KR101060135B1 - welding method - Google Patents

welding method Download PDF

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Publication number
KR101060135B1
KR101060135B1 KR1020030086621A KR20030086621A KR101060135B1 KR 101060135 B1 KR101060135 B1 KR 101060135B1 KR 1020030086621 A KR1020030086621 A KR 1020030086621A KR 20030086621 A KR20030086621 A KR 20030086621A KR 101060135 B1 KR101060135 B1 KR 101060135B1
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South Korea
Prior art keywords
component
stopper
welding
printed circuit
parts
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KR1020030086621A
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Korean (ko)
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KR20040050710A (en
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바이브렌쿠어트
올크리스티안
콘올리버
하아크프리더
호너미하엘
하알붐토마스
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로베르트 보쉬 게엠베하
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K33/00—Specially-profiled edge portions of workpieces for making soldering or welding connections; Filling the seams formed thereby
    • B23K33/004—Filling of continuous seams
    • B23K33/008—Filling of continuous seams for automotive applications
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/244—Overlap seam welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/782—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined
    • B29C65/7823—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint
    • B29C65/7829—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint said distance pieces being integral with at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/13—Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
    • B29C66/131—Single flanged joints, i.e. one of the parts to be joined being rigid and flanged in the joint area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/32—Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
    • B29C66/322—Providing cavities in the joined article to collect the burr
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/541—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles a substantially flat extra element being placed between and clamped by the joined hollow-preforms
    • B29C66/5414—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles a substantially flat extra element being placed between and clamped by the joined hollow-preforms said substantially flat extra element being rigid, e.g. a plate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/542—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles joining hollow covers or hollow bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1477—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

본 발명은 제 1 부품(10, 27, 27a)을 제 2 부품(11, 28, 28a)과 용접하기 위한 방법에 관한 것이며, 상기 방법은 양 부품(10, 11, 27, 28, 27a, 28a)들을 레이저 빔을 이용해서 결합할 시에, 부품(10, 11, 27, 28, 27a, 28a)들의 서로간의 상대 운동을 제한하며 동시에 제 3 부품(12, 35, 35a)을 고정하는 적어도 하나의 스토퍼(17, 43, 43a)를 특징으로 한다.The present invention relates to a method for welding the first component (10, 27, 27a) with the second component (11, 28, 28a), said method being the two components (10, 11, 27, 28, 27a, 28a). ) At the time of combining the parts 10, 11, 27, 28, 27a, 28a by the laser beams, at least one that limits the relative movement of each other and simultaneously fixes the third parts 12, 35, 35a. It is characterized by the stopper (17, 43, 43a).

스토퍼, 용접 시임, 인쇄 회로 기판, 지지면Stopper, welding seam, printed circuit board, support surface

Description

용접 방법{Method for welding}Welding method {Method for welding}

도 1은 용접 과정 전의 본 발명에 따른 용접 방법의 단면도이고,
도 2는 용접 과정 후의 본 발명에 따른 용접 방법의 단면도이고,1 is a cross-sectional view of a welding method according to the invention before the welding process,
2 is a sectional view of a welding method according to the present invention after a welding process,

도 3은 본 발명에 따른 방법에 의해 부품들이 용접된 제 1 제어 장치의 횡단면도이고,3 is a cross-sectional view of a first control device in which parts are welded by the method according to the invention,

도 4는 도 3에 비해 변형된 제어 장치의 횡단면도이다.4 is a cross-sectional view of a control device modified from FIG. 3.

*도면의 주요 부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

10: 제 1 부품 11: 제 2 부품10: first part 11: second part

12: 제 3 부품 13, 30: 결합 영역12: third component 13, 30: bonding area

14: 연장부 16, 42: 숄더14: extension 16, 42: shoulder

17, 43, 43a: 스토퍼 18, 19: 림17, 43, 43a: stopper 18, 19: rim

22, 29: 레이저 빔 23: 용융물22, 29: laser beam 23: melt

25, 25a: 하우징 27, 27a: 베이스부25, 25a: housing 27, 27a: base portion

28, 28a: 커버 31: 에지28, 28a: cover 31: edge

32: 융기부 33: 챔버32: ridge 33: chamber

35, 35a: 인쇄 회로 기판 36, 36a: 구성 소자35, 35a: printed circuit boards 36, 36a: component elements

37: 홀 38: 압입 핀37: hole 38: press-fit pin

39: 원통형 섹션 41: 간격 블록39: cylindrical section 41: gap block

45: 에지 영역45: edge area

본 발명은 청구항 제 1 항의 전제부에 따른 용접 방법에 관한 것이다.The present invention relates to a welding method according to the preamble of claim 1.

