KR101092086B1 - LED package - Google Patents

LED package Download PDF

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Publication number
KR101092086B1
KR101092086B1 KR1020100042714A KR20100042714A KR101092086B1 KR 101092086 B1 KR101092086 B1 KR 101092086B1 KR 1020100042714 A KR1020100042714 A KR 1020100042714A KR 20100042714 A KR20100042714 A KR 20100042714A KR 101092086 B1 KR101092086 B1 KR 101092086B1
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KR
South Korea
Prior art keywords
light
led
led package
coating layer
led chip
Prior art date
Application number
KR1020100042714A
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Korean (ko)
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KR20110123304A (en
Inventor
최종식
박희원
Original Assignee
희성전자 주식회사
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Priority to KR1020100042714A priority Critical patent/KR101092086B1/en
Publication of KR20110123304A publication Critical patent/KR20110123304A/en
Application granted granted Critical
Publication of KR101092086B1 publication Critical patent/KR101092086B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Abstract

The present invention relates to a light emitting diode package and a method of manufacturing the same, wherein the lead frame on the side is removed and a fine pattern is formed on the upper surface, thereby improving light efficiency and simplifying the manufacturing process. The LED chip is mounted by wire bonding so as to be connected to the electrode pads, and a coating layer of a transparent resin is formed to seal the LED chip, and a light pattern is formed on the top surface of the coating layer while the reflector partition wall is removed. do.
In addition, the LED package manufacturing method of the present invention comprises the steps of mounting a plurality of LED chips by wire bonding on the substrate on which the electrode pad is formed; Injecting a transparent liquid resin to cover the LED chips; Coating the transparent resin to have a uniform thickness by rotating the substrate at a high speed using a spin coater; Forming a light pattern on the upper surface of the coating layer of the transparent resin using a stamp; And dicing the substrate such that each LED chip is separated.

Description

Light Emitting Diode Package {LED package}

The present invention relates to a light emitting diode package, and more particularly, the lead frame on the side is removed and a fine pattern is formed on the upper surface, thereby improving light efficiency and simplifying a manufacturing process, and a manufacturing method thereof. It is about.

Light emitting diodes (hereinafter referred to as "LEDs") are devices that generate a small number of carriers (electrons or holes) using a pn junction structure of a semiconductor, and emit a predetermined light by recombination thereof, and consume less power. As the service life is long, can be installed in a narrow space, and the vibration resistant property is provided, the use of various information processing and communication devices is increasing.

Such LEDs exhibit advantages in high lifespan, low power, eco-friendliness, and thinness, and recently, various functional LEDs have been developed, and are widely used as light sources of backlight units or various lighting devices.

A backlight unit or lighting device using LED as a light source is packaged and used in order to secure the required luminance once, and is packaged and arranged to show optimal light efficiency with minimum LED quantity in consideration of economy. . That is, the LED package can improve the distribution of light incident into the light guide plate according to its structure, because the light efficiency and directivity of the LED can be adjusted according to the shape and material of the package.

Particularly, when used as a light source of a backlight unit, a LED package having a wide light directing angle with high brightness and uniformity of brightness is required. As the light directing angle is wider, fewer LED packages are used for a backlight unit having the same area. It is because it shows an advantage in manufacturing cost.

According to the LED package according to the related art, as shown in FIGS. 1 and 2, the LED chip 2 is bonded onto the substrate 1, and the reflector 3 partition wall is formed along the upper edge of the substrate 1. In addition, the silicon molding part 4 is filled inside the reflector 3 while sealing the LED chip 2.

In this structure, the light generated from the LED chip (2) sealed with silicon is totally reflected by the critical angle in the reflector (3) partition wall and the molding part 4, and the electrode pad, lead wire, etc. There is a problem that the light efficiency is converted to heat by the conventional structure, the light efficiency emitted to the outside is lowered.

In addition, the upper surface of the molding portion 4, from which light is emitted, forms a plane, and there is a problem in that a limit is shown in an angle at which light is emitted, that is, a direction angle.

In addition, the LED package having the above structure is a process of forming the reflector 3 on the substrate 1, and injecting a liquid transparent silicone resin into the reflector 3 to form the molding part 4. There is a problem in that the manufacturing process is complicated, even if the molding portion 4 is formed by the spin coating method, there is a limit in securing a uniform thickness and slimming the thickness by the reflector 3 partition wall.

