KR101108865B1 - A substrate processing apparatus - Google Patents

A substrate processing apparatus Download PDF

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Publication number
KR101108865B1
KR101108865B1 KR1020100085414A KR20100085414A KR101108865B1 KR 101108865 B1 KR101108865 B1 KR 101108865B1 KR 1020100085414 A KR1020100085414 A KR 1020100085414A KR 20100085414 A KR20100085414 A KR 20100085414A KR 101108865 B1 KR101108865 B1 KR 101108865B1
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KR
South Korea
Prior art keywords
process chamber
tray
transfer
link
chamber
Prior art date
Application number
KR1020100085414A
Other languages
Korean (ko)
Inventor
이승준
Original Assignee
주식회사 테스
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Priority to KR1020100085414A priority Critical patent/KR101108865B1/en
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Publication of KR101108865B1 publication Critical patent/KR101108865B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Abstract

PURPOSE: A substrate processing apparatus is provided to improve production efficiency by revising a structure in order to transfer a substrate to a processing chamber from a load lock chamber. CONSTITUTION: A reaction space is formed in the inner side of a processing chamber(100). A load lock chamber(200) is communicated with the processing chamber through a gate(g). A guide rail(201) for the transfer of a tray is installed in the load lock chamber. The guide rail is horizontally arranged in the same height as a transfer rail(101) of the processing chamber. A transport part(300) transfers the tray from the load lock chamber to the processing chamber. A first link rotates with a first rotating shaft as the center. A second link is rotates with the first link. One end of a transfer board is connected to the end part of the first link and the other end of the transfer board is connected to the end part of the second link.

Description

A substrate processing apparatus

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus having a load lock chamber and a process chamber.

The substrate processing apparatus which performs a predetermined process, for example, a thin film deposition process, an etching process, etc. with respect to a board | substrate is comprised with the load lock chamber in which the board | substrate before a process process is loaded, and the process chamber in which the process with respect to a board | substrate is performed.

1 is a schematic configuration diagram of a conventional substrate processing apparatus.

Referring to FIG. 1, a conventional substrate processing apparatus has a process chamber 1 and a load lock chamber 2.

The process chamber 1 is a place where a process is performed with respect to a board | substrate, and the gas injector (not shown) in which process gas is injected, the heater (or lamp) (not shown), etc. for heating a board | substrate are provided. In addition, a transfer rail 1a for transferring the tray 0 on which the substrate is mounted is provided in the process chamber.

The load lock chamber 2 is installed at one side of the process chamber 1 and is connected to the process chamber 1 through a gate. The load lock chamber 2 is provided with a guide rail 2a for conveying the tray.

In the substrate processing apparatus configured as described above, when the tray is loaded into the guide rail 2a of the load lock chamber, the transfer member 3 (for example, the hydraulic / pneumatic cylinder) as shown in FIG. While the tray (0) is pushed to transfer to the process chamber (1). By the way, in order to transfer the tray from the load lock chamber to the process chamber in this manner, the transfer member must extend at least as long as the length of the load lock chamber. Therefore, this conveying member must have a very long length (size), and its structure and size must be large.

In addition, since the conveying member 3 has a long length as described above, the conveying member is mainly installed at the outside of the load lock chamber, so that the load lock chamber 2 is in communication with the outside when the tray is conveyed, that is, at atmospheric pressure. Becomes That is, the tray is transported in the load lock chamber 2 at atmospheric pressure, and thus the process chamber 1 communicating with the load lock chamber 2 is also at atmospheric pressure.

As described above, in the case of the conventional substrate processing apparatus, the process chamber 1 is at atmospheric pressure during the transfer of the tray, and after the transfer is completed, a vacuum is formed in the process chamber 1 and the process temperature is maintained inside the process chamber. After raising to, the substrate is processed.

However, when the process chamber 1 repeatedly changes the atmospheric pressure state and the vacuum state, it takes a long time to change from the atmospheric pressure state to the vacuum state (heated state), and as a result, the production efficiency of the substrate processing apparatus is lowered. There is a problem.

The present invention has been made to solve the above problems, an object of the present invention is to provide a substrate processing apparatus with improved production efficiency by improving the structure to transfer the substrate from the vacuum load lock chamber to the process chamber .