상기와 같은 방법은 DE 196 25 873 A1에 공지되어 있다. 공지된 방법의 경우 커버형 제 1 부품의 원주가 압축되어, 베이스부를 형성하는 제 2 부품의 내벽과 접촉됨으로써 상기 2 개의 부품들이 서로 결합된다. 제 2 부품의 내벽에는 스토퍼가 제공되므로 제 1 부품은 제 2 부품 내부의 스토퍼에까지만 삽입될 수 있다. 상기 2 개의 부품들 사이의 이행 영역에는 이어서 에너지가 레이저 빔 용접 장치 또는 전자 빔 용접 장치에 의해 제공되므로, 이행 영역에서는 상기 두 부품들이 결합된다. 이 경우, 제 1 부품이 제 2 부품의 스토퍼에까지 압착되는 접합 과정 후, 상기 두 부품들이 서로에 대해 더 이상 움직이지 않는 것이 중요하다.Such a method is known from DE 196 25 873 A1. In the known method the circumference of the covered first part is compressed so that the two parts are joined together by contacting the inner wall of the second part forming the base part. Since the stopper is provided on the inner wall of the second part, the first part can be inserted only up to the stopper inside the second part. Since the energy is supplied to the transition region between the two components by a laser beam welding device or an electron beam welding apparatus, the two components are combined in the transition region. In this case, after the joining process in which the first part is pressed to the stopper of the second part, it is important that the two parts no longer move relative to each other.

예컨대 인쇄 회로 기판 상에 배치되는 전자 소자를 수용하는 하우징을 제조할 경우, 인쇄 회로 기판(들)을 하우징의 내부에 고정하거나 지지하는 것이 일반적으로 필요하다. 자동차 제어 장치용 하우징의 제조에서는, 인쇄 회로 기판 내에 개구를 제공하는 것이 공지되어 있으며 상기 개구들은 하우징 부품들 중 하나에 배치된 압입 핀과 협동한다. 따라서 인쇄 회로 기판은 하우징 부품에 대해 고정된다. 그러나 자동차 운전시 극한 상황에서 일어날 수 있는 특히 높은 진동 부하의 경우, 압입 핀에 의한 인쇄 회로 기판(들)의 종래 방식의 고정은 충분하지 않는데, 특히 상기 결합이 비교적 적은 수의 압입 핀에 의해 이뤄지는 경우 충분하지 않다는 것이 실제로 밝혀졌다.For example, when manufacturing a housing that houses electronic elements disposed on a printed circuit board, it is generally necessary to fix or support the printed circuit board (s) inside the housing. In the manufacture of housings for motor vehicle control devices, it is known to provide openings in a printed circuit board which cooperate with press-fit pins arranged in one of the housing parts. The printed circuit board is thus fixed to the housing part. However, in the case of particularly high vibration loads, which may occur in extreme situations when driving a car, the conventional fixation of the printed circuit board (s) by the indentation pins is not sufficient, in particular the coupling is achieved by a relatively small number of indentation pins. It turns out that the case is not enough.

따라서 본 발명의 과제는, 제 3 부품, 예컨대 인쇄 회로 기판이 제 1 부품과 제 2 부품의 용접과 동시에 상기 제 1 및 제 2 부품에 대해 확실하게 고정되고, 이러한 고정이 추가 부품 없이 이뤄지도록, 청구항 제 1 항의 전제부에 따른 용접 방법을 개선시키는 것이다.The object of the present invention is therefore that a third component, for example a printed circuit board, is securely fixed to the first and second components simultaneously with the welding of the first component and the second component, and such fixing is achieved without additional components, To improve the welding method according to the preamble of claim 1.

