KR101054146B1 - Led chip testing and classifying apparatus - Google Patents

Led chip testing and classifying apparatus Download PDF

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Publication number
KR101054146B1
KR101054146B1 KR1020100090857A KR20100090857A KR101054146B1 KR 101054146 B1 KR101054146 B1 KR 101054146B1 KR 1020100090857 A KR1020100090857 A KR 1020100090857A KR 20100090857 A KR20100090857 A KR 20100090857A KR 101054146 B1 KR101054146 B1 KR 101054146B1
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South Korea
Prior art keywords
led chip
unit
measuring
led
sorting
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KR1020100090857A
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Korean (ko)
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장철희
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장철희
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Publication of KR101054146B1 publication Critical patent/KR101054146B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Led Devices (AREA)

Abstract

The present invention relates to a measurement and classification device for an LED chip, LED chip measuring unit 100 for examining the performance of each LED chip; An LED chip classification unit 200 for classifying and arranging LED chips having passed through the LED chip measuring unit 100 according to performance; The cassette elevator 300 is provided between the LED chip measuring unit 100 and the LED chip sorting unit 200 to supply the LED chip measured by the LED chip measuring unit 100 to the LED chip sorting unit 200. It includes; The LED chip measuring unit 100 includes a supply unit 110 for supplying an LED chip, a rotary arm 120 for holding an LED chip provided through the supply unit 110, and the rotary arm 120. A measurement unit 130 for measuring the performance of the held LED chip, and an array unit 140 for arranging the LED chips whose performance is measured through the measurement unit 130; The LED chip sorting unit 200 is characterized in that it comprises a sorting unit 210 located on the top of the LED chip measuring unit 100 to classify the LED chip supplied through the array unit 140. .
As a result, the LED chip measuring and sorting device is constructed in a multi-layer structure, thereby eliminating the constraints of the installation space and minimizing the worker's moving lines, thus enabling efficient management with a small manpower, and using a single measuring stay. Therefore, the accuracy of the measurement results of the LED chip is improved.

Description

LED CHIP TESTING AND CLASSIFYING APPARATUS}

The present invention relates to an LED chip measuring and sorting apparatus, and more particularly, to test whether the LED chip produced in the LED manufacturing process is normally operated, and to classify the normally operated LED chip according to its electrical characteristics and optical characteristics. It relates to an LED chip measuring classifier.

LED (Light Emitting Diode, hereinafter referred to as "LED") is one of the light emitting device using a semiconductor, it has a relatively low power consumption and a long service life compared to the light emitting devices such as bulb-type lamps, fluorescent lamps that have been conventionally used, There are many advantages that it can be manufactured in a small size has been widely used as a display lamp, backlight, lighting equipment of various electronic and mechanical devices in recent years.

The LED chip process for manufacturing such LED is largely an epitaxial process (EPI) to form a compound thin film layer on the substrate, the Fab chip (fabrication) and the LED chip manufactured by the fab process to produce the LED chip to the final product (LED It consists of a package process made of).

The LED finally made by the above manufacturing process selects LEDs that are normally operated and non-LEDs, that is, good and bad products, through the subsequent test process, and according to the performance (electrical and optical characteristics), LEDs need to be divided into different classes.

However, when the finished product is tested according to the process described above, if the defective product is found in the test process, it is difficult to determine which process is wrong and the defective product is generated. In this case, since the defective products made at this time are unnecessarily passed through the package process, there is a problem of waste of material costs, process time, and manpower required for the package process.

Therefore, it is necessary to test the semi-finished LED chip between the fab process and the package process to screen out the defective product, so that the defective LED chip is not transferred to the subsequent package process. LED chip measuring and sorting apparatus has been proposed to classify the goods by grade, and the LED chip test apparatus of Patent No. 10-0935706 and its transmission member are mentioned as one example.

