KR101076227B1 - Vacuum evaporation apparatus - Google Patents

Abstract

The present invention relates to a vacuum deposition apparatus having a heater module capable of rotating an angle toward a substrate and rotating the substrate, wherein the vacuum chamber, a substrate holder installed on the upper part of the vacuum chamber and supporting the substrate, and a deposition source are provided. Heater module for discharging the vaporized deposition source by heating toward the substrate, and fixed to the lower portion of the heater module to adjust the angle so that the heater module makes a certain angle with respect to the bottom surface of the vacuum chamber And a rotation device connected to the angle adjuster to rotate the angle adjuster, so that the angle of the heater module can be easily adjusted toward the substrate mounted on the vacuum chamber, thereby forming a uniform film on the substrate after the process. If not, it is possible to simply redesign without having to reposition the components of the deposition apparatus. In is configured to rotate around without the heater module, it is possible to form a uniform film without increasing the size of the deposition apparatus, even if the substrate having a large area.

Vacuum deposition, heater, angle adjustment, rotation

Description

Vacuum deposition equipment {VACUUM EVAPORATION APPARATUS}

The present invention relates to a vacuum deposition apparatus, and more particularly, to a vacuum deposition apparatus having a heater module capable of rotating and rotating an angle toward a target (substrate).

In general, vacuum deposition apparatuses are used for the production of various articles such as organic electroluminescent devices. In the vacuum deposition apparatus, a thin film is formed on the surface of a substrate by atomic or molecular units by evaporating the material by applying heat to the material to be deposited in the vacuum chamber.

1 and 2 show a vacuum vapor deposition apparatus according to the prior art. Conventional vacuum vapor deposition is carried out in the vacuum chamber 2, the heater module 3 is mounted to the lower portion of the vacuum chamber, the heater module 3 is formed in a cylindrical shape with an opening formed in the upper portion. In the heater module 3, an accommodating part 4 accommodating the deposition source 5 is embedded therein, and a heater part 6 is installed to surround the accommodating part.

In addition, a substrate holder 7 is installed above the vacuum chamber so that the substrate 8 on which the film is deposited is mounted on the substrate holder, and the substrate holder is rotated to form a uniform deposition film.

The vapor deposition source 5 in the solid state or liquid state is heated by the heater and vaporized, and the vaporized deposition source moves toward the substrate, and vaporized deposition source particles are attached to the substrate, thereby depositing the deposited particles on the substrate surface. It is arranged or combined to form a thin film on the substrate surface.

However, since the vacuum deposition apparatus according to the related art has a structure in which the constituent devices including the heater module are configured on the basis of the simulation results in the design of the vacuum deposition apparatus, the heater module is fixed to the bottom surface of the vacuum chamber, If the vaporized deposition source cannot be moved in only one direction and a uniform deposition film is not formed after the process is performed inside the vacuum chamber, the problem of having to redesign the interior of the vacuum chamber or repositioning components including the heater module is required. there was.

In addition, since the vacuum deposition apparatus according to the related art has a structure for rotating a substrate holder on which a substrate on which a film is deposited is mounted, when the substrate is a large-area substrate, the substrate holder becomes large, thereby rotating the substrate holder. Since the configuration to be also large, there was a problem that the configuration of the vacuum deposition apparatus is enlarged and the cost is high.

The present invention is to solve the above-mentioned problems of the prior art, is configured to simply adjust the angle of the heater module toward the substrate mounted on the vacuum chamber is deposited when a uniform film is not formed on the substrate after the process proceeds It is an object of the present invention to provide a vacuum deposition apparatus that can be simply redesigned without the need to reposition components of the apparatus.

In addition, another object of the present invention is to provide a vacuum deposition apparatus capable of forming a uniform film even in the case of a large area substrate without having to enlarge the vapor deposition apparatus by configuring the heater module to rotate without rotating the substrate. will be.

In order to achieve the above object, a vacuum deposition apparatus according to the present invention includes a vacuum chamber, a substrate holder installed on an upper portion of the vacuum chamber to support a substrate, a receiving portion accommodating a deposition source, and a heater surrounding the receiving portion. And a heater main body having a cylindrical main body having an opening formed thereon and discharging the vapor deposition source toward the substrate by heating the vapor deposition source, and fixed to the lower part of the heater module. Characterized in that it comprises an angle control unit for adjusting the angle to achieve a certain angle with respect to the bottom surface of the vacuum chamber.

