KR101071452B1 - 다계조 포토마스크 및 그것을 이용한 패턴 전사 방법 - Google Patents
다계조 포토마스크 및 그것을 이용한 패턴 전사 방법 Download PDFInfo
- Publication number
- KR101071452B1 KR101071452B1 KR1020090018683A KR20090018683A KR101071452B1 KR 101071452 B1 KR101071452 B1 KR 101071452B1 KR 1020090018683 A KR1020090018683 A KR 1020090018683A KR 20090018683 A KR20090018683 A KR 20090018683A KR 101071452 B1 KR101071452 B1 KR 101071452B1
- Authority
- KR
- South Korea
- Prior art keywords
- region
- light
- semi
- film
- transmissive
- Prior art date
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008056700 | 2008-03-06 | ||
JPJP-P-2008-056700 | 2008-03-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090096338A KR20090096338A (ko) | 2009-09-10 |
KR101071452B1 true KR101071452B1 (ko) | 2011-10-10 |
Family
ID=41094650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090018683A KR101071452B1 (ko) | 2008-03-06 | 2009-03-05 | 다계조 포토마스크 및 그것을 이용한 패턴 전사 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2009237569A (zh) |
KR (1) | KR101071452B1 (zh) |
CN (1) | CN101526733B (zh) |
TW (1) | TW200942963A (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5215019B2 (ja) * | 2008-03-28 | 2013-06-19 | Hoya株式会社 | 多階調フォトマスク及びその製造方法、並びにパターン転写方法 |
CN103345118A (zh) * | 2013-07-05 | 2013-10-09 | 深圳市华星光电技术有限公司 | 光罩、玻璃基板及其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007171651A (ja) * | 2005-12-22 | 2007-07-05 | Dainippon Printing Co Ltd | 階調をもつフォトマスクの欠陥修正方法および階調をもつフォトマスク |
JP2008046623A (ja) * | 2006-07-21 | 2008-02-28 | Dainippon Printing Co Ltd | 階調マスク |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5942356A (en) * | 1996-03-30 | 1999-08-24 | Hoya Corporation | Phase shift mask and phase shift mask blank |
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2009
- 2009-03-04 TW TW098106950A patent/TW200942963A/zh unknown
- 2009-03-05 KR KR1020090018683A patent/KR101071452B1/ko not_active IP Right Cessation
- 2009-03-06 CN CN2009100045196A patent/CN101526733B/zh not_active Expired - Fee Related
- 2009-03-06 JP JP2009053013A patent/JP2009237569A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007171651A (ja) * | 2005-12-22 | 2007-07-05 | Dainippon Printing Co Ltd | 階調をもつフォトマスクの欠陥修正方法および階調をもつフォトマスク |
JP2008046623A (ja) * | 2006-07-21 | 2008-02-28 | Dainippon Printing Co Ltd | 階調マスク |
Also Published As
Publication number | Publication date |
---|---|
KR20090096338A (ko) | 2009-09-10 |
CN101526733B (zh) | 2012-10-10 |
JP2009237569A (ja) | 2009-10-15 |
CN101526733A (zh) | 2009-09-09 |
TW200942963A (en) | 2009-10-16 |
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LAPS | Lapse due to unpaid annual fee |