The LED chip test apparatus is provided with a supply unit 2 for supplying an LED to one side of the LED chip measurement classifier 1 as shown in FIG. 1, and sequentially inspects the LEDs supplied through the supply unit 2. The test unit 3 is provided for loading, and before and after each of them, a loading transfer line (not shown) for receiving LEDs from the fab process and an unloading transfer line (not shown) for sending the tested LED chip to the package process. ) Is installed.

As described above, the technology disclosed in the document is arranged in a long row so that the operation of supplying, measuring, and arranging the LED chips can be sequentially performed. Since it has to be arranged in a long row, it requires a long installation space, and there is a limitation in the installation space. Also, since the driver has to move along a long copper wire to continuously monitor and control each process unit, monitoring is not easy. In order to solve the problem, a separate worker must be disposed in each process unit.

Meanwhile, as shown in FIG. 2, the supply unit 2 of the components constituting the above apparatus includes a rotating unit 2A and a plurality of seating members 2B rotating through the rotating unit 2A 360 ° /. It is provided at intervals of n, and the LED chip to be tested is rotated in the adsorption fixed state to the seating member 2B and supplied to the measuring unit 3.

At this time, when one seating member 2B of the plurality of seating members 2B is at the test position TP of the measuring unit 3, the other seating member 2B is connected to the loading position LP of the test chip. It is located at the unloading position (ULP) respectively.

That is, as the mounting member 2B is rotated by n / 360 °, loading, unloading, and performance testing of the LED chip to be tested are simultaneously performed.

Therefore, the plurality of seating members 2B all become one independent measuring stage for testing the LED chip, and thus, when the seating member 2B of any one of these seating members 2B is deteriorated, the measuring unit (3) The results of LED's optical characteristics (luminance, wavelength, luminous flux, luminous intensity, illuminance, spectral distribution, color temperature, etc.) may also vary, so that the performance of the LED chip may not be properly understood and may be classified correctly. There is no problem.

The present invention has been made to improve the problems of the prior art as described above, the present invention can minimize the installation space of the LED chip measurement and classification device for sorting defective products by testing LED chips that are semi-finished products at the same time copper wire for work The purpose is to provide a LED chip measuring and sorting device that can reduce the number of operators by reducing this.

Another object of the present invention is to provide an LED chip measuring and sorting apparatus that can reliably measure the measurement result of the LED chip to be measured by supplying the LED chip to be measured to a specified test stage.

LED chip measuring classification apparatus of the present invention according to the above object, LED chip measuring unit for inspecting the performance of each LED chip; An LED chip sorting unit for classifying and arranging the LED chips having passed through the LED chip measuring unit according to performance; A cassette elevator provided between the LED chip measuring unit and the LED chip sorting unit to supply the LED chip measured by the LED chip measuring unit to the LED chip sorting unit; The LED chip measuring unit, the supply unit for supplying the LED chip, the rotary arm holding the LED chip provided through the supply unit, the measuring unit for measuring the performance of the LED chip held by the rotating arm, and the measuring unit It includes an array unit for arranging the LED chip whose performance is measured through; The LED chip sorting unit is achieved by including a sorting unit located on top of the LED chip measuring unit to classify the LED chips supplied through the array unit.

A cassette elevator for supplying the ring arranged with the LED chip measured by the LED chip measuring unit is further provided with an LED chip sorting unit, and the LED chip measuring unit is a supply unit for supplying a single LED chip from the ring in which the LED chip is arranged and; A rotary arm for holding an LED chip provided through the supply unit; A measuring unit positioned at one side of the rotating arm to measure performance of the LED chip; The LED chip measured through the measuring unit is provided through the rotary arm to arrange the LED chip in the ring rearranged, the LED chip sorting unit is located on the LED chip measuring unit is arranged through the array unit It is characterized by consisting of a classification unit for classifying each LED chip by receiving a ring.

The present invention can test the semi-finished LED chip prior to producing the LED as a finished product, so that the defective product can be selected and removed, so that the defective product does not go through the packaging process, thereby reducing the loss of material and manpower, and also the optical characteristics under a certain standard. LED chips can be classified according to their performance, etc., thus increasing the reliability of the measurement.

