DE102009043201A1 - Method for welding a plastic housing - Google Patents

Method for welding a plastic housing Download PDF

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Publication number
DE102009043201A1
DE102009043201A1 DE102009043201A DE102009043201A DE102009043201A1 DE 102009043201 A1 DE102009043201 A1 DE 102009043201A1 DE 102009043201 A DE102009043201 A DE 102009043201A DE 102009043201 A DE102009043201 A DE 102009043201A DE 102009043201 A1 DE102009043201 A1 DE 102009043201A1
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DE
Germany
Prior art keywords
circuit board
housing
housing part
welding
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102009043201A
Other languages
German (de)
Inventor
Henryk Frenzel
Volker Müller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Priority to DE102009043201A priority Critical patent/DE102009043201A1/en
Priority to PCT/DE2010/001122 priority patent/WO2011035771A1/en
Publication of DE102009043201A1 publication Critical patent/DE102009043201A1/en
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/541—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles a substantially flat extra element being placed between and clamped by the joined hollow-preforms
    • B29C66/5414—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles a substantially flat extra element being placed between and clamped by the joined hollow-preforms said substantially flat extra element being rigid, e.g. a plate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/782—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined
    • B29C65/7823—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint
    • B29C65/7829—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint said distance pieces being integral with at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/32—Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/32—Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
    • B29C66/324—Avoiding burr formation
    • B29C66/3242—Avoiding burr formation on the inside of a tubular or hollow article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/84—Specific machine types or machines suitable for specific applications
    • B29C66/841—Machines or tools adaptable for making articles of different dimensions or shapes or for making joints of different dimensions
    • B29C66/8416—Machines or tools adaptable for making articles of different dimensions or shapes or for making joints of different dimensions of different thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/924—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/9261—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools
    • B29C66/92651—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools by using stops
    • B29C66/92655—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools by using stops by using several stops
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/929—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools characterized by specific pressure, force, mechanical power or displacement values or ranges
    • B29C66/9292—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools characterized by specific pressure, force, mechanical power or displacement values or ranges in explicit relation to another variable, e.g. pressure diagrams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/066—Hermetically-sealed casings sealed by fusion of the joining parts without bringing material; sealed by brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/06—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using friction, e.g. spin welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1677—Laser beams making use of an absorber or impact modifier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0037—Other properties
    • B29K2995/0068—Permeability to liquids; Adsorption
    • B29K2995/0069—Permeability to liquids; Adsorption non-permeable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Casings For Electric Apparatus (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

In ein Gehäuseteil wird die Leiterplatte eingelegt. Am anderen Gehäuseteil ist eine Ausformung zur Leiterplatte hin vorgesehen und das Gehäuseteil mit der Ausformung wird während dem Verschweißen in Richtung der Leiterplatte gepresst, vorzugsweise so lange, bis eine vorgegebene Gegenkraft erreicht wird. Zudem wird auch beim Auskühlen eine vorgegebene Kraft auf das Gehäuseteil mit der Ausformung ausgeübt. Während des Verschweißens sorgt das Anpressen für eine Fixierung der Leiterplatte in der vorgegebenen Position und verhindert ein Aufschwimmen der Leiterplatte und die Ausbreitung von Schmelze in kritische Regionen der Leiterplatte. Zudem bewirkt das Anpressen eine federartige Verspannung des Gehäuseteils mit der Ausformung. Durch das Halten einer vorgegebenen Kraft während dem Auskühlen bleibt die Leiterplatte durch die Ausformung im Gehäuse fixiert und kann sich die Verspannung nicht abbauen, sondern wird durch das Schrumpfen des Materials beim Aushärten eher noch verstärkt. Dadurch wird sichergestellt, dass auch nach dem Aushärten die Ausformung mit einer vorgegebenen Kraft auf die Leiterplatte drückt und diese somit äußerst sicher im Gehäuse fixiert.The circuit board is inserted into a housing part. On the other housing part, a recess is provided towards the circuit board and the housing part with the recess is pressed in the direction of the circuit board during the welding, preferably until a predetermined counterforce is reached. In addition, a predetermined force is exerted on the housing part with the formation when it cools down. During the welding process, pressing ensures that the circuit board is fixed in the specified position and prevents the circuit board from floating and the spread of melt in critical regions of the circuit board. In addition, the pressing causes a spring-like tensioning of the housing part with the formation. By maintaining a predetermined force while it cools, the circuit board remains fixed in the housing through the molding and the tension cannot be relieved, but rather is reinforced by the shrinkage of the material during curing. This ensures that, even after hardening, the molding presses on the circuit board with a predetermined force and thus fixes it extremely securely in the housing.

