JPS60135566A - Evaporating source device having directivity in oblique direction - Google Patents

Evaporating source device having directivity in oblique direction

Info

Publication number
JPS60135566A
JPS60135566A JP24220783A JP24220783A JPS60135566A JP S60135566 A JPS60135566 A JP S60135566A JP 24220783 A JP24220783 A JP 24220783A JP 24220783 A JP24220783 A JP 24220783A JP S60135566 A JPS60135566 A JP S60135566A
Authority
JP
Japan
Prior art keywords
evaporation
evaporated
vessel
oblique direction
source device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24220783A
Other languages
Japanese (ja)
Other versions
JPH0360913B2 (en
Inventor
Muneharu Komiya
小宮 宗治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Nihon Shinku Gijutsu KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc, Nihon Shinku Gijutsu KK filed Critical Ulvac Inc
Priority to JP24220783A priority Critical patent/JPS60135566A/en
Publication of JPS60135566A publication Critical patent/JPS60135566A/en
Publication of JPH0360913B2 publication Critical patent/JPH0360913B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material

Abstract

PURPOSE:To carry out vapor deposition independently of the placement and shape of a substrate by tilting and rotating a vessel so as to generate vapor distributed at high density in an oblique direction by the evaporation of a material to be evaporated from the evaporating outlet of the vessel tilted upward. CONSTITUTION:A heat resistant vessel 7 contg. a material 8 to be evaporated is set in a vacuum chamber 1. The vessel 7 is tilted so that the evaporating outlet 4 is titlted upward, and it is made freely rotatable on a tilted rotating shaft 6. The material 8 is melted with electron beams 10 or other heating means 11, and the melt is evaporated from the outlet 4 to generate vapor distributed at high density in an oblique direction. Thus, vapor deposition is carried out independently of the placement and shape of a substrate 3.

Description

【発明の詳細な説明】 本発明は真空蒸着に使用される蒸発蒸気を斜め方向に指
向性?有するように蒸発させるに適した蒸発源装置に関
する。
[Detailed Description of the Invention] The present invention provides diagonal directionality of evaporated vapor used in vacuum evaporation. The present invention relates to an evaporation source device suitable for evaporation.

従来蒸発源装置として例えば第1図示のように水冷銅ハ
ースがうなる耐熱性容器aに蒸発材料b’2入れ、電子
ビームCを該蒸発材料すに投入してこれ全溶解きせる式
のものが知られているが、この式のものでは容器a内の
溶解面を水平に保つように蒸発源装置全配置すると共に
その上方に基板d全配衡し、咳溶解面から蒸発する蒸気
全基板d上に凝縮でせる全一般とするもので、斜め方向
に配置さ扛た基板には蒸気を凝縮させ姉い欠点がある。
Conventional evaporation source devices are known, for example, as shown in Figure 1, in which an evaporation material b'2 is placed in a heat-resistant container a with a water-cooled copper hearth, and an electron beam C is thrown into the evaporation material to completely melt it. However, in this type, the entire evaporation source device is arranged so that the melting surface in the container a is kept horizontal, and the entire substrate d is placed above it, so that the vapor evaporated from the melting surface is all over the substrate d. In general, a diagonally placed substrate has the disadvantage of condensing vapor.

即ちこうした水平に配置された蒸発源装置から蒸発する
蒸気は鉛直方向に最も密度が高く近似的に余弦則(ωS
θ:nは1より大きい実数)で表わされる密度分布全方
し、傾斜方向にはさして大きな密度分布を得ることが出
来ないものでるり、基板の配置や形状が制約されて好ま
しくない。
In other words, the vapor evaporated from such a horizontally arranged evaporation source device has the highest density in the vertical direction, and approximately follows the cosine law (ωS).
θ: n is a real number greater than 1), and it is not possible to obtain a particularly large density distribution in the direction of inclination, and the arrangement and shape of the substrate are restricted, which is undesirable.

本発明は斜め方向に高い密度分布が得られる蒸発源装置
f:提供すること全目的としたもので、蒸発材料金入f
′した耐熱性容器を、蒸発口含料め上方に向けると共に
傾斜した回転軸を中心として回転自在に真空室内に設け
、電子ビームその他の加熱手段により溶解し几蒸発材料
ヲ咳蒸発口を介して斜め上方に蒸発させることを特徴と
する。
The entire purpose of the present invention is to provide an evaporation source device that can obtain a high density distribution in an oblique direction.
A heat-resistant container containing the evaporation port is placed in a vacuum chamber so that it can be rotated freely around an inclined rotation axis with the evaporation port facing upward, and the evaporation material is melted by an electron beam or other heating means and then passed through the evaporation port. It is characterized by evaporating diagonally upward.

本発明の実施例を図面につき説明するに、その第2図に
於て(1)は真空室、(2)は該室(1)内に設けた蒸
発源装置、(3)は蒸着処理でれるべき基板會示し、該
蒸発源装置(2)は蒸発口+41全斜め上方に向は駆動
軸(51Kより傾斜した回転軸(6)を中心として回転
される水冷銅ハース等の耐熱性容器(7)を備え1咳容
器(7)内に入れた蒸発材料(8)はフィラメント(9
)から磁界で偏向芒扛た電子ビーム001による加熱手
段旧jで溶解される。
To explain the embodiment of the present invention with reference to the drawings, in FIG. The evaporation source device (2) is a heat-resistant container such as a water-cooled copper hearth that is rotated around a rotation shaft (6) tilted from the drive shaft (51K) with the evaporation port +41 diagonally upward. The evaporative material (8) contained in a cough container (7) comprising a filament (9)
) is melted by heating means (old j) using an electron beam 001 deflected by a magnetic field.

