KR101051284B1 - Chemical Vapor Deposition Equipment for Thin Film Solar Cell Manufacturing - Google Patents

Abstract

A chemical vapor deposition apparatus for manufacturing thin film solar cells is disclosed. The chemical vapor deposition apparatus for manufacturing a thin film solar cell of the present invention includes: a transfer module chamber having a substrate handling robot configured to handle a substrate for manufacturing a thin film solar cell; At least one loadlock chamber connected to one side of the transfer module chamber and into and out of the substrate; And at least one process module chamber connected to the other side of the transfer module chamber to perform a substantial deposition process on the substrate, wherein the process module chamber comprises: a plurality of reaction chambers; A plurality of reaction chamber fixing plates each coupled to the plurality of reaction chambers and having different transverse lengths; And a plurality of fixing plate supports which protrude from both sidewalls of the process module chamber and are spaced apart from each other in a vertical direction by a pair so that both ends of the reaction chamber fixing plate are seated, respectively. According to the present invention, a plurality of reaction chambers can be easily introduced into or taken out of the process module chamber, thereby simplifying the maintenance of the reaction chamber and reducing the additional space for maintenance. The footprint of the vapor deposition apparatus can be relatively reduced as compared with the prior art.

 Solar cell, chemical vapor deposition apparatus, process module chamber, reaction chamber

Description

Chemical vapor deposition apparatus for manufacturing thin-film solar cells

The present invention relates to a chemical vapor deposition apparatus for manufacturing a thin film solar cell, and more particularly, a plurality of reaction chambers can be easily introduced into or taken out of the process module chamber to simplify the maintenance of the reaction chamber, maintenance The present invention relates to a chemical vapor deposition apparatus for manufacturing a thin film solar cell, which can relatively reduce a footprint of the chemical vapor deposition apparatus for manufacturing a thin film solar cell, by reducing an additional space for maintenance.

Solar cells are devices that convert light energy into electrical energy using the properties of semiconductors. Such solar cells are classified into monocrystalline silicon solar cells, polycrystalline silicon solar cells, thin-film solar cells, and the like according to their types.

The thin film solar cell is manufactured in the form of a thin film, and its efficiency is lower than that of a single crystal silicon solar cell. In addition, depending on the type of substrate to be deposited may be transported or stored in a roll like a floor.

Such thin film solar cells are manufactured into products through a number of processes similar to semiconductor processes.

Among many processes, there is a deposition process for depositing a thin film deposition film on the surface of a substrate for manufacturing a thin film solar cell. This deposition process is mainly performed through a chemical vapor deposition apparatus (PECVD) for manufacturing a thin film solar cell using plasma. For reference, the chemical vapor deposition apparatus for manufacturing a thin film solar cell has a configuration substantially similar to that of a conventional chemical vapor deposition apparatus (PECVD) for manufacturing a LCD substrate.

The conventional chemical vapor deposition apparatus for manufacturing a thin film solar cell includes a load lock chamber (LOADLOCK CHAMBER) through which a substrate for manufacturing a thin film solar cell is introduced and taken out, and a transfer module chamber connected to the load lock chamber and having a substrate handling robot therein (TRANSFER). MODULE CHAMBER) and a plurality of process module chambers (PROCESS MODULE CHAMBER) connected to the transfer module chamber to perform the actual deposition process.

Therefore, when the substrate for manufacturing the thin film solar cell is introduced into the load lock chamber, the substrate handling robot in the transfer module chamber transfers the substrate for manufacturing the thin film solar cell to the transfer module chamber, and then transfers the substrate to any one of the plurality of process module chambers. The deposition process for the thin film solar cell manufacturing substrate is performed in the process module chamber, and when the operation is completed, the thin film solar cell manufacturing substrate is taken out in the reverse order described above.

Meanwhile, the conventional chemical vapor deposition apparatus for manufacturing a thin film solar cell includes a plurality of reaction chambers provided to simultaneously perform a deposition process for a plurality of thin film solar cell manufacturing substrates. Since the plurality of reaction chambers are disposed in the plurality of process module chambers, deposition processes for a large amount of thin film solar cell manufacturing substrates are performed at one time.

However, the conventional chemical vapor deposition apparatus for manufacturing a thin film solar cell has a problem that maintenance of the reaction chamber is inconvenient because it does not have a structure that can be easily separated from the process module chamber during maintenance of a plurality of reaction chambers.

In addition, the conventional chemical vapor deposition apparatus for manufacturing a thin film solar cell requires a large area of additional space for maintenance of the reaction chamber, so that the construction area of the chemical vapor deposition apparatus for manufacturing a thin film solar cell is relatively large. have.

Thus, while maintaining a large number of reaction chambers, it is necessary to research and develop a chemical vapor deposition apparatus for manufacturing a thin film solar cell that can reduce the footprint of the chemical vapor deposition apparatus for manufacturing a thin film solar cell. .

