KR20060135669A - Electric connecting device - Google Patents

Abstract

In an electric connecting device, a plurality of pins are disposed in a ceramic substrate in such a manner that they project from one surface thereof, and a resin substrate having a plurality of electrically conductive sections electrically connected to these pins is disposed on the other surface of the ceramic substrate. A socket device is provided with a plurality of recesses which open to the surface on the ceramic substrate side to individually receive the pins, and a plurality of pairs of grip members for releasably gripping the pins individually received in the recesses, whereby the ceramic substrate is joined to the socket device, the latter being joined to a wiring board.

Description

Electric Connecting Device

Field of technology

The present invention relates to an electrical connection device such as a probe card for electrically connecting an integrated circuit as an inspection object and an electrical circuit of the inspection device.

In the following description, the thickness direction of each substrate is referred to as a vertical direction, the needle needle side (semiconductor wafer side) of the contact with respect to each substrate is referred to as a downward direction, and two directions of rectangular coordinates parallel to each substrate are referred to as X and Y directions. This is called. However, in the actual use of the electrical connection device, the thickness direction of each substrate may be inclined or transverse, or the vertical direction may be reversed.

Background

As one of these types of electrical connection devices, there is a so-called ceramic substrate made of ceramic and a resin layer arranged on one surface of the ceramic substrate, and a plurality of contacts are formed in the resin layer (Patent Documents 1 and 2).

Patent Document 1 Japanese Patent Application Laid-Open No. 6-140484

Patent Document 2: Japanese Patent Application Laid-Open No. 11-160356

In the invention described in Patent Literature 1, the resin layer is a multilayer wiring layer in which a wiring, a contactor, or the like is formed on a ceramic substrate by photolithography technology, and the resin layer is thus bonded to the ceramic substrate.

In the invention described in Patent Literature 2, the ceramic substrate is a multilayer wiring substrate having a plurality of wirings, and the resin layer drills a plurality of holes in a film in which a resin thin film and a copper thin film are laminated, and the metal material is electroplated in the holes. It is produced by filling a contact as a contact and removing the unnecessary part by a copper thin film by etching. The resin layer is bonded to the ceramic substrate by an anisotropic conductive rubber sheet.

On the other hand, in an integrated circuit as a test object, the position, function, size, placement pitch, and the like of the electrode differ depending on the type of integrated circuit.

However, in any of the prior arts, a ceramic substrate that is difficult to manufacture must be manufactured and prepared for each type of integrated circuit, and the ceramic substrate itself is expensive.

Disclosure of the Invention

It is an object of the present invention to enable standardization of ceramic substrates and to provide a cheap ceramic substrate.

The electrical connecting device according to the present invention has a plurality of first conductive members on one side as a ceramic substrate, and also has a plurality of second conductive members electrically connected to the first conductive members on the other side. A ceramic substrate electrically connected to the second conductive member and having a plurality of pins protruding from the other surface, and an electrically insulating resin substrate disposed on one side of the ceramic substrate, in contact with the first conductive member. A resin substrate provided with a plurality of third conductive members on the surface of the ceramic substrate and provided with a plurality of fourth conductive members electrically connected to the third conductive member on a surface opposite to the ceramic substrate; A plurality of contacts provided on the fourth conductive member so as to be in contact with the electrodes, and a plate-like disposed on the other surface of the ceramic substrate. A ket device having a plurality of elements opening to the surface of the ceramic substrate for receiving the pins respectively, and at the same time releasing the pins disposed on the elements and releasably held by the corresponding elements. A socket device having a plurality of pairs of holding members, and a wiring board having a plurality of fifth conductive members electrically connected to one of the holding members, respectively, as a wiring board disposed on the other side of the socket device. do.

In the above electrical connection device, the holding of the pins of the ceramic substrate by the socket device can be released to separate the ceramic substrate from the socket substrate and the wiring board together with the resin substrate, and the pins of the ceramic substrate are inserted into the elements of the socket device. The ceramic substrate can be joined to a socket apparatus and also a wiring board with a resin board | substrate by putting these pins in a socket apparatus.

For this reason, the ceramic substrate can be standardized by making the arrangement pattern and connection pattern of the 1st and 2nd electroconductive member of a ceramic substrate common, and producing the resin substrate according to the kind of integrated circuit.