The present invention has been proposed to solve the above problems, by forming a fine light pattern on the upper surface of the silicon molding portion to emit light that is totally reflected inside by the critical angle, thereby reducing the energy loss due to total internal reflection to improve the overall light efficiency It is an object to provide an LED package that can be improved.

Another object of the present invention is to provide an LED package that can reduce manufacturing costs by using a small number of LED packages for the same area of the backlight unit by a wide light directivity angle and high light efficiency.

In addition, the present invention provides a method of manufacturing a thin LED package by a simple manufacturing process by removing the reflector surrounding the silicon molding, by forming a silicon molding by a spin coating method.

LED package of the present invention for achieving the above object is mounted on the substrate by wire bonding so that the LED chip is connected to the electrode pad, a coating layer of a transparent resin is formed to seal the LED chip, the upper surface of the coating layer A prism-shaped light pattern is formed in which the angle θ of the valley is 90 ° ≦ θ ≦ 130 °, and the floor spacing W1 is 10 μm ≦ W1 ≦ 50 μm.

In the above-described configuration, the optical pattern has a radius of curvature R of 0.8 µm ≤ R ≤ 25 µm, a floor gap W2 of 0.4 µm ≤ W2 ≤ 50 µm, and a depth H of the radius of curvature R. 0.25R ≤ H ≤ R, characterized in that formed in a lenticular shape recessed inward.

In the above-described configuration, the light pattern has an angle α1 of the first inclined plane and an angle α2 of the second inclined plane with respect to the vertical direction, respectively, wherein 45 ° ≦ α1 (or α2) ≦ 65 ° (where, α1 ≠ α2), the height H1 of the first slope and the height H2 of the second slope are 0.2H3 ≦ H1 (or H2) ≦ 0.8H3 for the total height H3, H3 = H1 + H2, respectively. The spacing W2 is characterized in that it is formed in a double prism shape with 0.4 µm ≤ W3 ≤ 50 µm.

In the LED package of the above-described configuration according to an embodiment of the present invention, the reflector partition wall is removed and a fine light pattern is formed on the upper surface of the silicon molding part, thereby radiating light totally reflected inside by the critical angle, thereby causing energy loss due to total internal reflection. Can reduce and improve the overall light efficiency.

In addition, a relatively small number of LED packages are used for the same area backlight unit due to the wide light directivity, thereby reducing manufacturing costs.

LED package manufacturing method of the above configuration according to an embodiment of the present invention by removing the reflector surrounding the silicon molding, by forming a silicon molding by a spin coating method can be manufactured in a simple process, it is easy to slim the thickness .

1 is a perspective view showing an LED package according to the prior art,
2 is a cross-sectional view showing an LED package according to the prior art,
3 is a perspective view showing an LED package according to an embodiment of the present invention,
4 is a cross-sectional view showing an LED package according to an embodiment of the present invention;
5A to 5C are views illustrating a light emission path of the LED package according to various embodiments of the present disclosure.
6a and 6b is a view showing the optical characteristics of the LED package according to an embodiment of the present invention,
7A to 7E are views illustrating a manufacturing process of the LED package according to the embodiment of the present invention.

The technical problem achieved by the present invention and the practice of the present invention will be apparent from the preferred embodiments described below. The following examples are merely illustrated to illustrate the present invention and are not intended to limit the scope of the present invention. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a perspective view showing the structure of the LED package according to an embodiment of the present invention, Figure 4 is a cross-sectional view showing a B-B 'structure of the LED package according to the embodiment of FIG.

Referring to the drawings, the LED package 100 according to the embodiment of the present invention has a structure in which the LED chip 20 is seated on the substrate 10 and a coating layer 30 for sealing the LED chip 20 is formed. Achieve. In particular, in the LED package 100 according to the embodiment of the present invention, the reflector (3 in FIG. 1) which surrounds the LED chip 20 is removed so that the coating layer 30 can be easily formed and the package can be slimmed.

Specifically, the above-described substrate 10 is a configuration for applying power by mounting the LED chip 20 on the upper side, and may be configured as a printed circuit board or a lead frame, and as long as for applying power to the upper surface. Pairs of electrode pads 11 at different potentials are formed.

The LED chip 20 described above serves as a light source, and is a semiconductor device that converts electrical energy into light energy by using a potential difference. The LED chip 20 is connected to each electrode pad 11 by a lead wire 21 while being connected to a substrate ( 10) is mounted on.

