KR101103369B1 - Vacuum evaporation method - Google Patents

Abstract

The present invention relates to a vacuum deposition method, in the vacuum deposition method for depositing evaporation material in a workpiece inside the chamber, the rotary plate 700 is installed on the ceiling of the chamber 800 is rotated by a rotating motor, Installing a plurality of crucibles (600) on the rotating plate (700) and placing the evaporation material (200) in each of the crucibles (600); The high temperature electrons generated from the electron gun 100 installed in the chamber 800 are led to the crucible 600 of the rotating plate 700 to evaporate the evaporation material 200 inside the crucible 600 to evaporate the evaporated material ( It relates to a vacuum deposition method comprising a; step 200 is blown to the workpiece 400 located below the chamber 800, and deposited, irrespective of the weight of the body to be coated easily In addition, there is a remarkable effect of being able to easily seat and coat all parts of the coated body at once.

Description

Vacuum deposition method {VACUUM EVAPORATION METHOD}

According to the present invention, a plurality of crucibles are installed in the chamber, and metal or oxide, which is an evaporation material, is placed in each of the crucibles, and high temperature electrons are directed to the respective crucibles to evaporate the evaporation material in the crucible and evaporate the evaporated material. It relates to a vacuum deposition method comprising the steps of being deposited by flying to the workpiece located below the chamber.

Generally, a thin film constituting a part of an electronic component, especially an integrated circuit device, is known to have a manufacturing method using chemical vapor deposition, spraying, sputtering, and vacuum deposition. Among them, the thin film manufacturing method using vacuum deposition is compared with other methods. It is widely used because it is easy to manufacture and easy to evaluate characteristics.

As described in Patent Publication No. 10-2004-0056211, vacuum deposition is a kind of physical vapor deposition technique, wherein physical vapor deposition is intended to coat a material by heating the material in a vacuum or plasma atmosphere or by evaporating the coating material by using momentum transfer. The method of manufacturing a film on the board | substrate to be mentioned is generically. Physical vapor deposition is generally well known that it is easy to manufacture a metal film with high purity and smooth surface.

Physical vapor deposition includes vacuum deposition, sputtering, and ion plating. In the case of manufacturing a metal film, vacuum deposition is widely used except for special cases. This is because the vacuum deposition method is relatively simple and the evaporation rate is higher than other methods. Vacuum deposition methods are classified into resistance heating vacuum deposition, electron beam heating vacuum deposition, and induction heating vacuum deposition according to the type of heating source and heating method. It is used.

Resistance heating vacuum evaporation is a vacuum evaporation method that melts and evaporates a substance contained in an evaporation source by directly passing an electric current through a refractory metal or an intermetallic compound in the form of a boat, crucible or filament, and electron beam heating vacuum evaporation is negative. After the filament to which a high voltage is applied is discharged and an electron is discharged, it concentrates on the copper crucible which becomes water-cooled, and vaporizes a substance and forms a film | membrane. Resistance heating vacuum deposition is used for evaporation of materials having low reactivity and relatively low vaporization temperature, such as copper, zinc, silver, etc., because the entire heating source is heated so that the evaporant reacts with or evaporates. On the other hand, electron beam heating uses water-cooled crucibles, so that virtually all materials on the periodic table can be evaporated.

Patent registration No. 10-0325410, which has been previously filed by the applicant, describes a technology in which an evaporator and a sputtering target are installed together.

1 is a plan view of the inside of the vacuum deposition coating apparatus. Here, reference numeral 1 denotes a chamber of the vacuum deposition coating apparatus, reference numeral 10 denotes an outer cylinder of the chamber and 20 denotes an inner cylinder.

The outer cylinder 10 of the chamber of the vacuum deposition coating apparatus is fixed and the inner cylinder 20 is rotatable. On the inner circumferential surface of the inner cylinder, a plurality of jig 21 for mounting a ready-made injection molded product (coated body) of ordinary resin material is provided.

Discharge means (24, 24 ') for generating a glow discharge or a plasma discharge across the outer cylinder (10) and the inner cylinder (20) are provided so as to receive a power source from the power supply device (13) to form a discharge table. And a gas input port 11 for supplying the inert injection gases Ar, N2 and He necessary for the plasma discharge or the glow discharge, and a vacuum exhaust means 12 for evacuating the other side of the outer cylinder. Doing.

In addition, an evaporator 23 and a sputtering target 22 for melting and coating a coating material in a state where a ready-made injection molded product (coated body) is mounted on the jig 21 on the inner circumferential surface are provided.

The sputtering target 22 is attached to the fixing means 26.

