KR101093174B1 - Heat radiating printed circuit board unified bracket for backlight unit - Google Patents

Abstract

The present invention relates to a bracket integrated heat dissipation printed circuit board (PCB) for a backlight unit (BLU) and a chassis structure having the same. Specifically, an interior of the chassis structure for providing a light guide passage of the backlight unit. In the heat dissipation PCB to be mounted on the heat dissipation PCB, the heat dissipation PCB includes a circuit pattern portion and at least one bent region portion, wherein the bent region portion is at least one of the electrode wiring portion connecting the chip mounting portion and the electrode portion included in the circuit pattern portion. It includes the above electrode wire, and any one of the bent region portion relates to a bracket integrated heat dissipation PCB and a chassis structure having the same, characterized in that it comprises a mounting portion mounted to the chassis structure.

According to the present invention, by integrating the heat radiation PCB and the bracket for fixing it, it is possible to maximize the heat dissipation characteristics of the heat dissipation PCB by preventing the heat transfer rate decrease by the use of the TIM, there is no need to go through a separate bracket manufacturing process This will simplify the process and structure and reduce the material cost. Furthermore, by forming the electrode lines on a different plane from the circuit pattern portion, the width of the PCB is reduced, contributing to the slimming of the BLU, and the effect of maximizing the heat dissipation characteristics by separating the heat source generated by the current flowing through the electrode lines. do.

 Heat Resistant PCB, BLU, Bracket, TIM

Description

Bracket Integrated Heat Resistant Printed Circuit Board for Backlight Unit {HEAT RADIATING PRINTED CIRCUIT BOARD UNIFIED BRACKET FOR BACKLIGHT UNIT}

The present invention relates to a heat dissipation PCB for a backlight unit and a structure having the same.

As the electronics industry develops, various display devices are being developed, and imaging devices, computers, and mobile communication terminals using the same are being developed. The liquid crystal display (LCD), which has appeared to reflect this trend, is currently in the spotlight as a display device such as a monitor and a mobile communication terminal.

Liquid crystal display (LCD) is an application of the electro-optical properties of liquid crystals having intermediate characteristics between liquid and solid to display devices. It is an electric device that changes and transmits various electrical information into visual information. It is a flat panel display that is widely used because of its low power consumption and low power consumption.

LCDs don't self-luminous, so all LCDs always require a backlight. The backlight acts as a light source of the LCD. The backlight unit includes a light source unit including a light source itself to irradiate light from the back of the liquid crystal module, and a power supply circuit for driving the light source and an integral part that forms uniform plane light. : BLU). Recently, a backlight unit using a light emitting diode (LED) has been proposed as a light source for illuminating the LCD. An LED is a light emitting device that generates light by using a light emission phenomenon generated when a voltage is applied to a semiconductor. Such LEDs have advantages in that they are smaller than conventional light sources, have a long lifetime, and have high energy efficiency and low operating voltages because electrical energy are directly converted into light energy. Such a backlight unit is used by mounting a plurality of light source elements such as LEDs on a PCB. Since the PCB must endure heat emitted from the light source element, metal materials are mainly used. However, if the heat generated from the light source device is not properly discharged, the light source device may be destroyed or the life may be shortened.

FIG. 1 illustrates a cross-sectional view of a heat dissipation PCB 10 and a bracket 40 manufactured according to the related art in a chassis 50 which is a light guiding passage of a backlight unit.

Referring to Figure 1, the heat dissipation PCB 10 and the bracket 40 for fixing it to the chassis 50 is manufactured separately and bonded using a TIM (Thermal Interface Material: TIM) 20, this is a light guide passage The TIM 30 is attached to the chassis 50 to be used.

However, when the heat dissipation PCB 10 and the bracket 40 are separated and manufactured and bonded using the TIM 20, the heat transfer rate is lowered by the TIM 20, and thus the heat dissipation effect is lowered.

Figure 2 shows a plan view of the conventional heat dissipation PCB.

Referring to FIG. 2, the heat dissipation PCB includes an electrode unit including a chip mounting unit 80 for mounting a light emitting device 90, and an anode 61 and a cathode 62 for supplying power to the chip mounting unit 80. (61, 62) and electrode wiring portions (71, 72) for connecting the chip mounting portion 80 and the electrode portions (61, 62).

