WO2021149956A1

WO2021149956A1 - Turntable fixing jig and operation method for vacuum evaporation apparatus

Info

Publication number: WO2021149956A1
Application number: PCT/KR2021/000366
Authority: WO
Inventors: 유흥상
Original assignee: 유흥상
Priority date: 2020-01-21
Filing date: 2021-01-12
Publication date: 2021-07-29

Abstract

The present invention relates to a turntable fixing jig and an operation method for a vacuum evaporation apparatus, wherein a turntable (301) for coating a workpiece is installed in a chamber of the vacuum evaporation apparatus, fixing jigs (101, 102, 201, 202) are installed on the upper surface of the turntable, and the fixing jigs (101, 102, 201, 202) rotate. In the present invention, the plurality of fixing jigs above the turntable in the chamber rotate without interfering with each other, and thus a large number of workpieces can be coated even when the chamber is narrow. Therefore, the invention has the remarkable effects of being economical and having a short work time.

Description

Turntable fixing jig and operation method of vacuum deposition apparatus

The present invention relates to a turntable fixing jig and an operating method of a vacuum deposition apparatus, and more particularly, by rotating a plurality of fixing jigs on the top of the turntable in a chamber without interfering with each other, many workpieces can be coated even when the chamber is narrow. Therefore, it relates to a turntable fixing jig and an operating method of a vacuum deposition apparatus that has a short working time and is economical.

In general, as a method for coating a product, recently sputtering or evaporating vacuum deposition method is widely used, which is to put a workpiece in a vacuum chamber and coat the surface by sputtering or evaporating. As an example, in the prior art Laid-Open Patent Publication No. 10-2014-0083260, an electron beam vacuum deposition apparatus and a sputtering vacuum deposition apparatus are selectively installed in one and the same vacuum chamber 200, and the electron beam vacuum deposition method and the spat It is characterized in that any one method is selectively performed. In the electron beam vacuum deposition apparatus, the electron gun 104 is installed in the lower part of the vacuum chamber 200, and the coating objects rotated about the central axis are arranged in the upper part. A dome table 102 is installed, a cathode 201 is installed around the sidewall, and a target 202 is installed inside the cathode,

In addition, in the sputtering vacuum deposition apparatus, a turntable 104 is installed at a lower portion of the vacuum chamber 200 , and the turntable 204 is rotated by a motor installed outside the vacuum chamber 200 , and the turntable 204 is rotated by a motor installed outside the vacuum chamber 200 . ) revolves, rotates, and a jig 203 in which a coating object is disposed is installed, a cathode 201 is installed around the sidewall, and a target 202 is installed inside the cathode 201. A vacuum deposition method has been disclosed.

In addition, Patent Publication No. 10-0192129 discloses a target fixing unit using a complex rotational motion transmission device for ultra-high vacuum including the components listed below in a pulsed laser thin film deposition apparatus; 1) A target attachment part formed of four disks 2) A turntable that supports the target holder and has a tapered groove formed at the lower end 3) The main shaft, which is a single rotary shaft that rotates by the operation of a motor 4) The main shaft is transmitted Rotational motion distributor that transmits rotational motion to each target attachment 5) Stenball guide, its cover, and rotational motion controller consisting of three stencils inserted inside 6) Inserted into the groove formed at the lower end of the turntable A stencil support that supports the sten ball with a constant pressure as a spring has been disclosed.

However, since the prior art cannot charge a large number of workpieces in the chamber, the working efficiency is reduced, the working time is long, and it is uneconomical.

Therefore, the present invention has been devised to solve the above problems, and by rotating a plurality of fixing jigs on the top of the turntable in the chamber without interfering with each other, many works can be coated even when the chamber is narrow, so the working time is short and economical An object of the present invention is to provide a turntable fixing jig and an operating method of a phosphorus vacuum deposition apparatus.

The present invention relates to a turntable fixing jig and an operating method of a vacuum deposition apparatus, wherein a turntable 301 for coating a workpiece is installed in a chamber of the vacuum deposition apparatus, and fixing jigs (101, 102, 201, 202) are installed on the upper surface of the turntable. However, the fixing jig (101, 102, 201, 202) is characterized in that it rotates.

Therefore, according to the present invention, since a plurality of fixing jigs on the top of the turntable rotate without interfering with each other in the chamber, many works can be coated even when the chamber is narrow, so the working time is short and economically significant.

1 is a layout diagram of a fixing jig of the vacuum deposition apparatus of the present invention;

2 is an operation diagram of a fixing jig of the vacuum deposition apparatus of the present invention;

3 is a flow chart of a fixing jig of the vacuum deposition apparatus of the present invention;

4 is a fixed jig arrangement photograph of the vacuum deposition apparatus of the present invention;

5 is a front view of the fixing jig of the vacuum deposition apparatus of the present invention;

6 is a photograph from another angle of the fixing jig of the vacuum deposition apparatus of the present invention;

301: turntable

101, 102: (clockwise rotation) fixing jig

201, 202: (counterclockwise rotation) fixing jig

The present invention relates to a method of operating a turntable fixing jig of a vacuum deposition apparatus, wherein a turntable 301 for coating a workpiece is installed in a chamber of the vacuum deposition apparatus, and

fixing jigs

101, 102, 201, and 202 are installed on the upper surface of the turntable. However, the fixing jig (101, 102, 201, 202) is characterized in that it rotates.

