KR101081590B1

KR101081590B1 - Marking method

Info

Publication number: KR101081590B1
Application number: KR1020090085399A
Authority: KR
Inventors: 전해진; 홍명호
Original assignee: 삼성전기주식회사
Priority date: 2009-09-10
Filing date: 2009-09-10
Publication date: 2011-11-08
Also published as: KR20110027346A

Abstract

A marking method is disclosed. Laminating a first ink layer on a carrier, laminating a second ink layer having a different color from the first ink layer and covering the first ink layer to form a label film, attaching the label film to an electronic device or a substrate The marking method comprising the step of selectively removing the second ink layer of the label film and marking, by uniformly forming the ink layer constituting the marking area and preventing the adhesion of foreign matter, thereby uniformly marking quality I can keep it.

Electronic device, board, marking

Description

Marking method

The present invention relates to a marking method.

In general, marking technology in the electronic field is used to mark an identification (ID) unique to the upper surface of the electronic device or the substrate. By marking the ID of each electronic device or substrate through marking at the beginning of the electronic device or substrate manufacturing process, the electronic device or substrate is classified based on the ID during or after the process.

Laser marking is mainly used for marking electronic devices or substrates. After the white ink and the black ink are sequentially applied to the marking area and cured by using a mask on the electronic device or the substrate, the black ink is removed by a laser and then marked.

However, a method of forming a marking area by directly applying ink to an electronic device or a substrate has a problem in that it is difficult to apply ink uniformly and foreign matter adheres well to cause a recognition failure of the marking. In addition, the process of applying ink to the electronic device or the substrate increases the cost and processing time, which requires the manufacture and cleaning of the mask.

The present invention provides a marking method for forming a marking of uniform quality on an electronic device or a substrate.

In addition, to provide a marking method for reducing the cost and time required for the formation of the marking in the manufacturing process of the electronic device or the substrate.

According to an aspect of the invention, the step of laminating a first ink layer on a carrier, the step of forming a label film by laminating a second ink layer having a different color from the first ink layer and covering the first ink layer And attaching the label film to an electronic device or a substrate, and selectively removing and marking the second ink layer of the label film.

The first ink layer and the second ink layer are thermosetting inks, and before the attaching step, semi-curing the first ink layer and the second ink layer, and after the attaching step, the first ink layer and the The method may further include completely curing the second ink layer.

After the semi-curing step, the label film may further comprise the step of separating from the carrier.

The attaching step may include fusing the label film to the electronic device or the substrate.

The attaching step may include attaching the label film to the electronic device or the substrate.

In the marking step, the second ink layer may be selectively removed using a laser.

According to the present invention, the quality of the marking can be maintained uniformly by forming the ink layer constituting the marking area uniformly and preventing the adhesion of foreign matter.

In addition, by simplifying the marking process in the electronic device or substrate manufacturing process, it is possible to reduce the manufacturing time and manufacturing cost.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a flowchart illustrating an electronic device marking method according to an embodiment of the present invention, and FIGS. 2 to 5 are cross-sectional views illustrating steps of an electronic device marking method according to an embodiment of the present invention.

The marking method according to an embodiment of the present invention includes a first ink layer stacking step (S110), a label film forming step (S120), a label film attaching step (S130), and a marking step (S140).

First, in the first ink layer stacking step (S110), the first ink layer 10 is stacked on the carrier 5. The first ink layer 10 is a portion that is exposed when the second ink layer 20, which will be described later, is selectively removed and becomes a marking pattern. In order to achieve a good marking, the first ink layer 10 must have a uniform height, that is, a flat upper surface. To this end, the first ink layer 10 having a uniform height may be formed by uniformly applying ink to the flat carrier 5.

As shown in FIG. 2, in the present embodiment, a white ink is applied to a carrier 5 made of a film to form the first ink layer 10.

Next, in the label film forming step (S120), the second ink layer 20 having a color different from that of the first ink layer 10 and covering the first ink layer 10 is laminated to form a first ink layer 10. ) And the second ink layer 20 are sequentially formed to form a label film 50. At this time, the second ink layer 20 is uniformly applied to have a uniform distance, that is, a uniform thickness with the first ink layer 10 is formed.

As shown in FIG. 3, in the present embodiment, black ink is applied to the carrier 5 on which the first ink layer 10 is formed to form a second ink layer 20 covering the first ink layer 10. .

In this case, the first ink layer 10 and the second ink layer 20 are thermosetting inks and may be semi-cured to form the label film 50 (S125). The label film 50 of the semi-cured state is easy to move and attach, there is an advantage that the foreign matter is not attached well. In addition, the label film 50 in the semi-cured state can be separated from the carrier 5 to form a label film 50 formed only of the first ink layer 10 and the second ink layer 20 on the electronic device or the substrate. I can attach it.

Meanwhile, the label film 50 may be attached to the electronic device or the substrate together with the carrier 5 film.

Next, in the label film attaching step (S130), the label film 50 is attached to the electronic device or the substrate 60. Specifically, as shown in FIG. 4, the semi-cured label film 50 may be directly fused to the electronic device or the substrate 60. In addition, the label film 50 may be attached to the electronic device or the substrate 60 by using an adhesive.

In this embodiment, after the label film 50 is attached, the first ink layer 10 and the second ink layer 20 of the label film 50 in the semi-cured state are completely cured to mark the marking area on the electronic device or the substrate. To form (S135).

Accordingly, in the manufacturing process of the electronic device or the substrate, the marking area may be formed only by attaching the label film 50. Therefore, as compared with the conventional method of applying ink directly to the electronic device or the substrate during the manufacturing process, the marking area forming process is simplified and time is saved in the manufacturing process of the electronic device or the substrate. In addition, as described above, since the label film 50 formed separately has a uniform thickness and prevents adhesion of foreign matter, it is possible to form a marking of uniform quality.

Next, in the marking step S140, marking is performed by selectively removing the second ink layer 20 of the label film 50. As shown in FIG. 5, when the second ink layer 20 is removed corresponding to the marking pattern, the first ink layer 10 having a different color is exposed to be marked.

In this embodiment, the black second ink layer 20 is removed using a laser to form a white marking.

Although the above has been described with reference to embodiments of the present invention, those skilled in the art may variously modify the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. And can be changed.

Many embodiments other than the above-described embodiments are within the scope of the claims of the present invention.

1 is a flow chart showing a method for marking an electronic device according to an embodiment of the present invention.

2 to 5 are cross-sectional views showing steps of an electronic device marking method according to an embodiment of the present invention.

5: carrier

10: first ink layer

20: second ink layer

50: label film

60: substrate

Claims

Laminating a thermosetting first ink layer on a carrier;

Stacking a second thermosetting second ink layer having a color different from that of the first ink layer and covering the first ink layer, and semi-curing the first ink layer and the second ink layer to form a label film;

Separating the label film from a carrier;

Attaching the label film to an electronic device or a substrate;

Completely curing the first ink layer and the second ink layer; And

And selectively removing and marking the second ink layer of the label film.

delete

The method of claim 1,

The attaching step,

Marking the label film on the electronic device or the substrate.

The method of claim 1,

The attaching step comprises marking the label film on the electronic device or the substrate.

The method of claim 1,

The marking method, characterized in that for removing the second ink layer selectively using a laser.