Description

Die Erfindung betrifft ein Verfahren zum Verschweißen eines Kunststoffgehäuses gemäß dem Oberbegriff von Anspruch 1.The invention relates to a method for welding a plastic housing according to the preamble of claim 1.

Zum Verschließen von Kunststoffgehäusen insbesondere elektronischer Baugruppen, wie Kraftfahrzeugsteuergeräten wird mittlerweile häufig ein Verschweißen der Kunststoffteile eingesetzt, wobei die Einbringung der Wärmeenergie durch den Laser besonders bevorzugt ist, weil dabei die Wärmeenergie besonders genau an die innere Verbindungsstelle zwischen den Gehäuseteilen eingebracht werden kann und ein besonders gleichmäßiger und allseits dichter Schweißvorgang erreicht werden kann.For sealing plastic housings, in particular electronic assemblies, such as motor vehicle control devices, a welding of the plastic parts is now often used, wherein the introduction of heat energy by the laser is particularly preferred, because the heat energy can be particularly accurately introduced to the inner joint between the housing parts and a particularly uniform and on all sides tight welding process can be achieved.

Bei elektronischer Baugruppen, wie beispielsweise Kraftfahrzeugsteuergeräten ist im Inneren des Gehäuses ein Schaltungsträger, wie beispielweise eine Leiterplatte angeordnet, die ihrerseits an einer Gehäusehälfte befestigt werden muss, insbesondere wenn auf diesem Schaltungsträger beschleunigungsempfindliche Sensoren angeordnet sind, welche eine entsprechend starre Befestigung zur Aufnahme der zu sensierenden Beschleunigungen benötigen.In electronic assemblies, such as motor vehicle control devices, a circuit carrier, such as a circuit board is arranged inside the housing, which in turn must be attached to a housing half, especially if on this circuit substrate acceleration-sensitive sensors are arranged, which a correspondingly rigid attachment for receiving the sensed Need accelerations.

Die Aufgabe der vorliegenden Erfindung ist es, ein Verfahren zum Verschweißen eines Kunststoffgehäuses anzugeben, bei dem besonders preiswert und dennoch sicher die Leiterplatte befestigt werden kann.The object of the present invention is to provide a method for welding a plastic housing, in which particularly inexpensive and yet secure the circuit board can be attached.

Diese Aufgabe wird durch die Merkmale der unabhängigen Ansprüche gelöst. Vorteilhafte Weiterbildungen der Erfindung ergeben sind aus den Unteransprüchen, wobei auch Kombinationen und Weiterbildungen einzelner Merkmale miteinander denkbar sind.This object is solved by the features of the independent claims. Advantageous developments of the invention will become apparent from the dependent claims, wherein combinations and developments of individual features are conceivable with each other.

In ein Gehäuseteil wird die Leiterplatte eingelegt. Ein wesentlicher Gedanke der Erfindung besteht darin, dass am anderen Gehäuseteil eine Ausformung zur Leiterplatte hin vorgesehen ist und das Gehäuseteil mit der Ausformung während dem Verschweißen in Richtung der Leiterplatte gepresst wird, vorzugsweise so lange bis eine vorgegebene Gegenkraft erreicht wird, und zudem auch beim Auskühlen eine vorgegebene Kraft auf das Gehäuseteil mit der Ausformung ausgeübt wird.In a housing part, the circuit board is inserted. An essential idea of the invention is that on the other housing part a molding is provided toward the circuit board and the housing part is pressed with the molding during welding in the direction of the circuit board, preferably until a predetermined counterforce is achieved, and also during cooling a predetermined force is exerted on the housing part with the molding.