상기 과제는 청구항 제 1 항의 특징들을 갖는 용접 방법에 의해 해결된다.The problem is solved by a welding method with the features of claim 1.

본 발명에 따른 용접 방법의 바람직한 다른 실시예는 종속 청구항에 제시된다.Another preferred embodiment of the welding method according to the invention is given in the dependent claims.

본 발명의 실시예는 도면에 도시되며 하기에서 더 자세히 설명된다.Embodiments of the invention are shown in the drawings and described in more detail below.

도 1에는 제 1 부품(10)이 도시되며 상기 부품은 레이저 용접에 의해 제 2 부품(11)과 결합되어야 한다. 제 3 부품(12)도 도시되며, 상기 제 3 부품은 상기 제 1 및 제 2 부품(10, 11)이 결합된 후, 이들 부품들(10, 11) 사이에 고정되어야 한다. 도면에서 하부 제 1 부품(10)은 결합 영역(13)을 포함하며, 제 1 및 제 2 부품(10, 11)은 레이저 빔에 의해 상기 영역에서 서로 결합된다. 결합 영역(13)은 브릿지형 연장부(14)보다 약간 폭이 작으며 상기 연장부 상에 배치된다. 바람직하게 상기 결합 영역(13)은 도면 평면에 대해 수직으로 도시된, 제 1 및 제 2 부품(10, 11)의 전체 길이에 걸쳐 이들 부품들(10, 11) 사이에서 연장되므로, 상기 두 부품들(10, 11)은 결합 영역(13)에 선 접촉한다. 이에 대한 대안으로, 상기 결합 영역(13)을 제 1 부품(10)에 단지 점 접촉시키는 것도 고려할 수 있으며, 이 경우 결합 영역(13)은 융기부의 형태로 연장부(14)로부터 융기된다.The first part 10 is shown in FIG. 1, which part must be joined with the second part 11 by laser welding. A third part 12 is also shown, which must be fixed between these parts 10, 11 after the first and second parts 10, 11 are joined. The lower first part 10 in the figure comprises a joining region 13, wherein the first and second parts 10, 11 are joined to one another in the region by means of a laser beam. The joining region 13 is slightly smaller in width than the bridge-like extension 14 and is disposed on the extension. Preferably the joining region 13 extends between these parts 10, 11 over the entire length of the first and second parts 10, 11, shown perpendicular to the drawing plane, so that the two parts The fields 10, 11 are in linear contact with the joining region 13. As an alternative to this, it is also conceivable to only point contact the joining region 13 to the first part 10, in which case the joining region 13 is raised from the extension 14 in the form of a ridge.

상기 제 1 부품(10)은 또한 제 3 부품(12)을 수용하기 위한 스텝형 숄더(16)를 포함한다. 제 2 부품(11)은 횡단면이 실질적으로 L형으로 형성되며, 제 3 부품(12)을 향한 측면에, 상기 제 2 부품(11)에 일체형으로 형성된 적어도 하나의 스토퍼(17)를 포함한다. 적어도 하나의 스토퍼(17)는 제 2 부품(11)의 수직 림(18)에 연장되어 일체형으로 형성되는 반면, 수평으로 배치된 제 2 부품(11)의 다른 림(19)은 결합 영역(13)에서, 제 1 부품(10)을 향하는 측면으로 제 1 부품(10)에 면 접촉한다.The first part 10 also includes a stepped shoulder 16 for receiving the third part 12. The second component 11 has a substantially L-shaped cross section and includes at least one stopper 17 integrally formed with the second component 11 on the side facing the third component 12. At least one stopper 17 extends integrally with the vertical rim 18 of the second part 11, while the other rim 19 of the horizontally arranged second part 11 is a joining region 13. ), The surface contacts the first component 10 to the side facing the first component 10.