In addition, in the present invention, since the classification unit is located on the upper side of the measurement unit, there is little space restriction for installing the equipment, and since the driver's moving line is minimized, the equipment can be easily operated and controlled with less manpower.

In addition, the present invention is equipped with a rotary arm has the advantage that the LED chip provided in the ring can be quickly supplied to the measuring unit and rearranged.

1 is a perspective view showing an example of a conventional LED chip test apparatus,
2 is a perspective view showing a supply unit of a conventional LED chip test apparatus,
Figure 3 is a side view showing an example of the LED chip measurement classification apparatus according to the present invention,
4 is a plan view showing a cross-section AA of FIG.
5 is a plan view showing an example of a supply unit according to the present invention;
Figure 6 is a side view showing an example of the clamper and the rotary drive device according to the present invention,
7 is a plan view showing a rotating arm and a measuring unit according to the present invention;
8 (a, b) is a plan view and a side view showing a fixed clip portion according to the present invention,
9 is a plan view showing an example of the arrangement unit according to the present invention;
10 is a perspective view showing an example of a cassette elevator according to the present invention;
11 is a plan view showing a cross-sectional view taken along line BB of FIG.
12 is a plan view showing an example of a supply table according to the present invention;
13 is a plan view showing an example of a sorting arrangement table according to the present invention;
14 is a plan view showing an example of a classification unit according to the present invention.

Hereinafter will be described in more detail with reference to the accompanying drawings showing an embodiment of the present invention.

The present invention is an LED chip measuring classification apparatus for classifying the performance of each LED chip before the package process through the fab process, and sorting and collecting defective products in advance. In order to minimize the installation space of the LED chip measuring and sorting device for performing the performance inspection and classification arrangement of the process, and to thereby reduce the number of personnel to work, to provide an LED chip measuring and sorting device, LED chip measuring unit 100 for checking the performance of each LED chip as shown in Figure 3; The LED chip measuring unit 100 includes a LED chip classification unit 200 for classifying and arranging according to the performance.

Hereinafter, the LED chip measuring unit 100 and the LED chip classification unit 200 will be described in more detail.

① LED Chip Measuring Unit (100)

The LED chip measuring unit 100 is located in the lower layer in the LED chip measuring classifier having a double layer structure as shown in FIG. 3. When the LED chip measuring unit 100 is supplied to the ring after the fab process is supplied to the ring, In order to inspect the performance of each LED chip, and store the inspection data of each LED chip, the LED chip classification unit 200 to be described later, the arrangement can be arranged.

To this end, the LED chip measuring unit 100 is provided on one side with a supply unit 110 for supplying the LED chip as shown in Figure 4 AA section of Figure 3, arranged in the ring of the supply unit 110 Through the clamper 111 for holding the LED chip individually, and the rotary arm 120 and the measuring unit 130 to transfer the LED chip supplied through the clamper 111 to the measuring unit 130 to check the performance Arrangement unit 140 for rearranging the measured LED chip in the ring through the clamper 141 is configured in sequence.

The supply unit 110 is arranged in a ring after the LED chip produced through the fab process, is housed in a cassette (storage box) and supplied, take out the ring in the cassette individually, the LED chip is held individually through the clamper 111 As a device for positioning on the supply table 110 ', such a supply unit 110 is installed with two transport rails 113, 114 orthogonal to each other in the X, Y axis as shown in FIG. In this way, the clamper 111 can repeatedly hold the LED chip at the same position.

The clamper 111 is also provided in the arrangement unit 140 to be described later, which is rotated by the rotary drive device 112, each clamper (111, 141) 180 ° around the rotation axis (C) as shown in FIG. Alternatively, each LED chip is gripped by two clamps 111A and 141A provided at both ends while rotating at 360 °, while the clamps 111A and 141A are held by the clamps 111A and 141A. 141A) moves down the held LED chip.

