KR101123624B1 - Semiconductor manufacturing apparatus - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, comprising: a first processing module and a first module disposed at an acute angle with the first side and the second side, respectively, between a transfer module and a second side adjacent to the first side of the transfer module. 2 provides a semiconductor manufacturing apparatus including a process module and a load lock chamber connected to a third side of the transfer module. Here, the first and second process modules are preferably arranged parallel to each other. As such, by adhering or adhering adjacent process modules to each other, the area of semiconductor manufacturing equipment can be reduced without a change in production efficiency, and the source supply unit can be extended in the direction of the approaching surface to which adjacent process modules are accessed, thereby forming various types of semiconductor devices. The source material can be effectively provided to the manufacturing apparatus.

Transfer Module, Process Module, Access, Reaction Chamber, Cooling Chamber

Description

Semiconductor manufacturing apparatus

1 is a schematic view for explaining a semiconductor manufacturing apparatus according to the prior art.

2 is a schematic view for explaining a semiconductor manufacturing apparatus according to the present invention.

3 is a conceptual diagram illustrating an arrangement of a process module according to the present invention.

4A and 4B are conceptual views illustrating the structure of a process module.

5 to 7 are schematic views for explaining a semiconductor manufacturing apparatus according to another embodiment of the present invention.

8 and 9 are cross-sectional views illustrating a semiconductor manufacturing apparatus in accordance with still another embodiment of the semiconductor manufacturing apparatus according to the present invention.

<Explanation of symbols for the main parts of the drawings>

10, 110: transfer module 20, 120: load lock chamber

30, 130: process module 32, 132: reaction chamber

34, 134: control unit 36, 136: source supply unit

40, 140: cooling chamber 45, 145: transfer robot arm

133: gas supply control unit 135: drive control unit

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a semiconductor manufacturing apparatus capable of efficiently arranging between a process chamber and a transfer chamber to create the same production efficiency in a semiconductor manufacturing apparatus occupying a smaller area.

In general, a semiconductor manufacturing apparatus used for manufacturing a semiconductor device is mainly used during the deposition of a semiconductor film using a vapor deposition or sputtering method on the semiconductor substrate, an etching process for forming a pattern, or an exposure process.

1 is a schematic view for explaining a semiconductor manufacturing apparatus according to the prior art.

As shown in FIG. 1, a conventional semiconductor manufacturing apparatus includes a transfer module 10 provided with a transfer robot arm 45 at a central portion thereof, each of which is predetermined in the circumferential direction of the transfer module 10. A plurality of process modules (30: 30a, 30b) in which a predetermined environment for manufacturing a semiconductor chip is set at a distance apart from each other is placed, and the substrates waiting for or performing the process are waiting for the process. The load lock chamber 20 is disposed in the circumferential direction of the transfer module 10. In addition, the cooling chamber 40 for cooling may be arranged in the outer circumferential direction of the transfer module.

The process module 30 includes a reaction chamber 32 in which a process for manufacturing a semiconductor chip is performed, a control unit 34 for controlling the operation of the process module 30, and a source supply unit 36 for supplying a separate source. )

Such a conventional semiconductor manufacturing apparatus is described in detail in Korean Unexamined Patent Publication No. 2000-20876 and Korean Utility Model Publication No. 1996-8156.

However, in the conventional semiconductor manufacturing apparatus having the above-described structure, a plurality of process modules 30a and 30b are disposed in the outer circumferential direction of the transfer module 10, and each of the process modules 30a and 30b has the center of the transfer module. As a reference, they are spaced apart in the form of 'V'. For this reason, the area occupied by the semiconductor manufacturing apparatus is large and there is a limit to the number of semiconductor manufacturing apparatuses installed in the same area. There is a problem that a sufficient space of the region for the equipment must be secured in order to obtain a target production efficiency. In addition, when the source supply part used according to various process conditions is expanded, the area which a semiconductor manufacturing apparatus occupies becomes large. As described above, in the conventional semiconductor manufacturing apparatus, there are many restrictions in the expansion of the source supply unit.

Accordingly, the present invention can facilitate the expansion of the source supply by in close contact with adjacent process modules located on the outer periphery of the transfer module to solve the above problems, and reduces the autonomous space, that is, the area more than the prior art It is an object of the present invention to provide a semiconductor manufacturing apparatus capable of producing the same production efficiency as in the prior art in a small area.

