KR101051137B1 - Probe unit manufacturing method and probe unit manufacturing apparatus - Google Patents

Abstract

A method of manufacturing a probe unit comprising a plurality of plate-shaped probe blocks formed at predetermined intervals and bonded to each other and probes mounted on the slits, the method includes: mounting the probes on the slits of the probe blocks; Bonding the plate surfaces of the probe blocks to face the plate surfaces of other probe blocks, and aligning transparent substrates with alignment marks having a pattern set on the tip of the probe with respect to the mutually bonded probe blocks. Positioning the tips of the probes to align each of the tips of the probes to respective corresponding alignment marks, and fixing the interbonded probe blocks and the other probe blocks to each other.

Probe Blocks, Probes, Align

Description

Probe unit manufacturing method and probe unit manufacturing apparatus {METHOD FOR MANUFACTURING PROBE UNIT AND APPARATUS FOR MANUFACTURING PROBE UNIT}

The present invention relates to a method for manufacturing a probe unit, and more particularly, to a method and apparatus for manufacturing a probe unit including a probe and a probe block to which the probe is mounted.

In general, semiconductor devices have a fabrication process of forming contact pads for circuit patterns and inspections on a wafer, and an assembly process of assembling wafers having circuit patterns and contact pads into respective semiconductor chips. It is manufactured through.

Between the fabrication process and the assembly process, an inspection process is performed in which an electrical signal is applied to the contact pads formed on the wafer to inspect the electrical properties of the wafer.

This inspection process is performed to inspect a defect of a wafer and to remove a portion of a wafer in which a defect occurs during an assembly process.

In the inspection process, inspection equipment called a tester for applying an electrical signal to a wafer and probe equipment for performing an interface function between the wafer and the tester are mainly used. Among them, the probe card includes a printed circuit board that receives an electrical signal applied from a tester and a plurality of probes in contact with contact pads formed on the wafer.

In recent years, as the demand for high integrated semiconductor chips increases, the circuit patterns formed on the wafer by the fabrication process become high integrated, whereby the spacing between neighboring contact pads, i.e., the pitch, is formed very narrowly. It is becoming.

To inspect this fine pitch contact pad, the probe of the probe card is also finely formed. As described above, since the probe is finely formed, a plurality of slits are formed for aligning and mounting the probes, and the plate-shaped probe blocks are bonded to each other, and the plurality of probes are mounted and aligned to the slits of the probe block. At the same time, a probe unit in which a plurality of probe blocks are bonded to each other is used in the manufacture of a probe card.

However, in order to manufacture a probe unit used for a probe card for inspecting a fine pitch contact pad, when a plurality of probes are mounted on the probe block, the probes may have a predetermined alignment, but the difference in the fine thickness of each probe itself and Due to the difference in the fine width of each slit formed in the probe block, there is a problem that the actual alignment position of the tip portion of the probe in contact with the contact pad of the inspected object is different from the formation position of the contact pad of the inspected object.

In addition, when the plurality of probe blocks are bonded to each other for the manufacture of the probe unit, it is difficult to align the probe blocks to be bonded to each other, and when the alignment of the mutually bonded probe blocks is slightly misaligned, the entire probes constituting the probe unit There was a problem that the actual alignment position of the tip portion of is different from the formation position of the contact pad of the object under test.

That is, in the design, when the probe unit is manufactured, by attaching the probe to the probe block or by joining the plurality of probe blocks together, formation of a fine pitch contact pad in which the position of the tip portion of the probe constituting the probe unit is formed on the object under test is formed. Although it corresponds to the position, in manufacturing, if the manufacturing environment for manufacturing the probe unit is slightly different from the design, a problem arises in that the alignment position of the tip portion of the probe differs from the formation position of the contact pad of the actual test object.

One embodiment of the present invention is to solve the above-described problems, the probe unit manufacturing method and probe unit manufacturing method capable of manufacturing a probe unit that the alignment position of the tip portion of the probe corresponding to the formation position of the contact pad of the object under test It is an object to provide a device.

As a technical means for achieving the above-described technical problem, the first aspect of the present invention is a probe unit comprising a plurality of plate-shaped probe block and at least one slit is formed at a predetermined interval and bonded to each other and a probe mounted on each of the slits (A) mounting the probe in the slit of the probe block, (b) joining each other with the plate surface of the probe block facing the plate surface of another probe block, (c) mutually Aligning the transparent substrate on which the alignment mark with a pattern set on the tip of the probe is marked with respect to the bonded probe blocks, (d) adjusting the tip of the probe to correspond to each of the tips of the probe Aligning each of the alignment marks and (e) the probe block and the other probe block that are bonded to each other. To provide a method of manufacturing a cross-setting step the probe unit including a.