SUMMARY OF THE INVENTION An object of the present invention is to manufacture a thin film solar cell by allowing a plurality of reaction chambers to be easily introduced into or taken out of a process module chamber, thereby simplifying maintenance of the reaction chamber and reducing additional space for maintenance. The present invention provides a chemical vapor deposition apparatus for manufacturing a thin film solar cell capable of relatively reducing a footprint of the chemical vapor deposition apparatus.

The object is, according to the present invention, the transfer module chamber (Transfer Module Chamber) provided with a substrate handling robot for handling the substrate for manufacturing a thin film solar cell; At least one loadlock chamber connected to one side of the transfer module chamber to allow the substrate to enter and exit the substrate; And at least one process module chamber connected to the other side of the transfer module chamber to perform a substantial deposition process on the substrate, wherein the process module chamber comprises: a plurality of reaction chambers; A plurality of reaction chamber fixing plates each coupled to the plurality of reaction chambers and having different transverse lengths; And a plurality of fixing plate supports which protrude from both sidewalls of the process module chamber and are spaced apart from each other in a vertical direction by a pair so that both ends of the reaction chamber fixing plate are seated, respectively. Is achieved.

The plurality of reaction chambers may include a first reaction chamber and a second reaction chamber, and the plurality of reaction chamber fixing plates may be disposed on an upper surface of the first reaction chamber fixing plate and the second reaction chamber coupled to an upper surface of the first reaction chamber. And a second reaction chamber fixing plate coupled to each other, wherein the plurality of fixing plate supporting parts include: a first fixing plate support portion on which both ends of the first reaction chamber fixing plate are seated; and a second fixing plate support portion on which both ends of the second reaction chamber fixing plate are respectively seated. Including, but the distance between the pair of first fixing plate support may be greater than the distance between the pair of second fixing plate support.

The horizontal length of the second reaction chamber fixing plate may be smaller than the distance between the pair of first fixing plate supports.

The reaction chamber fixing plate may include a seating protrusion protruding from both ends in a horizontal direction, and a stepped portion corresponding to the shape of the seating protrusion may be formed on the fixing plate support.

The reaction chamber fixing plate further includes a coupling protrusion protruding from the lower surface of the seating protrusion, and the stepped groove may be provided with a coupling groove into which the coupling protrusion is inserted.

The chemical vapor deposition apparatus for manufacturing the thin film solar cell may further include a chamber lid covering the upper side of the process module chamber such that the plurality of reaction chambers respectively enter or exit through the upper side of the process module chamber. have.

The object is, according to the present invention, the transfer module chamber (Transfer Module Chamber) provided with a substrate handling robot for handling the substrate for manufacturing a thin film solar cell; At least one loadlock chamber connected to one side of the transfer module chamber to allow the substrate to enter and exit the substrate; And at least one process module chamber connected to the other side of the transfer module chamber to perform a substantial deposition process on the substrate, wherein the process module chamber comprises: a plurality of reaction chambers; And a plurality of sliding units provided between both sidewalls of the process module chamber and both ends of the reaction chamber so that the reaction chamber can be introduced into or withdrawn from the front or rear of the process module chamber. It is also achieved by a chemical vapor deposition apparatus for producing solar cells.

Each of the plurality of sliding units may include fixing parts coupled to both sidewalls of the at least one process module chamber; A guide rail part provided to be movable relative to the fixing part so that the reaction chamber can move forward or backward of the process module chamber; And a connection part provided to be movable relative to the guide rail part and interconnecting the reaction chamber and the guide rail part.

The fixing unit may include a fixing plate coupled to both side walls of the process module chamber; And it may include a first fixing block coupled to the fixing plate.

The connection part may include support plates provided at both ends of the reaction chamber to support the reaction chamber; And it may include a second fixing block coupled to the support plate.

The guide rail unit may include a first guide rail member provided to be movable relative to the first fixed block; A second guide rail member provided to be movable relative to the second fixed block; And a third guide rail member connecting the first guide rail member and the second guide rail member, wherein the first guide rail member, the second guide rail member, and the third guide rail member are integrally provided. Can be.

The first guide rail member and the second guide rail member may be coupled to the third guide rail member with a step in the vertical direction.

A plurality of first fixing blocks are provided on each of the upper side and the lower side of the fixing plate, and the first guide rail member is a first guide rail member dually provided to be coupled to the first fixing block, respectively. A plurality of fixing blocks may be provided on each of the upper side and the lower side of the support plate, and the second guide rail member may be a second guide rail member provided in double so as to be coupled to the second fixing block, respectively.

The support plate may be provided as a bracket having a 'b' shape to support a portion of the lower side of the reaction chamber.

The chemical vapor deposition apparatus for manufacturing a thin film solar cell may further include a reaction chamber fixing unit coupled to each of the fixing unit and the guide rail unit and the guide rail unit and the connecting unit to fix the position of the reaction chamber. have.

