KR101056092B1 - Light emitting diode package - Google Patents

Abstract

The present invention relates to a light emitting diode package, and a technical problem to be solved is to provide a light emitting diode package capable of heat dissipation without the need to attach a separate heat sink.

To this end, a light emitting diode chip having a first electrode and a second electrode, and emits light when power is supplied to the first electrode and the second electrode; A first lead part electrically connected to a first electrode of the light emitting diode chip; A second lead part spaced apart from the first lead part, electrically connected to a second electrode of the light emitting diode chip, and mounted on the light emitting diode chip; And a molding part which integrally couples the first lead part and the second lead part by filling a gap between the first lead part and the second lead part. It includes, and discloses a light emitting diode package, characterized in that a plurality of heat dissipation groove is formed in the lower portion of the second lead portion.

Description

Light Emitting Diode Package {LIGHT-EMITTING DIODE PACKAGE}

The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package in which the light emitting diode chip, the lead and the molding part are integrally formed.

Recently manufactured light emitting diodes have been manufactured in the form of light emitting diode packages that are integrally manufactured by light emitting diode chips, leads and moldings.

Such a light emitting diode package is in the spotlight because the light emitting diode chip, the lead and the molding part are integrally formed to increase durability and lifespan.

However, since the LED package is integrally formed by the LED chip, the lead, and the molding part, a problem of dissipating heat generated from the LED chip is increasing.

In order to solve the heat dissipation problem, a light emitting diode package is heat dissipated by attaching a separate heat sink to the lead after forming the LED chip, the lead, and the molding unit integrally.

In particular, a light emitting diode package applied to a lighting or a street lamp uses 1 W or more of power consumption of a light emitting diode chip, and a high power light emitting diode package having a power consumption of 1 W or more of a light emitting diode chip is used without a heat sink. Since the internal circuit melts the wiring, it is necessary to use a heat sink.

However, a design for attaching a heat sink to a light emitting diode package increases a separate manufacturing cost by adding a heat sink, and thus, an application using a high output light emitting diode package also increases manufacturing cost, thereby deteriorating a price competitiveness.

An object of the present invention is to provide a light emitting diode package capable of heat dissipation without attaching a separate heat sink.

According to an aspect of the present invention, there is provided a light emitting diode package including a light emitting diode chip including a first electrode and a second electrode and emitting light when power is supplied to the first electrode and the second electrode; A first lead part electrically connected to a first electrode of the light emitting diode chip; A second lead part spaced apart from the first lead part, electrically connected to a second electrode of the light emitting diode chip, and mounted on the light emitting diode chip; And a molding part which integrally couples the first lead part and the second lead part by filling a gap between the first lead part and the second lead part. It includes, characterized in that a plurality of heat dissipation groove is formed in the lower portion of the second lead portion.

In this case, the first lead portion extends from the side of the first lead connection portion to a thickness smaller than the thickness of the first lead connecting portion and the first lead connecting portion, and the first electrode of the LED chip. And a second lead connecting portion formed at a position opposite to the first lead connecting portion, and having a thickness thinner than a thickness of the second lead connecting portion. A second lead extension part extending from a side of a second lead connection part and electrically connected to a second electrode of the light emitting diode chip, and a first lead accommodation space in which the light emitting diode chip is mounted and accommodates the first lead connection part; A second lead receiving space in which the second lead connecting portion and the second lead extension portion are formed; The two heat releasing grooves may be formed to include a second lead plate that is formed.

In addition, the power of the LED chip is preferably formed between 1W to 3W.

In this case, the plurality of heat dissipation grooves may have a sum of the bottom surface areas of 40% to 70% of the lower area of the second lead portion, and the depth of the heat dissipation grooves may be 40% to 60% of the thickness of the second lead portion. It is preferable to form.

According to the present invention, since the heat dissipation groove is formed in the lead portion to emit heat generated from the light emitting diode chip, the heat dissipation can be performed without attaching a separate heat sink, thereby reducing the production cost of the application product using the light emitting diode package. There is a saving effect.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a light emitting diode package according to an embodiment of the present invention. FIG. 2 is a plan view of the light emitting diode package shown in FIG. 1. 3 is a cross-sectional view taken along the line A-A shown in FIG. 4 is a rear view of the light emitting diode package shown in FIG. 2. FIG. 5 is a perspective view as viewed from an oblique line of the light emitting diode package shown in FIG. 4.