In order to achieve the above object, the substrate processing apparatus according to the present invention has a reaction space for processing the substrate is formed, a pair of transfer horizontally installed in the reaction space so that the tray on which the substrate is mounted A process chamber having a rail, a pair of guide rails disposed on one side of the process chamber, horizontally parallel to the transport rail, and loaded with a substrate, and a tray loaded with the guide rails; A conveying part for conveying to the substrate, comprising a load lock chamber which is maintained in a vacuum state during the conveying of the tray, wherein the conveying part is disposed between the pair of guide rails and has a height equal to that of the guide rails; A position, a second position above the guide rail and moved toward the process chamber from the first position, the guide rail being the same as the guide rail. The tray is gradually transported to the process chamber while pivoting a movement path having the same height and having a third position moved toward the process chamber rather than the second position.

According to the present invention, the transfer unit, the first link to rotate about the first axis of rotation, and the same length as the first link, the first axis around the second axis of rotation in the horizontal direction from the first axis of rotation; Preferably, the second link rotates together with one link, and one end is connected to an end of the first link, and the other end includes a transfer plate connected to an end of the second link.

In addition, according to the present invention, the transfer unit, the first cam to rotate around the first axis of rotation, and the second cam to rotate with the first cam around the second axis of rotation spaced apart from the first axis of rotation in the horizontal direction It is preferable to include.

In addition, according to the present invention, it is preferable to further include a conveying member which is installed inside the load lock chamber and extends such that the tray is conveyed from the load lock chamber to the process chamber.

According to the present invention of the above configuration, the substrate can be transferred to the process chamber in a vacuum state, the process chamber can always maintain the vacuum and heating state, as a result of which the production efficiency of the substrate processing apparatus is improved.

1 is a schematic configuration diagram of a conventional substrate processing apparatus.
2 (a) is a front view of a substrate processing apparatus according to an embodiment of the present invention, Figure 2 (b) is a plan view of a substrate processing apparatus according to an embodiment of the present invention.
3 to 5 are views for explaining a process of the tray is transferred in the substrate processing apparatus according to the present embodiment.
6 is a view for explaining a process of the tray is transferred by the transfer unit of the substrate processing apparatus according to another embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail with respect to the substrate processing apparatus according to a preferred embodiment of the present invention.

2 (a) is a front view of a substrate processing apparatus according to an embodiment of the present invention, Figure 2 (b) is a plan view of a substrate processing apparatus according to an embodiment of the present invention, Figures 3 to 5 is this embodiment In the substrate processing apparatus according to the drawings for explaining a process of transferring.

2 (a) to 5, the substrate processing apparatus 1000 according to the present exemplary embodiment includes a process chamber 100 and a load lock chamber 200.

The process chamber 100 is a process where a substrate is processed, for example, a thin film deposition process or an etching process, and a reaction space is formed inside the process chamber. In the process chamber, a gas injector (not shown) for injecting process gas and a heater or lamp (not shown) for heating the substrate to the process temperature are provided. In addition, a transfer rail 101 for transferring the tray on which the substrate is seated is installed in the reaction space of the process chamber 100. As shown in Figure 2 (a) and 2 (b), a pair of conveying rails 101 are provided to be spaced apart from each other, each conveying rail is formed long in one direction and arranged horizontally.

The load lock chamber 200 is coupled to one side of the process chamber 100 and communicated with the process chamber 100 through the gate g. The load lock chamber 200 is provided with a vacuum pump (not shown), and the load lock chamber is maintained in a vacuum state when the tray is transferred from the load lock chamber to the process chamber as described below. In addition, the guide lock 201, the transfer unit 300 and the transfer member 400 for the transfer of the tray is installed in the load lock chamber.

As shown in Figure 2 (a) and 2 (b), a pair of guide rails 201 are provided to be spaced apart from each other. Each guide rail 201 is elongated in one direction, and is disposed horizontally at the same height as the transfer rail 101 of the process chamber.

The transfer unit 300 is for transferring the tray 0 from the load lock chamber 200 to the process chamber 100. As shown in FIG. 2 (a), the transfer part 300 is disposed below the guide rail 201 and is installed between the pair of guide rails 201 as shown in FIG. However, the transfer part 300 illustrated in FIGS. 2A and 2B is briefly displayed to indicate an arrangement state of the transfer part, and a detailed configuration is shown in FIG. 3.