At least one of the steps (a) to (d) may be repeatedly performed.

The step (a) may include (a-1) positioning the probes in the slits, and (a-2) fixing the probes to the slits with an adhesive.

In the step (b), (b-1) arranging the probe blocks on a stage such that the plate surface of the probe block faces the plate surface of the other probe block and (b-2) the plate of the probe block. And positioning the plate surface and the plate surface of the other probe block to be aligned and bonded to each other.

In the step (b-1), both side end portions of each of the probe block and the other probe block are respectively supported on the engaging portions formed to protrude from the stage at positions corresponding to the both side end portions and disposed on the stage. Can be.

In the step (b-1), both side end portions of the probe block may be disposed on the stage supported by the engaging portion formed to protrude from the stage at a position corresponding to both side end portions.

The plate surface of the probe block and the plate surface of the other probe block may be disposed on the stage while being sucked by the stage.

The step (b-2) may include moving the probe block in at least one of a first direction on the stage, a second direction perpendicular to the first direction, and a third direction rotating on the stage, and the other The method may include moving the probe block in a fourth direction perpendicular to the first and second directions.

The step (e) may be performed by fixing the probe block and the other probe block bonded to each other with an adhesive.

After the step (e), (e) inverting the interlocked probe blocks, (f) the inverted interlocked probe blocks having a pattern set on a connection portion opposite to the tip of the probe. The method may further include arranging the connection part transparent substrate on which the mark is marked, and (g) adjusting the connection part of the probe to align each connection part of the probe with each corresponding connection part alignment mark.

In addition, the second aspect of the present invention is a device for producing a probe unit comprising a plurality of plate-shaped probe blocks are formed at one or more slits at a predetermined interval and bonded to each other and the probes mounted on the slits, the probe block And a stage including a first fixing portion to which the plate surface of the plate is fixed and a second fixing portion to which the plate surface of the probe block is different from the probe block, and a transparent substrate marked with an alignment mark having a set pattern. And a substrate aligning portion for moving the transparent substrate so that the alignment marks corresponding to each of the tip portions of the probe are aligned on the tip portion of the probe with respect to the probe blocks. The fixing part is arranged so that the plate surface of the probe block and the plate surface of the other probe block face each other. Provided is a probe unit manufacturing apparatus, which is movable on the stage to be bonded to each other.

The first fixing part may include a first locking part protruding from the first fixing part so as to support both side ends of the probe block.

The second fixing part may include a second locking part protruding from the second fixing part so as to support both side ends of the other probe block.

Each of the first fixing part and the second fixing part may suck and fix each of the plate surface of the probe block and each of the plate surfaces of the other probe block.

The first fixing part is movable in at least one of a first direction, a second direction orthogonal to the first direction, and a third direction rotating on the stage, and the second fixing part is movable in the first direction and It may be movable in a fourth direction orthogonal to the second direction.

According to one embodiment of the above-described problem solving means of the present invention, by aligning the tip portion of the probe using a transparent substrate having an alignment mark having a set pattern, the alignment position of the tip portion of the probe is the contact pad of the test subject There is a technical effect that can produce a probe unit corresponding to the formation position of.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Throughout the specification, when a member "includes" a certain component, it means that it can further include other components, without excluding the other components unless otherwise stated.

Hereinafter, a probe unit manufactured by the present invention will be described with reference to FIGS. 1 to 5. The probe unit is included in a probe card for inspecting an object to be inspected, and the probe unit is directly connected to a printed circuit board included in the probe card or indirectly connected to other components such as a space converter. Can be.

The probe unit 100 manufactured by the present invention includes a probe 110 and a probe block 120.

1 is a perspective view showing a probe of a probe unit manufactured by the present invention.

As shown in FIG. 1, the probe 110 includes a body portion 111, a first support portion 112, a beam portion 113, a tip portion 114, a second support portion 115, and a connection portion 116. .

The body portion 111 has a rod shape and extends in one direction.

The first support part 112 extends from one portion of the body part 111 and is inserted into the first slit 121 formed in the probe block 120 to be described later.

The beam portion 113 is spaced apart from the first support portion 112 and extends from one end of the body portion 111.