The angle adjusting unit may include a first angle adjusting rod having one end fixed to the lower portion of the main body, and a second angle adjusting rod connected to the first angle adjusting rod to be hinged. .

Here, the first angle adjustment rod has an insertion protrusion formed with a first pin fixing hole into which the connection fixing pin is inserted, and the second angle adjustment rod has an insertion groove into which the insertion protrusion is inserted at one end thereof; And a second pin fixing hole into which the connection fixing pin is inserted, and a bolt fixing hole into which a fixing bolt for pressing against the insertion protrusion inserted into the insertion groove is pressed.

In addition, the deposition apparatus is further provided with a rotating device connected to the angle control unit for rotating the angle control unit,

The rotating device includes a rotating body, a center shaft inserted through the bottom surface of the vacuum chamber and the center hole, a driving motor for rotating the center shaft, and a bottom surface of the vacuum chamber through a support rod. It is connected to the drive motor is configured to include a flange seated, characterized in that the center shaft is characterized in that the second angle adjustment rod.

The central axis and the flange of the rotating body main body is characterized in that it is formed inclined with respect to the bottom surface of the vacuum chamber.

The angle adjusting unit further includes a third angle adjusting rod, and the second angle adjusting rod has a second insertion protrusion having a third pin fixing hole into which a connecting pin is inserted at the other end, and the third angle. The adjustment rod is pressed against the second insertion groove into which the second insertion protrusion is inserted, the fourth pin fixing hole into which the connection fixing pin is inserted, and the second insertion protrusion inserted into the second insertion groove. The fixing bolt has a second bolt fixing hole is inserted, the center shaft is characterized in that the third angle adjustment rod.

According to the vacuum deposition apparatus of the present invention having the configuration as described above, since the angle of the heater module can be easily adjusted toward the substrate mounted on the vacuum chamber, even if a uniform film is not formed on the substrate after the process proceeds. It can be simply redesigned without the need to reposition components of the device, and is configured to rotate the heater module without rotating the substrate, so that even a large area substrate can form a uniform film without increasing the deposition apparatus. Can be.

Hereinafter, a vacuum deposition apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

≪ Example 1 >

3 is a view showing a vacuum deposition apparatus according to the present invention. As shown in FIG. 3, the vacuum deposition apparatus 1 according to the present invention includes a vacuum chamber 10, a substrate holder 11, a substrate 12, a heater module 20, and an angle adjusting unit ( 30 and the rotary device 40.

The substrate holder 11 is installed above the vacuum chamber 10 to support the substrate 12 transferred from the outside into the vacuum chamber 10. In the present invention, the substrate holder 12 is fixed to the vacuum chamber 10 without being rotated.

A vacuum pump (not shown) is installed in the vacuum chamber 10 to vacuum the inside of the vacuum chamber 10 after the substrate is transferred.

The heater module 20 is installed at the bottom of the vacuum chamber 10 on the bottom surface 10a of the vacuum chamber 10 through the angle adjusting unit 30 and the rotating device 40, the heater module 20 ) Is provided around the bottom surface 10a of the vacuum chamber 10 with respect to the substrate 12 supported on the upper portion of the vacuum chamber 10.

The heater module 20 is composed of an accommodating portion 21, a main body portion 22, and a heater portion 23.

The accommodating part 21 accommodates a deposition source 24, which is a material to be deposited on the substrate 12, in the vacuum chamber 10. The main body portion 22 is configured to surround the receiving portion 21, and an opening is provided at an upper portion thereof so that the vaporized deposition source 24 is discharged through the opening. A nozzle may be provided on the main body 22 to increase the discharge efficiency of the deposition source 24.

Inside the main body portion 22 is provided a heater 23 composed of a plurality of heating wires surrounding the receiving portion 21.

An angle adjusting unit 30 is provided below the heater module 20, and the heater module 20 is configured to form a predetermined angle with respect to the bottom surface 10a of the vacuum chamber 10.

The angle adjusting section 30 is composed of a plurality of angle adjusting rods, and two angle adjusting rods 31 and 32 in this embodiment.