According to the standardized ceramic substrate, it is possible to reduce the ceramic substrate by producing a large amount of ceramic substrate, and to shorten the production period of the electrical connection device by forming a resin substrate according to the type of integrated circuit on the ceramic substrate in stock. have.

Each said pin may be provided with the flange part provided in the said 2nd electroconductive member, and the pin-shaped main part extended from the said flange part so that it may be received by the said element. By doing so, the pin can be attached to the second conductive member by a conductive adhesive such as soldering at the flange portion, thereby facilitating the connection work of the pin to the second conductive member. Moreover, since the adhesive area of the pin to a 2nd electroconductive member becomes large compared with the case where a flange part is not provided, a pin is firmly connected to a 2nd electroconductive member.

The first and second conductive members may be electrically connected to each other by wiring or conductive through holes formed in the ceramic substrate, both ends of the first and second conductive members serving as the first and second conductive members.

Furthermore, the said resin substrate may be equipped with the some wiring which electrically connects the said 3rd and 4th conductive member as a some wiring arrange | positioned in multiple layers. In this case, since the number of wirings formed on the ceramic substrate is not reduced or the wirings need not be formed on the ceramic substrate, the manufacture of the ceramic substrate is facilitated and the ceramic substrate is cheap.

Each said contact may be provided in the cantilever shape in the 4th electroconductive member. In this case, when the overdrive is applied, the contact is bent, so that unevenness of the height position of the needle bar can be absorbed, and all the contacts can be reliably brought into contact with the electrodes of the integrated circuit.

Each contact member is provided with a mounting portion provided in the fourth conductive member in a state extending from the fourth conductive member in the thickness direction of the ceramic substrate, and an arm extending from the mounting portion in a direction crossing the thickness direction. ) And a needle contact portion extending from the distal end of the arm portion in a direction opposite to the installation portion. In this way, a contactor can be manufactured easily and inexpensively by the electroplating method like electroplating.

The arm portion includes first and second arms spaced in the thickness direction, and first and second connecting portions connecting the first and second arms at their tip and base ends, respectively, and at the proximal end. While supporting the mounting portion, the needle tip portion may be supported by the tip portion.

The socket device is a socket substrate positioned on the wiring substrate side and a movable substrate movable in one direction crossing the thickness direction with respect to the socket substrate, and movable substrate positioned on the ceramic substrate side with respect to the socket substrate. An elastic body for exerting a force from the movable substrate to one side in its moving direction to the movable substrate, a cam for pushing the movable substrate against the force of the elastic body so as to be releasable to the other side, and the cam at an angle. And a manipulating member for rotationally rotating, wherein the socket substrate and the movable substrate form the element together, one pair of holding members of each pair are provided on the socket substrate, and the other holding member of each pair of the movable members is movable. It may be provided in the board | substrate. By doing so, since the force required for detachment of the ceramic substrate to and from the socket device is considerably less than when the pins of the ceramic substrate are coupled to the elements of the socket device, the ceramic substrate to and from the socket device becomes easy.

The socket device further includes a plurality of second pins connected to the respective holding members and protruding from the socket substrate toward the wiring board, wherein the wiring board is a plurality of holes in which the second pins are respectively coupled. You may further be provided with the some hole which has the electroconductive inner surface which respectively acts as said 5th electroconductive member.

The socket device may further include a frame disposed between the wiring substrate and the resin substrate and disposed around the socket substrate and the movable substrate to prevent movement of the socket substrate and to movably support the movable substrate. have. By doing so, attachment of the socket substrate and the movable substrate to the wiring substrate becomes easy.

One side of the frame and the movable substrate has a pair of grooves that support the movable substrate from the edge thereof to the frame so as to correspond to a pair of square opposite sides, wherein the frame and the movable substrate The other side of may have the convex part received so that the movement to the said groove | channel corresponds to the pair of sides which face the said rectangle. By doing so, the movable substrate can be supported to be movable without using parts such as balls and rolls.

The ceramic substrate and the socket device may be coupled by a plurality of screw members that penetrate the ceramic substrate and are coupled to the socket device. By doing so, the ceramic substrate is stabilized with respect to the socket device and the wiring substrate.