The tip portion 114 is bent and extended from the end of the beam portion 113, and serves to contact the contact pad formed on the wafer during the inspection process.

The second support part 115 is bent and extended from the other part of the body part 111 to face the first support part 112 and is inserted into the second slit 122 formed in the probe block 120 to be described later.

The connecting portion 116 extends from the second support portion 115 in the opposite direction to the tip portion 114 and contacts the terminals of other components such as a substrate pad or a space transducer formed on the printed circuit board constituting the probe card. Play a role.

2 is a perspective view showing a probe block of a probe unit manufactured by the present invention.

As shown in FIG. 2, the probe block 120 is plate-shaped and includes a first slit 121, a second slit 122, a probe seat 123, and a junction 124.

The first slit 121 is formed below the probe block 120, and the first support part 112 of the probe 110 is inserted.

The second slit 122 is formed above the probe block 120, and the second support 115 of the probe 110 is inserted.

The probe seat 123 is positioned between the first slit 121 and the second slit 122 and is recessed from the plate surface of the probe block 120. The body portion 111 of the probe 110 is seated on the probe seat 123.

The junction 124 is positioned at both side ends of the probe block 120, and the surface of the junction 124 forms a step with the surface of the probe seat 123. That is, the junction part 124 forms a step with the probe seating part 123, and is joined to the junction part 124 of the neighboring probe block 120, and the neighboring probe seating parts 123 are spaced apart from each other. Forming and facing each other. The body portion 111 of the probe 110 is located in this space. The lower end of the junction 124 is positioned above the lower end of the probe seat 123 and forms a step with the lower end of the probe seat 123.

3 is an exploded perspective view of a probe unit manufactured by the present invention.

As shown in FIG. 3, the adjacent probe blocks 120 are bonded to each other with their plate surfaces facing each other, and a plurality of probes are mounted to each probe block 120 adjacent to each other.

4 is a cross-sectional view taken along line IV-IV of FIG. 3.

As shown in FIG. 4, the probe 110 is mounted to the probe block 120. More specifically, the body portion 111 of the probe 110 is seated on the probe seating portion 123 of the probe block 120, the first support 112 and the beam portion 113 of the probe 110 is a probe The tip portion 114 is inserted into the first slit 121 of the block 120 and is exposed to the outside of the first slit 121.

A portion of the second support 115 and the connector 116 of the probe 110 is inserted into the second slit 122 of the probe block 120, and the other portion of the connector 116 is of the probe block 120. The second slit 122 is exposed to the outside. At this time, the connection portions 116 of the probes 110 adjacent to each other are positioned to be offset from each other on the probe block 120.

5 is a bottom perspective view of a probe unit manufactured by the present invention.

As shown in FIG. 5, the tip portions 114 of each probe 110 exposed on the mutually bonded probe blocks 120 are alternately arranged. As such, the tip portions 114 of the probe blocks 120 that are joined to each other are alternately arranged so that the tip portions 114 of the neighboring probes 110 on the probe blocks 120 that are joined to each other are densified. Are arranged. That is, since the tip portions 114 of the neighboring probes 110 in contact with the contact pads of the test object are densely arranged, the probe unit 100 may easily correspond to the contact pads formed at a fine pitch on the test object. Can be.

Pitch here means the space | interval between adjacent contact pads.

Hereinafter, a probe unit manufacturing apparatus according to an embodiment of the present invention for manufacturing the probe unit described above with reference to FIGS. 6 to 8 will be described.

6 is a perspective view showing a probe unit manufacturing apparatus according to an embodiment of the present invention, Figure 7 is an enlarged perspective view of a portion of FIG.

6 and 7, the apparatus for manufacturing a probe unit according to the exemplary embodiment of the present invention includes a stage 500 and a substrate alignment unit 600.

The stage 500 includes a seating plate 510, a first fixing part 520, a first adjusting part 530, a second adjusting part 540, a third adjusting part 550, a second fixing part 560, and a fourth The adjusting unit 570 is included.

The seating plate 510 has a large area plate shape, and on the seating plate 510, a first fixing part 520, a first adjusting part 530, a second adjusting part 540, a third adjusting part 550, and a second The fixed part 560 and the 4th adjustment part 570 are located.

The first fixing part 520 fixes the plate surface of the probe block 120, and includes a first locking part 521 and a first suction part 522.

The first locking portion 521 protrudes from the first fixing portion 520 to correspond to the shape of the lower end portion of the bonding portion 124 that is both side ends of the probe block 120, and the bonding portion of the probe block 120. 124 to engage and serves to support the probe block 120.

