KR101151568B1 - Apparatus for receiving chemical - Google Patents

Abstract

PURPOSE: An apparatus for receiving a chemical solution is provided to prevent the malfunction of an auto valve for draining a chemical solution in a bath by including a filtration part and filtering precipitates included in the chemical solution. CONSTITUTION: A bath(10) includes a bottom plate(11) and a plurality of sidewalls(12). The bottom plate is arranged in a lower portion of the bath. One or more drain holes(13) are formed on the bottom plate. The drain holes are connected to a drain line. A filtration part(20) is arranged on an upper side of the bottom plate.

Description

Chemical liquid accommodation device {APPARATUS FOR RECEIVING CHEMICAL}

An embodiment relates to a drug receiving device.

In general, a wafer made of single crystal silicon for semiconductor device manufacturing grows single crystal ingots, and then slices, chamfers, lappings, etchings, grindings, and polishes them. It is manufactured through a series of processes such as polishing and washing and drying. These processes may change the order of some processes, repeat several times, or add or substitute other processes, such as heat treatment, depending on the specifications of the wafer and the purpose of the process.

Among the above processes, the etching process is performed to remove the mechanically degraded layer generated during mechanical processing such as slicing, chamfering, lapping and grinding and to remove organic substances or contaminants adsorbed on the surface. It is divided into etching and alkali etching.

In general, a wafer etching apparatus includes an etching bath in which a wafer is stored, an etching solution is supplied, and an etching process is performed, a wafer rack supporting a plurality of wafers in an etching bath, and a wafer rack disposed below the wafer rack. It consists of an etching liquid supply pipe etc. which supply an etching liquid upward toward a mounted wafer. By the way, the etching liquid supplied upward from the etching tank below by the etching liquid supply pipe is not uniformly and stably supplied to the plurality of wafers loaded in the wafer rack, thereby forming a turbulent flow, whereby the wafer storage position or position in the wafer is formed. This causes non-uniform etching and consequently degrades the wafer flatness after etching.

In addition, impurities or by-products generated during the etching process may remain, and these impurities or by-products may be re-adsorbed onto the wafer and become a pollution source that contaminates the wafer. In particular, the etching rate may not be smoothly circulated and drained from the etching bath due to the impurities or by-products generated in the process having a very high etching rate.

Embodiments provide a chemical liquid receiving device that is easy to drain and prevents clogging of drain holes.

According to an embodiment, a chemical liquid receiving apparatus includes: a bath including a bottom plate having a drainage hole and a sidewall extending upward from the bottom plate; And a filtration unit disposed on the bottom plate and including a plurality of filtration holes.

The chemical liquid container according to the embodiment drains the chemical liquid after the cleaning process or the etching process. At this time, the precipitate contained in the chemical liquid is filtered by the filtration unit. Accordingly, through the drain hole, the chemical liquid can be easily drained, and clogging of the drain hole can be prevented.

In addition, since the filtration unit filters out deposits contained in the chemical liquid, failure of the automatic valve 40 for draining the chemical liquid in the bath may be prevented.

In addition, the filtration unit is detachable from the bath, the precipitate contained in the chemical can be easily removed.

1 illustrates a wafer etching apparatus according to an embodiment.
2 is a cross-sectional view showing a wafer etching apparatus according to an embodiment.
3 is a plan view of the filtration unit.
4 is a cross-sectional view taken along line AA ′ of FIG. 3.
FIG. 5 is a cross-sectional view taken along line BB ′ in FIG. 3.
6 is a perspective view showing a lower portion of the filtration unit.
7 is a view illustrating a process in which the filtration unit is detached from the bath.
8 is a view showing the front of the jig.
9 is a view showing the side of the jig.

