JP4111872B2 - Electrical connection device for current test - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrical connection device used for an energization test of a plurality of integrated circuit regions formed on a semiconductor wafer.
[0002]
[Prior art]
Various electrical connection devices such as a probe card that can be used in a simultaneous energization test of a plurality of integrated circuit regions on a semiconductor wafer have been proposed as described in Patent Documents 1 and 2, for example.
[0003]
[Patent Document 1]
Japanese Patent Laid-Open No. 9-321100 [Patent Document 2]
Japanese Patent Laid-Open No. 2001-116767
In these conventional techniques, the same number of probes, probe regions, or probe elements (hereinafter simply referred to as “probes”) as many as the number of electrodes in an integrated circuit region to be subjected to a current test at a time are attached to a support substrate. .
[0005]
Therefore, the electrical connection device must be equipped with a large number of probes. In such a connection device, it is important that the probe size and shape, and the height position of the probe tip with respect to the support substrate and thus the semiconductor wafer are the same.
[0006]
[Problems to be solved]
However, since this type of conventional apparatus has a complicated structure, the height and position of the needle tip with respect to the support substrate are the same when assembled in the apparatus even though the size and shape of the probe can be the same. Difficult to make. For this reason, conventionally, after assembling the apparatus, the needle tip is polished and aligned.
[0007]
When the probe needle tip is polished in such a manner, the polished probe needle tip is partially removed by polishing even though it has a desired shape before being polished. Will be lost.
[0008]
An object of the present invention is to enable assembly so that the height positions of the probe tips are aligned.
[0009]
[Solution, action, effect]
The electrical connection device for energization test according to the present invention is used for an energization test of a plurality of integrated circuit regions formed on a semiconductor wafer.
[0010]
Such an electrical connection device includes a support substrate having a plurality of first connection portions on the lower surface and a plurality of second connection portions electrically connected to the first connection portions on the upper surface. And a plurality of mounting boards each having a plurality of probe seats individually connected to the second connection portion, the mounting board being attached to the lower side of the support board, and the probe seats in a cantilever shape And a plurality of probes individually attached to.
[0011]
In the electrical connection device according to the present invention, each mounting board is supported by a plurality of screw members penetrating the supporting board in the thickness direction and having a tip portion screwed into a screw hole provided in the mounting board. Each of the mounting substrates is provided with a number of the second connection portions and the probe seats that can perform an energization test of at least one integrated circuit region.
[0012]
In the apparatus as described above, for example, a probe is first attached to a probe seat with a conductive adhesive such as solder to produce a plurality of probe assemblies, and then the probe assemblies are appropriately mounted on a support substrate such as a screw member. It can be manufactured by attaching each probe assembly with a simple stopper.
[0013]
Since a large number of probes having the same size and shape can be easily manufactured, for example, the probe tip between the probes is, for example, the thickness of the conductive adhesive applied at the time of attaching the probe to each mounting substrate. By attaching each attachment substrate to the support substrate for each attachment substrate so that the height positions of the needle tips of the adjacent attachment substrates are aligned at the same time, it is possible to align them at the same height position.
[0014]
As described above, according to the present invention, the probe can be easily assembled so that the height positions of the probe tips are aligned.
[0015]
Each screw member includes an adjustment screw, and each mounting board includes the plurality of screw members, and a plurality of adjustment screws having penetrating the support board in the thickness direction and having tip portions in contact with the mounting board. It may be assembled to the support substrate. By doing so, by adjusting the screwing amount of the screw member into the screw hole, the height positions of the needle tips of the adjacent mounting substrates can be more accurately aligned.
[0016]
Each mounting board may be assembled to the supporting board by the plurality of screw members and the supporting board and an elastic body disposed between the mounting boards. By doing so, by adjusting the screwing amount of the adjusting screw into the screw hole, the height positions of the needle tips of the adjacent mounting substrates can be more accurately aligned.
[0017]
Each probe is attached to the probe seat and protrudes downward from the probe seat, an arm portion extending in a cantilever shape from the lower end portion of the attachment seat portion, and downward from the tip portion of the arm portion And a needle tip portion that protrudes toward the tip. By doing so, the probe can be easily attached to the probe seat so that the height position of the needle tip is aligned for each attachment board by making the upper end of the attachment seat portion the surface corresponding to the lower surface of the probe seat. it can.
[0018]
The connection device may further include a plurality of positioning pins that are inserted in the thickness direction of the support substrate and the attachment substrate in order to relatively position the support substrate and the attachment substrate. By doing so, since the positioning of each mounting substrate with respect to the support substrate is performed and maintained by the positioning pins, each mounting substrate can be easily attached to the support substrate.
[0019]
Each mounting substrate may be assembled to the support substrate by a plurality of screw members.
[0020]
The first and second connection portions may be electrically connected by a conductive adhesive.
[0021]
However, the first and second connection portions are electrically connected by a plurality of connection pieces, and the connection pieces are attached to one of the first and second connection portions and connected. A mounting seat that protrudes downward or upward from the arm, an arm that extends in a cantilever shape from the lower end or upper end of the mounting seat, and a tip that protrudes downward or upward from the tip of the arm Can be provided. If it does so, an attachment surface is formed in the 1st or 2nd connection part like the above-mentioned probe, and the upper end or lower end of the attachment seat part corresponded to the attachment surface of the 1st or 2nd connection part. It can be a surface. As a result, the connection piece can be easily attached to the first or second connection portion so that the height position of the tip is aligned for each attachment substrate.