A first process module and a second process module and the transfer module and the transfer module according to the present invention disposed at an acute angle with the first side and the second side, respectively, between a first side and an adjacent second side of the transfer module. A semiconductor manufacturing apparatus including a load lock chamber connected to a third side of a module is provided.

Here, it is preferable to form an angle of 10 to 90 degrees with the long axis direction of the first side and the second side, the first process module and the second process module. At this time, it is effective that the interval between the first process module and the second process module is 30 cm or less.

In addition, the first side and the second side between the plurality of transfer modules disposed spaced apart from each other, the first side of each of the plurality of transfer modules, and the second side adjacent to the first side and Provided is a semiconductor manufacturing apparatus including a load lock chamber connected to a first process module, a second process module, and a third side surface of each of the plurality of transfer modules disposed at an acute angle, respectively.

In addition, the transfer module according to the present invention is connected to the first side and the second side of the transfer module, the first process module and the second process module and parallel to each other are connected to the third side of the transfer module Provided is a semiconductor manufacturing apparatus including a load lock chamber.

Here, it is effective that the first process module and the second process module are parallel and spaced at equal intervals in the major axis direction.

The transfer module is preferably a circular or polygonal shape. In addition, it is effective that the sum of the widths of the first process module and the second process module is equal to or larger than the width of the transfer module. Preferably, the transfer module further includes a slot valve between the first process module, the second process module, and the load lock chamber.

The first process module and the second process module may include a reaction chamber, a gas supply controller for supplying gas to the reaction chamber, and a drive control unit for driving the first process module and the second process module. And a source supply for supplying a source material to the reaction chamber.

It is effective that the distance between the first process module and the second process module is 30 cm or less.

In addition, a plurality of transfer modules disposed in parallel to each other according to the present invention, the first and second process modules and the plurality of first and second processing modules disposed in parallel to each other on the first side and the second side of each of the plurality of transfer modules A plurality of semiconductor manufacturing apparatuses including a load lock chamber connected to a third side of each transfer module are provided.

Here, the plurality of first process modules and the second process modules connected to the plurality of transfer modules are preferably parallel to each other.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention in more detail. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Like numbers refer to like elements in the figures.

2 is a schematic view for explaining a semiconductor manufacturing apparatus according to the present invention.

Referring to FIG. 2, the semiconductor manufacturing apparatus of the present invention includes a transfer module 110 and at least two process modules 130 (130a and 130b) disposed at an outer periphery of the transfer module 110, but adjacent to the process module. 130 are arranged adjacent to each other. In addition, the semiconductor manufacturing apparatus of the present invention may further include a cooling chamber 140 for cooling the substrate, and further includes a load lock chamber 120 waiting for process execution or waiting for completed substrates. can do. In addition, a slot disposed at the interface between the flat zone aligner (not shown), the substrate storage elevator (not shown), the transfer module 110 and the process module 130 to align the flat zone of the substrate for performing the process. Slit Valve (not shown) may optionally further include.

The transfer module 110 is located at the center of the semiconductor manufacturing apparatus and loads or unloads the substrate waiting in the load lock chamber 120 to the process modules 130a and 130b. To this end, the transfer module 110 includes a transfer robot arm 145, which loads a substrate waiting in the load lock chamber 120 to the process module 130, and loads the processed substrate into the load lock chamber 120. Unload with). In addition, in the present invention, the shape of the outer periphery of the transfer module 110 may be manufactured in a polygonal shape including a quadrangle, a pentagon, a hexagon, an octagon, or a circular or elliptical shape. In this embodiment, it is preferable to manufacture the transfer module 110 in a hexagonal shape as shown in FIG. The load lock chamber 120 is disposed at the lower two outer peripheries of the transfer module 110 having the outer periphery of the hexagon, and two process modules are disposed at the two outer peripheries facing the outer periphery of the load lock chamber 120. 130a and 130b) are disposed respectively. The arrangement of the process module 130 will be described later. In addition, the cooling chamber 140 is disposed at another outer periphery (the area between the process module and the load lock chamber) of the transfer module 110. In addition, a plurality of the transfer robot arm 145 may be configured to load / unload substrates into different process chambers 130.