1 to 5, a light emitting diode package according to an embodiment of the present invention includes a light emitting diode chip 10, a first lead portion 20, a second lead portion 30, and a molding portion 40. It is formed to include.

The LED chip 10 includes a first electrode 11 and a second electrode 12. In this case, the first electrode 11 is formed of an anode of the light emitting diode, and the second electrode 12 is formed of a cathode. The light emitting diode chip 10 emits light when electric power is supplied to the first electrode 11 and the second electrode 12.

The first lead part 20 is formed to include a first lead connection part 21 and a first lead extension part 22. The first lead part 20 is electrically connected to the first electrode 11 of the LED chip 10.

The first lead connecting portion 21 is formed in a flat plate shape and is spaced apart from the second lead portion 30. Here, the first lead connection portion 21 provides a space that can be soldered when mounted on a device such as a printed circuit board (not shown) or a power supply line (not shown) when the LED package is integrally formed. . In this case, the first lead connector 21 receives power from a device such as a printed circuit board or a power supply line to supply power to the first electrode 11 of the LED chip 10.

The first lead extension part 22 extends from the side of the first lead connection part 21 to a thickness thinner than the thickness of the first lead connection part 21. In this case, the first lead extension part 22 is formed to be spaced apart from the second lead part 30. The first lead extension part 22 provides a space that can be electrically connected to the LED chip 10, and is electrically connected to the first electrode 11 and the bonding wire 1a of the LED chip 10. Connected.

In addition, the first lead extension part 22 is formed to extend to a thickness thinner than the first lead connection part 21 at the side of the first lead connection part 21 to provide a space in which a part of the molding part 40 can be filled. By providing, it serves to improve the bonding force with the molding portion (40).

The second lead part 30 is formed to include a second lead connection part 31, a second lead extension part 32, and a second lead flat part 33. The second lead part 30 is formed to be spaced apart from the first lead part 20, is electrically connected to the second electrode 12 of the light emitting diode chip 10, and the light emitting diode chip 10 is mounted. .

The second lead connecting portion 31 is formed in a substantially flat plate shape and is formed at a position opposite to the first lead connecting portion 21. Here, when the LED package is integrally formed, the second lead connection part 31 provides a space that can be soldered when mounted in a device such as a printed circuit board (not shown) or a power supply line (not shown). . In this case, the second lead connector 31 receives power from a device such as a printed circuit board or a power supply line to supply power to the second electrode 12 of the LED chip 10.

The second lead extension part 32 extends from the side of the second lead connection part 31 to a thickness thinner than the thickness of the second lead connection part 31. The second lead extension part 32 is formed to extend from the second lead connection part 31 to a thickness thinner than the thickness of the second lead connection part 31 to provide a space in which a part of the molding part 40 may be filled. As a result, the bonding force with the molding part 40 is improved.

The light emitting diode chip 10 is mounted on the second lead plate 33. In addition, the second lead plate 33 is connected to the second electrode 12 of the LED chip 10 by the bonding wire 1b. In addition, the second lead flat plate 33 forms a first lead accommodating space 33a for accommodating the first lead connecting portion 21. In addition, the second lead flat part 33 forms a second lead accommodating space 33b in which the second lead connecting part 31 and the second lead expanding part 32 are formed. In this case, both the first lead portion 20 and the second lead portion 30 are formed in the wide rectangular shape of the LED package in the first lead accommodating space 33a and the second lead accommodating space 33b. The improvement of the degree of integration is to easily discharge the heat generated from the light emitting diode chip to the second lead part 30 and to easily form the molding part 40. Here, the second lead extension part 32 is formed to protrude into the second lead receiving space of the second lead plate part 33 to a thickness thinner than the thickness of the second lead plate part 33, and the second lead connection part ( 31 is connected to the second lead flat plate 33.

In this case, it is preferable that a plurality of heat dissipation grooves 34 are formed in the lower portion of the second lead plate portion 33 of the second lead portion 30. Here, the heat dissipation groove 34 is formed by half etching the second lead flat plate portion 33. The plurality of heat dissipation grooves 34 serve to form a wide heat dissipation area of the second lead flat plate 33. The second lead flat plate 33 conducts heat generated from the LED chip 10. In response, the heat dissipation groove 34 and the second lead flat plate portion 33 having a wide heat dissipation area serve to discharge heat. Accordingly, the LED package according to the embodiment of the present invention can discharge heat generated from the LED chip 10 to the outside without attaching a separate heat sink to the second lead flat plate 33.