Here, the evaporator 23 is coated by melting and evaporating the coating material in a resistive heating or electron beam method, and the sputtering target is coated by sputtering and dispersing the coating material.

The resistance heating method uses a heating method using a current to flow through the resistor to generate Joule heat. In this case, both a direct method of heating a current directly through an object and an indirect method of transferring heat from a heating element to a heated object by radiant convection conduction can be adopted.

In the plasma or glow discharge, the plasma or glow discharge zone 25 is formed by the above-mentioned inert injection gas and the high-voltage voltage spark supplied from the power supply device 13 between the discharge means 24 and 24 '.

In this state, the inner cylinder 20 is rotated while etching is carried out through the above-described discharge zone on the coated portion of the coated body seated on the jig 21, and at the same time, the sputtering target 22 and / or the evaporer The molten coating material is scattered or sputtered by the radar 23 so that a multilayer conductive shield film is formed on the coated object.

Summarizing the coating process of the to-be-coated body as described above, after mounting the substrate (to-be-coated body) to be coated on the jig 21 of the inner cylinder 20, the vacuum deposition chamber 1 through the vacuum exhaust device 12 ), And when the chamber reaches a constant vacuum, the inner cylinder 20 equipped with the jig 21 is rotated so that the portion to be coated is etched in the plasma or glow discharge zone, and the sputtering The coating material melted or sputtered from the target 22 or the evaporator 23 is uniformly coated on the coated body.

The above-described vacuum vapor deposition coating method is a substrate made of a polycarbonate or plastic material to be coated (injected product), an intermediate adhesive film layer of resin or paint, a main conductive thin film layer made of copper or silver, a film made of SUS or Ni. The coating laminated body in which the electroconductive film shield film in which the protective thin film layer was laminated | stacked was formed can be obtained.

2 is an overall front view of the vacuum deposition coating apparatus, 1 is a chamber in which the above-described coating process is performed, 41 is a high vacuum valve for evacuating the chamber to maintain a high vacuum state, and 42 is oil. Is an oil diffusion high vacuum pump which diffuses water, and 43 is a low vacuum pump.

And Patent Publication No. 2002-0081104 describes a detailed description of the vacuum deposition as follows.

An apparatus for forming a thin film by the vacuum deposition method is called a vacuum deposition apparatus. 3 is a layout view schematically showing a configuration of an example of a general vacuum deposition apparatus. The vacuum deposition apparatus is formed by disposing the evaporation source container 2 and the substrate holder 3 inside the vacuum container 1 connected to the vacuum system. An evaporation source 4 is accommodated in the evaporation source container 2. The substrate holder 3 is equipped with a substrate 5 on which a thin film is to be formed and a mask 6 defining a deposition region. The vacuum chamber 1 is connected to a vacuum system composed of a vacuum pump 7, an exhaust valve 8, and the like used to depressurize the inside of the vacuum chamber. Then, the heating power supply 9 is connected to the evaporation source container 2.

In a general vacuum deposition apparatus, the evaporation source vessel 2 is disposed below (in the direction of gravity) inside the vacuum vessel, and the substrate holder 3 is disposed above the interior of the vacuum vessel.

In forming the thin film and setting the shape of the thin film, first, the evaporation source 4 is accommodated in the evaporation source container 2, and the substrate 5 having the thin film attached to the substrate holder 3 is fixed. In addition, in order to set the thin film shape by the mask method, the mask 6 in which the opening part was formed in the thin film shape required on the board | substrate 5 is adhered and fixed. Then, the inside of the vacuum vessel 1 is reduced to a vacuum state by the vacuum pump 7, and then the evaporation source 4 housed in the evaporation source vessel 2 is heated. The molecules evaporated by heating fly inside the vacuum vessel 1 in the direction of the substrate 5 (from the lower side to the upper side in the general vacuum deposition apparatus), and adhere to the surface of the substrate 5 to form a thin film. Conventionally, organic electroluminescent element was also manufactured by the vacuum deposition apparatus of such a structure.

However, all of the above-described prior arts have a crucible which holds the coated body on the ceiling of a chamber and contains a crucible containing evaporation material for coating the coated body, and thus, if the coated body is heavy, it carries a coated body. There was a problem, and some rectangular parts of the medallion to-be-coated body were not coated, so they had to be re-coated by turning them again.

Therefore, the present invention can be easily placed on the coated body regardless of the weight of the coated body by placing the crucible to be placed in the lower chamber and the crucible containing the evaporation material for coating the coated body in the upper chamber. It is to provide a vacuum deposition method that can easily coat all parts of the coating at once.