Each of the process modules 130 includes a reaction chamber 132 in which a predetermined process for manufacturing a semiconductor device is performed, a drive controller 134 for controlling operations of the process modules 130a and 130b, and a reaction chamber. And a source supply unit 136 for supplying a separate source according to the reaction process performed in 132. Moreover, it further comprises a separate exhaust unit for exhausting the gas of the chamber to the outside. The apparatus may further include an RF power generator for generating a plasma in the reaction chamber.

Here, the reaction chamber 132 may be a deposition chamber for depositing a predetermined semiconductor film on at least one substrate or a patterning chamber for predetermined patterning. An etching chamber and an ashing chamber are used as the patterning chamber, and various deposition chambers may be used as the deposition chamber depending on the semiconductor film. The present invention is not limited thereto, and various chambers for manufacturing a semiconductor device may be used. For example, a chamber for exposure can be used.

The reaction chamber 132 of the present embodiment is fabricated so as to deposit or pattern a semiconductor film on four substrates simultaneously as shown in FIG. 2. The control unit 134 includes a driving control unit for driving the process modules 130a and 130b and a gas supply control unit for supplying gas to the reaction chamber 132. This will be described later.

In order to connect the process module 130 and the transfer module 110, the above-described slot valve is connected to the process module 130, and the other surface thereof is connected to the outer periphery of the transfer module 110.

Process modules 130 of the present invention are disposed adjacent to each other inclined in a direction adjacent to the adjacent process module 130. In this case, adjacent first and second process modules 130a and 130b may be disposed to have a space of about 0 to 100 cm. That is, as shown in FIG. 2, the first and second process modules 130a and 130b may be disposed to be in close contact with each other, or may be disposed to be spaced a predetermined interval apart. Preferably, the largest spaced areas of the neighboring first and second process modules 130a and 130b have a space of 50 cm or less and face each other horizontally. More preferably, a space of 30 cm or less is effective. Even more preferably, a space of 20 cm or less is preferable. With such a space, maintenance work can be easily performed. In this case, when the spaced space becomes too wide, a problem may occur that the area efficiency of the semiconductor manufacturing apparatus of the present invention decreases.

Hereinafter, the arrangement of the process module 130 and the structure of the process module will be described with reference to the drawings.

3 is a conceptual diagram illustrating an arrangement of a process module according to the present invention, and FIGS. 4A and 4B are conceptual views illustrating a structure of a process module.

As shown in FIG. 3, the conventional process module is disposed such that an angle θ3 formed between the longitudinal line of the transfer module 110 and the outer periphery of the transfer module 110 on which the process module 130 is disposed is perpendicular to each other. It was formed to spread.

On the other hand, in the present invention, the first and second process modules 130a and 130b are respectively connected to the first side and the second side between the first side of the transfer module 110 and the second side adjacent to the first side. It is arranged at an acute angle.

It is preferable that an angle θ4 formed between a line in the longitudinal direction of the process module 130, that is, a line in the long axis direction, and the side surface of the transfer module 110 connected thereto is an acute angle. Through this, the neighboring process module 130 may be arranged to approach. It is preferable that the angle (theta) 4 which the line and the side surface of the said longitudinal direction make is 10-90 degree. More preferably, it is 35-60 degrees. When the angle θ4 formed between the longitudinal line and the side surface is smaller than the above range, the first and second process modules 130 overlap each other so that the process module 130 cannot be disposed on the side of the transfer module 110. If larger than the above range, the effect of saving space is inferior. Each setting within the above range may vary in accordance with the shape of the transfer module 110 of the lower. In this case, the load lock chamber 120 is connected to the third side surface of the transfer module 110.

The process modules 130 of the present invention are disposed such that two process modules 130a and 130b are adjacent to each other and adjacently symmetric with each other. That is, adjacent first and second process modules 130a and 130b are manufactured in mirror symmetry with respect to each other. For example, the inlet on which the substrate of the first process module 130a is loaded is on the right side, while the inlet on which the substrate of the second process module 130b is loaded is on the left side. Of course, the two adjacent process modules 130 may be arranged to be in close contact with each other in the direction of the vertex formed by the adjacent outer periphery. In addition, the first and second process modules 130a and 130b are preferably spaced apart at equal intervals in the major axis direction and arranged in parallel with each other.