One end of the first angle adjustment rod 31 is fixed to the lower portion of the main body portion 22, and the second angle adjustment rod 32 is connected to the other end of the first angle adjustment rod 31.

An insertion protrusion 31a is formed at the other end of the first angle adjustment rod 31, and is inserted and fastened into the insertion groove 32a of the second angle adjustment rod 32 to be described later. Near the end of the insertion protrusion 31a, a first pin fixing hole 31b into which a pin for connection fixing described later is inserted is provided.

An insertion groove into which the insertion protrusion 31a of the first angle adjustment rod 31 is inserted at one end of the second angle adjustment rod 32, that is, near the end connected to the first angle adjustment rod 31. 32a is formed. The depth of the insertion groove (32a) is preferably formed slightly larger than the protruding length of the insertion projection (31a).

In addition, in the vicinity of one end of the second angle adjustment rod 32, the second pin fixing hole 32b into which the connection fixing pin 34 is inserted into the length within the depth of the insertion groove 32a is inserted into the insertion groove. It is provided in both sides of 32a. Thus, the insertion protrusion 31a of the first angle adjusting rod 31 is inserted into the insertion groove 32a, and then the first pin fixing hole 31b and the second pin fixing hole 32b After the center is inserted, the first angle adjusting rod 31 and the second angle adjusting rod 32 are fastened to each other by inserting the connection fixing pin 34.

Bolt fixing holes 32c are formed at both sides of the insertion groove 32a on the second pin fixing hole 32b. The bolt fixing hole 32c may be provided in plural along the circumference of the second angle adjusting rod 32. A screw thread is formed in the bolt fixing hole 32c, and the bolt 35 is screwed into the bolt fixing hole 32c so that the end of the bolt 35 is inserted into the insertion groove (34) by the connection fixing pin 34. It is configured to abut on the surface of the insertion projection (31a) fastened in 32a) by pressing. Here, the bolt 35 may use a conventional bolt formed with a screw thread, but may also use a headless bolt without a head in consideration of the convenience of construction.

After the first angle adjusting rod 31 and the second angle adjusting rod 32 are fastened by using the first pin fixing hole and the second pin fixing hole 31b and 32b and the connection fixing pin 34, After adjusting the angle so that the heater module 20 faces the substrate 12 at a desired angle, the first angle adjusting rod 31 is fastened by fastening the bolt 35 through the bolt fixing hole 32c. By fixing so as not to rotate relative to the second angle adjustment rod 32, it is possible to simply adjust the angle of the heater module 20 toward the substrate 12.

In addition, in the case where a uniform film is not formed on the substrate 12 after the process is performed, the heater module 20 may be disposed at a desired angle after the bolt 35 is released without the need to rearrange the components of the deposition apparatus. After the angle is readjusted to face the substrate 12, the bolt 35 is fastened through the bolt fixing hole 32c so that the first angle adjusting rod 31 is connected to the second angle adjusting rod 32. By fixing so as not to rotate relative to, the angle of the heater module 20 toward the substrate 12 can be easily readjusted.

Meanwhile, referring to FIGS. 6 and 7, the deposition apparatus 1 further includes a rotating device 40 connected to the angle adjusting unit 30 to rotate the angle adjusting unit 30.

The rotating device 40 is composed of a rotating body 41, a central shaft, a drive motor 43, and a flange 44.

The rotating body 41 is installed in contact with the outside of the bottom surface (10a) of the vacuum chamber 10, the inner side is formed with a central hole (41a) into which the center shaft is inserted. A plurality of sealing members 41b are provided at a portion where the rotating body 41 and the bottom surface 10a of the vacuum chamber 10 come into contact with each other to maintain airtightness in the vacuum chamber 10.

In addition, a bearing 41c is provided at the upper and lower ends of the rotating body 41 in the center hole 41a, and a plurality of spacers 41d and a plurality of O-rings 41e are disposed below the bearing 41c. ) And a plurality of washers 41f are provided.

In addition, the plurality of bearings 41c and the spacer 41d are connected to a plate 42 having a hole concentric with the center hole 41a at a lower portion of the rotating body 41 by fixing means such as a bolt. ), The O-ring 41e and the washer 41f can be pressed to further maintain airtightness.