Während des Verschweißens sorgt das Anpressen für eine Fixierung der Leiterplatte in der vorgegebenen Position und verhindert ein Aufschwimmen der Leiterplatte und die Ausbreitung von Schmelze in kritische Regionen der Leiterplatte. Zudem bewirkt das Anpressen eine federartige Verspannung des Gehäuseteils mit der Ausformung. Durch das Halten einer vorgegebenen Kraft während dem Auskühlen bleibt die Leiterplatte durch die Ausformung im Gehäuse fixiert und kann sich die Verspannung nicht abbauen, sondern wird durch das Schrumpfen des Materials beim Aushärten eher noch verstärkt. Dadurch wird sichergestellt, dass auch nach dem Aushärten die Ausformung mit einer vorgegebenen Kraft auf die Leiterplatte drückt und diese somit äußerst sicher im Gehäuse fixiert.During welding, the pressing ensures a fixation of the printed circuit board in the predetermined position and prevents floating of the circuit board and the spread of melt in critical regions of the circuit board. In addition, the pressing causes a spring-like tension of the housing part with the shape. By holding a predetermined force during cooling, the printed circuit board remains fixed by the molding in the housing and can not break the tension, but is rather reinforced by the shrinkage of the material during curing. This ensures that even after curing presses the formation with a predetermined force on the circuit board and thus fixes this extremely secure in the housing.

Es ist dabei hervorzuheben, dass es für de Erfindung völlig unerheblich ist, welches der Gehäuseteile Deckel bzw. Unterteil sind und ob die nachfolgend diskutierten Ausformungen am Deckel bzw. Unterteil vorhanden sind. Einzig deren relative Lage zur Leiterplatte ist für die Funktionsweise relevant.It should be emphasized that it is completely irrelevant for the invention which of the housing parts are the cover or the lower part and whether the subsequently discussed embodiments are present on the cover or lower part. Only their relative position to the circuit board is relevant to the operation.

Auch wird im folgenden in den Ausführungsbeispielen immer das bevorzugte Laserschweißen diskutiert, ist jedoch die Erfindung auch für andere Formen der lokalen Verschweißung, wie Reibschweißen, Ultraschallschweißen usw. geeignet.Also, the preferred laser welding is always discussed below in the embodiments, however, the invention is also suitable for other forms of local welding, such as friction welding, ultrasonic welding, etc.

Bei der Erfindung handelt es sich also um ein neues Konzept zum Verschließen eines Kunststoffgehäuses mit einem Deckel, bei gleichzeitiger Befestigung einer Leiterplatte, während eines Schweißvorganges, z. B. via Laser. Das Ziel ist es die Leiterplatte so zu befestigen, dass sie für Crashsensierung verwendet werden kann.In the invention, therefore, it is a new concept for closing a plastic housing with a lid, with simultaneous attachment of a circuit board, during a welding operation, for. B. via laser. The goal is to fix the PCB so that it can be used for crash sensing.

So wird die Leiterplatte durch Anschläge am Deckel kraftschlüssig im Gehäuse befestigt. Der Fügeweg ist, durch die Anschläge, abhängig von der Leiterplattendicke. Er liegt beispielsweise bei 0,4–0,8 mm. Durch dieses Verfahren bzw. Design erfolgt die Fixierung der PCB selbst bei unterschiedlichen Dickentoleranzen der PCB immer mit der gleichen Kraft und wird über die Lebensdauer eine sichere feste Fixierung erzeugt, die z. B. geeignet für vibrationsfreie Montage der PCB ohne zusätzliche Bauteile (z. B. Schrauben, Kleben) und Übertragung von Crashimpulsen. Parallel erfolgt auch ein wasserdichter Gehäuseverschluß.Thus, the circuit board is fixed by stops on the lid frictionally in the housing. The joining path is, by the stops, depending on the board thickness. It is for example at 0.4-0.8 mm. By this method or design, the fixation of the PCB is always done even with different thickness tolerances of the PCB with the same force and over the life of a secure fixed fixation is generated, the z. B. suitable for vibration-free mounting of the PCB without additional components (eg screws, gluing) and transmission of crash pulses. At the same time, a watertight housing closure takes place.

Der Vorteil dieses Konzeptes besteht darin das zum Befestigen der Leiterplatte und Verschließen des Gehäuses nur noch ein Arbeitsgang notwendig ist. Weiterhin ist die Befestigungsfläche der Leiterplatte weit größer als beim herkömmlichen Heißgasnieten. Wobei der Platzbedarf auf der Leiterplatte aber geringer ist, da die Auflageflächen nur die Randzone der Leiterplatte beeinträchtigen.The advantage of this concept is that it is necessary to attach the circuit board and closing the housing only one operation. Furthermore, the mounting surface of the circuit board is much larger than the conventional hot gas riveting. However, the space requirement on the circuit board is lower because the contact surfaces affect only the edge zone of the circuit board.