The electrical connection device further includes a reinforcing member disposed opposite the socket device side of the wiring board, wherein the reinforcing member is provided by a plurality of screw members coupled to the socket device through the reinforcing member and the wiring board. It is provided in the said wiring board and the said socket device, The said ceramic board | substrate and a socket device may be couple | bonded with the some screw member couple | bonded with the socket apparatus through a ceramic substrate. By doing so, the parallelism of a wiring board, a socket device, a ceramic board | substrate, and a resin board | substrate is maintained high.

In addition, the electrical connection device includes a plurality of electronic components disposed on the opposite side of the socket device of the wiring board, each of which is electrically connected to the fifth conductive member, and a reinforcing member positioned around the electronic component. can do.

The reinforcing member includes a frame member positioned around the electronic component, and a plurality of arm portions extending in a radial direction of an imaginary circle from the frame member, and the wiring member is connected to the frame member by a plurality of screw members. It may be provided in the board | substrate and the said socket apparatus, and may be provided in the said wiring board by the some other screw member in the said arm part. By doing so, not only the wiring board is reinforced but also the upper region of the wiring board can be effectively used.

The electrical connection device may further include a connector having a plurality of connectors electrically connected to the fifth conductive member, respectively, as a plurality of connectors disposed on the wiring board.

Brief description of the drawings

1 is a plan view showing one embodiment of an electrical connection device according to the present invention.

FIG. 2 is a front view of the electrical connection device shown in FIG.

3 is a bottom view of the electrical connection device shown in FIG.

FIG. 4 is an exploded perspective view of the electrical connection device shown in FIG. 1 seen from below. FIG.

5 is an exploded perspective view of the electrical connection device shown in FIG. 1 as viewed from above.

FIG. 6 is an enlarged longitudinal sectional view of a part of the electrical connection device shown in FIG. 1, with the upper portion of the wiring board omitted.

7 is an enlarged longitudinal sectional view of a part of the probe substrate.

8 is a perspective view showing a part of the bottom surface of the resin substrate.

Fig. 9 is a view showing one embodiment of a contactor, where (A) is a front view and (B) is a right side view.

Fig. 10 is a perspective view showing one embodiment of a socket device.

Fig. 11 is a sectional view showing a supporting state of a movable substrate to a frame.

12 is a longitudinal cross-sectional view for explaining the operation of the socket substrate, (A) is a view showing a state of releasing a pin, (B) is a view showing a state of holding a pin.

Best Mode for Carrying Out the Invention

1 to 12, the electrical connection device 10 is integrated with a plurality of electrodes for power supply, earth and signal, such as an uncut integrated circuit formed in a semiconductor wafer or an integrated circuit cut into a chip shape. The circuit is a test subject.

The electrical connection device 10 includes a wiring board 12 provided in the inspection apparatus, a probe board 14 having a plurality of contacts 32 to be described later, and a probe board 14 of the wiring board 12. A flat socket device 16 detachably provided below and a reinforcing member 18 disposed above the wiring board 12 are included.

The wiring board 12 is a circular multilayer wiring board having a plurality of conductive members 20 and having a plurality of wirings 22 electrically connected to the conductive members 20 in a multilayer manner. The electrodes and the conductive member 20, the conductive member 20, and the wiring 22 of the integrated circuit correspond to each other in at least one form and at least one form, preferably in a form of one to one. Such a wiring board 12 can be manufactured using glass containing epoxy.

Each conductive member 20 is a so-called conductive through hole formed by a conductive ordinary member that extends from the bottom surface of the wiring board 12 into the wiring board 12 and extends to the middle of the thickness direction of the wiring board 12. have.

In the center of the upper surface of the wiring board 12, a plurality of electronic components 24 such as relays and resistors are arranged in a substantially rectangular area in plan view. Each electronic component 24 corresponds to a power supply or a signal electrode, is bonded to a connection land (not shown) by a conductive adhesive such as soldering, and is electrically connected to the wiring 22.

In addition, on the upper surface of the wiring board 12, a plurality of connectors 26 connected to the electric circuit of the inspection apparatus are arranged. Each connector 26 is electrically connected to the electroconductive member 20 via the wiring 22 of the wiring board 12, respectively.