Meanwhile, the widths of the adjacent first and second process modules 130a and 130b (ie, the transverse widths in the drawing) of the transfer module 110 are disposed below the first and second process modules 130a and 130b. Form greater than or equal to width. Through this, the size of the substrate seated in the process modules 130a and 130b may be increased, and a plurality of substrates may be seated in one chamber. However, when the transfer module 110 is large, the area gain, which is an effect of the present invention, cannot be obtained.

In addition, slot valves connected to each of the adjacent first and second process modules 130a and 130b and adjacent to each other form a predetermined angle. That is, the slot valves connected to each of the accessed first and second process modules 130a and 130b are arranged to have an internal angle of 60 to 170 degrees. Preferably, the connection between the two slot valves has an internal angle of 110 to 150 degrees. Thereby, the transfer of the substrate can be easier than when arranged in parallel. To this end, as described above, the first and second process modules 130a and 130b should be approached.

In addition, as mentioned above, the angle θ1 between one surface of the conventional process module and the transfer module was maintained at about 90 degrees. However, in the present invention, the inner angle θ2 between the access surfaces of the first and second process modules 130a and 130b and the outer periphery of the transfer module has an angle greater than 90 degrees. On the other hand, since the first and second process modules 130a and 130b are approaching, the internal angle θ formed between the access surface and the outer periphery cannot be widened indefinitely. Therefore, the cabinet can be made 90 to 165 degrees, preferably 100 to 150 degrees.

In the present invention, the cross-sectional shape of the process module 130 is manufactured in the shape of a pentagon, and the positions of the control unit 134 of FIG. 2 and the source supply unit 136 of FIG. . In addition, the location of wiring and piping located inside the process module was also changed. The position of the substrate support means on which the substrate is seated is also changed to adjust the angle formed with the robot arm of the transfer module.

As such, by placing the two process modules 130a and 130b closer to each other in the vertex direction, that is, the approach surface direction, spaces such as areas A and B of FIG. 3 may be saved. When the area (T1 x H1 in FIG. 1) of the conventional semiconductor manufacturing apparatus is 1, the area (T2 x H2 in FIG. 2) of the semiconductor manufacturing apparatus of the present invention is 0.4 to 0.8, which is about In the area corresponding to 40 to 80% can produce the same production efficiency as in the prior art. Specifically, the conventional semiconductor manufacturing apparatus is T1 = 3600mm and H1 = 2700mm, while the area of the semiconductor manufacturing apparatus of the present invention is T2 = 2000mm and H2 = 2800mm. When the conventional area is 100% as described above, the area of the present invention is about 58% to obtain the same production efficiency in a smaller area than the conventional one. In addition, as shown in FIG. 3, the position of the reaction chamber 132 may not be changed to minimize the change of the transfer robot arm 145. In addition, the cross-sectional shape of the process module 130 may be formed in a polygon.

As shown in FIGS. 4A and 4B, the driving controller 135 constituting the controller 134 and the gas supply controller 133 may be positioned in various shapes and structures in the peripheral region of the reaction chamber 132. That is, since the driving control unit 135 includes various electrical circuits and detection sensors, and the gas supply control unit 133 includes various valves and piping, the arrangement of the driving control unit 135 and the gas supply control unit 133 is It is not limited, It can arrange | position variously according to the characteristic and the objective. As described above, the driving control unit 135 and the gas supply control unit 133 are arranged to be mirror symmetric with each other in the two process modules 130a and 130b which are accessed, and accordingly, there are internal valves, piping, wiring, and the like. It is desirable to arrange the various components of symmetrical to each other.

In addition, in the present invention, the source supply unit 136 may be extended in the direction of the access surface, so that various source materials for forming a semiconductor device may be effectively provided to the manufacturing apparatus. The source supply unit 136 located in the edge regions of the first and second process modules 130a and 130b may be disposed in the access surface region, and may be disposed away from the access surface region. By maximizing the expandability of the source supply unit 136 may be performed a variety of processes in one process module 130.

5 to 7 are schematic views for explaining a semiconductor manufacturing apparatus according to another embodiment of the present invention.