Diese Randzone wiederum ist aufgrund der Trennung der einzelnen Leiterplatte aus dem Nutzen als Sperrzone definiert. Durch die größere Kontaktfläche treten Vorspannverluste durch Kriechen des Kunststoffes nicht störend in Erscheinung.This edge zone in turn is defined as a barrier zone due to the separation of the individual circuit board from the benefit. Due to the larger contact surface preload losses caused by creep of the plastic are not disturbing in appearance.

Neben den genannten Vorteilen ist dieses Verfahren sehr prozesssicher, da der Schweißweg mithilfe einer Kraftauswertung gesteuert wird. Daher kann der Schweißprozess beim Anstieg der Vorspannkraft (nach Aufliegen der Anschläge auf die Leiterplatte) gestoppt werden, ohne dass die Leiterplatte zu stark beansprucht wird. Außerdem ist das Verschweißen eines Deckels erheblich materialsparender als das Vergießen der Leiterplatte. Neben der Materialersparnis gegenüber dem Verguss spart ein Schweißvorgang auch erheblich Zeit da die Schweißverbindung schneller auskühlt und nicht trocknen muss. Die elektrische Kontaktierung der Leiterplatte kann sowohl auf herkömmliche Art, mit Pressfiteinsätzen, als auch mit Einfach-Pins oder direkten Verbindungen erfolgen. In addition to the advantages mentioned, this method is very reliable, since the sweat path is controlled by means of a force evaluation. Therefore, the welding process can be stopped when the biasing force increases (after the stops on the printed circuit board have come to rest) without overstressing the printed circuit board. In addition, the welding of a lid is much more material-saving than the casting of the circuit board. In addition to the material savings compared to the casting, a welding process also saves considerable time because the welded joint cools faster and does not have to dry. The electrical contacting of the circuit board can be done both in a conventional manner, with Pressfiteinsätzen, as well as with single pins or direct connections.

Der entscheidende Punkt ist das während eines Schweißvorganges sowohl die Leiterplatte fixiert als auch das Gehäuse verschlossen wird. Bei bisherigen Anwendungen sind diese beiden Arbeitsschritte immer voneinander getrennt.The key point is that during a welding process both the circuit board fixed and the housing is closed. In previous applications, these two steps are always separated.

Die Erfindung wird nun nachfolgend anhand eines Ausführungsbeispieles unter Zuhilfenahme der 1 bis 2 näher erläutert. Im Folgenden können für funktional gleiche und/oder gleiche Elemente mit den gleichen Bezugsziffern bezeichnet sein. Es zeigenThe invention will now be described below with reference to an embodiment with the aid of 1 to 2 explained in more detail. Hereinafter, for functionally identical and / or identical elements may be denoted by the same reference numerals. Show it

1: Ausführungsbeispiel mit Gehäusedeckel, Gehäuseunterteil und Leiterplatte zu Beginn des Schweißvorgangs. 1 Embodiment with housing cover, housing base and circuit board at the beginning of the welding process.

2: Ausführungsbeispiel mit Gehäusedeckel, Gehäuseunterteil und Leiterplatte nach Beendigung des Schweißvorgangs. 2 Embodiment with housing cover, housing base and circuit board after completion of the welding process.

3 Skizze des Kraftverlaufs 3 Sketch of the force curve

1 zeigt ein erstes Ausführungsbeispiel mit Gehäusedeckel 1, Gehäuseunterteil 2 und Leiterplatte 3 zu Beginn des Schweißvorgangs. Am Deckel 1 ist eine Ausformung 1.1 zur Leiterplatte hin vorgesehen. 1 shows a first embodiment with housing cover 1 , Housing base 2 and circuit board 3 at the beginning of the welding process. On the lid 1 is a shape 1.1 provided to the circuit board.

Das Gehäuseunterteil 2 weist eine Ausformung 2.1 mit einem Übermaß auf, wobei dieses Übermaß sich gegenüber der äußerer Nase 1.3 und/oder gegenüber der Ausformung 1.1 am Deckel ergibt und ein definiertes Materialvolumen an Schmelze bestimmt, welches während des Schweißens aufgeschmolzen wird.The lower housing part 2 has a shape 2.1 with an excess, this excess being opposite the outer nose 1.3 and / or with respect to the molding 1.1 on the cover and determines a defined volume of material melt, which is melted during welding.