The probe substrate 14 forms a rectangular resin substrate 30 on the bottom surface of the substantially rectangular ceramic substrate 28, and includes a plurality of contacts 32 and electrons such as a capacitor, respectively corresponding to the electrodes of the integrated circuit. The component 34 is provided on the bottom surface of the resin substrate 30. The height position of the lower end of the electronic component 34 is higher than the height position of the lower end (needle line) of the contactor 32.

The ceramic substrate 28 has a plurality of conductive members 36 and 38 on both surfaces thereof, and the conductive members 36 and 38 are formed by the conductive wiring 40 and the normal member 42, respectively. It is electrically connected in at least one to at least one form, preferably in a one-to-one form. The electroconductive members 36 and 38 are the one end and the other end of the normal member 42, respectively.

Although the normal member 42 is shown to penetrate the ceramic substrate 28 in the thickness direction, it is actually divided into two upper and lower members so that the upper member of one ordinary member and the lower member of the other ordinary member 42 are separated. It is electrically connected by the wiring 40.

However, the wiring 40 may not be provided on the ceramic substrate 28 but may be a single normal member 40. In this case, the wiring 40 may be a reinforcing material.

On the upper surface of the ceramic substrate 28, a plurality of pins 44 are arranged in a state extending upward. Each pin 44 has a flange portion 46 and a pin-shaped main body portion 48 extending from the flange portion 46, and is electrically conductive above the flange portion 46 by a conductive adhesive such as soldering. It is bonded to the member 36 and electrically connected.

As a result of this, the connection work of the pin 44 to the electroconductive member 36 becomes easy. Moreover, since the adhesive area of the pin 44 to the conductive member 36 becomes large compared with the case where the flange portion is not provided, the pin 44 is firmly connected to the conductive member 36.

The resin substrate 30 is directly formed on one surface of the ceramic substrate 28 using an electrically insulating resin such as polyimide. The resin substrate 30 has a plurality of conductive members 50 and 52 acting as pads for connection on both surfaces thereof, and the conductive members 50 and 52 are each at least one to at least by the conductive wiring 54. In one form, it is preferably electrically connected in a one-to-one form.

The power supply or earth wiring 56 is exposed on the bottom surface of the resin substrate 30 and is connected to an electronic component 34 such as a capacitor. The conductive member 52 connected to the wiring 56 is used as a power pad or earth pad portion. The other conductive member 52 is used as the signal pad portion.

Each contactor 24 is provided toward the distal end of the mounting portion 58 provided on the conductive member 52 of the resin substrate 30, the arm portion 60 extending downward from the mounting portion 58, and the arm portion 60. Is a plate-shaped contactor (probe) including a needle portion 62 extending in the opposite direction (downward) from the installation portion 58.

The attachment part 58 is provided with the rectangular plate-shaped area | region 58a and the extension part 58b which extends downward from the plate-shaped area | region 58a and reaches the arm part 60. As shown in FIG.

The arm portion 60 includes first and second arms 60a and 60b spaced in the vertical direction and first and second portions connecting the first and second arms 60a and 60b at their distal and proximal ends, respectively. The connection parts 60c and 60d are provided. The arm part 60 is supported by the extension part 58b of the installation part 58 at the base end, and supports the needle tip part 62 at the tip part.

The needle point portion 62 includes a plate-shaped pedestal portion 62a connected to the lower end side of the arm portion 60 and a projection needle-shaped needle line 62b provided at the lower end of the pedestal portion 62a.

Each contactor 24 is bonded to the conductive member 52 by a conductive adhesive such as soldering in the plate-like region 58 of the mounting portion 58 in a state where it extends downward from the resin substrate 30.

Even if it has a complicated structure as mentioned above, the contactor 24 can be manufactured easily and inexpensively by the electroplating method like electroplating.

The socket device 16 includes a socket board 64 located on the wiring board 12 side, a movable board 66 movable in one direction in a horizontal plane with respect to the socket board 64, and a socket board board. The frame 68 disposed around the 64 and the movable substrate 66 has a substantially rectangular plate shape as a whole.

In addition, the socket device 16 includes an elastic body 70 for exerting a force applied to the movable substrate 66 to one side thereof in the moving direction thereof and the movable substrate 66 such as a leaf spring. A pair of cams 72 pushed releasably to the other side in response to the force of the elastic body 70, a support shaft 74 in which the cams 72 are not movable relative, and the cams 72 at an angle And an operation member 76 provided at each end of the support shaft 74 for rotation.