레이저 빔이 상기 제 1 및 제 2 부품들(10, 11)에 아직 작용하지 않은 도 1에 따라, 적어도 하나의 스토퍼(17)와, 스토퍼를 향하는 제 3 부품(12)의 측면 사이에 갭(21)이 형성된다.According to FIG. 1, in which a laser beam has not yet acted on the first and second parts 10, 11, a gap between the at least one stopper 17 and the side of the third part 12 facing the stopper ( 21) is formed.

제 1 부품(10) 및 제 2 부품(11)은 플라스틱으로 이루어지고, 상기 제 1 부품(10)은 예컨대 적합한 첨가제에 의해 레이저 빔을 흡수하는 반면, 제 2 부품(11)은 레이저 빔을 실질적으로 투과시킨다.The first part 10 and the second part 11 are made of plastic and the first part 10 absorbs the laser beam, for example by a suitable additive, while the second part 11 substantially absorbs the laser beam. Permeate through.

도 2에는 용접시의 상태가 도시되어 있다. 레이저 빔(22)은 제 1 부품(10)과 대향하는 측면으로부터 제 2 부품(11)의 수평 림(19)에 작용한다. 상기 두 부품들(10, 11)의 흡수 특성이 상이하기 때문에, 이들 부품들(10, 11) 사이의 결합 영역(13)은 플라스틱 재료의 용융점 이상으로까지 가열됨으로써, 이들 부품들이 서로 결합된다. 레이저 빔(22)의 작용 동안, 상기 두 부품들(10, 11)은 서로 가압되며, 이는 힘의 화살표(F)로 도시된다. 레이저 빔(22)이 결합 영역(13) 내의 플라스틱 재료를 상기 재료가 소성 변형될 때까지 가열하면, 상기 두 부품들(10, 11)이 압착됨에 따라 제 2 부품(11)은 적어도 하나의 스토퍼(17)와 함께 제 1 부품(10) 및 제 3 부품(12) 방향으로 움직인다. 적어도 하나의 스토퍼(17)가 제 3 부품(12)과 접촉하면, 제 1 및 제 2 부품(10, 11)의 상대 운동이 더 이상 일어나지 않는데, 이는 레이저 빔(22)의 영향을 받지 않는 적어도 하나의 스토퍼(17)가 제 3 부품(12)을 제 1 부품(10)의 숄더(16)에 대해서 가압하기 때문이다. 이로써 적어도 하나의 스토퍼(17)는, 레이저 용접시 제 1 및 제 2 부품(10, 11)의 상대 운동을 제한하는 경로 제한부 또는 경로 스토퍼로서 사용되고, 또한 상기 두 부품들(10, 11) 사이에 제 3 부품(12)을 고정시킨다. 레이저 빔(22)에 의한 용접 과정에서, 결합 영역(13)이 변형되며 용융물(23)은 제 1 및 제 2 부품(10, 11)으로부터 측면으로 압출된다. 결합 영역(13)이 연장부(14)보다 약간 더 작은 폭을 갖기 때문에, 상기 용융물(23)은 이들 부품들(10, 11)을 지나 돌출하지 않는다.2 shows a state at the time of welding. The laser beam 22 acts on the horizontal rim 19 of the second component 11 from the side opposite the first component 10. Since the absorption properties of the two parts 10, 11 are different, the joining region 13 between these parts 10, 11 is heated to above the melting point of the plastic material, so that these parts are joined together. During the action of the laser beam 22, the two parts 10, 11 are pressed against each other, which is shown by the arrow F of force. When the laser beam 22 heats the plastic material in the bonding region 13 until the material is plastically deformed, the second part 11 is at least one stopper as the two parts 10, 11 are compressed. Together with 17 moves in the direction of the first component 10 and the third component 12. When at least one stopper 17 is in contact with the third component 12, the relative movement of the first and second components 10, 11 no longer occurs, which is at least not affected by the laser beam 22. This is because one stopper 17 presses the third component 12 against the shoulder 16 of the first component 10. The at least one stopper 17 is thus used as a path limiter or path stopper for limiting the relative movement of the first and second parts 10, 11 during laser welding, and also between the two parts 10, 11. The third part 12 is fixed to the. In the course of welding by the laser beam 22, the joining region 13 is deformed and the melt 23 is extruded laterally from the first and second parts 10, 11. Since the joining region 13 has a width slightly smaller than the extension 14, the melt 23 does not protrude past these parts 10, 11.