In the description of the embodiment, each pad, plate, wafer (W) or region, etc. are formed on the "on" or "under" of each pad, plate, wafer (W) or region, etc. In the case described, "on" and "under" include both those that are formed "directly" or "indirectly" through other components. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 illustrates a wafer etching apparatus according to an embodiment. 2 is a cross-sectional view showing a wafer etching apparatus according to an embodiment. 3 is a plan view of the filtration unit. FIG. 4 is a cross-sectional view taken along line AA ′ in FIG. 3. FIG. 5 is a cross-sectional view taken along line BB ′ in FIG. 3. 6 is a perspective view showing a lower portion of the filtration unit. 7 is a view illustrating a process in which the filtration unit is detached from the bath. 8 is a view showing the front of the jig. 9 is a view showing the side of the jig.

1 to 9, the wafer etching apparatus according to the embodiment includes a bath 10 and a filtration unit 20. In addition, the bath 10 is connected to the drain line 30, the drain line 30 is provided with an automatic valve 40. In addition, the drain line 30 is connected to the main line 50.

In addition, the wafer etching apparatus according to the embodiment may further include a recycling apparatus connected to the drain line 30, regenerating the chemical liquid drained through the drain line 30, and supplying the chemical liquid back to the bath 10. Can be.

The bath 10 accommodates the filtration unit 20. The bath 10 accommodates a wafer W and a chemical liquid for processing the wafer W. In more detail, the bath 10 may accommodate the wafer W and an etchant for etching the wafer W.

An example of the etchant may be a light etchant. The light etchant may include hydrofluoric acid, nitric acid, chromium oxide, copper nitrate and acetic acid. That is, the light etchant may be a solution containing the material.

When the wafer W is etched by the light etchant, a material included in the light etchant may react with silicon of the wafer W to form a precipitate. The precipitate is present in the bath 10 in a mixed state with the chemical liquid.

In addition, the bath 10 may accommodate the wafer (W) and a cleaning liquid for cleaning the wafer (W). That is, the chemical liquid contained in the bath 10 may be a cleaning liquid for cleaning the wafer W such as deionized water.

As shown in FIGS. 1 and 2, the bath 10 includes a bottom plate 11 and a plurality of sidewalls 12.

The bottom plate 11 is disposed below the bath 10. The bottom plate 11 supports the filtration unit 20. One or more drain holes 13 are formed in the bottom plate 11. The drain holes 13 are connected to the drain line 30. The diameter of the drain holes 13 may be about 40 mm to about 41 mm.

The sidewalls 12 extend upward from the bottom plate 11. In more detail, the side walls 12 may extend upward from an end of the bottom plate 11. A space for accommodating the wafer W and the chemical liquid may be formed by the sidewalls 12 and the bottom plate 11.

The filtration unit 20 is disposed in the bath 10. In more detail, the filtration unit 20 is disposed on the bottom plate 11. In more detail, the filtration unit 20 is disposed on the top surface of the bottom plate 11. In addition, the filtration unit 20 covers the drainage holes 13.

As shown in FIGS. 3 to 6, the filtration unit 20 includes a filtration plate 100, a plurality of spacers 200, an outer block unit 300, an inner block unit 400, and a locking unit 500. And a precipitate guide portion 600.

The filtration plate 100 is spaced apart from the bottom plate 11 at a predetermined interval. A plurality of filtration holes 110 are formed in the filtration plate 100.

The filtration plate 100 may filter the precipitate generated in the etching process or the cleaning process of the wafer (W). That is, the precipitate is filtered by the filtration plate 100, and only the chemical liquid may pass through the filtration holes 110.

In particular, a large amount of impurities may be generated when the wafer W is etched through the light etching process using the light etchant. In order to effectively filter out such impurities, the diameter of the filtration holes 110 may be about 4 mm to about 6 mm.

In addition, the filtration holes 110 may be spaced apart from each other at regular intervals, and the distance between the filtration holes 110 may be about 30 mm to about 31 mm.

In addition, two jig guide holes 120 may be formed in the filtration plate 100. The jig guide holes 120 may be spaced apart from each other and formed at both ends. The jig guide holes 120 may expose the top surface of the bottom plate 11.