The first adsorption part 522 is formed in a tubular shape at a position corresponding to the plate surface of the junction part 124 of the probe block 120. The first adsorption part 522 communicates with the vacuum valve V positioned at the rear side of the first fixing part 520 and probes with a vacuum pressure by suction force by a vacuum tube that can be mounted to the vacuum valve V. The probe block 120 is fixed to the first fixing part 520 by suctioning the junction 124 of the block 120.

The first adjusting part 530 is located below the first fixing part 520, and when the user operates the first adjusting part 530, the first adjusting part 520 is moved in the first direction (on the stage 500). X) makes it possible to move. The first adjusting part 530 may adjust the slide part which is slid guided by the slide guide to enable the first fixing part 520 to slide in the first direction X on the stage 500.

The second adjusting unit 540 is spaced apart from the first adjusting unit 530 in the first direction X to form a step with the first adjusting unit 530. When the user operates the second adjusting unit 540, the second adjusting unit 540 is provided. The first fixing part 520 is movable on the stage 500 in a second direction Y orthogonal to the first direction X. FIG. The second adjusting unit 540 may adjust the slide unit which is slid guided by the slide guide to enable the first fixing unit 520 to slide in the second direction Y on the stage 500.

The third adjusting unit 550 is spaced apart from the second adjusting unit 540 with the first adjusting unit 530 interposed therebetween so as to form a step with the first adjusting unit 530 and the second adjusting unit 540. When operating the adjusting unit 550, the first fixing unit 520 is movable in the third direction R rotating on the stage 500. The third adjusting unit 550 may adjust the rotating unit rotated by the rotating shaft to enable the first fixing unit 520 to be rotatable in the third direction R on the stage 500.

FIG. 8 is a perspective view of an opposite part of the portion shown in FIG. 7; FIG.

As shown in FIG. 8, the second fixing part 560 fixes the plate surface of the other probe block 120, and includes a second locking part 561 and a second suction part 562.

The second locking portion 561 is formed to protrude from the second fixing portion 560 corresponding to the shape of the lower end portion of the bonding portion 124 which is both side ends of the other probe block 120, the other probe block 120 The junction portion 124 of the to serve to support the other probe block 120.

The second suction part 562 is formed in a tubular shape at a position corresponding to the plate surface of the junction part 124 of the other probe block 120. The second adsorption part 562 communicates with the vacuum valve V positioned at the rear side of the second fixing part 560, and is different from the vacuum pressure due to the suction force by the vacuum tube that can be mounted to the vacuum valve V. The other probe block 120 is fixed to the second fixing part 560 by suctioning the junction 124 of the probe block 120.

The fourth adjusting part 570 is positioned below the second fixing part 560, and when the user manipulates the fourth adjusting part 570, the second fixing part 560 is moved on the stage 500 in the first direction ( X) and the fourth direction Z orthogonal to the second direction Y. That is, the fourth adjusting part 570 enables the second fixing part 560 to move in the vertical direction.

As described above, when the first adjusting part 530, the second adjusting part 540, the third adjusting part 550, and the fourth adjusting part 570 of the stage 500 are operated, the first fixing part 520 is operated as the first fixing part 520. The direction X, the second direction Y, and the third direction R may be moved or the second fixing part 560 may be moved in the fourth direction Z. FIG. That is, by adjusting the four axes can be made to face the plate surface of the probe block 120 fixed to the first fixing portion 520 and the plate surface of the other probe block 120 fixed to the second fixing portion 560 mutually. At the same time, the first fixing part 520 may be moved in the direction of the second fixing part 560 to bond the plate surface of the probe block 120 with the plate surface of the other probe block 120.

The substrate alignment unit 600 is equipped with a transparent substrate 610 on which an alignment mark 611 having a set pattern is displayed, and probes the transparent substrate 610 such that the transparent substrate 610 is aligned with the probe 110. The alignment marks 611 of the transparent substrate 610 correspond to each of the plurality of tips mounted on the probe blocks 120 bonded to each other by moving on the block 120. When the transparent substrate 610 is aligned on the probe block 120, the alignment mark 611 is positioned at a position corresponding to the position where each of the tip portions 114 of the plurality of probes 110 is positioned in the design. do. That is, the set pattern refers to a pattern corresponding to a position where each tip portion 114 of the plurality of probes 110 is positioned in the design.

