside, it is possible to improve the brightness of the light.

Claims (7)

A substrate comprising an upper surface and a lower surface; First and second electrodes spaced apart from each other on the substrate; A light emitting chip electrically connected to the first electrode and the second electrode; It includes a molding formed over the entire area of the upper surface of the substrate, The first electrode includes a positive electrode connection conductive material vertically extending from an upper surface of the substrate to a bottom surface of the substrate, and a positive electrode formed on the upper surface of the substrate and in contact with an upper end of the positive electrode connection conductive material, The second electrode includes a negative electrode conductive material vertically from an upper surface of the substrate to a bottom surface of the substrate, and a negative electrode formed on an upper surface of the substrate and in contact with an upper end of the negative electrode conductive material, The light emitting chip is mounted on at least one of an upper surface of the positive electrode, an upper surface of the negative electrode, and an upper surface of the substrate, An upper part of the molding part is integrally formed with a protruding optical lens for directly placing the light emitting chip. And the positive electrode and the negative electrode include straight portions parallel to each other, wherein the straight portions are positioned outside a region directly under the optical lens. The light emitting diode of claim 1, wherein the substrate comprises Al 2 O 3 , and the first electrode and the second electrode comprise Cu. The bottom surface of the substrate is a portion of the first electrode connected to the conductive material for the positive electrode connection, a portion of the second electrode connected to the conductive material for the negative electrode connection, and the heat sink further included in the substrate Light-emitting diode, characterized in that present. delete delete The light emitting diode of claim 1, wherein the substrate is formed of a material in which a thermal conductive resin and a thermal conductivity enhancer are mixed. The method of claim 6, The heat conduction enhancer is at least one of Al 2 O 3 , MgO, ZnO, SiO 2 , Bn, AlN, SiC and Si 3 N 4 .
KR1020040102293A 2004-12-07 2004-12-07 Light emitting diode KR101161396B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014129853A1 (en) * 2013-02-21 2014-08-28 주식회사 씨엘포토닉스 Led lighting module

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100845041B1 (en) * 2006-12-29 2008-07-09 서울반도체 주식회사 Lens, light emitting diode and lighting apparatus having the same
KR100940985B1 (en) * 2007-09-03 2010-02-05 알티전자 주식회사 Lighting module using light emitting diode

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150967A (en) * 1998-11-05 2000-05-30 Agilent Technol Inc Surface-mountable led package
JP2003318448A (en) * 2002-02-19 2003-11-07 Nichia Chem Ind Ltd Light emitting device and its forming method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150967A (en) * 1998-11-05 2000-05-30 Agilent Technol Inc Surface-mountable led package
JP2003318448A (en) * 2002-02-19 2003-11-07 Nichia Chem Ind Ltd Light emitting device and its forming method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014129853A1 (en) * 2013-02-21 2014-08-28 주식회사 씨엘포토닉스 Led lighting module
US9502626B2 (en) 2013-02-21 2016-11-22 Clphotonics Co., Ltd. LED lighting module

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