The socket substrate 64 and the movable substrate 66 together form a plurality of elements 78 that open to the surface of the ceramic substrate 28 so as to receive the pins 44 of the ceramic substrate 28, respectively. Doing.

The element 78 corresponds to the cylindrical conductive member 20 of the wiring board 12, respectively. Of the elements 78, the socket substrate 64 portion is a so-called bottomed hole having a bottom, and the movable substrate 66 portion is a through hole connected to the bottomed hole.

Each element 78 is arranged such that a pair of gripping members 80 and 82 releaseably grip the pin 44 received by the element 78 as the movable substrate 66 moves. have. One pair of holding members 80 of each pair is provided so that relative movement is impossible to the socket board | substrate 64, and the other holding member 82 of each pair is provided so that relative movement to a movable board 66 is impossible. .

Moreover, the some pin 84 is arrange | positioned in the socket board | substrate 64 in the state which protrudes above the socket board | substrate 64 from the holding member 80. Each pin 84 is electrically connected to the holding member 80, and is fitted to the cylindrical conductive member 20 of the wiring board 12. As a result, the movement of the socket substrate 64 with respect to the wiring substrate 12 is prevented.

The movable substrate 66 has a pair of grooves 86 extending in the movement direction thereof at the opposite edges of the rectangle, and the frame 68 is a convex portion that is received to be movable in the grooves 86 ( 88 部 88 is provided in the part corresponding to the opposite side of a rectangle. However, the grooves 86 may be formed in the frame 68, and the convex portions 88 may be formed in the movable substrate 66.

In any of the above examples, the pins 44 are moved to the position at which the element 78 is opened to receive the pins 44, and to the position at which the pins 44 are held by the holding members 80 and 82. The socket substrate 64 is placed on the movable substrate 66. When the groove 86 and the convex portion 88 are used to support the movable substrate 66 in this manner, the movable substrate 66 is movably supported by the frame 68 without using parts such as balls and rolls. You can.

The support shaft 74 is rotatably supported by the frame 68 so as to extend in the horizontal direction crossing the moving direction of the movable substrate 66.

The cam 72 is provided on the support shaft 74 at intervals in the longitudinal direction thereof so as to rotate at an angle in the vertical plane including the moving direction of the movable substrate 66. The outer circumferential surface of the cam 72 has a first cam surface having a large radius of curvature and a second cam surface having a small radius of curvature.

The operation member 76 can rotate the support shaft 74 at a position where the first cam surface is in contact with the side surface of the movable substrate 66 and a position where the second cam surface is in contact with the side surface of the movable substrate 66. It is installed at the end of the support shaft so that.

As described above, the socket device 16 connects the ceramic substrate 28 to the socket device (remarkably less than the case where the pin 44 of the ceramic substrate 28 is fastened to the element 78 in a state where the pin 44 is coupled). Since it can attach or detach with respect to 16, the detachment of the ceramic substrate 28 to the socket apparatus 16 becomes easy.

In addition, since the socket device 16 prevents the movement of the socket substrate 64 by the frame 68 and supports the movable substrate 66 so as to be movable, the socket to the wiring substrate 12 is provided. Mounting of the board | substrate 64 and the movable board 66 becomes easy.

The reinforcing member 18 includes a substantially rectangular frame member 90 positioned around the electronic component 24, and a plurality of arm portions 92 extending in the radial direction of the virtual circle from the frame member 90. . Thereby, not only the wiring board 12 is reinforced but also the upper region of the wiring board 12 can be effectively used.

The reinforcing member 18 is connected to the wiring board 12 and the socket in the frame member 90 by a plurality of threaded members 94 penetrating the reinforcing member 18 and the wiring board 12 to the frame 68. It is provided in the apparatus 16 and is provided in the wiring board 12 in the arm part 92 by the several screw member 96 which penetrates the reinforcing member 18, and is couple | bonded with the wiring board 12. .

The probe substrate 14 is provided in the socket device 16 by a plurality of screw members 98 that penetrate the ceramic substrate 28 and are coupled to the frame 68.

The relative positioning of the wiring board 12, the probe board 14, and the socket device 16 passes through and extends from the wiring board 12 to the frame 68 to be inserted into the ceramic substrate 28. It is done by 100.