According to the present invention, a plurality of reaction chambers may be easily introduced into the process module chamber, including a reaction chamber fixing plate coupled to each of the plurality of reaction chambers, and a plurality of fixing plate supports coupled to both ends of the reaction chamber fixing plate, respectively. By taking it out, the maintenance of the reaction chamber is simplified, and the additional space for maintenance can be reduced, so that the footprint of the chemical vapor deposition apparatus for manufacturing a thin film solar cell can be relatively reduced. .

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, in describing the present invention, descriptions of already known functions or configurations will be omitted to clarify the gist of the present invention.

1 is a schematic configuration diagram of a chemical vapor deposition apparatus for manufacturing a thin film solar cell according to a first embodiment of the present invention, Figure 2 is a schematic configuration diagram of a process module chamber of the chemical vapor deposition apparatus for manufacturing a thin film solar cell of Figure 1 3 is a schematic diagram of the process module chamber of FIG. 2 in which a plurality of reaction chambers are coupled, and FIG. 4 is a schematic diagram illustrating a principle of taking out a plurality of reaction chambers from the process module chamber of FIG. 3, respectively.

Referring to these drawings, a chemical vapor deposition apparatus for manufacturing a thin film solar cell according to the first embodiment of the present invention (hereinafter, referred to as a 'chemical vapor deposition apparatus'), a substrate into which a deposition process target is introduced or a substrate on which deposition is completed is taken out The load lock chamber 110 is connected to the load lock chamber 110 and is connected to the transfer module chamber 170 having the substrate handling robot 180 therein and the transfer module chamber 170 to perform a substantial deposition process. A plurality of process module chamber 120 is provided.

In the chemical vapor deposition apparatus 100 according to the present exemplary embodiment, the transfer module chamber 170 has an octagonal structure when the plane is projected, and on each of the eight sides, the load lock chamber 110 and the six process module chambers 120 are provided. Are arranged concentrically and have a structure connected to the transfer module chamber 170.

However, the scope of the present invention need not be limited thereto. That is, if the load lock chamber 110 and the process module chamber 120 has a structure that is connected to the transfer module chamber 170, it is sufficient, so that the transfer module chamber 170 leaves the octagonal structure, It may have a structure.

However, hereinafter, the load lock chamber 110 and the six process module chambers 120 will be described in detail with reference to FIG. 1.

The load lock chamber 110 is divided into an incoming load lock chamber 110a through which a substrate to be deposited is introduced and a takeout load lock chamber 110b through which a substrate on which deposition is completed is taken out.

In this embodiment, the inlet load lock chamber 110a and the takeout load lock chamber 110b are connected to the transfer module chamber 170 so as to be adjacent to each other. This is one way to reduce the tact time by reducing the operating distance of the substrate handling robot 180 as much as possible, but the present invention is not limited thereto.

It is described with respect to the incoming load lock chamber 110a and the extraction load lock chamber 110b. In order to proceed with the deposition process of the substrate through the process module chamber 120, the substrate handling robot 180 transfers the substrate to be deposited into the corresponding process module chamber 120, wherein the substrate under atmospheric pressure is directly heated to a high temperature. Since the process of entering the low pressure process module chamber 120 is difficult, it is necessary to create the same environment as the process module chamber 120 before transferring the substrate to the process module chamber 120. For this purpose, the incoming load lock chamber 110a is provided.

In other words, when the substrate to be deposited is introduced from the outside by a robot (not shown) outside the apparatus, the incoming load lock chamber 110a creates an internal environment at a temperature and pressure substantially the same as that of the process module chamber 120. It plays a role. In this way, the substrate in the inlet load lock chamber 110a having the substantially same environment as the process module chamber 120 is handled by the substrate handling robot 180 provided in the transfer module chamber 170 and the corresponding process module chamber. After being transferred to 120, the deposition process is performed there.

On the contrary, the substrate in which the deposition process is completed in the process module chamber 120 should be handled by the substrate handling robot 180 and taken out of the device, while maintaining the temperature and pressure substantially the same as the outside. Since the substrate has to be taken out, the takeout load lock chamber 110b is provided.

As a result, the incoming load lock chamber 110a and the extraction load lock chamber 110b form an access passage to the substrate, but the state of the substrate is based on the internal and external environmental conditions of the chemical vapor deposition apparatus for manufacturing a thin film solar cell. Is arranged to coordinate.

However, since the scope of the present invention is not limited thereto, the inlet load lock chamber 110a and the takeout load lock chamber 110b are not necessarily provided separately. In other words, only one load lock chamber (not shown) may be provided, and the substrate may be allowed to enter and exit all through the load lock chamber.

However, when the inlet load lock chamber 110a and the takeout load lock chamber 110b are separately provided as in the present embodiment, loading or waiting time may be reduced according to the entrance and exit of the substrate, thereby reducing tact time. It can be expected to be effective, and therefore must help to increase productivity.