As such, when the transparent substrate 610 is aligned on the probe block 120, the position of the alignment mark 611 of the set pattern formed on the transparent substrate 610 is the tip of the probe 110 in the initial design. Since it is the same as the position of 114, the alignment position of the tip part 114 of the manufacturing probe 110 which is the alignment position of each tip part 114 of the some probe 110 mounted in the probe block 120 is carried out. It may be determined whether is identical to the alignment mark 611 which is the alignment position of the tip portion 114 of the probe 110 in the initial design.

Hereinafter, a probe unit manufacturing method according to an embodiment of the present invention using a probe unit manufacturing apparatus according to an embodiment of the present invention described above with reference to FIGS. 9 to 13 will be described.

9 is a flowchart illustrating a method of manufacturing a probe unit according to an exemplary embodiment of the present invention, and FIGS. 10 to 13 are views illustrating a method of manufacturing a probe unit according to an exemplary embodiment of the present invention.

First, as shown in FIG. 9, the probe 110 is mounted on the probe block 120 (S100).

Specifically, the probe block 120 is made of an insulating material such as ceramic and the probe block 120 is made of a conductive material such as silver (Ag), aluminum (Al), titanium (Ti), and the like. Insert the probe 110 into the first slit 121 and the second slit 122, and then attach the adhesive to the first slit 121, the second slit 122, and the probe seat of the probe block 120. The probe 110 is fixed to the probe block 120 by interposing between at least one of the units 123 and the probe 110, thereby mounting the plurality of probes 110 to one probe block 120. As the adhesive, an epoxy resin having a low shrinkage in a high temperature environment may be used. The first slit 121 and the second slit 122 of the probe block 120 may be formed using a microelectromechanical systems (MEMS) manufacturing process such as a photolithography process or a partial cutting process using a mechanical tool. In addition, the probe 110 may also be formed using a MEMS manufacturing process.

Next, as shown in FIGS. 10 and 11, the probe block 120 and the other probe block 120 are bonded to each other (S200).

Specifically, first, the lower side of the junction portion 124 which is both side ends of the probe block 120 in which the plurality of probes 110 are mounted on the first locking portion 521 of the first fixing portion 520 of the stage 500. After supporting the probe block 120 with respect to the first fixing part 520 by engaging the end, the surface of the junction part 124 of the probe block 120 is vacuum-sucked through the first adsorption part 522 to detect the probe. The block 120 is fixed with respect to the first fixing part 520. The fixing of the probe block 120 to the first fixing part 520 may be performed by operating one or more of the first adjusting part 530, the second adjusting part 540, and the third adjusting part 550. 520 by moving in one or more of the first direction X, the second direction Y, and the third direction R, or by operating the fourth adjusting unit 570 to control the second fixing part ( 560 may be performed by moving in the fourth direction Z. FIG.

Next, the lower ends of the joints 124, which are both side ends of the other probe blocks 120 on which the plurality of probes 110 are mounted, are attached to the second locking portions 561 of the second fixing portion 560 of the stage 500. After supporting the other probe block 120 with respect to the second fixing part 560, the second surface of the joining portion 124 of the other probe block 120 through the second suction part 562 by vacuum suction The probe block 120 is fixed to the second fixing part 560. The fixing of the other probe block 120 to the second fixing part 560 as described above is performed by moving the second fixing part 560 in the fourth direction Z by manipulating the fourth adjusting part 570, Alternatively, one or more of the first adjusting unit 530, the second adjusting unit 540, and the third adjusting unit 550 may be operated to move the first fixing unit 520 in the first direction X, the second direction Y, and the first adjusting unit 520. This can be done by moving in one or more of the three directions (R).

By this process, the probe block 120 and the other probe block 120 are disposed on the stage 500.

Next, the first fixing part 520 is operated on the stage 500 by operating one or more of the first adjusting part 530, the second adjusting part 540, and the third adjusting part 550. The second fixing part by moving in the direction of at least one of the second direction Y orthogonal to the direction X and the third direction R rotating on the stage 500, or by operating the fourth adjusting part 570. By moving the 560 in the fourth direction Z orthogonal to the first direction X and the second direction Y, the first fixing part 520 and the second fixing part 560 are moved in the 4-axis direction. Adjust the plate surface of the probe block 120 fixed to the first fixing portion 520 to face the plate surface of another probe block 120 fixed to the second fixing portion 560 and the probe block 120. The other probe blocks 120 are bonded to each other.