At this time, the clamps 111A and 141A may be implemented in the form of tongs, and the LED chips may be gripped individually, or the clamps 111A and 141A may be provided with an adsorption unit capable of vacuum adsorption.

On the other hand, the supply unit 110 scans each LED chip arranged in the ring supplied on the supply table to set the chip address (Chip Address), the inspection information of each LED chip when inspecting the LED chip through this information Are separately input and classified by performance in the LED chip classification unit 200 to be described later.

The rotary arm 120 is a device that transfers the LED chip supplied through the supply unit 110 to the measuring unit 130 so as to carry out the necessary inspection by holding each of the clamps 111A of the array unit 110. It takes over the LED chip held in and rotates at a predetermined angle and performs a predetermined process for each section.

To this end, as shown in FIG. 7, four fixed clip portions 121 are installed at intervals of 90 ° as shown in FIG. 7. The loading portion 121A, the measuring portion 121B, and the unloading portion of the LED chip according to respective positions are installed. The part 121C and the discharge part 121D are provided, and the fixed clip part 121 at this time may be implemented by increasing or decreasing the number for easy implementation by those skilled in the art.

The loading part 121A is a position to receive the LED chip to be measured forward through the rotating clamp 111A. The clamp 111A is clamped at the opposite side while the LED chip is held by the ring in which the LED chip is arranged. The 111A moves the LED chip to the fixed clip part 121, and the LED chip transferred to the fixed clip part 121 rotates at a predetermined angle and transfers the LED chip to the measuring part 121B.

The measuring unit 121B is a position for testing the optical characteristics of the LED chip through the measuring unit 130 to be described later, and supplies power to the LED chip using a plurality of measuring probes 131 provided in the measuring unit 130. Therefore, the optical characteristics are measured.

The unloading unit 121C is a position for supplying the LED chip to the clamp 141A of the array unit 140 to be described later to rearrange the LED chip that has been inspected through the measuring unit 130 to the ring regardless of the characteristics. As such, the LED chip that is determined to be defective through the inspection is transferred to the discharge unit 121D without being rearranged to the array unit 140 and collected in a separate collection box, and the fixed clip 121 of the discharge unit 121D is The process moves to the loading unit 121A again to receive the LED chip again.

At this time, the fixing clip 121, as shown in FIG. 8, two clamps 121 'are installed at one end, and the clamps 121' are picked up or placed while the clamp 121 'is opened or retracted.

Measuring unit 130 is a device for checking the optical characteristics of each LED chip according to the LED chip transported through the rotary arm 120 is located in the measuring unit 121B, for this purpose fixed as shown in FIG. A plurality of measurement probes 131 are installed at the position.

According to the present invention, a measurement stage for testing the optical characteristics of the LED chip does not change, and one measurement stage is provided so that it can be inspected under the same conditions at all times. It is a structure that is rearranged in a ring, and thus it is possible to solve the existing problem that the measurement result is different according to the aging degree and performance of each stage by inspecting the optical characteristics of the LED chip at each stage with multiple measuring stages. Can be.

The array unit 140 is a configuration for storing the optical characteristics of the LED chip through the measuring unit 130 and rearranging the object that is not a defective product in the ring again in the ring, and arranged as shown in FIG. 9 for this purpose. Feed rails 143 and 144 are installed to move the table 140 'in the X and Y axes, and the clamper 141 is positioned on one side of the arrangement table 140' so that the clamper 141 is unloaded. The LED chip is taken over by the unit 121C and rearranged in a ring placed on the array table 140 '.

At this time, the clamper 141 is made of the same configuration as the clamper 111 of the supply unit 110, the LED chip is gripped by the clamp 141A provided at both ends of the forceps or the vacuum suction unit, the clamper 141 is rotated The LED chip is arranged in a ring while being rotated about the rotation axis C ″ through the driving device 142 and reciprocating between the unloading part 121C and the array table 140 '.