As shown in FIGS. 5 to 7, the semiconductor manufacturing apparatus of the present embodiment is connected to first and second sides of the pentagonal and octagonal transfer module 110 and the transfer module 110 and is disposed in parallel with each other. And a load lock chamber 120 connected to the process module and the second process module 130a and 130b and the third side surface of the transfer module 110.

As shown in FIG. 5, the first and second process modules 130a and 130b are disposed to face each other between the first side of the octagonal transfer module 110 and the second side adjacent to the first side. To place. In this case, adjacent surfaces of the first and second process modules 130a and 130b are in close contact with each other. In addition, as shown in FIG. 6, the first and second process modules 130a and 130b are disposed in parallel to two adjacent outer peripheries of the pentagonal transfer module 110. In addition, as shown in FIG. 7, the first and second process modules 130a and 130b are disposed at two outer peripheries of the octagonal transfer module 110, and are formed to face each other in parallel. In this case, it is preferable that the interval between the first and second process modules 130a and 130b facing in parallel is 1 m or less. At this time, it is more preferable that the space | interval is 30 cm or less.

Hereinafter, other components are the same as in the embodiment described with reference to FIG.

Thus, the semiconductor manufacturing apparatus of this invention is not only limited to the shape of a transfer module, but is not limited to the kind and function of a process chamber. In addition, it is possible to maintain the same productivity as before with only 60% of the area as before, and various processes may be possible in one process chamber.

In addition, according to the present invention, a plurality of process modules and a transfer module may be arranged on a single line to place more process modules on the same area. This will be described with reference to the drawings, but descriptions overlapping with the above-described embodiments will be omitted.

8 and 9 are cross-sectional views illustrating a semiconductor manufacturing apparatus in accordance with still another embodiment of the semiconductor manufacturing apparatus according to the present invention.

8 and 9, a plurality of transfer modules 110-1 to 110-n to which at least two process modules 130a-1 to 130a-n (130b-1 to 130b-n) are connected. Place on one line. That is, the semiconductor manufacturing apparatus according to the present embodiment may include a plurality of transfer modules 110-1 to 110-n spaced apart from each other, a first side surface of each of the transfer modules 110-1 to 110-n, and A first process module 130a-1 to 130a-n and a second process module 130b-1 to an acute angle disposed between the first side and the second side, respectively, between the first side and the adjacent second side; 130b-n) and load lock chambers 120-1 to 120-n connected to third sides of the plurality of transfer modules 110-1 to 110-n, respectively.

In this case, the first process module 130a-1 to 130a-n and the second process module 130b-1 to 130b-are respectively disposed on the first side and the second side of each of the transfer modules 110-1 to 110-n. n) each of which is preferably arranged parallel to each other.

Here, the plurality of transfer modules (110-1 to 110-n) are arranged in sequence, and the first and second process modules (130a-1, 130b-1) connected to one transfer module (110-1) In this case, the process modules 130a-2 and 130b-2 connected to the transfer module 110-2 adjacent to the transfer module 110-2 may be disposed close to or in close contact with each other. More preferably, they are arranged parallel to each other. That is, as illustrated in FIG. 8, the first to nth transfer modules 110 in which the first process modules 130a-1 to 130b-n and the second process modules 130b-1 to 130b-n are adjacently connected to each other. -1 to 110-n are disposed continuously, and the first process module 130a- of the second process module 130b-1 and the second transfer module 110-2 of the first transfer module 110-1 is disposed. 2) in parallel.

In addition, for ease of maintenance management, the first and second process modules 130a-1 and 130b-1 connected to the source supply units 136-1 to 136-n to one transfer module 110-1 may be used. It may be placed at both ends. Of course, the second process module 130b-1 of the first transfer module 110-1 and the second process module 130b-2 of the second transfer module 110-2 are closely arranged, and then the source of each other It is possible to share the supply unit (136-1, 136-2).