When inspecting, the electrical connecting device 10 presses the needle bar 62b of the contactor 24 on the electrode of the integrated circuit. At this time, the cantilever-shaped contactor 24 is disengaged from the arms 60a and 60b by the overdrive acting on it. As a result, the unevenness of the height position of the needle bar 62b is absorbed, and all the contacts 24 are surely in contact with the electrodes of the integrated circuit.

In the electrical connection device 10, when the cam 72 is rotated by the operating member 76 so that the first cam surface is in contact with the side surface of the movable substrate 66 in the state shown in FIG. The substrate 66 is pushed against the force of the elastic body 70. As a result, as shown in Fig. 12B, the holding members 80 and 82 hold the pins 44 of the ceramic substrate 28, and the probe substrate 14 is the socket device 16, and thus the wiring. It is provided in the board | substrate 12.

In contrast, in the state shown in Fig. 12B, when the cam 72 is rotated by the operation member 76 so that the second cam surface is in contact with the side surface of the movable substrate 66, the movable substrate 66 is an elastic body. It is pushed back by the force of 70. As a result, as shown in Fig. 12A, the gripping members 80 and 82 release the gripping of the pin 44. As shown in Figs. In this state, detachment of the probe board 14 to the socket device 16 is performed.

According to the electrical connecting device 10, the holding of the pin 44 of the ceramic substrate 28 by the holding members 80 and 82 as described above releases the ceramic substrate 28 together with the resin substrate 30 and the socket. The board 64 can be separated from the wiring board 12, and the pins 44 of the ceramic substrate 28 are inserted into the elements 78 of the socket device 16 so that the pins 44 are held by the holding member ( By holding the 80 and 82, the ceramic substrate 28 can be bonded to the socket device 16 and the wiring board 12 together with the resin substrate 30.

For this reason, the ceramic substrate 28 is produced by making the arrangement pattern and connection pattern of the electroconductive members 36 and 38 of the ceramic substrate 28 common, and manufacturing the resin substrate 30 which has a pattern according to the kind of integrated circuit. Can be standardized.

The standardized ceramic substrate 28 can be inexpensive by mass production of this, and the resin substrate 30 according to the type of integrated circuit is formed on the ceramic substrate 28 in stock, so that the electrical connection device 10 The production period can be shortened.

When the ceramic substrate 28 and the resin substrate 30 are used as the probe substrate 14, the number of wirings formed on the ceramic substrate 28 can be reduced, and in the extreme case, the wirings are not formed on the ceramic substrate 28. Since it is not necessary, manufacture of the ceramic substrate 28 becomes easy, and the ceramic substrate 28 becomes cheap.

In addition, according to the electrical connection device 10, the reinforcing member 18 penetrates the reinforcing member 18 and the wiring board 12 and is connected by the plurality of screw members 96 coupled to the socket device 16 to the wiring board. The plurality of screw members 98 provided at the 12 and the socket device 16 and coupled to the socket device 16 through the ceramic substrate 28 and the socket device 16 through the ceramic substrate 28. In this case, the parallelism of the wiring board 12, the socket device 16, the ceramic board 28, and the resin board 30 is maintained high.

However, the reinforcing member 18 may not be provided. In that case, the wiring board 12 and the frame 68 may be joined by a plurality of screw members.

The present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit thereof.

Claims (16)