In the conventional heat dissipation PCB, the electrode portions 61 and 62 and the electrode wiring portions 71 and 72 are formed in the same region as the chip mounting portion 80, whereby the width X of the PCB becomes wider and the BLU becomes slimmer. On the contrary, there is a problem in that a defective circuit pattern is generated by heat generated as a current flows, thereby shortening its lifespan.

The present invention has been made to solve the above problems, an object of the present invention is to maximize the heat dissipation characteristics by integrating the heat dissipation PCB and the bracket, to provide a simplified process and structure, the material cost savings by not manufacturing a bracket separately It is to provide a bracket integrated heat dissipation PCB and a structure having the same.

In addition, by forming the electrode portion or the electrode line on a different plane from the circuit pattern portion to remove the electrode line area to reduce the width of the PCB and to separate the heat generated in the electrode line area to increase the heat dissipation effect of the bracket integrated heat dissipation PCB and chassis structure having the same It is another object of the present invention to provide.

According to an aspect of the present invention, there is provided a heat dissipation PCB mounted inside a chassis structure that provides a light guide path of a backlight unit, wherein the heat dissipation PCB includes a circuit pattern portion and at least one bent region portion. The bent region part includes at least one or more electrode lines among the electrode wiring parts connecting the electrode and the chip mounting part included in the circuit pattern part, and any one of the bent area parts includes a mounting part mounted to the chassis structure. By providing a bracket integrated heat dissipation PCB, the heat dissipation characteristics can be maximized, and the process can be simplified and the structure can be simplified. At the same time, the amount of TIM can be reduced in terms of material cost without using a separate bracket.

In particular, in the case where the bent region portion is two or more, the electrode line formed in the bent region portion is formed in the bent region portion not provided with the mounting portion, so that the width of the PCB is formed by forming the electrode line on a different plane from the circuit pattern portion. In addition, the heat dissipation effect can be maximized by reducing the heat generated from the electrode wire as well as contributing to slimming of the BLU.

In addition, at least one of the anode and the cathode constituting the electrode portion of the present invention is formed in the bent region portion, so that not only the electrode line but also the electrode portion from the circuit pattern portion to reduce the BLU slimming and heat dissipation characteristics Can contribute to maximization.

Such a bracket-integrated heat dissipation PCB can be a variety of modifications, characterized in that the insulating layer, the circuit pattern is formed sequentially on the metal substrate, the preferred embodiment is characterized in that the metal substrate is an Al substrate, mounted on the chip mounting portion The light emitting device may be an LED.

In addition, the present invention is an insulating layer, a circuit pattern is sequentially formed on a metal substrate, and provided with a circuit pattern portion and at least one bent region portion, the heat radiation PCB is formed at least one electrode line or electrode portion in the bent region; The heat dissipation PCB provides a chassis structure having a bracket-integrated heat dissipation PCB, characterized in that it is mounted so as to have a space portion spaced apart from the side of the chassis structure, any one of the distal end portion of the heat dissipation PCB, It is formed in a close contact structure can reduce the width of the PCB can contribute to slimming the BLU.

According to the present invention, by integrating the heat radiation PCB and the bracket for fixing it, it is possible to prevent the heat transfer rate decrease by the use of the TIM and reduce the occurrence of the interface (interface) to prevent the heat conduction degradation caused by the air layer to maximize the heat radiation characteristics of the heat radiation PCB can do.

In addition, by integrating the brackets during fabrication of the heat dissipation PCB, there is no need to go through a separate bracket manufacturing process, thereby simplifying the process and structure.

In addition, there is no need to use a TIM between the heat dissipation PCB and the bracket, thereby reducing the amount of TIM used and reducing the material cost in terms of the use of the bracket.

Further, by forming the electrode line or the electrode portion in a plane different from the circuit pattern portion, that is, the bent region, the electrode line region can be removed from the circuit pattern portion. Therefore, the width of the PCB is reduced by that, making it possible to slim the BLU, and by separating the heat generated by the current flowing through the electrode line, it has the effect of securing the heat radiation characteristics.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation of the present invention. In the following description, well-known functions or constructions are not described in detail to avoid unnecessarily obscuring the subject matter of the present invention.