도 3에는 본 발명에 따른 방법을 사용한 실시예가 도시되며, 이 실시예에서는 플라스틱으로 형성되며 예컨대 제어 장치로서 자동차에 사용되는 박스형 하우징(25)이 제조된다. 상기 하우징(25)은 레이저 빔이 흡수되는 베이스부(27) 및 레이저 빔이 투과되는 커버(28)를 포함한다. 레이저 빔(화살표 29)은, 베이스부(27)에 대향 배치된 커버(28)의 측면 상에 있는 환형의 평평한 결합 영역(30)의 부분에서 상기 결합 영역(30)에 작용한다. 커버(28)는, 아래로 내려간 에지(31)를 포함하며, 상기 에지는 베이스부(27)가 커버(28)와 결합된 후, 베이스부(27)의 외부면을 둘러싸는 융기부(32)와 함께 환형 챔버(33)를 형성하며, 상기 챔버는 결합 영역(30)으로부터 유출된 용융 재료를 수용한다.3 shows an embodiment using the method according to the invention, in which a box-shaped housing 25 is manufactured which is made of plastic and used for example in a motor vehicle as a control device. The housing 25 includes a base portion 27 through which the laser beam is absorbed and a cover 28 through which the laser beam is transmitted. The laser beam (arrow 29) acts on the joining region 30 at the portion of the annular flat joining region 30 on the side of the cover 28 disposed opposite the base portion 27. The cover 28 includes an edge 31 which is lowered down, which edges 32 surround the outer surface of the base portion 27 after the base portion 27 is engaged with the cover 28. ) Together with the annular chamber 33, which receives the molten material flowing out of the bonding region 30.

하우징(25)의 내부에는, 예컨대 상부면 상에 전자 소자(36)를 갖는 인쇄 회로 기판(35)이 배치된다. 인쇄 회로 기판(35)은 베이스부(27)의 내부에 커버(28)를 배치하기 전에 이미 위치 설정된다. 이를 위해 인쇄 회로 기판(35)은 소위 압입 핀들(38)과 협동하는 다수의 홀(37)들을 포함한다. 압입 핀들(38)은 예컨대 베이스부(27)의 베이스 영역 내에 일체형으로 형성되며, 상기 핀의 원통형 섹션(39)이 인쇄 회로 기판(35)의 홀들(37)을 통해 돌출한다. 홀들(37)의 직경 및 압입 핀들(38)의 원통형 섹션(39)의 직경을 적합한 허용 오차 범위 내로 설정함으로써, 인쇄 회로 기판(35)은 압입 핀들(38)에 의해 지지된다. 인쇄 회로 기판(35)을 압입 핀(38) 상에 조립할 때 인쇄 회로 기판(35)의 운동을 제한하기 위해, 또는 인쇄 회로 기판(35)을 원하는 목표 위치에 위치 설정하기 위해, 베이스부(27)의 에지 영역에는 간격 블록들(41)이 배치된다. 커버(28)와 베이스부(27)가 결합되기 전에, 상기 간격 블록(41) 상에 인쇄 회로 기판(35)이 놓인다. 이로써 간격 블록들(41)은 베이스부(27)와 함께, 도 1 및 도 2에서의 숄더(16)에 상응하게 각각 하나의 숄더(42)를 형성한다.Inside the housing 25, for example, a printed circuit board 35 having an electronic element 36 on the top surface is disposed. The printed circuit board 35 is already positioned before placing the cover 28 inside the base portion 27. For this purpose the printed circuit board 35 comprises a plurality of holes 37 which cooperate with the so-called indentation pins 38. The indentation pins 38 are integrally formed, for example, in the base area of the base portion 27, wherein the cylindrical section 39 of the pin protrudes through the holes 37 of the printed circuit board 35. By setting the diameter of the holes 37 and the diameter of the cylindrical section 39 of the indentation pins 38 within a suitable tolerance range, the printed circuit board 35 is supported by the indentation pins 38. In order to limit the movement of the printed circuit board 35 when assembling the printed circuit board 35 on the press-fit pin 38 or to position the printed circuit board 35 at a desired target position, the base portion 27 Spacing blocks 41 are disposed in the edge region of the cross-section. Before the cover 28 and the base portion 27 are joined, a printed circuit board 35 is placed on the gap block 41. Thus, the spacing blocks 41 together with the base portion 27 form one shoulder 42 each corresponding to the shoulder 16 in FIGS. 1 and 2.