Referring to FIG. 3, the transfer unit according to the present embodiment includes a first link 310, a second link 320, and a transfer plate 330. The first link 310 is rotatably installed around the first rotation shaft 311. At this time, the first rotation shaft 311 is disposed below the guide rail 201. The second link 320 has the same length as the first link 310 and is rotatably installed together with the first link 310 about the second rotation shaft 321. In this case, the second rotary shaft 321 is disposed to be spaced apart from the first rotary shaft 311 in the horizontal direction. The transfer plate 330 is formed in a plate shape, one end is connected to the end of the first link 310, the other end is connected to the end of the second link (320).

The transfer member 400 is for transferring the tray 0 from the load lock chamber to the process chamber. In the case of this embodiment, as shown in Figure 5 (b), the conveying member 400 has a structure that can be stretched (hydraulic / pneumatic cylinder). The transfer member 400 is installed on one side of the load lock chamber, and is preferably installed toward the process chamber based on the center of the load lock chamber as shown in FIG. The function of this transfer member will be described later.

In the substrate processing apparatus 1000 configured as described above, when the first link 310 and the second link 320 rotate, the transfer plate 330 includes a first position, a second position, and a third position. It will be a movement to move the path. Here, the first position means that the transfer plate 330 is disposed at the same height as the guide rail 201 as shown in FIG. As illustrated in FIG. 3B, the second position means a position where the transfer plate 330 is higher than the guide rail 201 and is advanced toward the process chamber compared to the first position. As shown in (c) of FIG. 3, the third position means a position in which the transfer plate 330 is flush with the guide rail 201 and is advanced toward the process chamber compared to the second position.

That is, in conjunction with the rotation of the first link and the second link, the transfer plate 330 is a pivoting motion (circular motion) passing through the first position, the second position and the third position, (The first link is rotated one turn), and the tray is transferred to the process chamber from the state of FIG. 3 (a) to the state of (c) of FIG.

On the other hand, if the transfer plate is once more pivoting in the state (c) of Figure 3, as shown in Figure 4 (a), (b), (c), the tray is further transferred to the process chamber.

That is, when the transfer plate is repeatedly swiveled in conjunction with the rotation of the first link and the second link, the tray 0 is gradually transferred to the process chamber by a predetermined distance as shown in FIG.

On the other hand, after the tray is conveyed to the extent shown by the solid line in FIG. 5A, when the tray is lifted by the transfer plate 330 (that is, the transfer plate is raised to the second position), the tray is tilted to one side. There is a risk of losing. That is, when less than half of the tray is placed on the transfer plate, the tray is inclined. Therefore, as shown in FIG. 5B, in this state, the transfer member 400 is extended to transfer the tray 0 into the process chamber.

At this time, since the conveying member only needs to be transported as much as the remaining distance from the state in which the tray 0 is conveyed to the process chamber considerably, it is more advantageous to install the possible conveying member on the process chamber side (that is, the length of the conveying member may be shortened. ). And, as compared with the conventional method, the length (pitch) in which the conveying member is extended is very shortened, and thus the size and structure of the conveying member are simplified, so that it is possible to install the conveying member in the load lock chamber.

As described above, according to the present embodiment, since the size and structure of the device for transporting the tray are simplified as compared with the prior art, such devices can be installed in the load lock chamber. Therefore, the tray can be transferred to the process chamber while the load lock chamber is blocked from the outside and maintained in a vacuum state. As a result, the process chamber can be maintained in a vacuum state and a heated state even when the tray is transferred. Production efficiency is improved.

6 is a view for explaining a process of the tray is transferred by the transfer unit of the substrate processing apparatus according to another embodiment of the present invention.

Referring to FIG. 6, the transfer unit according to the present exemplary embodiment includes a first cam 510 and a second cam 520. The first cam 510 is rotatably installed around the first rotation shaft 511. At this time, the first rotary shaft 511 is located below the guide rail 201. The second cam 520 is formed in the same shape as the first cam 510, and is rotatably installed together with the first cam 510 about the second rotation shaft 521. At this time, the second rotary shaft 521 is disposed to be spaced apart from the first rotary shaft 511 in the horizontal direction.

In this configuration, as shown in (a), (b), and (c) of FIG. 6, the ends of the first cam 510 and the second cam 520 when the first cam and the second cam rotate. Pivots a movement path including a first position, a second position, and a third position, whereby the tray is conveyed. Here, the first position is the state (a) of FIG. 6, the second position is the state (b) of FIG. 6, and the third position is the state (c) of FIG. 6.