The above-described coating layer 30 typically functions to seal the LED chip 20 and the lead wire 21 to protect against the outside, and at the same time to convert the light from the LED chip 20 to the wavelength to emit upward. It is for the configuration. The coating layer 30 is preferably composed of a resin that exhibits white light. For example, the coating layer 30 is formed by spin coating using a liquid resin material in which a phosphor is mixed with a transparent resin-based material such as an epoxy resin or a silicone resin. Can be. The phosphor converts a portion of the relatively short wavelength light emitted from the LED chip 20 into a long wavelength, and white light is realized by mixing the remaining short wavelength light of the LED chip 20 with the wavelength converted by the phosphor. .

On the other hand, the upper surface of the coating layer 30 according to an embodiment of the present invention is formed in parallel with the light pattern 31 in one direction in order to improve the directing angle of the emitted light, with respect to the light pattern 31 in the following Look specifically.

5A to 5C are views illustrating light patterns having various shapes formed on the upper surface of the coating layer of the LED package and the light emission paths of the light patterns.

Referring to FIG. 5A, a plurality of prismatic shapes 31a having lengths in the front and rear directions may be formed in parallel in the left and right directions. In this case, the angle θ of the valley of the prism shape 31a is 90 ° ≦ θ ≦ 130 °, and the floor gap W1 is formed to have a thickness of 10 μm ≦ W1 ≦ 50 μm to indicate a wide light directing angle. desirable. If the angle of the valley and the distance between the floor is out of the above range, the light directing angle is lowered.

In addition, as illustrated in FIG. 5B, a plurality of lenticular shapes 31b having lengths in the front and rear directions may be formed in parallel in the left and right directions. At this time, the curvature radius (R) of the lenticular shape (31b) is 0.8㎛ ≤ R ≤ 25㎛, the floor spacing (W2) is 0.4㎛ ≤ W2 ≤ 50㎛, in order to show a wide light direction angle, depth (H) Is preferably formed such that 0.25R ≦ H ≦ R with respect to the radius of curvature R. If the radius of curvature, the spacing and depth of the floor are out of the above range, the light directing angle is lowered.

In addition, as illustrated in FIG. 5C, a plurality of double prism shapes 31c having lengths in the front and rear directions may be formed in parallel in the left and right directions. At this time, the angle α1 of the first inclined plane and the angle α2 of the second inclined plane with respect to the vertical direction of the double prism shape 31c are 45 ° ≦ α1 ≦ 65 ° and 45 ° ≦ for the wide light directing angle. α2 ≦ 65 ° and the height H1 of the first slope and the height H2 of the second slope are 0.2H3 ≦ H1 ≦ 0.8H3 and 0.2H3 ≦ H2 with respect to the total height (H3, H3 = H1 + H2), respectively. ≦ 0.8H3, and the floor spacing W2 is preferably formed such that 0.4 μm ≦ W2 ≦ 50 μm. Here, the angle α1 of the first inclined plane and the angle α2 of the second inclined plane should not be equal to each other, and the angle and height of the first inclined plane, the angle and height of the second inclined plane, and the interval between the floors are within the above range. If it deviates, the light directing angle is lowered.

In the LED package according to the embodiment of the present invention, the light pattern 31 having the structure as described above narrows the conditions under which the light from the LED chip 20 is totally reflected inside the coating layer 30, thereby resulting in light efficiency and The light directing angle in the left and right directions (x direction in Fig. 3) is improved.

6A and 6B are diagrams illustrating optical characteristics of an LED package according to the related art and an LED package according to various embodiments of the present disclosure, and FIG. 6A is a graph showing left and right directivity angles (x direction in FIG. 3). 6B is a graph showing the vertically oriented angle (y direction of FIG. 3).

As shown, the reflector partition wall is removed according to the exemplary embodiment of the present invention, and the light pattern 31 having the prism shape 31a, the lenticular shape 31b, and the double prism shape 31c is formed on the upper surface of the coating layer 30. It can be seen that all of the packages are emitted at a much wider light directivity angle than the LED packages according to the prior art.

That is, as shown in Figure 6a, 6b and Table 1, in the light efficiency, the LED package formed with the light pattern 31 of various shapes according to the embodiment of the present invention is 124%, respectively, compared to the LED package according to the prior art , Light efficiency of 122% and 124%.

In addition, in the light directing angle, the light directing angle of the LED package according to the related art shows both the left and right directivity angles and the up and down directivity angles as 120 °, but according to the embodiment of the present invention, The formed LED package has 148 °, 162 ° and 160 ° angles, and the vertical and vertical beam angles are 101 °, 140 ° and 126 °, respectively. .