その作動を説明するに耐熱性容器(7)を回転でせ内部
の蒸発材料(8)に電子ビーム00を当ててこれ全溶解
すると溶湯は重力に従って水平な溶解面全形成すべく流
動する。この場合回転が比較的遅いと溶湯は容器(7)
内で水平化するが回転速度が適切であると溶湯の動粘性
と遠心力及び表面張力の相乗作用によって放物面状に壁
面に沿って分布し、放物面の全面力)らほぼ一様に溶湯
が蒸発する。こうした条件で蒸発を行なうと傾斜回転軸
(6)方向に最も高い密度分布をもった蒸気ビームが得
ら扛、例えば図示のように傾斜して設けられた基板(3
)に高い密度の蒸気を当てることが出来、迅速な蒸着を
行なうことが出来る。
To explain its operation, the heat-resistant container (7) is rotated, and when the evaporated material (8) inside is irradiated with an electron beam 00 to completely melt it, the molten metal flows according to gravity to form a horizontal melting surface. In this case, if the rotation is relatively slow, the molten metal will be in the container (7).
However, if the rotation speed is appropriate, the kinematic viscosity of the molten metal, the synergistic effect of the centrifugal force, and the surface tension will distribute it in a parabolic shape along the wall surface, and the entire surface force of the paraboloid will be almost uniform. The molten metal evaporates. When evaporation is carried out under these conditions, a vapor beam with the highest density distribution in the direction of the tilted rotation axis (6) can be obtained.
) can be applied with high-density steam, allowing rapid deposition.

蒸発材料(8)はワイヤ状の蒸発材を蒸発口(4)から
挿入する等の方法により蒸発した分の補充全行ない適切
な高石の溶解面全維持する。
The evaporation material (8) is completely replenished by a method such as inserting a wire-shaped evaporation material from the evaporation port (4), and the entire melting surface of the high stones is maintained at an appropriate level.

このように本発明によると@は傾斜して耐熱性容器を回
転させ斜め上方全肉く蒸発口から蒸発材料全蒸発させる
ようにしたので斜め方向に高い密度分布の指向性を有す
る蒸発蒸気會得ることが出来1基板の配置や形状にfl
i(l約芒れることなく蒸Nを行なえる効果がある。
As described above, according to the present invention, the heat-resistant container is rotated at an angle so that all of the evaporation material is evaporated from the evaporation port diagonally upward, so that an evaporation vapor having directivity with a high density distribution in the diagonal direction can be obtained. It is possible to change the layout and shape of one board.
It has the effect of being able to carry out steaming N without having to burn.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来例の裁断側面図、第2図は本発明の実施例
の裁断側面図である。 (1)・・・真空室 (4)・・・蒸発口 (6)・・
・回転軸(7)・・・耐熱性容器 (8)・・・蒸発材
料 圓・・・加熱手段 外2名
FIG. 1 is a cut side view of a conventional example, and FIG. 2 is a cut side view of an embodiment of the present invention. (1)...Vacuum chamber (4)...Evaporation port (6)...
・Rotating shaft (7)...Heat-resistant container (8)...Evaporation material En...2 people outside the heating means

Claims (1)

【特許請求の範囲】[Claims] 蒸発材料金入れた耐熱性容器を、蒸発口含料め上方に向
けると共に傾斜した回転軸を中心と、 して回転自在に
真空室内に設け、電子ビームその他の加熱手段により溶
解した蒸発材料金該蒸発口會介して斜め上方に蒸発させ
ることを特徴とする斜め方向に指向性を有する蒸発源装
置。
A heat-resistant container containing evaporated material gold is placed in a vacuum chamber so that it can rotate freely around an inclined rotation axis with the evaporation port facing upward, and the evaporated material gold melted by an electron beam or other heating means is placed inside the vacuum chamber. An evaporation source device having diagonal directivity, characterized in that it evaporates diagonally upward through an evaporation port.
JP24220783A 1983-12-23 1983-12-23 Evaporating source device having directivity in oblique direction Granted JPS60135566A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24220783A JPS60135566A (en) 1983-12-23 1983-12-23 Evaporating source device having directivity in oblique direction

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24220783A JPS60135566A (en) 1983-12-23 1983-12-23 Evaporating source device having directivity in oblique direction

Publications (2)

Publication Number Publication Date
JPS60135566A true JPS60135566A (en) 1985-07-18
JPH0360913B2 JPH0360913B2 (en) 1991-09-18

Family

ID=17085841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24220783A Granted JPS60135566A (en) 1983-12-23 1983-12-23 Evaporating source device having directivity in oblique direction

Country Status (1)

Country Link
JP (1) JPS60135566A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH042764A (en) * 1990-04-18 1992-01-07 Sharp Corp Production of thin-film el element
JPH0449668U (en) * 1990-08-31 1992-04-27
KR101076227B1 (en) * 2008-12-23 2011-10-26 주식회사 테스 Vacuum evaporation apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH042764A (en) * 1990-04-18 1992-01-07 Sharp Corp Production of thin-film el element
JPH0449668U (en) * 1990-08-31 1992-04-27
KR101076227B1 (en) * 2008-12-23 2011-10-26 주식회사 테스 Vacuum evaporation apparatus

Also Published As

Publication number Publication date
JPH0360913B2 (en) 1991-09-18

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