By such a process, each plate surface of the probe block 120 and the other probe block 120 is aligned and bonded to each other by adjusting the position of one or more of the first fixing part 520 and the second fixing part 560.

By the above process, the probe block 120 and the other probe block 120 are bonded to each other.

Next, as shown in FIG. 12, the transparent substrate 610 on which the alignment mark 611 is displayed is aligned on the tip portion 114 of the probe 110 (S300).

Specifically, the probe block 120 and the other probe block 120 may move the transparent substrate 610 on which the alignment mark 611 having the pattern set by moving the substrate alignment unit 600 to the stage 500. The transparent substrate 610 is aligned on the tip portion 114 of the probe 110 by moving onto the tip portion 114 of the probe 110 which is bonded to each other. When the transparent substrate 610 is aligned on the tip portion 114 of the probe 110, an alignment mark 611 formed in a pattern set on the transparent substrate 610 may have a tip portion 114 of the plurality of probes 110 in the design. ) So that each is located at the position corresponding to the position.

Next, the tip portion 114 of the probe 110 is aligned with the alignment mark 611 (S400).

Specifically, after determining whether each of the plurality of tip portions 114 mounted on the probe block 120 and the other probe block 120 through the transparent substrate 610 coincides with the alignment mark 611, Of the tip portions 114, the tip portion 114, which does not coincide with the alignment mark 611, is adjusted by using an adjustment tool such as tweezers to be mounted on the probe block 120 and the other probe block 120. The entirety of 114 is correspondingly aligned with the alignment mark 611 of the transparent substrate 610 which is aligned on the tip portion 114.

That is, the position of the tip portion 114 of the probe 110 in the initial design is the position of the alignment mark 611 of the set pattern formed on the transparent substrate 610 aligned on the tip portion 114 of the probe 110. And the tip portion 114 of the probe 110 that does not coincide with the alignment mark 611 to match the tip portion 114 of the entire probe 110 in correspondence with the alignment mark 611. By doing so, the alignment positions of the tip portions 114 of the entire probes 110 included in the probe units 100 included in the plurality of probe blocks 120 are the same as the alignment positions in the initial design.

Next, as shown in FIG. 13, the mutually bonded probe blocks 120 and the other probe blocks 120 are fixed to each other (S500).

Specifically, the adhesive B is injected as a drop between each junction 124 of the probe block 120 and the other probe block 120 which are bonded to each other, and thus the adhesive B is interposed between neighboring junctions 124. Adjacent probe blocks 120 are fixed to each other. As the adhesive (B), an epoxy resin or the like having less shrinkage in a high temperature environment may be used, but the present invention is not limited thereto.

In another embodiment, the step S500 of mutually bonding the probe block 120 and the other probe block 120 may be performed by aligning the tip portion 114 of the probe 110 to the alignment mark 611 ( S400) may be performed before. That is, the neighboring probe blocks 120 are bonded to each other and fixed using an adhesive B, and then the alignment positions of the tip portions 114 of the probes 110 mounted on the probe blocks 120 are arranged on the transparent substrate 610. It can be adjusted using the alignment mark 611 of.

Thereafter, the processes of S100 to S500 are repeatedly performed as necessary to bond and fix the plurality of probe blocks 120 on which the probes 110 are mounted, and adjust the alignment positions of the tip portions 114 of the plurality of probes 110. To produce the probe unit 100.

Specifically, another probe block 120 that is fixed to the second fixing part 560 by releasing the adsorption fixing state of the probe block 120 by the first adsorption part 522 of the first fixing part 520. In the state in which the probe block 120 is bonded and fixed thereto, the plurality of probes 110 are mounted on another probe block 120 and the other probe block 120 is suction-fixed to the first fixing part 520. By performing the above-described process, another probe block 120 fixed to the second fixing part 560 and the another probe block 120 are fixed to the probe block 120 by bonding a plurality of probe blocks 120. ) Produces a probe unit 100 in which the mutual bonding is fixed.

In another embodiment, the process of aligning the tip portion 114 of the probe 110 to the alignment mark 611 of the transparent substrate 610 may be performed by bonding and fixing the plurality of probe blocks 120 to each other. After manufacturing the entirety of 100), the entirety of the tip portions 114 of the plurality of probes 110 constituting the entire probe unit 100 may be aligned through a single process.