베이스부(27)를 향하는 커버(28)의 내면에는 간격 블록들(41)과 겹쳐지는 다수의 스토퍼 소자들(43)이 배치된다. 바람직하게 스토퍼 소자들(43)은 커버(28)에 일체형으로 형성된다. 스토퍼 소자들(43)이 형성된 영역에서, 인쇄 회로 기판(35) 상에는 전자 소자(36)가 제공되지 않는다. 커버(28)를 베이스부(27) 상에 용접할 때(화살표 29), 간격 블록(41)에 대향하는 인쇄 회로 기판(35)의 측면에 스토퍼 소자(43)가 놓이면, 스토퍼 소자들(43)은 베이스부(27)에 대한 커버(28)의 상대 운동을 제한한다. 이로써, 커버와(28)와 베이스부(27)의 결합 후, 인쇄 회로 기판(35)이 하우징(25) 내에 고정되는데, 이는 이제 인쇄 회로 기판(35) 자체가 높은 진동 부하 시에도 압입 핀들(38)에 대해서 상대적으로 운동하지 않을 수 있기 때문이다.On the inner surface of the cover 28 facing the base portion 27, a plurality of stopper elements 43 overlapping the gap blocks 41 are disposed. Preferably, the stopper elements 43 are formed integrally with the cover 28. In the region where the stopper elements 43 are formed, the electronic element 36 is not provided on the printed circuit board 35. When the cover 28 is welded onto the base portion 27 (arrow 29), if the stopper element 43 is placed on the side of the printed circuit board 35 opposite the gap block 41, the stopper elements 43 ) Limits the relative motion of the cover 28 relative to the base 27. Thus, after coupling of the cover 28 and the base portion 27, the printed circuit board 35 is fixed in the housing 25, which is now press-fit pins (") even under high vibration loads. 38) they may not exercise relatively.

도 4에 따른 실시예는, 인쇄 회로 기판(35a)의 상부면 상의 에지 영역(45)에도 전자 소자(36a)가 배치되는 것이 도 3에 따른 실시예와 상이하다. 베이스부(27a)와 커버(28a)의 용접시 스토퍼 소자(43a)가 에지 영역(45)에서 전자 소자(36a)와 접촉하지 않기 위해, 스토퍼 소자(43a)는 소자가 없는 인쇄 회로 기판(35a)의 중앙 영역에 배치된다.The embodiment according to FIG. 4 differs from the embodiment according to FIG. 3 in which the electronic element 36a is also arranged in the edge region 45 on the upper surface of the printed circuit board 35a. Since the stopper element 43a does not come into contact with the electronic element 36a in the edge region 45 when the base portion 27a and the cover 28a are welded, the stopper element 43a is a printed circuit board 35a without an element. Is disposed in the central area of the plane.

스토퍼 소자(43a)의 상기와 같은 배치는, 물론, 에지 영역에 전자 소자를 갖지 않는 인쇄 회로 기판에도 사용될 수 있다. 스토퍼 소자(43a)에 대향 배치된 인쇄 회로 기판의 측면 상에 다른 스토퍼 소자 또는 간격 블록이 배치되지 않는 도 4에 따르는 스토퍼 소자(43a)의 배치는 레이 아웃의 이유로, 또는 인쇄 회로 기판 상에 소정의 휨 응력을 가하는 것이 바람직하기 때문에 선택될 수 있다.Such arrangement of the stopper element 43a can, of course, also be used for a printed circuit board having no electronic element in the edge region. The arrangement of the stopper element 43a according to FIG. 4 in which no other stopper element or spacing block is disposed on the side of the printed circuit board opposite to the stopper element 43a is arranged for reasons of layout or on the printed circuit board. It may be selected because it is desirable to apply a bending stress of.