According to an aspect of the present invention, there is provided a heat dissipation PCB mounted inside a chassis structure providing a light guide path of a backlight unit, wherein the heat dissipation PCB includes a circuit pattern portion and at least one bent region portion, and at least one electrode line or An electrode part is formed, and the bracket-integrated heat dissipation PCB, characterized in that it comprises a mounting portion mounted to the chassis structure any one of the bent region portion to the subject, heat dissipation through the bracket-integrated heat dissipation PCB By maximizing the characteristics, simplifying the process and structure, and furthermore, by forming the electrode wire or the electrode portion on a different plane from the circuit pattern portion, the PCB width can be reduced, the BLU can be reduced, and the heat source separation can maximize the heat dissipation effect. At its core.

3 shows a cross-sectional view of one preferred embodiment of the present invention.

Referring to FIG. 3, the present invention includes a bracket integrated heat dissipation PCB 110, a TIM 150, and a chassis 170.

The bracket integrated heat dissipation PCB 110 is composed of a circuit pattern portion 140 and two bent regions. An insulating layer and a circuit pattern are sequentially formed on a metal substrate and the light emitting device 160 is formed on the circuit pattern portion 140. It consists of a chip holding part provided with). The upper end 120 of the bending area is fixed to the side of the chassis 170, and the lower end 130 of the bending area is a mounting portion mounted to the chassis 170 structure, the space portion spaced apart from the side of the chassis 170 By placing (P) on the bottom of the chassis 170 by the TIM 150, the heat dissipation PCB and the bracket can be matched without using a separate bracket to maximize the heat dissipation effect and simplify the process and structure. have.

In this case, the circuit pattern part 140 and the two bent regions have a '-' shape. That is, the two bent regions in which the circuit pattern is not formed in the heat dissipation PCB 110 are perpendicular to the angles θ1 and θ2 with the rear surface of the circuit pattern part 140 of the heat dissipation PCB 110. This is only a preferred embodiment of the present invention, the two bent regions are not necessarily perpendicular to the circuit pattern portion 140.

The light emitting device 160 is mounted on the chip holding part provided in the circuit pattern part 140 to be a light source of the backlight unit. The chip mounting part is preferably equipped with an LED as the light emitting device 160, but is not limited thereto. It doesn't happen.

In addition, the metal substrate is preferably an Al substrate, but is not necessarily limited thereto.

4 illustrates a cross-sectional view of another embodiment of the present invention.

Referring to FIG. 4, the bracket integrated heat dissipation PCB 110 includes a circuit pattern portion 140 and two bent regions. The circuit pattern portion 140 includes an insulating layer and a circuit pattern sequentially on a metal substrate. It is formed and consists of a chip holding part provided with the light emitting element 160. As shown in FIG. The upper end 120 of the bending area is fixed to the side of the chassis 170, and the lower end 130 of the bending area is a mounting portion mounted to the chassis 170 structure, the space portion spaced apart from the side of the chassis 170 By placing (P) on the bottom of the chassis 170 by the TIM 150, the heat dissipation PCB 110 and the bracket may be integrated without maximizing the heat dissipation effect.

In this case, the angle θ1 between the upper end 120 of the bending area and the rear surface of the circuit pattern part 140 forms a right angle, and the lower end 130 of the bending area and the front surface of the circuit pattern part 140. An angle θ2 is also formed at right angles, which is merely an embodiment of the present invention, and two bending regions are not necessarily perpendicular to the circuit pattern unit 140. In addition, the light emitting device 160 is mounted on the chip holding part provided in the circuit pattern part 140 to become a light source of the backlight unit, and the metal mounting part includes an LED as the light emitting device 160. Is preferably an Al substrate, but is not necessarily limited thereto.

5 shows a cross-sectional view of another embodiment of the present invention.

Referring to FIG. 5, the bracket-integrated heat dissipation PCB 110 has only one bending area, which is perpendicular to the angle θ2 between the front surface of the circuit pattern part 140 and the chassis 170. It is mounted to the chassis 170 by the TIM 150 with a space P spaced apart from the side. As such, the bending area of the bracket-integrated heat dissipation PCB may be one or two, as shown in FIGS. 3 and 4. Of course, the bending area may be three or more.

6 to 10 show the plan view before bending of the bracket integrated heat dissipation PCB of FIG. 3 or 4 and FIGS. 11 to 13.