The transfer module chamber 170 is a chamber connecting six process module chambers 120 and two load lock chambers 110a and 110b. The transfer module chamber 170 has an octagonal structure in planar projection as shown.

As described above, a substrate handling robot (eg, five substrates) is simultaneously handled by six process module chambers 120 and two load lock chambers 110a and 110b inside the transfer module chamber 170. 180 is provided, and the transfer module chamber 170 is required to transfer a so-called fifth generation substrate having a width / vertical width of about 1.5 meters by the substrate handling robot 180 within the transfer module chamber 170. ) Is provided with a huge structure.

On the other hand, the six process module chamber 120 is a portion for performing a substantial deposition process on the substrate in an environment of high temperature and low pressure.

Each of the six process module chambers 120 includes a plurality of reaction chambers 131 to 135 provided therein so that deposition processes for a plurality of substrates may be simultaneously performed. Of course, the number of reaction chambers 131 to 135 may be adjusted as necessary, and the scope of the present invention is not limited by the number of reaction chambers 131 to 135.

Hereinafter, the present embodiment will be described with reference to two reaction chambers 131 and 132 provided inside the process module chamber 120 for convenience of description.

As shown in FIG. 3, the process module chamber 120 of the present embodiment may include reaction chambers 131 and 132 and reaction chamber fixing plates 141 and 142 coupled to upper surfaces of the reaction chambers 131 and 132, respectively. , And fixing plate supporting parts 151 and 152 on which the reaction chamber fixing plates 141 and 142 are seated.

The reaction chambers 131 and 132 include a first reaction chamber 131 and a second reaction chamber 132 as a portion where a substantial deposition process is performed on the substrate. The first reaction chamber 131 and the second reaction chamber 132 are respectively provided on a susceptor (not shown) on which the substrate is loaded and on the susceptor (not shown) so that a deposition film may be deposited on the surface of the substrate. An electrode (not shown) for releasing reactive gas ions for film deposition onto the surface of the substrate loaded on the susceptor (not shown), and a lift pin for loading and unloading the substrate onto the susceptor (not shown) A lift pin, a suspension supporting means (not shown) for supporting the electrode (not shown), and a sag prevention means (not shown) for preventing the electrode (not shown) from being sag, and the reaction chamber ( Slots 131s and 132s are formed on front surfaces of the 131 and 132 to draw in and out of the substrate.

The reaction chamber fixing plates 141 and 142 are coupled to the upper surfaces of the reaction chambers 131 and 132, respectively, and are mounted on the fixing plate supporting parts 151 and 152 provided inside the process module chamber 120. And a fixing plate 141 and a second reaction chamber fixing plate 142.

In the first reaction chamber fixing plate 141 and the second reaction chamber fixing plate 142, seating protrusions 141a and 142a protruding in the longitudinal direction from both ends are formed, and the seating protrusions 141a and 142a are the reaction chamber fixing plate 141. And 142 protrude in the longitudinal direction from both upper ends of the upper portion 142 to be seated on the stepped portions 151a and 152a formed on the fixing plate support portions 151 and 152. However, according to another embodiment of the present invention, the mounting protrusions 141a and 142a may be provided in a shape different from that shown in FIG. 3, and thus, the shapes of the stepped portions 151a and 152a may also be changed. The right range is not limited by the shapes of the seating protrusions 141a and 142a and the stepped portions 151a and 152a.

Although not shown, coupling protrusions (not shown) protruding from the surface of the seating protrusions 141a and 142a are respectively provided, and coupling protrusions (not shown) are coupling grooves formed on the upper surfaces of the stepped portions 151a and 152a. By being inserted into and fixed to (not shown), the reaction chambers 131 and 132 can be stably fixed inside the process module chamber 120.

Meanwhile, the fixing plate supporting parts 151 and 152 protrude from both sidewalls of the process module chamber 120, respectively, where the reaction chamber fixing plates 141 and 142 are seated. The first fixing plate supporting part 151 and the second fixing plate supporting part 152 are respectively provided. ).

As shown in FIGS. 3 and 4, the fixed plate supports 151 and 152 protrude in pairs from both side walls of the process module chamber 120 and along the height direction (Y direction) of the process module chamber 120. It is provided at regular intervals from each other.

As described above, the stepped plates 151a and 152a are formed on the fixed plate supporting parts 151 and 152 so that the mounting protrusions 141a and 142a of the reaction chamber fixing plates 141 and 142 are seated, and the stepped bars 151a and 152a. Is formed so that the lower portion of the fixing plate support (151, 152) protrudes. That is, the step 151a, 152a has a shape corresponding to the shape of the seating protrusions 141a, 142a so that the reaction chambers 131, 132 can be stably disposed in the process module chamber 120.

Meanwhile, the protruding length of the first fixing plate support 151 protruding from both side walls of the process module chamber 120 is smaller than the protruding length of the second fixing plate support 152 protruding from both side walls of the process module chamber 120. It is prepared to. That is, as shown in FIG. 4, the distance L1 between the pair of first fixing plate supports 151 is smaller than the distance L2 between the pair of second fixing plate supports 152.