The spacers 200 are interposed between the filtration plate 100 and the bottom plate 11. The spacers 200 space the filter plate 100 from the bottom plate 11. In particular, the spacers 200 space the filter plate 100 and the bottom plate 11 from each other at predetermined intervals.

The spacers 200 have an island shape. The spacers 200 may have a thickness of about 9 mm to about 9.5 mm. Accordingly, the distance between the filtration plate 100 and the bottom plate 11 may be about 9 mm to about 9.5 mm. The spacers 200 are spaced apart from each other. The spacers 200 may be integrally formed with the filtration plate 100.

The outer block portion 300 extends downward from the filtration plate 100. In more detail, the outer block portion 300 extends downward from the outer side of the filtration plate 100. The outer block part 300 extends along the outer side of the filtration plate 100.

As a result, the outer block part 300 surrounds the circumference of the filtration holes 110. In addition, the outer block part 300 surrounds the jig guide holes 120. That is, the filtering holes 110 and the jig guide holes 120 are disposed in the space defined by the outer block part 300.

In addition, the outer block part 300 extends along the circumference of the drainage holes 13. That is, the outer block part 300 surrounds the drainage holes 13. The drainage holes 13 are disposed in a space defined by the outer block portion.

The thickness of the outer block portion 300 may be substantially the same as the thickness of the spacers 200. In addition, the outer block part 300 may be integrally formed with the filtration plate 100. In addition, the outer block part 300 may directly contact the upper surface of the bottom plate 11.

The outer block part 300 may have a closed loop shape. The outer block part 300 prevents the chemical liquid from flowing between the filtration plate 100 and the bottom plate 11 without passing through the filtration holes 110. That is, the precipitate is prevented from flowing between the bottom plate 11 and the filtration plate 100 together with the chemical liquid.

The inner block portion 400 is formed around the jig guide holes 120. The inner block portion 400 surrounds each jig guide hole 120. The inner block portion 400 is in direct contact with the top surface of the bottom plate 11. In addition, the inner block portion 400 may be integrally formed with the filtration plate 100.

The thickness of the inner block portion 400 may be substantially the same as the thickness of the outer block portion 300 and the thickness of the spacers 200. The inner block part 400 prevents the chemical liquid and the precipitate from flowing into the space between the filtration plate 100 and the bottom plate 11 through the jig guide holes 120.

By the outer block portion 300 and the inner block portion 400, most of the chemical liquid is introduced between the filtration plate 100 and the bottom plate 11 through the filtration holes 110.

The locking part 500 is defined by the inner block part 400 in the filtering plate 100. That is, the inner block portion 400 is formed outside the jig guide holes 120. Accordingly, the inner block portion 400 is spaced apart from the inner surface 121 of each jig guide hole 120 at predetermined intervals.

That is, the locking portion 500 is a portion between the inner block portion 400 and the inner surface 121 of each jig guide hole 120. The catching part 500 is a portion adjacent to the jig guide holes 120.

The precipitate guide portion 600 extends upward from the filter plate 100. The precipitate guide portion 600 extends along the periphery of the filtration plate 100. The deposit guide part 600 may have a closed loop shape when viewed from the top side.

The deposit guide part 600 may be formed with through holes 610 penetrating sideways. The through holes 610 may be spaced apart from each other at a predetermined interval.

The precipitate guide may prevent the precipitate on the filtration plate 100 from flowing into the bath 10 when the filtration unit 20 is detached from the bath 10. In addition, the chemical liquid remaining in the filtering plate 100 may be easily discharged through the through holes 610.

The filtration unit 20 has high chemical resistance. Examples of the material used as the filtration unit 20 include plastics such as polytetrafluoroethylene (PTFE) and the like.

The filtration unit 20 may be easily detached and mounted to the bath 10. In more detail, the filtration unit 20 may be easily detached using the jig 80, as shown in FIG. 7.

8 and 9, the jig 80 may include a first jig body 81, a second jig body 82, a first grip part 83, a second grip part 84, and a rotation center 85. It includes.