6 is a preferred embodiment of the present invention, referring to FIG. 6, the heat dissipation PCB is divided into one circuit pattern part 270 and two bent area parts 280 around two bent parts 290. The circuit pattern part 270 includes a chip mounting part 250, and electrode parts 210 and 220 formed of an anode 210 and a cathode 220, and the chip mounting part 250 emits light such as an LED lamp. The element 260 is mounted. The bent region part 280 includes electrode wiring parts 230 and 240 connecting the chip mounting part 250 and the electrode parts 210 and 220, and the electrode wiring parts 230 and 240 are formed of a circuit. By being located in the bending area portion 280 that is different from the pattern portion 270, the width Y of the circuit pattern portion is narrowed, so that the BLU can be made slim, and the heat generated as the current flows in the circuit pattern portion 270. ), It is possible to prevent the occurrence of defects in the circuit pattern generated by heat and to enhance the heat dissipation effect.

In this case, the bent region in which the electrode wirings 230 and 240 are not formed may be a mounting portion and be mounted to the chassis structure as shown in FIG. 3 or 4 through the TIM, but the electrode wirings 230 and 240 may be mounted. ) May be mounted on the chassis structure by using the bent area formed with).

Referring to FIG. 7 as another embodiment of the present invention, as shown in FIG. 6, the heat dissipation PCB includes one circuit pattern part 270 and two bent area parts 280 around the bent part 290. The circuit pattern unit 270 includes electrodes 210 and 220 and a chip mounting unit 250, and a light emitting device 260 such as an LED lamp is mounted on the chip mounting unit 250. However, the difference from FIG. 6 is that the electrode lines 230 and 240 constituting the electrode wiring portions 230 and 240 are formed in different bent region portions 280. As such, by separating the chip mounting unit 250 and the electrode wires 230 and 240, the heat dissipation effect can be increased and the PCB width can be reduced. Any one of the bent area portion 280 becomes a mounting portion to be mounted to the chassis structure.

8 to 13 illustrate another embodiment of the present invention.

Referring to FIG. 8, unlike FIG. 6 and FIG. 7, not all of the electrode parts 210 and 220 are formed in the circuit pattern part 270, but one electrode 220 is a circuit pattern part 270. ), The other electrode 210 is formed in the bent region portion 280, and the electrode lines 230 and 240 connected thereto are not all formed in the bent region portion 280, but the electrodes 210 and 220 are formed. It is formed in this formed area. The electrode 210 formed in the bent region 280 may be any one of an anode and a cathode, and the bent region 280 in which the electrode 210 and the electrode line 230 are not formed may be a mounting portion and mounted on the chassis structure. It is preferable to be. As described above, the one electrode 210 and the electrode line 230 are formed in the bent region 280 to reduce the width of the conventional PCB.

Referring to FIG. 9, unlike FIG. 6 to FIG. 8, the positive electrode 210 and the negative electrode 220 constituting the electrode parts 210 and 220 are different from each other in the bent region part instead of the circuit pattern part 270. And the electrode lines 230 and 240 connected thereto are formed in the same bent region portion 280 as the region in which the electrode portions 210 and 220 are formed. By separating the electrode wires 230 and 240 or the electrode parts 210 and 220 from the chip mounting part 250, the width of the PCB can be narrowed and the heat source can be separated.

Referring to FIG. 10, unlike FIGS. 6 to 9, both the electrode parts 210 and 220 and the electrode wiring parts 230 and 240 are formed in the same bent region part 280. As such, since the electrode parts 210 and 220 and the electrode wiring parts 230 and 240 are formed on different planes from the chip mounting part 250, the electrode parts 210 and 220 and the electrode wiring parts 230 and 240 may be reduced in width than the conventional PCB width. Can be maximized. Among the bent region portions 280, the bent region portions 280, in which the electrode portions 210 and 220 and the electrode wiring portions 230 and 240 are not formed, become mounting portions and are mounted on the chassis structure via a TIM. However, the present disclosure is not limited thereto, and the bending region 280 having the electrode parts 210 and 220 and the electrode wiring parts 230 and 240 may be mounted parts.

11 to 13 illustrate an embodiment in which the electrode portion or the electrode wiring portion is formed on a plane different from that of the chip mounting portion when the bending region portion 280 is one.

Referring to FIG. 11, the bracket integrated heat dissipation PCB includes one circuit pattern portion 270 and one bent region portion 280, and the circuit pattern portion 270 includes a chip mounting portion 250 and the chip mounting portion. Electrode parts 210 and 220 for supplying power to the unit 250 are included, and the light emitting device 260 such as an LED lamp is mounted on the chip mounting unit 250. Electrode wiring portions 230 and 240 connecting the chip mounting portion 250 and the electrode portions 210 and 220 are formed in the bent region portion 280, and the bent region portion 280 is a mounting portion. By mounting on the chassis structure via the TIM has a structure as shown in FIG. By forming the electrode wirings 230 and 240 in the bent region 280 as described above, the width of the PCB can be reduced to contribute to slimming of the BLU, and heat dissipation can be improved by separating the heat source.