A plurality of first conductive members are provided on one side as a ceramic substrate, and a plurality of second conductive members electrically connected to the first conductive member are provided on the other side, and further electrically connected to the second conductive members. A ceramic substrate having a plurality of pins protruding from the other surface; An electrically insulating resin substrate disposed on one side of the ceramic substrate, which has a plurality of third conductive members in contact with the first conductive member on the side of the ceramic substrate and is electrically connected to the third conductive member. A resin substrate having a plurality of fourth conductive members on a surface opposite to the ceramic substrate; A plurality of contacts provided in the fourth conductive member so as to be in contact with the electrodes of the inspected object; A plate-shaped socket device disposed on the other side of the ceramic substrate, having a plurality of elements that open to the ceramic substrate side to receive the pins respectively, and simultaneously disposed on the elements and received by corresponding elements A socket device having a plurality of pairs of holding members for releasably holding the pins; And A wiring board arranged on the other side of the socket device, the wiring board including a plurality of fifth conductive members electrically connected to one of the holding members; Electrical connection device comprising a. The electrical connection device according to claim 1, wherein each of the pins includes a flange portion provided in the second conductive member, and a pin-shaped main portion extending from the flange portion to be received by the element. The said 1st and 2nd conductive member is a wiring or a conductive through hole formed in the said ceramic substrate, The both ends are electrically connected by the through-hole which acts as the said 1st and 2nd conductive member. Electrical connection device connected by. The electrical connection device according to any one of claims 1 to 3, wherein the resin substrate further includes a plurality of wirings for electrically connecting the third and fourth conductive members as a plurality of wirings arranged in a multilayer. The electrical connection device according to any one of claims 1 to 4, wherein each contactor is provided in a cantilever shape in the fourth conductive member. 6. The contact portion as set forth in claim 5, wherein each contact member is provided with an installation portion provided in the fourth conductive member in a state extending from the fourth conductive member in the thickness direction of the ceramic substrate, and crosses the thickness direction at one end of the installation portion. And an arm portion extending in a direction to extend, and a needle tip portion extending in a direction opposite to the installation portion at the distal end of the arm portion. The said arm part is equipped with the 1st and 2nd arm spaced in the said thickness direction, and the 1st and 2nd connection part which connects the said 1st and 2nd arm in the front part and the base part, respectively, And an electrical connection device that is supported by the installation portion at the base end and at the same time supports the needle tip at the tip portion. The said socket apparatus is a socket board | substrate located in the said wiring board side, and the said socket board | substrate as a movable board | substrate which is movable in the direction which cross | intersects the said thickness direction with respect to the said socket board | substrate. A movable substrate positioned on the ceramic substrate side with respect to the elastic substrate, an elastic body for exerting a force exerted on one side in the moving direction of the movable substrate to the movable substrate, and the movable body is released to the other side in response to the force of the elastic body. A cam that pushes possibly and an operating member that rotates the cam angularly, And the socket substrate and the movable substrate together form the element, one holding member of each pair is provided on the socket substrate, and the other holding member of each pair is provided on the movable substrate. The said socket apparatus is further equipped with several 2nd pin connected to each said holding | gripping tool, and protruding toward the said wiring board from the said socket board | substrate, And the wiring board further includes a plurality of holes each having a conductive inner surface that serves as the fifth conductive member, respectively, as a plurality of holes to which the second pins are coupled. The said socket device is a socket board | substrate and any one of Claims 8-9 which prevents the movement of the said socket board | substrate between the said wiring board and the said resin board | substrate, and movably supports the said movable board | substrate. And a frame disposed around the movable substrate. 11. The apparatus of claim 10, wherein one of the frame and the movable substrate has a pair of grooves at the edge corresponding to the pair of square facing sides to move the support substrate to the frame at an edge thereof. And the other side of the frame and the movable substrate has convex portions movably received in the grooves at portions corresponding to the pair of opposite sides of the quadrangle. The electrical connection device according to any one of claims 1 to 11, wherein the ceramic substrate and the socket device are coupled by a plurality of screw members coupled to the socket device through the ceramic substrate. 13. The socket device according to any one of claims 1 to 12, further comprising a reinforcing member disposed opposite to the socket device side of the wiring board, wherein the reinforcing member penetrates the reinforcing member and the wiring board. An electrical connection device provided in the wiring board and the socket device by a plurality of screw members coupled to the wiring board, wherein the ceramic substrate and the socket device are coupled by a plurality of screw members coupled to the socket device through the ceramic substrate. . The electronic component according to any one of claims 1 to 12, wherein the electronic component is electrically connected to the fifth conductive member as a plurality of electronic components arranged on the opposite side of the socket device of the wiring board, Electrical connection device further comprising a reinforcing member located around. The reinforcement member according to claim 14, wherein the reinforcing member includes a frame member positioned around the electronic component, and a plurality of arm portions extending in a radial direction of an imaginary circle from the frame member. An electrical connection device which is provided in the wiring board and the socket device in the frame member and is provided in the wiring board by a plurality of different screw members in the arm portion. The electrical connection device according to any one of claims 1 to 15, further comprising a connector having a plurality of connectors electrically connected to the fifth conductive member, respectively, as a plurality of connectors arranged on the wiring board.

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