In addition, the horizontal lengths (L4, X-direction length) of the second reaction chamber fixing plate 142 are smaller than the horizontal lengths (L3, X-direction length) of the first reaction chamber fixing plate 141, and the pair of first It is provided to be smaller than the distance (L1) between the fixing plate support portion 151.

As such, the distances L1 and L2 between the fixing plate supporting parts 151 and 152 are different from each other and the horizontal lengths L3 and L4 of the reaction chamber fixing plates 141 and 142 are different from each other. This is for convenience of taking out and drawing out when the reaction chambers 131 and 132 are withdrawn from the reaction chamber or when the reaction chambers 131 and 132 are led into the process module chamber 120.

The reaction chambers 131 and 132 separate the chamber lid 161 (see FIG. 3) covering the upper side of the process module chamber 120 and then into the process module chamber 120 through the upper side of the process module chamber 120. It is withdrawn or withdrawn.

When the reaction chambers 131 and 132 are introduced into the process module chamber 120, the second reaction chamber 132 is first introduced into the process module chamber 120. Since the length L4 of the second reaction chamber fixing plate 142 coupled to the upper surface is smaller than the distance L1 between the first fixing plate supporters 151 provided as a pair, the second reaction chamber 132 may have a first length. It is possible to be seated on the second fixing plate support 152 without being caught by the fixing plate support 151.

Similarly, when the reaction chambers 131 and 132 are withdrawn from the process module chamber 120, the first reaction chamber 131 is first taken out of the process module chamber 120 and then the second reaction chamber 132 is removed. In this case, the horizontal length L4 of the second reaction chamber fixing plate 142 coupled to the upper surface of the second reaction chamber 132 is a distance between the first fixing plate support part 151 provided as a pair (L1). Less than), the second reaction chamber 132 is withdrawn from the process module chamber 120 without being caught by the first fixing plate support 151.

Reaction chamber fixing plates (not shown) provided in the reaction chambers 133, 134, 135, which are not described in the present embodiment, and fixing plate supporting parts (not shown) on which the reaction chambers 133, 134, 135 are respectively seated. Matters are the same as described above. That is, the horizontal lengths of the reaction chamber fixing plates (not shown) respectively provided on the upper surfaces of the reaction chambers 133, 134, 135 become longer from the lower side to the upper side, and the fixing plates on which the reaction chambers 133, 134, 135 are respectively seated. The distance between the supports (not shown) becomes longer from the lower side to the upper side of the process module chamber 120. Duplicate description thereof will be omitted.

As such, the chemical vapor deposition apparatus 100 of the present embodiment covers an upper side of the process module chamber 120 when the reaction chambers 131 and 132 are withdrawn or drawn from the process module chamber 120 for maintenance or other reasons. Since the chamber lead 161 is separated and the reaction chambers 131 and 132 are moved through the upper side of the process module chamber 120, the maintenance of the chemical vapor deposition apparatus 100 may be simplified.

In addition, the chemical vapor deposition apparatus 100 of the present embodiment, by allowing the plurality of reaction chambers (131, 132) to be introduced or taken out above the process module chamber 120, to reduce the additional space for maintenance Accordingly, the footprint of the chemical vapor deposition apparatus 100 may be relatively reduced as compared with the related art.

5 is a perspective view of a chemical vapor deposition apparatus according to a second embodiment of the present invention, FIG. 6 is a front view of FIG. 5, and FIG. 7 is a state in which a reaction chamber is fixed in a process module chamber of the chemical vapor deposition apparatus of FIG. 5. 8 is a schematic plan view illustrating a state where a reaction chamber is taken out from a process module chamber of the chemical vapor deposition apparatus of FIG. 5.

Referring to these drawings, a chemical vapor deposition apparatus for manufacturing a thin film solar cell according to a second embodiment of the present invention (not illustrated, hereinafter referred to as a chemical vapor deposition apparatus), a substrate to which a deposition process target is introduced or a deposition is completed is taken out. A load lock chamber (not shown), a transfer module chamber (not shown) connected to the load lock chamber (not shown) and having a substrate handling robot (not shown), and a transfer module chamber (not shown) And a plurality of process module chambers 220 which undergo a substantial deposition process.

Regarding the load lock chamber (not shown), the substrate handling robot (not shown) and the transfer module chamber (not shown), the load lock chamber 110, the substrate handling robot 180 and the transfer module chamber 170 of the above-described embodiment are described. ) Are the same as the above, so duplicate explanations are omitted.

The process module chamber 220 is a part for performing a substantial deposition process on a substrate in an environment of high temperature and low pressure. The process module chamber 220 of the present embodiment is provided in six as in the above-described embodiment, and includes a plurality of reaction chambers 231 and 232 provided therein so that the deposition process for a plurality of substrates can be performed at the same time. For convenience of description, the remaining four reaction chambers (not shown) and the chamber lids (not shown) covering the upper side of the process module chamber 220 are omitted. Hereinafter, two reaction chambers 231 and 232 are omitted. This embodiment is demonstrated as a reference.