So durchdringt ein Laserstrahl an der gezeigten Stelle und Richtung den Deckel 1 und erwärmt die Ausformung 2.1 des gegenüberliegenden Gehäuseunterteils 2.Thus, a laser beam penetrates the lid at the location and direction shown 1 and heats the molding 2.1 of the opposite housing lower part 2 ,

Der Deckel 1 ist durch entsprechende Materialwahl zumindest in dem vom Laser durchstrahlten Bereich so gestaltet, dass er einen großen Anteil des Laserlichts zur Oberfläche 2.1.1 der gegenüberliegenden Ausformung 2.1 hindurchläßt, während dort durch entsprechende Materialwahl, bspw. Einbringung von Russpartikeln usw. eine besonders hohe Absorption und damit Umwandlung des Laserlichts in Wärme und damit Erzeugung von Kunststoffschmelze bewirkt wird.The lid 1 is designed by appropriate choice of material, at least in the irradiated area by the laser so that it covers a large proportion of the laser light to the surface 2.1 .1 the opposite shape 2.1 lets through, while there by appropriate choice of material, for example. Introduction of soot particles, etc., a particularly high absorption and thus conversion of the laser light into heat and thus production of plastic melt is effected.

Der Deckel 1 weist eine Ausformung 1.1 zur Leiterplatte 3 hin auf. Während dem Verschweißen erfolgt ein Zusammenpressen der Gehäuseteile 1,2 zueinander und wird das Verschweißen erst dann beendet, wenn eine vorgegebene Gegenkraft erreicht oder ein vorgegebener Verpressweg der Gehäuseteile 1,2 zueinander zurückgelegt wurde. Ein entsprechender Anstieg der Gegenkraft wird dann erreicht, wenn die Ausformung 1.1 auf die Leiterplatte 3 aufsetzt und eine Vorspannung im Deckel 1 entsteht.The lid 1 has a shape 1.1 to the circuit board 3 towards. During welding, a compression of the housing parts takes place 1 . 2 to each other and the welding is only terminated when a predetermined counterforce reached or a predetermined Verpressweg the housing parts 1 . 2 was covered to each other. A corresponding increase in the counterforce is achieved when the molding 1.1 on the circuit board 3 touches down and a bias in the lid 1 arises.

Die Ausformung 1.1 kann dabei partiell oder vorzugsweise komplett umlaufend ausgebildet sein und so eine weitere Abdichtung und natürliche Barriere für die beim Schweißen entstehende Schmelze bilden.The shape 1.1 can be partially or preferably completely encircling and thus form a further seal and natural barrier for the melt formed during welding.

Wird die Leiterplatte 3 in das Gehäuseunterteil 2 an der Auflagefläche 2.2 eingelegt und erreicht die Ausformung 1.1 zumindest zum Endzeitpunkt des Verschweißens die Leiterplatte 3, so kann diese Ausformung 1.1 die Leiterplatte 3 während des Auskühlens in einer vorgegebenen Position halten und wird ein Aufschwimmen oder Verschieben der Leiterplatte 3 verhindert. Da das Kunststoffmaterial beim Abkühlen zudem schrumpft, wird die Verspannung und Fixierung der Leiterplatte 3 im Gehäuse nur noch verbessert.Will the circuit board 3 in the lower housing part 2 on the support surface 2.2 inserted and reaches the shape 1.1 at least the end time of welding the circuit board 3 so this shaping can 1.1 the circuit board 3 during cooling in a predetermined position and will float or move the PCB 3 prevented. Since the plastic material also shrinks during cooling, the tension and fixation of the circuit board 3 only improved in the case.

Eine äußere Nase 2.6, hier ausgeformt am Gehäuseunterteil, schützt zusätzlich die Schweißnaht gegen direkt darauf einwirkende Objekte.An outer nose 2.6 , here formed on the housing base, additionally protects the weld against objects directly acting thereon.

Die 3 zeigt einen typischen Kraftverlauf über den Verstellweg s des Deckels relativ zur Leiterplatte mit einem deutlichen Anstieg der Gegenkraft bei Erreichen der Leiterplatte in T1, was damit die Abschaltung in T2 aktiviert. So kann eine Gegenkraft Fmax zur Abschaltung vorgegeben sein, die so dimensioniert ist, dass diese eben eine Verspannung zwischen Leiterplatte und Deckel sicherstellt. Alternativ kann auch die Veränderung des Anstiegs, also die relative Änderung der Kraft über den Verstellweg ΔF/ΔS oder über die Zeit ΔF/ΔT berücksichtigt werden.The 3 shows a typical force curve over the displacement s of the lid relative to the circuit board with a significant increase in the counterforce when reaching the circuit board in T1, which thus activates the shutdown in T2. Thus, a counterforce Fmax be given for shutdown, which is dimensioned so that it ensures just a tension between the circuit board and the lid. Alternatively, the change in the increase, ie the relative change in the force over the adjustment path .DELTA.F / .DELTA.S or over the time .DELTA.F / .DELTA.T be taken into account.