전술한 용접 방법은 물론 자동차 제어 장치 내의 사용에만 국한되지 않는다. 오히려 본 발명에 따른 방법에 의해, 일반적으로 다수의 부품들이 서로 결합될 수 있으며, 도시된 실시예에서 예컨대 인쇄 회로 기판인 제 3 부품은 2 개의 다른 부품들 사이에 고정된다. 또한 도 3과 도 4에서 인쇄 회로 기판들(35, 35a)은, 상응된 압입 핀(38) 없이도 사용될 수 있다. 도 3과 도 4에 따른 제어 장치의 경우, 제어 장치를 커버(28, 28a)로 폐쇄하기 전에, 압입 핀(38)이 제어 장치의 예비 조립 또는 조작 및 시험에 사용된다.The welding method described above is of course not limited to use in automotive control devices. Rather, by the method according to the invention, in general a number of parts can be combined with one another, and in the illustrated embodiment a third part, for example a printed circuit board, is fixed between two different parts. Also in FIGS. 3 and 4 the printed circuit boards 35, 35a can be used without the corresponding indentation pin 38. In the case of the control device according to FIGS. 3 and 4, the press-fit pin 38 is used for preliminary assembly or operation and testing of the control device before closing the control device with the covers 28, 28a.

본 발명에 따라, 예컨대 인쇄 회로 기판과 같은 제 3 부품이 제 1 부품과 제 2 부품의 용접과 동시에 제 1 및 제 2 부품에 대해 확실하게 고정되고, 또한 이러한 고정이 추가의 부품 없이 이루어진다.According to the invention, a third part, for example a printed circuit board, is securely fixed to the first and second parts simultaneously with the welding of the first part and the second part, and this fixing is also made without additional parts.

Claims (8)