This can dramatically reduce the layout space when multiple modules are deployed, allowing more equipment to be placed in the same area. That is, when the width of the conventional equipment is 1, the width of the equipment according to the present invention may be 0.6 to 0.95. Thus, for example, if 5 transfer modules connected to a conventional process module are continuously arranged, a length of 10 m is required, and the width of the equipment of the present invention is reduced by about 20% compared to conventional equipment. In the case of the equipment of the present invention, a space of 8 m is sufficient to continuously arrange five equipment. In addition, the number of equipment that can be arranged in a length of 10m is possible up to six, it is possible to significantly reduce the layout space of a plurality of modules, it is possible to place a larger number of equipment in the same area.

In addition, although the plurality of load lock chambers 120-1 to 120-n are shown to be separated from each other in the drawings, the present invention is not limited thereto, and the load lock chambers 120-1 to 120-n adjacent to each other are in close proximity and / or close contact with each other. Can be.

In addition to this, various arrangements of the process module and the transfer module are possible in the present invention. In FIG. 8, the process modules 130a-1 to 130a-n (130b-1 to 130b-n) and the transfer modules 110-1 to 110-n are disposed adjacent to each other in a vertical direction. That is, the plurality of process modules are arranged continuously in the upward direction of the transfer module 110-1. In contrast, in FIG. 9, the first process modules 130a-1 to 130a-n, the second process modules 130b-1 to 130b-n, and the transfer modules 110-1 to 110-n have a horizontal direction. It can be symmetrical.

The first and second process modules 130a-1 to 130a-n and the second process modules 130b-1 to 130b-n are sequentially disposed, and the transfer modules 110-1 to 110-n are sequentially arranged. The installation directions of the first and second process modules 130a-1 to 130a-n (130b-1 to 130b-n) are alternately arranged up and down. That is, the first and second process modules 130a-1 and 130b-1 of the first transfer module 110-1 are disposed in the upward direction, and the first and second of the second transfer module 110-2 are disposed. The process modules 130a-2 and 130b-2 are disposed downward, and the first and second process modules 130a-3 and 130b-3 of the third transfer module 110-3 are disposed upward again. Are arranged in succession.

At this time, maintenance of the equipment is performed to both the first process module 130a-1 to 130a-n and the second process module 130b-1 to 130b-n connected to the transfer modules 110-1 to 110-n. You can leave enough space for it.

As described above, the present invention may be disposed on the outer periphery of the transfer module, thereby approaching or in close contact with adjacent process modules, thereby reducing the area of semiconductor manufacturing equipment without changing production efficiency.

In addition, adjacent process modules can extend the source supply in the direction of approached access surfaces, thereby effectively providing various source materials for the fabrication of semiconductor devices to the manufacturing apparatus.

In addition, various processes may be performed in one process module.

Although described with reference to the embodiments, it will be understood by those skilled in the art that the present invention may be modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. .

Claims (13)

A transfer module; A first process module disposed on the first side of the transfer module; And A semiconductor manufacturing apparatus comprising; a second process module disposed on a second side adjacent to the first side; The first process module has a line in a longitudinal direction, the line making an acute angle with the first side surface, And the second process module has a line in a longitudinal direction, and the line forms an acute angle with the second side surface. The method according to claim 1, The first process module and the second process module is spaced apart and disposed in parallel to each other. The method according to claim 1, And the first process module and the second process module are disposed to be symmetrical with each other. The method according to claim 1, Each of the first process module and the second process module includes a gas supply controller, and each of the gas supply controllers is disposed to be symmetrical to each other. A transfer module; A first process module and a second process module connected to first and second side surfaces adjacent to each other of the transfer module and disposed parallel to each other in a longitudinal direction; And And a load lock chamber connected to the third side of the transfer module. The method according to claim 5, And the first process module and the second process module are parallel and spaced apart at equal intervals in the major axis direction. The method according to claim 5, The transfer module is a semiconductor manufacturing apparatus having a circular or polygonal shape. The method according to claim 5, And a sum of the widths of the first process module and the second process module is equal to or larger than the width of the transfer module. delete delete delete A plurality of transfer modules disposed in parallel to each other; A first process module and a second process module connected to a first side of each of the plurality of transfer modules and a second side adjacent to the first side and disposed in parallel to each other in a longitudinal direction; And A load lock chamber connected to a third side of each of the plurality of transfer modules; Semiconductor manufacturing apparatus comprising a. The method according to claim 12, And a plurality of the first process module and the second process module connected to the plurality of transfer modules are arranged in parallel with each other.

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