BezugszeichenlisteLIST OF REFERENCE NUMBERS

11
Deckelcover
1.11.1
Ausformung am Deckel zur Leiterplatte hinForming on the cover to the PCB out
1.21.2
Aufnahmeraum für Schmelze zwischen der Ausformung am Deckel und einer Ausformung am Gehäuseunterteil zum Deckel hinReceptacle for melt between the molding on the lid and a molding on the housing bottom to the lid
1.31.3
Äußere Nase am DeckelOuter nose on the lid
22
GehäuseunterteilHousing bottom
2.12.1
Ausformung am Gehäuseunterteil zum Deckel hinShaping on the lower part of the housing towards the lid
2.1.12.1.1
Oberseite an der Ausformung 2.1 Top on the molding 2.1
2.1.22.1.2
Abflussphase an der Ausformung 2.1 Drainage phase at the formation 2.1
2.22.2
Auflagefläche für LeiterplatteSupport surface for printed circuit board
2.32.3
Aufnahmeraum zur Gehäuseaußenseite für überschüssige SchmelzeReceptacle to the outside of the housing for excess melt
2.42.4
Zur Leiterplatte hin abgeflossene und erhärtete SchmelzeTo the printed circuit board down and hardened melt
2.52.5
Zur Gehäuseaußenseite abgeflossene SchmelzeTo outside of the housing melted melt
2.62.6
Äußere Nase am GehäuseunterteilOuter nose on the housing base
33
Leiterplattecircuit board
FF
Kraftforce
SS
Verstellwegadjustment

Claims (4)

Verfahren zum Verschweißen eines Kunststoffgehäuses bestehend aus zwei Gehäuseteilen, wobei im Gehäuse eine elektronische Leiterplatte angeordnet ist, dadurch gekennzeichnet, daß – in eine Gehäuseteil die Leiterplatte eingelegt wird, – am anderen Gehäuseteil eine Ausformung zur Leiterplatte hin vorgesehen ist, – das Gehäuseteil mit der Ausformung während dem Verschweißen in Richtung der Leiterplatte gepresst wird und – beim Auskühlen eine vorgegebene Kraft auf das Gehäuseteil mit der Ausformung ausgeübt wird – und nach dem Auskühlen die Leiterplatte durch die Ausformung im Gehäuse fixiert ist.A method for welding a plastic housing consisting of two housing parts, wherein in the housing an electronic circuit board is arranged, characterized in that - in a housing part, the circuit board is inserted, - is provided on the other housing part a molding to the circuit board out, - the housing part with the formation is pressed during welding in the direction of the circuit board and - when cooling a predetermined force is exerted on the housing part with the formation - and after cooling the circuit board is fixed by the molding in the housing. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß während des Schweißens die auf das Gehäuseteil mit der Ausformung einwirkende Kraft erfasst und daraus der Zeitpunkt der Beendigung des Schweißens abgeleitet wird.A method according to claim 1, characterized in that during welding, the force acting on the housing part with the shaping force detected and from the time of termination of the welding is derived. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß während des Schweißens der Verstellweg des Gehäuseteils mit der Ausformung relativ zum anderen Gehäuseteil und/oder der Leiterplatte erfasst und daraus der Zeitpunkt der Beendigung des Schweißens abgeleitet wird.A method according to claim 1, characterized in that detected during welding, the adjustment of the housing part with the molding relative to the other housing part and / or the circuit board and from the time of termination of the welding is derived. Elektronische Baugruppe bestehend aus einem Kunststoffgehäuse mit zwei Gehäuseteilen, wobei im Gehäuse eine elektronische Leiterplatte angeordnet ist, hergestellt nach dem Verfahren nach einem der vorangehenden Ansprüche.Electronic assembly consisting of a plastic housing with two housing parts, wherein in the housing an electronic circuit board is arranged, prepared by the method according to any one of the preceding claims.
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