The lower LED chip measuring unit 100 as described above collects and collects defects of the LED chips produced through the fab process at an early stage, thereby reducing the manufacturing cost wasted when continuing the process, and further, the lower process The operator can easily control each process without the operator moving and manipulating it.

② LED chip classification unit 200

The LED chip classification unit 200 is configured to be rearranged according to the light characteristics by receiving the LED chip that has been measured by the LED chip measuring unit 100 at the bottom. It is supplied to the LED chip classification unit 200.

At this time, in the present invention, the LED chip rearranged in the ring in the lower array unit 140 is accommodated in the receiving unit to be directly supplied to the LED chip sorting unit 200 located at the upper part, so that an operator manually moves the receiving unit. It is configured to automatically perform the work associated with the lower part without supply, for this purpose, the cassette elevator 300 is installed on one side for accommodating the LED chip measuring unit 100 and the LED chip sorting unit 200 reciprocating Supplying the completed LED chip to the LED chip classification unit 200 using (310).

The cassette elevator 300 is provided with an accommodating part 310 in which the LED chip is stored as shown in FIG. 10, and a conveying rail 320 having a length vertically coupled to the side of the accommodating part 310. And a driving device 330 for elevating the accommodating part 310 through the conveying rail 320, whereby the accommodating part 310 conveys the LED chip while being elevated along the conveying rail 320.

On the other hand, the LED chip sorting unit 200, as shown in Figure 11 showing the BB cross-section of Figure 3, and the sorting arm 212 for holding the LED chip of the supply table 211 individually; The sorting arrangement table 213 sequentially sorts and rearranges the LED chips through the sorting arm 212.

The supply table 211 is a configuration in which the LED chip has been measured at the bottom through the cassette elevator 300 is supplied, as shown in FIG. As the table 211 is moved to the X and Y axes, the splitting arm 212 can always hold the LED chip positioned at the same position.

Meanwhile, the supply table 211 scans again the LED chip address preset in the LED chip to classify the performance of the LED chip through the inspection information of the LED chip, and compares the LED chip with FIG. 13 based on the scanned information. As shown in 14, the sorting arms 212 are individually grasped and rotated so as to be rearranged in the sorting arrangement table 213.

The ring arranged in the sorting arrangement table 213 is stored in the receiving unit again and is transferred downward through the cassette collection elevator 400.

On the other hand, the present invention is further provided with a pusher on the lower surface of the lower supply unit 110 and the upper supply table 211 for supplying the LED chip to project the individual LED chip to the upper surface of the ring to classify the clamp 111A Arm 212 may be configured to hold the LED chip individually.

The present invention as described above is a measurement classification device for inspecting the optical characteristics of the LED chip, and to remove the defective products of the LED chip at the same time with the classification according to each performance, the supply and measurement of the LED chip and the measurement result of the LED chip In performing the sorting arrangement according to the upper and lower duplex structure, the cassette elevator 300 to reciprocate the upper and lower floors, it is possible to minimize the movement of the worker moving between operations can be easily controlled with less manpower There are technical features.

In addition, the LED chip is always measured and classified in the same measurement stage, thereby reducing the error of the performance result according to the characteristics of the stage, and because the long work process is a multi-layer structure of the upper and lower layers, the constraint of the installation space is minimized.

100: LED chip measuring unit 110: supply unit
110 ': feed table 111: clamper
111A: Clamp 112: Rotary Drive
113, 114: transfer rail 120: rotary arm
121: fixing clip 121 ': tongs
121A: Loading part 121B: Measuring part
121C: Unloading section 121D: Outlet section
130: measuring unit 131: measuring probe
140: array unit 140 ': array table
141: clamper 141A: clamp
142: rotary drive unit 143, 144: transfer rail
200: LED chip sorting unit 210: sorting unit
211: Feed table 211A, 211B: Feed rail
212: classification arm 213: classification array table
213A, 213B: Transfer rail 300: Cassette elevator
310: accommodating part 320: transfer rail
330: drive device 400: cassette recovery elevator
C, C ': axis of rotation