제 2 부품(11; 28; 28a)과 제 1 부품(10; 27; 27a)을 용접하기 위한 방법으로서, As a method for welding the second component (11; 28; 28a) and the first component (10; 27; 27a), 상기 제 1 및 상기 제 2 부품(10, 11; 27, 28; 27a, 28a)의 용융 영역(13; 30)을 용융시키기 위한 에너지로서 레이저 빔(22; 29)이 제공되며, 상기 제 2 부품(11; 28; 28a)은 상기 레이저 빔(22; 29)의 에너지를 약하게만 흡수하는 재료로 구성되고, 상기 제 1 부품(10; 27; 27a)은 상기 레이저 빔(22; 29)의 에너지를 심하게 흡수하는 재료로 구성되며, 상기 레이저 빔(22; 29)은 상기 제 2 부품(11; 28; 28a)을 통과하여 상기 제 1 부품(10; 27; 27a)을 향하고, 상기 용융 영역(13; 30) 외부에 상기 제 1 및 제 2 부품들(10, 11; 27, 28; 27a, 28a)의 운동을 제한하는 적어도 하나의 스토퍼(17; 43; 43a)가 제공되는 용접 방법에 있어서,A laser beam 22; 29 is provided as energy for melting the melting regions 13; 30 of the first and second components 10, 11; 27, 28; 27a, 28a. (11; 28; 28a) is composed of a material that only weakly absorbs the energy of the laser beam (22; 29), and the first component (10; 27; 27a) is the energy of the laser beam (22; 29). And the laser beams 22 and 29 pass through the second components 11 and 28 and 28a to face the first components 10 and 27 and 27a. 13; 30 in the welding method in which at least one stopper (17; 43; 43a) is provided externally to limit movement of the first and second parts (10, 11; 27, 28; 27a, 28a). , 상기 제 1 부품(10; 27; 27a)에 수용부(16; 42)를 설치하고, 상기 제 2 부품(11; 28; 28a)에 상기 적어도 하나의 스토퍼(17; 43; 43a)를 설치하고,Receiving portions 16; 42 are installed in the first components 10; 27; 27a, and at least one stopper 17; 43; 43a is installed in the second components 11; 28; 28a. , 상기 제 1 및 제 2 부품들(10, 11; 27, 28; 27a, 28a)은 용접 시점부터, 서로 가압되므로, 상기 적어도 하나의 스토퍼(17; 43; 43a)에 의해 상기 두 부품들(10, 11; 27, 28; 27a, 28a)의 운동이 용접 동안 제한되며 상기 적어도 하나의 스토퍼(17; 43; 43a)는 제 3 부품(12; 35; 35a)과 협동하고, 상기 제 3 부품은 용접 후 상기 적어도 하나의 스토퍼(17; 43; 43a)에 의해 상기 제 1 부품(10; 27; 27a)의 상기 수용부(16; 42)에 대해서 가압되는 것을 특징으로 하는 용접 방법.Since the first and second parts 10, 11; 27, 28; 27a, 28a are pressurized from each other from the time of welding, the two parts 10 by the at least one stopper 17; 43; 43a. Movement of the at least one stopper 17; 43; 43a cooperates with the third component 12; 35; 35a, and the third component Welding method characterized by being pressed against the receiving portion (16; 42) of the first part (10; 27; 27a) by the at least one stopper (17; 43; 43a) after welding. 제 1 항에 있어서, 상기 용접 영역(13; 30)은 긴 용접 시임을 형성하는 것을 특징으로 하는 용접 방법.Method according to claim 1, characterized in that the weld zone (13; 30) forms a long weld seam. 제 2 항에 있어서, 상기 용접 시임은 폐쇄된 윤곽을 형성하는 것을 특징으로 하는 용접 방법.The welding method according to claim 2, wherein the welding seam forms a closed contour. 제 1 항 내지 제 3 항 중 어느 한 항에 있어서, 폐쇄된 상태에서의 상기 제 1 및 상기 제 2 부품(27, 28; 27a, 28a)에 의해 하우징(25; 25a)이 형성되는 것을 특징으로 하는 용접 방법.4. A housing (25; 25a) according to any one of the preceding claims, characterized in that the housing (25; 25a) is formed by the first and second components (27, 28; 27a, 28a) in a closed state. Welding method. 제 4 항에 있어서, 상기 제 3 부품은, 적어도 하나의 전자 소자(36; 36a)를 지지하고 에지 영역(45)이 적어도 부분적으로 상기 제 2 부품(27; 27a)의 적어도 하나의 지지면(41; 41a) 상에 놓이는 인쇄 회로 기판(35; 35a)으로서 형성되는 것을 특징으로 하는 용접 방법.The at least one supporting surface of the second component (27; 27a) according to claim 4, wherein the third component supports at least one electronic element (36; 36a) and an edge region (45) at least partially. 41; A welding method, characterized in that it is formed as a printed circuit board (35; 35a) overlying. 제 5 항에 있어서, 상기 제 2 부품(27)에 있는 상기 적어도 하나의 스토퍼(43)는 상기 인쇄 회로 기판(35)의 적어도 하나의 지지면(41)과 적어도 부분적으로 겹쳐지도록 배치되는 것을 특징으로 하는 용접 방법.6. The at least one stopper (43) in the second component (27) is arranged to at least partially overlap with at least one support surface (41) of the printed circuit board (35). Welding method made with. 제 5 항에 있어서, 상기 적어도 하나의 스토퍼(43a)는 상기 제 2 부품(27a) 상에 있는 상기 인쇄 회로 기판(35a)의 지지면(41a)의 내부에 배치되는 것을 특징으로 하는 용접 방법.6. The welding method according to claim 5, wherein said at least one stopper (43a) is disposed inside a support surface (41a) of said printed circuit board (35a) on said second component (27a). 제 1 항 내지 제 3 항 중 어느 한 항에 있어서, 폐쇄된 상태에서의 상기 제 1 및 상기 제 2 부품(27, 28; 27a, 28a)에 의해 적어도 하나의 전자 소자(36; 36a)용 하우징(25; 25a)이 형성되는 것을 특징으로 하는 용접 방법.The housing for at least one electronic element (36; 36a) according to any one of claims 1 to 3, by said first and second components (27, 28; 27a, 28a) in a closed state. (25; 25a) is formed.
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