The first jig body 81 and the second jig body 82 are pivotally coupled to each other by the rotation center 85. The first jig body 81 and the second body may be rotated about the rotation center 85 so as to cross each other.

The first grip portion 83 is disposed at the end of the first jig body 81, and the second grip portion 84 is disposed at the end of the second jig body 82. The first grip part 83 and the second grip part 84 may have a 'b' shape to be caught by the locking part 500. In addition, the first grip part 83 may be integrally formed with the first jig body 81, and the second grip part 84 may be integrally formed with the second jig body 82.

The rotation center 85 may pass through the first jig body 81 and the second jig body 82. In addition, the rotation center 85 may be coupled so that the first jig body 81 and the second jig body 82 can be rotated with each other. The rotation center 85 may be fastened to an intermediate portion of the first jig body 81 and the second jig body 82.

The jig 80 has high chemical resistance. Examples of the material used for the jig 80 may include plastics such as polytetrafluoroethylene and the like.

Referring to FIG. 7, the jig 80 may be inserted into the jig guide holes 120 and may grip the filtration part 20 through the locking part 500. In more detail, the first grip part 83 is inserted into one jig guide hole, and the second grip part 84 is inserted into another jig guide hole.

Thereafter, the first jig body 81 and the second jig body 82 are rotated, and the filtration unit 20 may be gripped by the jig 80.

Then, by the user's operation, through the jig 80, the filter unit 20 is separated from the bath (10). At this time, the chemical liquid remaining in the bath 10 may be fatal to the health of the user, for the safety of the user, the jig 80 is used, the filtration unit 20 should be removed. In particular, since the chemical liquid such as the light etchant may be fatal to the user, the jig 80 is further needed.

In the wafer etching apparatus according to the embodiment, the precipitates generated in the etching process of the wafer W may be effectively filtered using the filtration unit 20.

Accordingly, the wafer etching apparatus according to the embodiment may prevent the deposit from blocking the inlet of the drain holes 13. In addition, the wafer etching apparatus according to the embodiment may also prevent a phenomenon that the deposit flows into the automatic valve 40 and interferes with the operation of the automatic valve 40.

In addition, the wafer etching apparatus according to the embodiment uses the jig guide holes 120, the catching part 500, and the jig 80 to effectively detach the filtration part 20 and efficiently deposit the precipitate. Can be removed

As described above, the chemical liquid may be a cleaning liquid for cleaning the wafer (W). Therefore, the main components of the wafer etching apparatus according to the embodiment may be modified and applied to the wafer cleaning apparatus for cleaning the wafer (W). More broadly, the wafer etching apparatus according to the embodiment is a chemical liquid containing device for accommodating the chemical liquid.

In addition, the features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Claims (9)

A bath including a bottom plate having a drain hole and sidewalls extending upwardly from the bottom plate; And
A filtration unit disposed on the bottom plate and including a plurality of filtration holes,
The filtration unit
A chemical solution containing device including an outer block portion surrounding the drain hole. The method of claim 1, wherein the filtration unit
A filtration plate in which the filtration holes are formed; And
And a spacer interposed between the filtration plate and the bottom plate. The chemical liquid container according to claim 2, wherein a distance between the filter plate and the bottom plate is 9 mm to 9.5 mm. delete delete A bath including a bottom plate having a drain hole and sidewalls extending upwardly from the bottom plate; And
A filtration unit disposed on the bottom plate and including a plurality of filtration holes,
The filtration unit
A filtration plate in which the filtration holes are formed; And
An inner block portion interposed between the filtration plate and the bottom plate,
The filter plate includes a jig guide hole for exposing the bottom plate,
And the inner block part surrounds the jig guide hole. 7. The chemical liquid containing device according to claim 6, wherein the inner block portion is spaced apart from the inner surface of the jig guide hole at a predetermined interval to form a catch portion in the filter plate. The chemical liquid container according to claim 6, wherein the inner block portion has a closed loop shape. According to claim 1, wherein the diameter of the filtration hole is a chemical liquid containing device 4mm to 6mm.

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