In addition, a plurality of the fixing jigs are installed and are radially arranged at a predetermined distance from each other at the center of the turntable.

In addition, the fixing jig is characterized in that the rectangular shape.

In addition, the fixing jig is characterized in that it rotates in opposite directions to the neighboring fixing jig.

In addition, the turntable is characterized in that it rotates with a disk.

The present invention relates to a fixing jig of a vacuum deposition apparatus, in which a turntable and a fixing jig for coating a workpiece are installed in the upper part of the chamber of the vacuum deposition apparatus to vacuum-deposit the workpiece, the turntable No. 301 is installed on the upper part of the chamber, the upper surface is hung downwardly, and a fixing jig for fixing the work is installed on the upper surface of the turntable 301, so that the deposition means of the lower part of the chamber is a sputtering device, an evaporating device. , or the work is deposited by an ion beam device, characterized in that the fixing jig is rotated.

The present invention will be described in detail with reference to the accompanying drawings. Fig. 1 is an arrangement diagram of a turntable fixing jig of the vacuum deposition apparatus of the present invention, Fig. 2 is an operation diagram of the turntable fixing jig of the vacuum deposition apparatus of the present invention, and Fig. 3 is the present invention It is a flowchart of the turntable fixing jig of the vacuum deposition apparatus of

In the present invention, deposition means necessary for conventional vacuum deposition, such as a sputtering device or an evaporating device, or an ion beam, are installed in the chamber of the vacuum deposition device. A turntable on which a work is placed is installed in the center of the chamber, and the turntable is connected to an electric motor to rotate. According to the present invention,

fixing jigs

101, 102, 201, and 202 are installed on the turntable, and the fixing jig is connected to an electric motor to rotate.

A plurality of the fixing jigs are installed and are radially arranged at a predetermined distance from each other at the center of the turntable 10 to improve the coating efficiency.

The fixing jig may have various shapes, but is configured in a rectangular shape as an embodiment.

In particular, the fixing jig is rotated in opposite directions to the neighboring fixing jig so as not to interfere with each other. When four are installed, the

fixing jigs

101 and 102 are installed symmetrically with each other and rotate clockwise, and the

fixing jigs

201 and 202 are installed symmetrically with each other and rotate counterclockwise. The speed of the fixing jigs is the same. And the lower turntable rotates counterclockwise. In the above configurations, the number of gears and the number of gear teeth of each power transmission gear coupled to each other between the motor, the turntable, and the fixing jig can be adjusted to control the rotation direction and speed of each.

The vacuum deposition technique uses a conventional technique, and as described in Patent Registration No. 20-0241223, which is a prior art described in the background of the present invention, in general, the principle of vacuum deposition is that the coating compound is evaporated from the lower side of the chamber. As being deposited on the surface of the lens, the present applicant's Patent Publication No. 10-1103369 discloses a vacuum deposition method for depositing an evaporation material on a work piece in a chamber, a rotating plate rotated by a rotating motor on the ceiling inside the chamber ( installing 700), installing a plurality of crucibles 600 on the rotating plate 700, and placing the evaporation material 200 in each of the crucibles 600; By inducing high-temperature electrons generated from the cathode filament of the electron gun 100 installed inside the chamber 800 to the crucible 600 of the rotating plate 700 to evaporate the evaporation material 200 inside the crucible 600, The evaporated evaporation material 200 is deposited by flying to the workpiece 400 located below the chamber 800; Including, but, the electron gun 100 is connected to the power supply to the Cadowda filament 110, and installs a magnet in the Cadowda filament 110 to densify the electrons, and next to the Cadowd filament By installing the field magnet 120 to induce the clustered electrons to the crucible 600, the high-temperature electrons generated from the cathode filament 110 of the electron gun 100 are guided to the crucible 600 of the rotating plate 700. The evaporation material 200 inside the crucible 600 is evaporated, and the evaporated evaporation material flies to the workpiece 400 located below the chamber 800 and is deposited, and inside the chamber 800, an ion source ( 500) is installed and the evaporation material 200 evaporated inside the crucible 600 flies to the workpiece 400 located under the chamber 800 and is deposited and then compacted by the ion source 500, and the rotating plate A mask 300 is installed between the 700 and the work 400 , and the evaporation material 200 evaporated at the lower part of the crucible 600 flies to the work 400 located at the lower part of the chamber 800 . A hole is drilled for deposition, the electron gun 100 is also installed on the ceiling of the chamber 800, and an electron beam shutter 900 is further installed between the rotating plate 700 and the mask 300 Since it is described in a vacuum deposition method, characterized in that it is a method, a detailed description is omitted.