In order to achieve the above, the present invention provides a vacuum deposition method for depositing evaporation material on a workpiece inside a chamber, and installs a rotary plate 700 which is rotated by a rotating motor on the ceiling of the chamber 800. Installing a plurality of crucibles 600 in the rotating plate 700 and placing the evaporation material 200 in each of the crucibles 600; The high temperature electrons generated from the electron gun 100 installed in the chamber 800 are led to the crucible 600 of the rotating plate 700 to evaporate the evaporation material 200 inside the crucible 600 to evaporate the evaporated material ( It is characterized in that it comprises a; and the step 200 is deposited by flying to the workpiece 400 located below the chamber 800.

Therefore, in the vacuum deposition apparatus, the coated body is placed in the lower part of the chamber, and the crucible containing the evaporation material for coating the coated object is placed on the upper part of the chamber to easily mount the coated body regardless of the weight of the coated body. In addition, there is a remarkable effect that it is easy to coat all parts of the coated body at once.

1 is an external view of a conventional vacuum deposition apparatus
2 is a front view of a conventional general vacuum deposition apparatus
3 is a general layout of a conventional electron beam heating vacuum deposition apparatus
Figure 4 is an external view of the present invention vacuum deposition apparatus
5 is an overall front view when the electron beam of the present invention vacuum deposition apparatus is bent 180 °
6 is an overall front view when the electron beam of the present invention vacuum deposition apparatus is bent 270 °
Figure 7 is a plan view of the installation of the mask of the vacuum deposition apparatus of the present invention

The present invention relates to a vacuum deposition method, in the vacuum deposition method for depositing evaporation material in a workpiece inside the chamber, the rotary plate 700 is installed on the ceiling of the chamber 800 is rotated by a rotating motor, Installing a plurality of crucibles (600) on the rotating plate (700) and placing the evaporation material (200) in each of the crucibles (600); The high temperature electrons generated from the electron gun 100 installed in the chamber 800 are led to the crucible 600 of the rotating plate 700 to evaporate the evaporation material 200 inside the crucible 600 to evaporate the evaporated material ( It is a vacuum deposition method comprising a; 200 is deposited by flying to the workpiece 400 located below the chamber 800.

The electron gun 100 connects power to the cathode filament 110, installs a magnet on the cathode filament 110 to concentrate electrons, and installs a field magnet 120 near the cathode filament. By inducing the concentrated electrons to the crucible 600, the high-temperature electrons generated from the cathode filament 110 of the electron gun 100 is led to the crucible 600 of the rotating plate 700, the inside of the crucible 600 The evaporation material 200 is evaporated and the evaporated evaporation material is deposited by flying on the work 400 positioned below the chamber 800.

In addition, an ion source 500 is installed in the chamber 800 so that the evaporation material 200 evaporated in the crucible 600 is blown onto the workpiece 400 positioned below the chamber 800 and deposited, and then the ion source. It is to further include the method to be compacted by 500.

In addition, a mask 300 is installed between the rotating plate 700 and the workpiece 400, and the lower portion of the crucible 600 is a workpiece in which the evaporated evaporation material 200 is located below the chamber 800. A hole is drilled so that it can be blown to 400 and deposited.

And the electron gun 100 is also characterized in that installed on the ceiling portion of the chamber 800.

The present invention will be described in detail with reference to the accompanying drawings. 1 is an external view of a conventional vacuum deposition apparatus, FIG. 2 is a front view of a conventional general vacuum deposition apparatus, FIG. 3 is a general layout view of a conventional electron beam heating vacuum deposition apparatus, and FIG. 4 is an appearance of a vacuum deposition apparatus according to the present invention. 5 is an overall front view when the electron beam of the vacuum deposition apparatus of the present invention is bent 180 °, FIG. 6 is an overall front view when the electron beam of the vacuum deposition apparatus of the present invention is bent 270 °, and FIG. 7 is a vacuum of the present invention. It is an installation top view of the mask of a vapor deposition apparatus.

In the present invention, a rotating motor is installed outside the chamber, and a rotating plate is connected to the shaft of the rotating motor to rotate. And a plurality of crucibles are installed on the rotating plate. The number of crucibles may be configured as 4, 6, 8, 12, etc. according to the capacity of the chamber and the like. And the evaporation material is settled in each said crucible. The present invention has a technical gist of installing the rotating plate and each crucible in the ceiling portion of the chamber. The lower part of the crucible is perforated to allow vaporized evaporated material to fly and deposit on the workpiece located below the chamber. The high temperature electrons generated by the conventional electron gun installed inside the chamber are guided to the crucible of the rotating plate to evaporate the metal or oxide, which is the evaporation material inside the crucible, and the evaporated evaporation material is blown to the work located at the lower part of the chamber. To be deposited. In the vacuum deposition apparatus of the present invention, even if a hole is formed in the lower part of the crucible installed at the ceiling of the chamber, the molten evaporated material contained in the crucible does not fall into the liquid state due to the surface tension, It is blown and deposited on the work located. In other words, the surface tension of molten metal overcomes the force to drop downward by gravity through the hole drilled in the bottom of the crucible in the liquid state. The size of the hole depends on the evaporation material in the crucible, and the larger the evaporation material with a higher surface tension in the molten state, the larger the perforated hole.