As shown in FIG. 5, the process module chamber 220 of the present embodiment includes reaction chambers 231 and 232 and sliding units 241 and 242 provided on both sidewalls of the process module chamber 220. .

The reaction chambers 231 and 232 are portions in which a substantial deposition process is performed on the substrate, and a susceptor (not shown) to which the substrate is loaded and a susceptor (not shown) to deposit a deposition film on the surface of the substrate, respectively. An electrode (not shown) provided at the top to release reactive gas ions for film deposition onto the surface of the substrate loaded on the susceptor (not shown), and for loading and unloading the substrate onto the susceptor (not shown) Lift pins (not shown), suspension support means (not shown) for supporting electrodes (not shown), and sag prevention means (not shown) for preventing sagging of electrodes (not shown). In addition, slots 231s and 232s are formed on front surfaces of the reaction chambers 131 and 132 for drawing out substrates.

Sliding units 241 and 242 are provided in pairs on both sidewalls of the process module chamber 120 and are connected to both ends of the reaction chambers 231 and 232 to the outside of the process module chamber 220. When taking out 232 or drawing reaction chambers 231 and 232 into the process module chamber 220, the reaction chambers 231 and 232 provide a movement path through which the reaction chambers 231 and 232 move.

The sliding units 241 and 242 may include fixing parts 251 and 252 coupled to both sidewalls of the process module chamber 220, and guide rail parts coupled to the fixing parts 251 and 252 so as to be movable relative to each other. 261 and 262, and connection parts 271 and 272 interconnecting the reaction chambers 231 and 232 and the guide rails 261 and 262.

The fixing parts 251 and 252 are coupled to both sidewalls of the process module chamber 220 so that the guide rails 261 and 262 can move in a predetermined path. The fixing plates 251a and 252a and the fixing plate It includes a plurality of first fixed blocks (251b, 252b) integrally coupled to (251a, 252a).

The fixing plates 251a and 252a are plate-shaped metallic members coupled to both sidewalls of the process module chamber 220. The first fixing blocks 251b and 252b include guide rails 261 and 262 having the process module chamber 220. ) Is a member provided to be able to move forward or backward.

As shown in FIGS. 5 to 8, the plurality of first fixing blocks 251b and 252b are doubled above and below the fixing plates 251a and 252a and mutually along the longitudinal direction of the fixing plates 251a and 252a. A plurality of intermittent spaces are provided at regular intervals. Correspondingly, the first guide rail members 261a and 262a coupled to the first fixing blocks 251b and 252b so as to be movable relative to each other are provided on the upper side and the lower side of the third guide rail members 261c and 262c.

As such, the first fixing blocks 251b and 252b and the first guide rail members 261a and 262a are provided in a dual structure, thereby stably arranging the reaction chambers 231 and 232 in the process module chamber 220. The sliding units 241 and 242 can be prevented from being bent or damaged even when the reaction chambers 231 and 232 are repeatedly drawn in and taken out.

Meanwhile, the connection parts 271 and 272 are configured to interconnect the reaction chambers 231 and 232 and the guide rail parts 261 and 262.

As shown in FIG. 4, the connection parts 271 and 272 are provided with support plates 271a and 272a provided at both ends of the reaction chambers 231 and 232 to support the reaction chambers 231 and 232, and the support plates 271a and 272a. It includes a plurality of second fixing blocks (271b, 272b) coupled to.

The support plates 271a and 272a are provided with 'b' shaped brackets, one side of which supports the lower side of the reaction chambers 231 and 232, and the other side of which is in contact with the side surfaces of the reaction chambers 231 and 232. Although not shown, the reaction chambers 231 and 232 and the support plates 271a and 272a may be fixed by a mutual bolting method.

The second fixing blocks 271b and 272b are members provided to allow the support plates 271a and 272a to move forward or rearward of the guide rails 261 and 262.

As shown in FIGS. 5 to 7, the plurality of second fixing blocks 271b and 272b are doubled above and below the support plates 271a and 272a and mutually along the longitudinal direction of the support plates 271a and 272a. A plurality of intermittent spaces are provided at regular intervals. Correspondingly, the second guide rail members 261b and 262b coupled to the second fixing blocks 271b and 272b are provided on the upper side and the lower side of the third guide rail members 261c and 262c.

As such, the second fixing blocks 271b and 272b and the second guide rail members 261b and 262b are provided in a dual structure, thereby stably arranging the reaction chambers 231 and 232 in the process module chamber 220. The sliding units 241 and 242 can be prevented from being bent or damaged even when the reaction chambers 231 and 232 are repeatedly drawn in and taken out.