In addition, a flange 44 to which the support rods 44a and 44b connected to the outer side of the bottom surface 10a of the vacuum chamber 10 may be further installed on the outer side of the rotating body 41.

A drive motor 43 is seated on the flange 44, and the drive motor 43 is connected to a center shaft inserted into the center hole 41a to rotationally drive the center shaft.

Here, in the present embodiment, the second angle adjustment rod 32 is configured as a center shaft, but is not necessarily limited thereto, and may be configured to be connected to each other after the center shaft and the second angle adjustment rod are separately installed.

As a result, when the driving motor 43 is driven to rotate the second angle adjusting rod 32, the first angle adjusting rod 31 is connected to the second angle adjusting rod 32 at a predetermined angle. And the heater module 20 connected to the first angle adjusting rod, as shown in FIG. 3.

Here, the drive motor 43 is composed of a motor capable of forward and reverse rotation, and after the heater module 20 is rotated 1 to 2 in one direction by a controller (not shown), 1 to 2 rotations are repeated in the reverse direction. By configuring so that the power connection line (not shown) connected to the heater module 20 is preferably controlled so as not to be twisted in the vacuum chamber 10.

In addition, when the rotary device 40 and the second angle adjustment rod is installed perpendicular to the bottom surface 10a of the vacuum chamber 10, the heater module (by rotating the drive motor 43) When the 20 is rotated, the heater module 20 may face the direction away from the substrate 12, that is, the side wall of the vacuum chamber 10. Therefore, the central axis of the rotating body 41 and the flange 44 is preferably formed to be inclined with respect to the bottom surface (10a) of the vacuum chamber (10).

That is, as shown in FIG. 7, a trapezoidal plate 45 having an inclined surface is provided between the bottom surface 10a of the vacuum chamber 10 and the rotating body 41. At this time, the inclined hole is drilled in the bottom surface 10a of the vacuum chamber 10, and a through hole having an inclined axis is formed in the plate 45 in accordance with the center of the hole, and the flange 44 ') One side 44b' of the support rod is long, one side (44a ') is small, so that the rotating body 40 itself without the inclined to form the rotating device 40 and the second angle adjustment The rod 32 may be installed to be inclined with respect to the bottom surface 10a of the vacuum chamber 10, and the heater module 20 is rotated when the heater module 20 rotates by rotating the driving motor 43. ) May always be in the direction towards the substrate 12.

<Example 2>

In the present embodiment, except for the configuration of the angle adjuster and the configuration of the rotating device is formed obliquely the same as the configuration of the first embodiment, the same reference numerals are assigned to the same components, and duplicate descriptions are omitted.

As described above, when the rotary device 40 and the second angle adjustment rod 32 is installed perpendicular to the bottom surface 10a of the vacuum chamber 10, the rotational drive of the drive motor 43 When the heater module 20 is rotated by the heater module 20 may be oriented toward the direction away from the substrate 12, that is, the side wall of the vacuum chamber 10.

In the present embodiment, the rotary device 40 is different from the configuration of the first embodiment in that the rotary device 40 is not formed to be inclined with respect to the bottom surface 10a of the vacuum chamber 10, and the angle adjusting part is provided with a plurality of angle adjustments. The rod and the three angle adjusting rods are configured such that the heater module does not face away from the substrate 12.

As shown in FIGS. 5A and 5B, the angle adjusting unit 30 'includes a first angle adjusting rod 31, a second angle adjusting rod 32 ′, and a third angle adjusting rod 33. It is composed.

The first angle adjustment rod 31 has the same configuration as that of the first angle adjustment rod of the first embodiment.

At one end of the second angle adjusting rod 32 ', an insertion groove 32a into which the insertion protrusion 31a of the first angle adjusting rod 31 is inserted, a second pin fixing hole 32b, The point where the bolt fixing hole 32c is formed is the same as that of the first embodiment.

In addition, a second insertion protrusion 32d having a third pin fixing hole 32e into which the connection fixing pin 34 is inserted is further formed at the other end of the second angle adjusting rod 32 '.