Although the preferred embodiments of the present invention have been shown and described above, the present invention is not limited to the specific preferred embodiments described above, and the present invention belongs to the present invention without departing from the gist of the present invention as claimed in the claims. Various modifications can be made by those skilled in the art, and such changes are within the scope of the claims.

For example, in the present embodiment, the load lock chamber is provided only on one side of the process chamber, and the load lock chamber is used as the loading chamber, that is, the chamber for transferring the substrate before the processing hole to the process chamber. However, one more load lock chamber having a similar structure may be installed in the process chamber, and this may be used as an unloading chamber in which the processed substrate is taken out.

1000 ... Substrate Processing Unit 100 ... Process Chamber
101.Transport rail 200 ... Rodlock chamber
201 ... Guide rail 300 ...
310 ... Link 1 320 ... Link 2
330 ... Transfer plate 400 ... Transfer member
510..Cam 1 520 ... Cam 2

Claims (4)

delete A reaction chamber having a reaction space for processing the substrate, the process chamber having a pair of transfer rails installed in the reaction space so that the tray on which the substrate is mounted is transferred; And
A pair of guide rails disposed on one side of the process chamber, in which a tray on which a substrate is mounted, and a transfer part for transferring the tray loaded with the guide rail to the process chamber are installed therein. And a load lock chamber maintained in a vacuum state during the transfer.
The transfer part is disposed between the pair of guide rails, a first position having the same height as the guide rail, a second position above the guide rail and moved toward the process chamber than the first position, and the guide The tray is gradually transported to the process chamber while pivoting a movement path that is the same height as the rail and includes a third position moved toward the process chamber rather than the second position.
The transfer unit
A first link rotating about the first rotating shaft,
A second link having the same length as the first link and rotating together with the first link about a second rotation shaft spaced apart from the first rotation shaft in a horizontal direction;
One end is connected to the end of the first link, the other end substrate processing apparatus, characterized in that it comprises a transfer plate connected to the end of the second link. A reaction chamber having a reaction space for processing the substrate, the process chamber having a pair of transfer rails installed in the reaction space so that the tray on which the substrate is mounted is transferred; And
A pair of guide rails disposed on one side of the process chamber, in which a tray on which a substrate is mounted, and a transfer part for transferring the tray loaded with the guide rail to the process chamber are installed therein. And a load lock chamber maintained in a vacuum state during the transfer.
The transfer part is disposed between the pair of guide rails, a first position having the same height as the guide rail, a second position above the guide rail and moved toward the process chamber than the first position, and the guide The tray is gradually transported to the process chamber while pivoting a movement path that is the same height as the rail and includes a third position moved toward the process chamber rather than the second position.
The transfer unit
A first cam rotating around the first rotating shaft,
And a second cam rotating together with the first cam about a second rotational axis spaced apart from the first rotational axis in a horizontal direction. The method according to claim 2 or 3,
Is installed inside the load lock chamber,
And a transfer member configured to extend the tray from the load lock chamber to the process chamber.
KR1020100085414A 2010-09-01 2010-09-01 A substrate processing apparatus KR101108865B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
KR1020100085414A KR101108865B1 (en) 2010-09-01 2010-09-01 A substrate processing apparatus

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140033714A (en) * 2012-09-10 2014-03-19 세메스 주식회사 Apparatus of manufacturing integrated circuit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070048865A (en) * 2005-11-07 2007-05-10 주성엔지니어링(주) Substrate process apparatus
KR20080021325A (en) * 2006-09-04 2008-03-07 엘지.필립스 엘시디 주식회사 Substrate loading/unloading device and method for driving the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070048865A (en) * 2005-11-07 2007-05-10 주성엔지니어링(주) Substrate process apparatus
KR20080021325A (en) * 2006-09-04 2008-03-07 엘지.필립스 엘시디 주식회사 Substrate loading/unloading device and method for driving the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140033714A (en) * 2012-09-10 2014-03-19 세메스 주식회사 Apparatus of manufacturing integrated circuit
KR102051361B1 (en) * 2012-09-10 2019-12-03 세메스 주식회사 Apparatus and Method of manufacturing Integrated circuit

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