The guide rails 261 and 262 are coupled to be movable relative to the first fixing blocks 251b and 252b, and to allow relative movement of the connecting parts 271 and 272 to the guide rails 261 and 262. It is a structure provided. The guide rails 261 and 262 allow the relative movement of the first guide rail members 261a and 262a and the connection parts 271 and 272 to be relatively movable with respect to the first fixing blocks 251b and 252b. A second guide rail member 261b and 262b coupled to the second fixing blocks 271b and 272b, and the first guide rail members 261a and 262a and the second guide rail members 261b and 262b. And three guide rail members 261c and 262c.

As described above, the first guide rail members 261a and 262a are dually provided on the upper and lower sides of the third guide rail members 261c and 262c to correspond to the first fixing blocks 251b and 252b. 2 The guide rail members 261b and 262b are provided on the upper side and the lower side of the third guide rail members 261c and 262c in correspondence with the second fixing blocks 271b and 272b.

In addition, the first guide rail members 261a and 262a and the second guide rail members 261b and 262b are coupled to the third guide rail members 261c and 262c with a step difference therebetween. The first guide rail members 261a and 262a and the second guide rail members 261b and 262b respectively pass through the plurality of first fixing blocks 251b and 252b and the plurality of second fixing blocks 271b and 272b. It is movably coupled so that the guide rail portions 261, 262 can move forward or backward of the process module chamber 220 with respect to the fixing portions 251, 252, and the connections 271, 272 are guide rails. With respect to portions 261 and 262, it may be possible to move forward or backward of the process module chamber 220.

Meanwhile, the chemical vapor deposition apparatus 200 according to the present embodiment is coupled to each of the fixing parts 251 and 252 and the guide rail parts 261 and 262, and the guide rail parts 261 and 262 and the connection parts 271 and 272, respectively. The reaction chamber fixing portion 280 is further included.

The reaction chamber fixing part 280 is coupled between the fixing plates 251a and 252a and the third guide rail members 261c and 262c and between the support plates 271a and 272a and the third guide rail members 261c and 262c, respectively. In order to fix the positions of the reaction chambers 231 and 232 in the process module chamber 220. The reaction chamber fixing part 280 of this embodiment includes a movement preventing plate 281 and a bolt 282 fastened through the movement preventing plate 281.

The bolt 282 penetrates the movement preventing plate 281, the fixing plates 251a and 252a, and the third guide rail members 261c and 262c, and also the movement preventing plate 281, the support plates 271a and 272a and the third plate. The positions of the reaction chambers 231 and 232 are fixed by interconnecting the members through the guide rail members 261c and 262c.

The chemical vapor deposition apparatus 200 according to the present exemplary embodiment has an advantage of allowing the reaction chambers 231 and 232 to be easily taken out or drawn into the front or rear of the process module chamber 220 by the sliding units 241 and 242. .

In addition, the chemical vapor deposition apparatus 200 according to the present embodiment can completely remove the reaction chambers 231 and 232 to the front of the process module chamber 220 by sliding units 241 and 242 having a double sliding structure. In addition, the convenience which can simplify maintenance of the chemical vapor deposition apparatus 200 is aimed at.

While specific embodiments of the invention have been described and illustrated above, it is to be understood that the invention is not limited to the described embodiments, and that various modifications and changes can be made without departing from the spirit and scope of the invention. It is self-evident to those who have. Therefore, such modifications or variations are not to be understood individually from the technical spirit or point of view of the present invention, the modified embodiments will belong to the claims of the present invention.

1 is a schematic configuration diagram of a chemical vapor deposition apparatus for manufacturing a thin film solar cell according to a first embodiment of the present invention.

FIG. 2 is a schematic configuration diagram of a process module chamber of the chemical vapor deposition apparatus for manufacturing the thin film solar cell of FIG. 1.

3 is a schematic diagram of the process module chamber of FIG. 2 incorporating multiple reaction chambers.

FIG. 4 is a schematic diagram illustrating a principle of extracting a plurality of reaction chambers from the process module chamber of FIG. 3, respectively.

5 is a perspective view of a chemical vapor deposition apparatus according to a second embodiment of the present invention.

6 is a front view of FIG. 5.

FIG. 7 is a schematic plan view illustrating a reaction chamber fixed in a process module chamber of the chemical vapor deposition apparatus of FIG. 5.

FIG. 8 is a schematic plan view illustrating a state in which a reaction chamber is taken out from a process module chamber of the chemical vapor deposition apparatus of FIG. 5.