In addition, the configuration of the third angle adjustment rod 33 is the same as the configuration of the second angle adjustment rod 32 of the first embodiment. That is, the third angle adjusting rod 33 has a second insertion groove 33a into which the second insertion protrusion 32d is inserted at one end and a fourth pin fixing into which the connection fixing pin 34 is inserted. And a second bolt fixing hole 33c into which the fixing bolt 35 which presses against and presses the hole 33b and the second insertion protrusion 32d inserted into the second insertion groove 33a is inserted. The third angle adjustment rod 33 may be configured as a center shaft as in the first embodiment, of course.

By configuring as described above, even if the rotary device 40 and the third angle adjustment rod are not inclined with respect to the bottom surface 10a of the vacuum chamber 10, Tilt the second angle adjustment rod 32 'to have a predetermined angle, and further adjust the angle by tilting the first angle adjustment rod 31 with a certain angle with respect to the second angle adjustment rod 32'. As a result, when the heater module 20 is rotated by the rotational driving of the drive motor 43, the heater module 20 may always be in the direction toward the substrate 12.

The present embodiment is merely a part of the technical idea included in the present invention clearly, and modifications and specific embodiments that can be easily inferred by those skilled in the art within the scope of the technical idea included in the specification of the present invention are all Obviously, it is included in the technical idea of the present invention.

1 is a view showing a vacuum deposition apparatus according to the prior art.

2 is a view showing a heater module of a vacuum deposition apparatus according to the prior art.

3 is a view showing a vacuum deposition apparatus according to the present invention.

4a and 4b is a view showing the angle adjustment portion of the vacuum deposition apparatus according to the present invention.

5A and 5B are views showing another example of the angle adjusting unit of the vacuum deposition apparatus according to the present invention.

6 is a view showing a rotating device of the vacuum deposition apparatus according to the present invention.

7 is a view showing another example of the rotary device of the vacuum deposition apparatus according to the present invention.

8 is a view showing a heater module of the vacuum deposition apparatus according to the present invention.

<Description of the symbols for the main parts of the drawings>

1: vacuum deposition apparatus

10: vacuum chamber

11: substrate holder

12: substrate

20: heater module

30: angle adjuster

40: rotating device

Claims (6)

delete In the vacuum deposition apparatus, With a vacuum chamber, A substrate holder installed at an upper portion of the vacuum chamber to support a substrate; A heater module for accommodating a deposition source, a heater part surrounding the accommodation part, and having a cylindrical body having an opening formed thereon, the heater module discharging the vaporized deposition source toward the substrate by heating the deposition source; A first angle adjusting rod having one end fixed to the lower portion of the main body, and a second angle adjusting rod hingedly connected to the first angle adjusting rod so that the heater module is connected to the bottom surface of the vacuum chamber. An angle adjusting unit that can adjust the angle to achieve a certain angle with respect to, And a rotation device connected to the angle control unit to rotate the angle control unit. The method of claim 2, The first angle adjustment rod has an insertion protrusion formed with a first pin fixing hole into which the connection fixing pin is inserted, The second angle adjustment rod is fixed to one end of the insertion groove into which the insertion protrusion is inserted, the second pin fixing hole into which the connection fixing pin is inserted, and to press the insertion protrusion inserted into the insertion groove. Vacuum deposition apparatus, characterized in that it has a bolt fixing hole into which the bolt is inserted. The method according to claim 2 or 3, The rotating device, A rotating body, A center shaft inserted through the bottom surface of the vacuum chamber; A drive motor for rotating the center shaft; Is connected to the bottom of the vacuum chamber and comprises a flange on which the drive motor is seated, The central shaft is a vacuum deposition apparatus, characterized in that the second angle adjustment rod. The vacuum deposition apparatus according to claim 4, wherein the central axis of the rotating body and the flange are inclined with respect to the bottom surface of the vacuum chamber. The method of claim 4, wherein the angle adjusting portion, further comprising a third angle adjusting rod connected to the second angle adjusting rod, The second angle adjustment rod has a second insertion protrusion formed with a third pin fixing hole into which the other end of the fixing pin is inserted, The third angle adjustment rod may include a second insertion groove into which the second insertion protrusion is inserted, a fourth pin fixing hole into which the connection fixing pin is inserted, and a second insertion protrusion inserted into the second insertion groove. A second bolt fixing hole into which a fixing bolt for abutting and pressing is inserted; The central shaft is a vacuum deposition apparatus, characterized in that the third angle adjustment rod.

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