In another embodiment, after the step S500, after fixing the probe blocks 120 fixed to each other to fix each probe block 120 to the first fixing part 520 and the second fixing part 560 (S600) After arranging the connection part transparent substrates on which the connection part alignment marks having a pattern set on the connection part 116 of the probe block 120 are turned upside down (S700), the position of the connection part 116 of each probe 110 is arranged. Can be aligned with each of the connection part alignment marks of the connection transparent substrate (S800).

In detail, the probe block 120 fixed to each other by the adhesive B is turned upside down to be fixed to the first fixing part 520 and the second fixing part 560, and then the transparent substrate mounted on the substrate alignment part 600. After replacing 610 with the connecting portion transparent substrate on which the connecting portion alignment mark of the set pattern is formed, moving the substrate alignment unit 600 onto the stage 500 to display the connecting portion transparent substrate displaying the connecting portion alignment mark having the set pattern. The upside is moved over the connecting portion 116 of the probe 110 mounted on the probe block 120 fixed to each other to align the connecting transparent substrate on the connecting portion 116 of the probe 110. When aligning the connecting portion transparent substrate on the connecting portion 116 of the probe 110, a positional alignment mark formed in a pattern set on the connecting portion transparent substrate is a position where each of the connecting portions 116 of the plurality of probes 110 is located in the design. Arrange to be located at the position corresponding to.

After aligning the connecting portion transparent substrate with respect to the connecting portion 116, it is determined whether each of the plurality of connecting portions 116 mounted on the probe block 120 that is inverted through the connecting portion transparent substrate and is fixed to each other coincides with the connecting portion alignment mark. Afterwards, the connecting portions 116 which do not coincide with the connecting portion alignment marks among the plurality of connecting portions 116 are adjusted by using an adjustment tool such as tweezers, and the plurality of connecting portions 116 attached to the fixed probe block 120. ) So that the whole coincides with the connecting portion alignment mark of the connecting portion transparent substrate, which is aligned on the connecting portion 116.

That is, since the position of the connecting portion alignment mark of the set pattern formed on the connecting portion transparent substrate aligned on the connecting portion 116 of the probe 110 is the same as the position of the connecting portion 116 of the probe 110 in the initial design. By adjusting the connecting portions 116 of the probes 110 that do not correspond to the connecting portion alignment marks, the connecting portions 116 of all the probes 110 correspond to the connecting portion alignment marks so that the plurality of probe blocks ( The alignment positions of the connecting portions 116 of the entire probes 110 included in the probe units 100 included in the 120 become identical to the alignment positions in the initial design.

As described above, the probe unit manufacturing apparatus and the probe unit manufacturing method according to an embodiment of the present invention, the probe block 120 and the other probe block 120 in the first direction (X), the second direction (Y), The adjacent probe block 120 is moved by moving in at least one of the three directions R and the fourth direction Z so as to face the plate surface of the other probe block 120 to the plate surface of the probe block 120 so as to face each other. The manufacturing error which may occur at the joining of) is suppressed.

In addition, the tip portion 114 of the probe 110 constituting the probe unit 100 using the transparent substrate 610 on which the alignment mark 611 having the set pattern is formed and the connection transparent substrate on which the alignment mark is formed, and By adjusting the alignment position of the entirety of the connection portion 116 to the alignment position in the design, the alignment position error of the tip portion 114 and the connection portion 116 of the probe 110 due to an error occurring in manufacturing or the like is prevented.

That is, the probe unit manufacturing apparatus and the probe unit manufacturing method according to an embodiment of the present invention may not only suppress manufacturing errors occurring when manufacturing the probe unit 100, but also may cause errors in manufacturing. By correcting the alignment position error of the tip portion 114 and the connecting portion 116 of the entire probe 110 due to the actual alignment position of the tip portion 114 of the probe 110 in contact with the contact pad of the object under test, the alignment position in the design Can be manufactured at the same time the actual alignment position of the connecting portion 116 in contact with the terminals of other components such as a substrate pad or a space transducer formed on the printed circuit board constituting the probe card. . This improves the reliability of the probing operation using the probe card including the probe unit 100.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is shown by the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents are included in the scope of the present invention. Should be.

1 is a perspective view showing a probe of a probe unit manufactured by the present invention,

2 is a perspective view showing a probe block of a probe unit manufactured by the present invention,

3 is an exploded perspective view of a probe unit manufactured by the present invention,

4 is a cross-sectional view taken along line IV-IV of FIG. 3,

5 is a bottom perspective view of a probe unit manufactured by the present invention,

6 is a perspective view showing a probe unit manufacturing apparatus according to an embodiment of the present invention,

FIG. 7 is an enlarged perspective view of a portion of FIG. 6;

FIG. 8 is a perspective view showing an opposite part of the portion shown in FIG. 7;

9 is a flowchart illustrating a method of manufacturing a probe unit according to an embodiment of the present invention.