* Description of the symbols for the main parts of the drawings *

100, 200: chemical vapor deposition apparatus 110: load lock chamber

120, 220: process module chamber 170: transfer module chamber

131, 231: first reaction chamber 132, 232: second reaction chamber

241, 242: sliding unit

Claims (15)

A transfer module chamber in which a substrate handling robot for handling a substrate for manufacturing a thin film solar cell is provided; At least one loadlock chamber connected to one side of the transfer module chamber to allow the substrate to enter and exit the substrate; And It is connected to the other side of the transfer module chamber includes at least one Process Module Chamber (Process Module Chamber) to perform a substantial deposition process for the substrate, The process module chamber, A plurality of reaction chambers; A plurality of reaction chamber fixing plates each coupled to the plurality of reaction chambers and having different transverse lengths; And And a plurality of fixing plate supports protruding from both sidewalls of the process module chamber and spaced apart from each other in a vertical direction by a pair so that both ends of the reaction chamber fixing plate are respectively seated. The method of claim 1, The plurality of reaction chambers include a first reaction chamber and a second reaction chamber, The plurality of reaction chamber fixing plates include a first reaction chamber fixing plate coupled to an upper surface of the first reaction chamber and a second reaction chamber fixing plate coupled to an upper surface of the second reaction chamber, The plurality of fixing plate supports may include a first fixing plate support on which both ends of the first reaction chamber fixing plate are seated, and a second fixing plate support on which both ends of the second reaction chamber fixing plate are respectively seated. And a distance between the pair of first fixed plate supports is greater than a distance between the pair of second fixed plate supports. The method of claim 2, And a horizontal length of the second reaction chamber fixing plate is smaller than a distance between the pair of first fixing plate supports. The method of claim 1, The reaction chamber fixing plate includes a seating protrusion protruding from both ends in the horizontal direction, Chemical vapor deposition apparatus for manufacturing a thin film solar cell, characterized in that the stepped portion corresponding to the shape of the mounting projection is formed on the fixing plate support. 5. The method of claim 4, The reaction chamber fixing plate further includes a coupling protrusion protruding from the lower surface of the seating protrusion, Chemical vapor deposition apparatus for manufacturing a thin film solar cell, characterized in that the stepped groove is formed with a coupling groove in which the coupling projection is inserted. The method of claim 1, And a chamber lid covering the upper side of the process module chamber such that the plurality of reaction chambers respectively enter or withdraw from the upper side of the process module chamber toward the process module chamber. . A transfer module chamber in which a substrate handling robot for handling a substrate for manufacturing a thin film solar cell is provided; At least one loadlock chamber connected to one side of the transfer module chamber to allow the substrate to enter and exit the substrate; And It is connected to the other side of the transfer module chamber includes at least one Process Module Chamber (Process Module Chamber) to perform a substantial deposition process for the substrate, The process module chamber, A plurality of reaction chambers; And And a plurality of sliding units provided between both sidewalls of the process module chamber and both ends of the reaction chamber so that the reaction chamber can be drawn in or out of the front or rear of the process module chamber. Chemical vapor deposition apparatus for battery manufacturing. The method of claim 7, wherein Each of the plurality of sliding units, Fixing portions coupled to both sidewalls of the at least one process module chamber; A guide rail part provided to be movable relative to the fixing part so that the reaction chamber can move forward or backward of the process module chamber; And A chemical vapor deposition apparatus for manufacturing a thin film solar cell, wherein the guide rail portion is provided to be movable relative to each other and comprises a connection portion interconnecting the reaction chamber and the guide rail portion. The method of claim 8, The fixing part, Fixing plates coupled to both side walls of the process module chamber; And Chemical vapor deposition apparatus for manufacturing a thin film solar cell comprising a first fixed block coupled to the fixed plate. 10. The method of claim 9, The connecting portion, Support plates provided at both ends of the reaction chamber to support the reaction chamber; And Chemical vapor deposition apparatus for manufacturing a thin film solar cell comprising a second fixed block coupled to the support plate. The method of claim 10, The guide rail portion, A first guide rail member provided to be movable relative to the first fixed block; A second guide rail member provided to be movable relative to the second fixed block; And And a third guide rail member connecting the first guide rail member and the second guide rail member. And the first guide rail member, the second guide rail member and the third guide rail member are integrally provided. The method of claim 11, The first guide rail member and the second guide rail member is a chemical vapor deposition apparatus for manufacturing a thin film solar cell, characterized in that coupled to the third guide rail member with a step in the vertical direction. The method of claim 12, The first fixed block is, A plurality of upper and lower sides of the fixing plate is provided, respectively The first guide rail member is a first guide rail member provided in double to be coupled to each of the first fixed block, The second fixed block is, A plurality of upper and lower sides of the support plate is provided, respectively The second guide rail member is a chemical vapor deposition apparatus for manufacturing a thin film solar cell, characterized in that the second guide rail member provided in duplicate to be respectively coupled to the second fixed block. The method of claim 10, The support plate is provided with a bracket having a 'b' shape, the chemical vapor deposition apparatus for manufacturing a thin film solar cell, characterized in that for supporting a portion of the lower side of the reaction chamber. The method of claim 8, The chemical vapor deposition apparatus for manufacturing a thin film solar cell further comprising a reaction chamber fixing unit fixed to the fixing unit and the guide rail unit, the guide rail unit and the connecting unit, respectively, to fix the position of the reaction chamber. .

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