Referring to FIG. 12, FIG. 12 is the same as FIG. 11 in that one bending area portion 280 is provided. However, unlike FIG. 11, not only the electrode wiring portions 230 and 240 but also the electrode portions 210 and 220 are bent regions. By forming in the portion 280 to achieve the object of the present invention, PCB width reduction and heat source separation. The bent region 280 is mounted to the chassis structure as a mounting portion to have the structure of FIG. 5.

Referring to FIG. 13, FIG. 13 is the same as FIG. 11 and FIG. 12 in that one bending area portion 280 is provided. However, a part 210 of the electrode portions 210 and 220 and the electrode wiring portions 230 and 240 may be used. Only 230 is formed in the bent region portion 280 and the other portions 220 and 240 are formed in the circuit pattern portion 270 as a difference is to perform the object of the present invention.

6 to 13 are only exemplary embodiments of the present invention and correspond to the present invention if the electrode wiring portion or the electrode portion is formed on a different plane from the chip mounting portion. For example, even if three bent regions are provided, the electrode wiring portion or the electrode portion is formed in any one of the bent regions.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical spirit of the present invention should not be limited to the above-described embodiments of the present invention, but should be determined by the claims and equivalents thereof.

1 is a cross-sectional view showing a heat radiation PCB, a bracket and a chassis mounted therein according to the prior art.

2 is a plan view showing a heat radiation PCB according to the prior art.

Figure 3 is a view showing a chassis having a light emitting device on the heat dissipation PCB integrated with a bracket according to an embodiment of the present invention, and mounted therein.

4 to 5 are views illustrating a chassis in which a light emitting device is integrated in a heat dissipation PCB integrated with a bracket according to another embodiment of the present invention and mounted therein.

6 is a plan view illustrating a bracket-integrated heat dissipation PCB in which electrode lines are formed on a different plane from a circuit pattern part, according to an exemplary embodiment of the present invention.

7 to 13 are plan views illustrating a bracket-integrated heat dissipation PCB in which an electrode line or an electrode unit is formed on a plane different from a circuit pattern unit according to another exemplary embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

120, 130: upper and lower portions of the bent region 140: circuit pattern portion

150: TIM 170: chassis

P: space portion spaced apart from the circuit pattern portion and the side of the chassis

210,220: electrode portion (anode, cathode) 230, 240: electrode wire

250: chip mounting part 270: circuit pattern part

280: bending area portion 290: bending portion

Claims (7)

In the heat dissipation PCB mounted in the chassis structure that provides the light guide passage of the backlight unit, The heat dissipation PCB has a circuit pattern portion and at least one bent region portion, The bent region part includes at least one electrode line among the electrode wiring part connecting the chip mounting part and the electrode part included in the circuit pattern part, Bracket-integrated heat dissipation PCB, characterized in that any one of the bent region portion having a mounting portion mounted to the chassis structure. The method according to claim 1, When the bent area portion is 2 or more, The electrode line formed in the bent region portion, Bracket-integrated heat dissipation PCB, characterized in that formed in the bent region portion is not provided with the mounting portion. The method according to claim 1, At least one of an anode and a cathode constituting the electrode unit, Bracket integrated heat dissipation PCB, characterized in that formed in the bent region. The method according to any one of claims 1 to 3, The heat dissipation PCB, Bracket integrated heat dissipation PCB, characterized in that the insulating layer, the circuit pattern is formed sequentially on the metal substrate. The method according to claim 4, The metal substrate is a bracket integrated heat dissipation PCB, characterized in that the Al substrate. The insulating layer and the circuit pattern are sequentially formed on the metal substrate, A circuit pattern portion and at least one bent region portion; A heat dissipation PCB having at least one electrode line or an electrode portion formed in the bent region; The heat dissipation PCB has a chassis structure having a bracket-integrated heat dissipation PCB, characterized in that it is mounted to have a space portion spaced apart from the side of the chassis structure. The method according to claim 6, Any one of the end portion of the heat dissipation PCB, The chassis structure having a bracket integrated heat dissipation PCB, characterized in that formed in close contact with the side of the chassis structure.

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