KR101119037B1 - Fpcb with extension and image sensor having the same - Google Patents

Abstract

PURPOSE: An FPCB(Flexible Printed Circuit Board) and an image sensor module including the same are provided to prevent a short by including an extension unit which surrounds a signal line. CONSTITUTION: A plurality of first pads(12) are formed on two edges of an FPCB(10). An extension unit(14a,14b) is symmetrical with a signal line of a PCB. The extension unit is formed on two outer sides of the plurality of the first pads and includes a first surface and a second surface. The first and second surfaces surrounds the signal line without exposure by bending.

Description

FPCB with extension and image sensor module including the same {FPCB WITH EXTENSION AND IMAGE SENSOR HAVING THE SAME}

The present invention relates to an FPCB and an image sensor module. More particularly, the present invention relates to an FPCB having an extension for preventing short circuits and an image sensor module including the same.

Currently, the frequency of digital cameras is increasing with the use of Internet video communication, and along with the necessity of a small camera module for using a small information communication terminal such as a mobile phone or a personal digital assistant (PDA) for video communication, etc. have. In other words, by directly or indirectly connected to the high-functionality and multi-functionality of the information communication terminal associated with the digital camera, the camera module is becoming more and more compact and lighter camera module.

With the miniaturization and lightening of electronic products including camera modules, flexible printed circuit boards (hereinafter referred to as "FPCBs") have been developed and used. FPCB has excellent workability, heat resistance, bending resistance, chemical resistance, and heat resistance, so it is the core parts of all electronic products such as camera, computer and peripheral, mobile phone, video & audio device, CAMCORDER, PRINTER, DVD, TFT LCD And, widely used in satellite equipment, military equipment, medical equipment, and the like, especially in the mobile phone is also used to connect the LCD module and the main board, in particular, the PCB with the image sensor (Image Sensor) and the main board.

1 is a plan view showing a conventional FPCB. As shown in FIG. 1, in general, the FPCB 1 is mounted with a PCB (Printed Circuits Board (hereinafter referred to as “PCB”)) at the top so that a plurality of first pads 3 may be soldered and bonded to the PCB. It is provided at the edge. In addition, in the case of a PCB mounted on the FPCB, all signal lines are designed to escape toward the edges in order to perform gold plating as a surface treatment for preventing an oxide film.

However, when the conventional FPCB is applied to the image sensor module, a terminal device such as a metal frame and a plated signal line of the PCB are short-circuited to cause a malfunction of the image sensor module. In order to overcome this problem, applying insulating tape is only a temporary measure, and it is necessary to provide a fundamental solution.

The present invention has been made in view of the necessity as described above, the present invention is intended to prevent the signal line of the PCB to the outside to be short-circuit in contact with the metal mechanism of the terminal.

The present invention, in the FPCB is coupled to the PCB mounted on the terminal, a plurality of first pads that can be coupled to the PCB is provided on the edge, formed around the plurality of first pads corresponding to the signal line of the PCB and the terminal Provided is an FPCB having an extension part that can wrap a signal line by bending when mounted.

In addition, the signal line may include a plating layer for preventing oxidation to the top.

The plating layer may be formed of gold plating.

The extension may be formed of polyimide.

In addition, the extensions may be formed in a pair so as to be symmetrical with each other.

In addition, the extension portion preferably has a thickness of 20 to 30 μm.

On the other hand, the present invention, the image sensor module mounted on the terminal, the image sensor for converting an optical signal into an electrical signal; A PCB coupled to the bottom of the image sensor, the PCB including a plurality of second pads wire-bonded with the image sensor and a signal line for transferring the converted electrical signals; And an FPCB having a plurality of first pads provided at an edge thereof, coupled to a lower portion of the PCB, and formed to correspond to the signal lines around the plurality of first pads and signal lines, and having an extension part which can wrap the signal lines by bending when mounted to the terminal. It provides an image sensor module comprising a.

The image sensor may be a CMOS sensor or a CCD device.

The signal line includes a plating layer for preventing oxidation to the top, and the plating layer may be formed of gold plating.

According to one embodiment of the present invention as described above, it is possible to prevent the signal line of the PCB is in contact with the metal mechanism of the terminal to short-circuit.

1 is a plan view showing a conventional FPCB,
2 is a plan view showing an FPCB of the present invention;
3 is an exploded perspective view showing an image sensor module of the present inventors;
4 is an exploded perspective view illustrating a state in which the image sensor module of the present invention is mounted on a metal frame of a terminal.

< Extension  Equipped FPCB >

2 is a perspective view showing an FPCB of the present invention. As shown in FIG. 2, the present embodiment relates to an FPCB 10 that can be coupled to and mounted with a PCB 20 on a terminal T, and includes a plurality of first pads that can be coupled to a PCB 20. 12 is provided at the edge, and extensions 14a and 14b are formed around the plurality of first pads 12 to correspond to the signal lines 24 of the PCB 20.