10 to 13 are views for explaining a method for manufacturing a probe unit according to an embodiment of the present invention.

Claims (15)

In one or more slits are formed at a predetermined interval and a plurality of plate-shaped probe block bonded to each other and a method for manufacturing a probe unit comprising a probe mounted to each of the slits, (a) mounting the probe in the slit of the probe block, (b) mutually bonding the plate surfaces of the probe blocks to face the plate surfaces of other probe blocks; (c) aligning, with respect to the probe blocks bonded to each other, an alignment mark marked with an alignment mark having a pattern set on the tip of the probe, (d) positioning the tips of the probes to align each of the tips of the probes to each of the corresponding alignment marks; and (e) fastening the probe blocks and the other probe blocks that are mutually bonded to each other; Method for producing a probe unit comprising a. The method of claim 1, Method of manufacturing a probe unit is one or more of the steps (a) to (d) is repeatedly performed. The method of claim 1, In step (a), (a-1) placing the probes in the slits, respectively; (a-2) fixing the probe to the slit with an adhesive Method for producing a probe unit comprising a. The method of claim 1, In step (b), (b-1) disposing the probe blocks on a stage such that the plate surface of the probe block faces the plate surface of the other probe block; (b-2) positioning the plate surface of the probe block and the plate surface of the other probe block to be aligned and bonded to each other; Method for producing a probe unit comprising a. The method of claim 4, wherein In the step (b-1), And both side ends of each of the probe block and the other probe block are respectively supported on the engaging portions formed to protrude from the stage at positions corresponding to both side ends, and are disposed on the stage. The method of claim 4, wherein In the step (b-1), Both side ends of the probe block is supported on the engaging portion formed to protrude from the stage at a position corresponding to both side ends are disposed on the stage. The method of claim 4, wherein And the plate surface of the probe block and the plate surface of the other probe block are disposed on the stage in an adsorbed state in the stage. The method of claim 4, wherein Step (b-2), Moving the probe block in one or more of a first direction on the stage, a second direction orthogonal to the first direction, and a third direction to rotate on the stage; and Moving the other probe block in a fourth direction orthogonal to the first and second directions Method for producing a probe unit comprising a. The method of claim 1, In step (e), The method of manufacturing a probe unit is performed by fixing the probe block and the other probe block bonded to each other with an adhesive. The method of claim 1, After the step (e), (e) inverting the mutually fixed probe blocks, (f) aligning the connection transparent substrate marked with a connection alignment mark having a pattern set on the connection portion opposite to the tip portion of the probe with respect to the probe blocks that are inverted and mutually fixed; (g) positioning the connection portions of the probes to align each of the connection portions of the probes to respective corresponding connection alignment marks. Method of manufacturing a probe unit further comprising. An apparatus for manufacturing a probe unit comprising a plurality of plate-shaped probe blocks which are formed at a predetermined interval and at least one slit is bonded to each other and probes mounted on the slits, respectively. A stage including a first fixing part to which a plate surface of the probe block is fixed and a second fixing part to which a plate surface of a probe block different from the probe block is fixed; and A transparent substrate on which an alignment mark having a set pattern is displayed is mounted, and with respect to the probe blocks bonded to each other, the transparent substrate corresponding to each of the tip portions of the probe is aligned on the tip portion of the probe. It includes a substrate alignment for moving the, And the first fixing portion and the second fixing portion are movable on the stage such that the plate surface of the probe block and the plate surface of the other probe block face each other and are bonded to each other. The method of claim 11, The first fixing part, Probe unit manufacturing apparatus comprising a first engaging portion protruding from the first fixing portion to support both side ends of the probe block. 13. The method of claim 12, The second fixing part, And a second catching part protruding from the second fixing part to support both side ends of the other probe block. The method of claim 11, Each of the first fixing part and the second fixing part, And a probe unit manufacturing apparatus for sucking and fixing each of the plate surface of the probe block and the plate surface of the other probe block. The method of claim 11, The first fixing part is movable in at least one of a first direction on the stage, a second direction perpendicular to the first direction, and a third direction rotating on the stage, And the second fixing part is movable in a fourth direction orthogonal to the first direction and the second direction.

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