And the electron gun is to use a conventional one widely used in the art, as is known, its main configuration is to connect the power supply to the cathode filament and the magnet around the cathode filament By placing a field magnet next to a cathode filament to induce a dense electron, which is already well known in the art. Detailed configurations are omitted. Therefore, the present invention induces the hot electrons generated from the cathode filament to the crucible of the rotating plate to evaporate the evaporation material inside the crucible and the evaporated evaporation material is blown to the workpiece located below the chamber and deposited. Will be. In particular, the electron gun is attached to the chamber ceiling together with the crucible. 5 is an overall front view when the electron beam of the vacuum deposition apparatus of the present invention is bent 180 °, and FIG. 6 is an overall front view when the electron beam of the vacuum deposition apparatus of the present invention is bent 270 °.

In addition, an ion source is installed in the chamber so that the evaporated material evaporated in the crucible is blown onto the workpiece located below the chamber and deposited, and then compacted by the ion source. The ion source is installed in any position on the upper side and the side side of the chamber as necessary.

And a conventional mask is provided between the said rotating plate and a workpiece | work.

The mask is made of aluminum or stainless steel, the outer circumferential surface of a round plate shape or a round plate shape is made of corrugations and convex portions in a wave shape, and the thickness of the mask is about 1.5 mm to make a gap between the crucible and the workpiece in the chamber. Install on. The mask is used to adjust the amount of evaporated material evaporated from the crucible to the work located in the lower part of the chamber. To ensure uniform deposition throughout the workpiece.

If necessary, an electron beam shutter can be installed between the rotating plate and the mask. The electron beam shutter serves to block evaporation material that evaporates from the crucible and reaches the desired temperature until it reaches a predetermined temperature or required quality, and is made by processing a metal plate, which is a common means in the art.

Therefore, in the vacuum deposition apparatus, the coated body is placed in the lower part of the chamber, and the crucible containing the evaporation material for coating the coated object is placed on the upper part of the chamber to easily mount the coated body regardless of the weight of the coated body. In addition, it is possible to easily coat all parts of the coated body at once.

100: electron gun 200: evaporation material 300: mask
400: workpiece 500: ion source 600: crucible
700: rotating plate 800: chamber 900: electron beam shutter
110: cathode filament 120: field magnet

Claims (6)

In the vacuum deposition method for depositing evaporation material on the workpiece inside the chamber, a rotary plate 700 which is rotated by a rotating motor is installed on the ceiling of the chamber, and a plurality of crucibles 600 are provided on the rotary plate 700. Installing and placing the evaporation material (200) in each of the crucibles (600); The high-temperature electrons generated from the cathode filament of the electron gun 100 installed in the chamber 800 are led to the crucible 600 of the rotating plate 700 to evaporate the evaporation material 200 inside the crucible 600. Evaporated evaporation material 200 is blown to the workpiece 400 located below the chamber 800 is deposited; including, The electron gun 100 is connected to the power supply to the caudal filament 110, By installing a magnet on the cathode filament 110, electrons are concentrated, and by installing a field magnet 120 near the cathode filament to induce the concentrated electrons to the crucible 600, the cage of the electron gun 100 The high temperature electrons generated in the dough filament 110 are guided into the crucible 600 of the rotating plate 700 to evaporate the evaporation material 200 inside the crucible 600 and the evaporated evaporation material is lowered in the chamber 800. To be deposited on the work 400 located in In addition, an ion source 500 is installed inside the chamber 800 so that the evaporation material 200 evaporated in the crucible 600 is blown onto the workpiece 400 positioned below the chamber 800 and deposited. It is compacted by the 500, the mask 300 is installed between the rotating plate 700 and the workpiece 400, the lower portion of the crucible 600 is evaporated evaporation material 200 is chamber 800 Perforated to be deposited to fly to the work piece 400 located below)
The electron gun 100 is also installed on the ceiling portion of the chamber 800, and the vacuum deposition method, characterized in that the electron beam shutter 900 is further installed between the rotating plate 700 and the mask 300. delete delete delete delete delete

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