Claims (7)

In the LED chip measuring classifier,
LED chip measuring unit 100 for checking the performance of each LED chip;
An LED chip classification unit 200 for classifying and arranging LED chips having passed through the LED chip measuring unit 100 according to performance;
The cassette elevator 300 is provided between the LED chip measuring unit 100 and the LED chip sorting unit 200 to supply the LED chip measured by the LED chip measuring unit 100 to the LED chip sorting unit 200. It includes;
The LED chip measuring unit 100 includes a supply unit 110 for supplying an LED chip, a rotary arm 120 for holding an LED chip provided through the supply unit 110, and the rotary arm 120. A measurement unit 130 for measuring the performance of the held LED chip, and an array unit 140 for arranging the LED chips whose performance is measured through the measurement unit 130;
The LED chip sorting unit 200 is located above the LED chip measuring unit 100, LEDs characterized in that it comprises a sorting unit 210 for classifying the LED chip supplied through the array unit 140 Chip measuring classifier.
delete The method according to claim 1,
The cassette elevator 300 includes an accommodating part 310 in which the LED chip is accommodated;
A conveying rail 320 vertically coupled to the side surface of the accommodating part 310;
LED chip measuring and sorting device, characterized in that consisting of a drive device (330) for elevating the receiving portion 310 through the conveying rail (320).
delete The method according to claim 1,
The supply unit 110 and the array unit 140 includes a clamper (111, 141) for picking up the LED chip to supply to the rotary arm 120, or to pick up and arrange the LED chip of the rotary arm 120;
LEDs, characterized in that two clamps (111A, 141A) are provided at both ends of each of the clampers (111, 141), and rotary drive devices (112, 142) for rotating the clampers (111, 141). Chip measuring classifier.
The method according to claim 1,
The rotary arm 120 includes a plurality of fixed clip portions 121;
The fixing clip 121 is a loading unit 121A receiving the LED chip through the supply unit 110, a measuring unit 121B for checking the performance of the LED chip, and the measured LED chip arrangement unit ( LED chip measurement classification, characterized in that the supply, measurement and rearrangement of the LED chip is repeated while rotating the unloading unit 121C and the defective product discharge unit 121D for collecting the defective products of the LED chip in order. Device.
The method according to claim 1,
The sorting unit 210 includes a supply table 211 to which the LED chip measured through the LED chip measuring unit 100 is supplied;
A classification arm 212 for holding each of the LED chips supplied from the supply table 211 individually;
LED sorting device comprising a classification arrangement table (213) in which the LED chip is classified and rearranged through the classification arm (212).
KR1020100090857A 2010-09-16 2010-09-16 Led chip testing and classifying apparatus KR101054146B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130118709A (en) * 2012-04-20 2013-10-30 (주)큐엠씨 Apparatus for sorting electronic element

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010018869A (en) * 1999-08-23 2001-03-15 윤세원 Light emitting diode tester
KR20080103892A (en) * 2007-05-25 2008-11-28 에이에스엠 어쌤블리 오토메이션 리미티드 System for testing and sorting electronic components
KR20100045230A (en) * 2008-10-23 2010-05-03 미래산업 주식회사 Luminous element test handler
KR100979763B1 (en) * 2010-03-25 2010-09-02 (주)큐엠씨 Apparatus for sorting target object

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010018869A (en) * 1999-08-23 2001-03-15 윤세원 Light emitting diode tester
KR20080103892A (en) * 2007-05-25 2008-11-28 에이에스엠 어쌤블리 오토메이션 리미티드 System for testing and sorting electronic components
KR20100045230A (en) * 2008-10-23 2010-05-03 미래산업 주식회사 Luminous element test handler
KR100979763B1 (en) * 2010-03-25 2010-09-02 (주)큐엠씨 Apparatus for sorting target object

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130118709A (en) * 2012-04-20 2013-10-30 (주)큐엠씨 Apparatus for sorting electronic element

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