Here, the light emitting diode chip 10 preferably has a power consumption of 1W to 3W. In this case, when the power consumption of the light emitting diode chip 10 is smaller than 1W, the area for forming the heat dissipation groove 34 is too small, so that the heat dissipation effect may be insignificant, and the light emitting diode chip 10 In the case where the power consumption is greater than 3W, heat dissipation may be difficult using only the heat dissipation area of the second lead flat plate 33 without using a separate heat sink (not shown).

In this case, the plurality of heat dissipation grooves 34 have a sum of the bottom surface areas of 40% to 70% in the lower area of the second lead portion 30, and the depth of the heat dissipation grooves 34 is the second lead portion. It is preferable to form from 40% to 60% of the thickness of (30). Here, the plurality of heat dissipation grooves 34 may reduce the heat dissipation effect when the sum of the bottom surface areas is less than 40% in the bottom area of the second lead part 30, and the sum of the bottom surface areas is the second lead. If the lower area of the portion 30 is greater than 70%, the structure of the second lead portion 30 may become weak. In addition, when the depth of the plurality of heat dissipation grooves 34 is smaller than 40% of the thickness of the second lead portion 30, heat is not sufficiently conducted from the light emitting diode chip 10, and the heat dissipation effect is insufficient. When the depth of the plurality of heat dissipation grooves 34 is formed to be 60% deeper than the thickness of the second lead portion 30, the structure of the second lead flat portion 33 may become weak.

The molding part 40 is formed including the gap part 41 and the protrusion part 42.

The gap 41 serves to integrally couple the first lead part 20 and the second lead part 30 by filling a gap between the first lead part 20 and the second lead part 30. .

The protrusion 42 is integrally formed with the gap 41 and protrudes to the upper surfaces of the first lead part 20 and the second lead part 30. In this case, a conical space 42a penetrating the center is formed in the protrusion 42 so that a part of the upper surface of the first lead extension 22 and the second lead flat plate 33 can be exposed, and the LED chip 10 is accommodated in the second lead flat portion 33 through the conical space 42a.

As described above, in the LED package according to the embodiment of the present invention, the heat generated from the LED chip 10 is discharged through the heat dissipation groove 34 of the second lead part 30 having the increased heat dissipation area. There is no need to provide a separate heat sink.

1 is a perspective view of a light emitting diode package according to an embodiment of the present invention.

2 is a plan view of the LED package shown in FIG.

3 is a cross-sectional view taken along line A-A shown in FIG.

4 is a rear view of the light emitting diode package shown in FIG. 2.

5 is a perspective view as viewed from an oblique line of the light emitting diode package shown in FIG. 4.

<Explanation of symbols for the main parts of the drawings>

10; Light emitting diode chip 20; 1st lead part

30; Second lead portion 34; Heat dissipation groove

40; Molding part

Claims (4)

A light emitting diode chip having a first electrode and a second electrode and emitting light when electric power is supplied to the first electrode and the second electrode; The light emitting diode is electrically connected to the first electrode of the light emitting diode chip, extends from the side of the first lead connecting portion to a thickness thinner than a thickness of the first lead connecting portion and the first lead connecting portion, and the light emitting diode A first lead part including a first lead extension part electrically connected to the first electrode of the chip; A second lead connection part spaced apart from the first lead part, electrically connected to a second electrode of the light emitting diode chip, mounted on the light emitting diode chip, and formed at a position opposite to the first lead connection part; A second lead extension part extending from a side of the second lead connection part to a thickness thinner than the thickness of the second lead connection part and electrically connected to a second electrode of the light emitting diode chip; and the light emitting diode chip is mounted. And a first lead accommodating space accommodating the first lead connecting part, a second lead accommodating space in which the second lead connecting part and the second lead extension part are formed, and a plurality of heat dissipation grooves are formed on a lower surface thereof. 2 lead parts; And A molding part which integrally couples the first lead part and the second lead part by filling a gap between the first lead part and the second lead part; Light emitting diode package comprising a. delete The method of claim 1, The power of the light emitting diode chip is a light emitting diode package, characterized in that formed between 1W to 3W. The method of claim 1, The plurality of heat dissipation grooves are formed in the sum of the lower surface area is between 40% to 70% in the lower area of the second lead portion, The depth of the heat dissipation groove is a light emitting diode package, characterized in that formed in 40% to 60% of the thickness of the second lead portion.

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