In the present embodiment, since the extension parts 14a and 14b may be bent while being mounted on the terminal T, the signal lines 24 of the PCB 20 may be wrapped to be surrounded by the metal frame M of the terminal T. Contact is blocked to act to prevent short circuits.

Here, the extensions 14a and 14b may be formed so that the main body of the FPCB 10 formed of polyimide (PI, Poly Imid) extends to the outside of the plurality of first pads 12, and the upper portion of the FPCB 10 is upward. It is preferably formed longer than the thickness of the PCB 20 to be mounted.

In addition, the extension parts 14a and 14b may be positioned in various ways depending on the direction in which the signal line 24 of the PCB 20 comes out, but a plurality of first pads 12 are formed in a pair so as to be symmetrical to each other. Thus, they may be formed to be symmetrical with each other in the same direction. In addition, the extensions 14a and 14b preferably have a thickness of 20 to 30 탆 for easy bending and to serve as an insulator.

<Image sensor module>

Figure 3 is an exploded perspective view showing an image sensor module of the present invention, Figure 4 is an exploded perspective view showing a state in which the image sensor module of the present invention is mounted on a metal frame of the terminal. As shown in FIG. 3, one embodiment of the present image sensor module includes an FPCB 10 having an image sensor 30, a PCB 20, and extensions 14a and 14b.

In addition, in addition to the image sensor 30, the image sensor module may be provided with a housing 40 serving as a frame and a dark room, and a lens 50 for transmitting an optical signal.

As shown in FIG. 4, an embodiment of the present image sensor module includes an image sensor module in which an FPCB 10, a PCB 20, and an image sensor 30 are coupled to a metal frame M of a terminal T. Since it is mounted, the extension parts 14a and 14b are bent at the time of mounting to act to surround the PCB 20 from the side. As a result, the image sensor module may be prevented from being shorted by contact with the mechanism of the terminal T such as the metal frame M. FIG.

The FPCB 10 is provided with a plurality of first pads 12 at edges thereof, coupled to a lower portion of the PCB 20, and formed to correspond to the signal lines 24 around the plurality of first pads 12 and the signal lines 24. And the extension parts 14a and 14b which can wrap the signal line 24 by bending when mounted on the terminal T. The FPCB 10 is bonded and soldered to the lower portion of the PCB 20 in order to transfer the electrical signal received from the PCB 20 to the outside (for example, the main board of the terminal).

The signal line 24 of the PCB 20 has a plating layer formed thereon to prevent oxidation. In this case, the plating layer may be a layer plated by at least one of gold, silver, and palladium (Pd, Palladium). In addition, the image sensor 30 is coupled to the plurality of second pads 22, and a circuit is connected through wire bonding between the PCB 20 and the image sensor 30.

In the case of the image sensor 30, the optical sensor converts an optical signal into an electrical signal. That is, the optical signal transmitted through the lens 50 is converted into an electrical signal by an image sensor 30 such as a complementary metal-oxide semiconductor (CMOS) sensor or a charge-coupled device (CCD) device.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all aspects. In addition, the scope of the present invention is indicated by the appended claims rather than the detailed description above. Also, it is to be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts are included in the scope of the present invention.

1, 10: FPCB
3, 12: a plurality of first pads
14a, 14b: extension
20: PCB
22: a plurality of second pads
24: signal line
30: image sensor
40: housing
50: lens
M: metal frame
T: terminal

Claims (10)

In the FPCB mounted on the terminal in combination with the PCB,
As the plurality of first pads are provided at two edges of the FPCB, respectively, the plurality of first pads are formed at two outer edges of the plurality of first pads in the same direction as the signal lines of the PCB. And an extension having first and second sides extending longer than the PCB thickness while wrapping so as to be unexposed.
The method of claim 1,
The signal line FPCB including a plating layer for preventing oxidation to the top.
The method of claim 2,
The plating layer is FPCB formed of gold plating.
The method of claim 1,
The extension portion is formed of polyimide FPCB.
delete The method of claim 1,
The extension is FPCB having a thickness of 20 to 30 μm.
In the image sensor module mounted on the terminal,
An image sensor for converting an optical signal into an electrical signal;
A PCB coupled to the bottom of the image sensor, the PCB including a plurality of second pads wire-bonded with the image sensor and a signal line for transmitting the converted electrical signal; And
As the plurality of first pads are provided at two edges of the FPCB, respectively, the plurality of first pads are formed at two outer edges of the plurality of first pads in the same direction as the signal lines of the PCB. And an FPCB having an extension having first and second sides extending longer than the PCB thickness while being wrapped to be unexposed.
The method of claim 7, wherein
And the image sensor is a CMOS sensor or a CCD element.
The method of claim 7, wherein
The signal line is an image sensor module including a plating layer for preventing oxidation to the top.
The method of claim 9,
The plating layer is an image sensor module formed of gold plating.

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