Conventional LED Prism shape Lenticular geometry Double prism geometry Light efficiency 100% 124% 122% 124% Right and left 120 ° 148 ° 162 ° 160 ° Vertical angle 120 ° 101 ° 140 ° 126 °

7A to 7E are views illustrating a manufacturing process of the LED package according to the embodiment of the present invention.

Referring to the drawings, the manufacture of the LED package according to an embodiment of the present invention, as shown in Figure 7a first on the substrate 10 to a predetermined interval in the horizontal and vertical direction on the substrate 10 in a chip-on-board method After mounting, the LED chip 20 is connected to the electrode pad 11 using the lead wire 21 to implement the LED array.

As shown in FIG. 7B, a liquid transparent resin 61 is injected into the upper surface of the LED array using a dispenser 60 to seal each component including the LED chip 20. As described above, the liquid transparent resin 61 may be an epoxy resin or a silicone resin mixed with phosphors.

The upper surface of the transparent resin 61 is not flat as shown, the thickness is formed differently depending on the position, using a spin coater (spin coater, 50) as shown in Figure 7c to be coated with a uniform thickness Rotate The strong rotation of the spin coater 50 seals the LED chip 20 while the resin is evenly dispersed over the entire surface of the substrate. In this case, since there is no reflector partition wall (3 in FIG. 1) surrounding the LED chip 20, spin coating may be easily performed, and the thickness of the coating layer 30 may be adjusted to achieve slimming.

An upper surface of the coating layer 30 formed to have a uniform thickness has a planar shape. As shown in FIG. 7D, the light pattern 31 is formed on the entire surface of the coating layer using the stamp 70. As described above, the light pattern 31 may be formed in various shapes such as a prism shape 31a, a lenticular shape 31b, and a double prism shape 31c.

After forming the light pattern, the LED array is diced in the horizontal and vertical directions C-C 'and D-D' by one LED chip unit as shown in FIG. 7E to finally manufacture the LED package 100.

In the manufacture of the LED package having the above-described process, the process of forming the reflector is eliminated, thereby simplifying the process, and the coating layer for white light emergence can be easily formed by using the spin coating method.

Although the embodiments of the present invention have been described with reference to the present invention, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

10 substrate 11 electrode pad
20: LED chip 21: lead wire
30 coating layer 31 light pattern

Claims (3)

Mounted on the substrate by wire bonding so that the LED chip is connected to the electrode pads,
A coating layer of a transparent resin is formed to seal the LED chip,
On the upper surface of the coating layer, a prism-shaped light pattern having an angle θ of 90 ° ≦ θ ≦ 130 ° and a floor gap W1 of 10 μm ≦ W1 ≦ 50 μm is formed.
LED package, characterized in that the reflector is removed. The method of claim 1, wherein the light pattern,
The radius of curvature R is 0.8 μm ≤ R ≤ 25 μm, the floor spacing W2 is 0.4 μm ≤ W2 ≤ 50 μm, and the depth H is 0.25R ≤ H ≤ R with respect to the radius of curvature R. LED package, characterized in that formed in a lenticular shape to be recessed. The method of claim 1, wherein the light pattern,
The angle α1 of the first inclined plane and the angle α2 of the second inclined plane with respect to the vertical direction are 45 ° ≦ α1 (or α2) ≦ 65 °, provided that α1 ≠ α2 and the overall height H3, H3 = The height H1 of the first slope and the height H2 of the second slope are 0.2H3 ≤ H1 (or H2) ≤ 0.8H3, and the floor spacing W2 is 0.4 µm ≤ W3 ≤ H1 + H2). An LED package, characterized in that formed in a double prism shape of 50㎛.
KR1020100042714A 2010-05-07 2010-05-07 LED package KR101092086B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100042714A KR101092086B1 (en) 2010-05-07 2010-05-07 LED package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100042714A KR101092086B1 (en) 2010-05-07 2010-05-07 LED package

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KR20110123304A KR20110123304A (en) 2011-11-15
KR101092086B1 true KR101092086B1 (en) 2011-12-12

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005317664A (en) * 2004-04-27 2005-11-10 Shin Etsu Handotai Co Ltd Light emitting element and method of manufacturing the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005317664A (en) * 2004-04-27 2005-11-10 Shin Etsu Handotai Co Ltd Light emitting element and method of manufacturing the same

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