On the other hand, the vacuum coating apparatus can efficiently implement coating by installing a thermal evaporation source in the center of the chamber in the conventional sputter vacuum coating method.

A linear ion source is installed on the chamber wall to perform pre-treatment and cleaning of the sample using Ar.

And the sputtering method refers to a conventional sputtering technique. Specifically, sputtering means that Ar cations (positive ions) formed in a plasma state are placed on the cathode by an electric field applied to the cathode mounted on the sputter module. It is a phenomenon in which atoms constituting the target are ejected by accelerating toward the target and collide with the target.

Since this sputtering does not require a heating process, it is possible to deposit even a solid solution point metal such as tungsten. In general vacuum deposition, since the metal is evaporated by heating it to a high temperature, in the case of an alloy, the vapor pressure of each component metal is different from each other, which causes a problem. However, sputtering can easily make a thin film of not only metal but also inorganic materials such as quartz.

The sputtering device is composed of a simple two-pole electrode and emits a glow discharge while flowing argon (Ar) gas. When the material to be deposited, Sn, is made into a circular or rectangular target and a negative high voltage is applied thereto, the target atoms protruding by the collision of Ar+ ions are piled up on the opposite substrate to form a thin film. When oxygen is blown into the chamber during sputtering, a SnO layer is formed on the glass plate.

Compared to Evaporation, which is a vacuum deposition method, sputtering has a high adhesion strength between the thin film and the substrate because the speed of flying target atoms is about 100 times faster. In addition to the two-pole sputtering, there are a four-pole sputtering method that generates plasma between a substrate and a target with a cathode and an anode, an RF method using high frequency, and a magnetron sputtering method using a magnetic field in addition to an electric field recently.

In addition, the basic principles of the sputtering method and the resistance heating method are described with respect to the basic principles of the sputtering method and the resistance heating method in registration number 20-0185068, which was registered by the applicant of the previous application. Citing the configuration, the target to be sputtered is clamped to the cathode of the sputter module.

Here, the evaporator is coated by melting and evaporating the coating material by a resistance heating method or an electron beam method, and the sputtering target sputters and disperses the coating material to deposit the deposited material.

The resistance heating method uses a heating method using a current to flow through a resistor to generate Joule heat. Here, both the direct method of heating an object by passing current directly to it and the indirect method of transferring the heat of the heating element to the object to be heated by radiative convection conduction, etc. can be adopted.

In the plasma or glow discharge, a plasma or glow discharge zone is formed between the above-described discharging means by the above-described inert injection gas and a spark of high voltage supplied from a power supply device. In this state, while the inner cylinder rotates, etching is performed through the discharge zone on the coated part of the object to be coated seated on the jig, and at the same time, the coating material melted by the sputtering target and the evaporator is scattered or sputtered. Thus, a multi-layered thin film is formed on the vapor-deposited material.

To summarize the deposition process of the vapor-deposited object, after the substrate to be deposited (the vapor-deposited object) is mounted on the jig of the inner cylinder, the vacuum deposition chamber is evacuated through the vacuum evacuation device, and when the inside of the chamber reaches a certain vacuum state, the jig It is a general method that the deposition material in which the portion to be deposited is scattering or sputtered from the sputtering target or the evaporator by rotating the mounted inner cylinder is uniformly deposited on the surface of the deposition target.

Claims

A turntable 301 for coating a workpiece is installed in the chamber of the vacuum deposition apparatus, and fixing jigs 101, 102, 201, and 202 are installed on the upper surface of the turntable, but the fixing jigs 101, 102, 201, 202 are Turntable fixing jig operation method of vacuum deposition apparatus characterized in that it rotates
According to claim 1, wherein a plurality of the fixing jigs (101, 102, 201, 202) are installed and radially arranged at a predetermined distance from each other at the center of the turntable (301), the fixing jigs (101, 102, 201) , 202) is a method of operating a turntable fixing jig of a vacuum deposition apparatus, characterized in that it has a rectangular shape.
[3] The method of claim 2, wherein the fixing jig rotates in opposite directions to the neighboring fixing jig so as not to interfere with each other.
In the fixing jig of the vacuum deposition apparatus for vacuum deposition of a workpiece by installing a turntable and a fixing jig for coating a workpiece in the upper part of the chamber of the vacuum deposition apparatus, the turntable 301 is installed in the upper part of the chamber, the upper surface is the lower part It is installed hanging toward the direction, and a fixing jig for fixing the work is installed on the upper surface of the turntable 301, so that the work is deposited by a sputtering device, an evaporating device, or an ion beam device, which is a deposition means under the chamber, The fixing jig is a fixing jig of the vacuum deposition apparatus, characterized in that it is rotated