[0022]
One of the first and second connection portions includes a contact piece, the other includes a protrusion pressed against the contact piece, and the contact piece includes a plate-like base having an opening, and the base into the opening. And at least one contact portion that is elastically deformable and extends and contacts at least a part of the outer periphery of the protrusion. By doing so, the contact piece and the protrusion are elastically deformed by the contact portion being pressed by the protrusion, so that the contact piece and the protrusion are securely in contact with each other and are attached when adjusting the height of the needle tip. The displacement of the substrate is absorbed. Further, since the contact piece itself is planar, it can be easily manufactured by using, for example, a plating technique or an etching technique using an appropriate mask such as a photoresist mask.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
Referring to FIGS. 1 to 5, an electrical connection device 10 electrically connects a plurality of electrodes provided in a plurality of integrated circuit regions formed on a semiconductor wafer 12 to a tester, and integrates the plurality of integrated circuits. The circuit area is used as a device for conducting an energization test at one time or by dividing a plurality of areas into a plurality of times.
[0024]
The connection device 10 includes a support substrate 14 such as a wiring substrate, a plurality of attachment substrates 16 arranged below the support substrate 12, and a plurality of probes attached in a cantilever shape below the attachment substrate 16. 18 and so on.
[0025]
The support substrate 14 is manufactured using an electrically insulating material such as ceramic, and a plurality of connectors 20 are assembled on the upper surface, and a plurality of flat first connection portions 22 acting as connection lands are formed on the lower surface. Have. Each connector 20 is attached to the support substrate 14 by a screw member at the flange portion on the outer periphery of the lower portion thereof.
[0026]
Each terminal of each connector 20 acts as a tester connection portion connected to the tester. In contrast, each first connection portion 22 is electrically connected to the terminal of the connector 20 by a wiring portion 24 of a wiring pattern in a one-to-one relationship (individually).
[0027]
Each mounting board 16 is manufactured using an electrically insulating material such as ceramic, glass-filled epoxy, resin, etc., and is electrically connected to the first connection portion 22 of the support board 14 in a one-to-one relationship (individually). A plurality of second connection portions 26 connected to each other are provided on the upper surface, and a plurality of probe seats 28 individually corresponding to the second connection portions 26 are provided on the lower surface.
[0028]
Each of the second connection portions 26 and each of the probe seats 28 are flat so as to function as a connection land to the first connection portion 22 and an attachment land for the probe, and the wiring portion 30 of the wiring pattern. Are electrically connected. In the illustrated example, each second connection portion 26 is bonded to the lower surface of the first connection portion 22 with a conductive adhesive such as solder.
[0029]
Each attachment board 16 has a function of attaching and supporting a plurality of probes 18 and a function of a connection board for connecting the probes 18 to the first connection portion 22 of the support board 14, and at least one integrated circuit. The number of the second connection portions 26 and the probe seats 28 are provided so as to be able to carry out the energization test of the region.
[0030]
Each probe 18 is a plate-like crank-type blade-type probe, and is attached to the probe seat 28 in a cantilever shape with a conductive adhesive such as solder.
[0031]
Each probe 18 is attached to the probe seat 28 and protrudes downward from the probe seat 28, an arm portion 34 extending in a cantilever shape from the lower end of the attachment seat 32, and the tip of the arm portion 34. And a needle tip portion 36 protruding downward from the portion. The distal end side of the needle tip portion 36 has a conical shape or a pyramid shape. The upper end of the mounting seat portion 32 is a flat surface corresponding to the mounting surface (lower surface) of the probe seat 28.
[0032]
The probe 18 having the above-described structure can be manufactured by a known method such as exposure and etching of a photoresist and electroplating technique by electroforming. Thereby, a large number of probes 18 having the same size and shape can be easily manufactured.
[0033]
The support substrate 14 and the mounting substrate 16 are relatively positioned by a plurality of positioning pins 40 inserted in the thickness direction.
[0034]
Each of the mounting substrates 16 is individually screwed into a plurality of screw holes formed so as to penetrate through the support substrate 14 in the thickness direction thereof, and a plurality of adjustments are made such that the tip ends abut on the upper surface of the mounting substrate 16. The height position is adjusted by the screw 42.
[0035]
Each mounting substrate 16 is removably assembled to the support substrate 14 by a plurality of assembly screw members 44 that pass through the support substrate 14 in the thickness direction and are screwed to the attachment substrate 16.
[0036]
Instead of screwing the screw member 44 to the support substrate 14, an elastic member is disposed between the support substrate 14 and the mounting substrate 16, and the adjustment screw 42 is passed through the support substrate 14 like the screw member 44. The tip of the adjustment screw 42 may be screwed onto the mounting substrate 16. Further, instead of using the adjusting screw, the screw member 44 for assembly may have the function of the adjusting screw 42.
[0037]
During the energization test, the connection device 10 presses the probe tip of each probe 18 against the electrode in the integrated circuit region, and supplies an electrical signal from the tester to the integrated circuit in this state.
[0038]
In the connection device 10 as described above, for example, first, each probe 18 is attached to the probe seat 28 with a conductive adhesive such as solder to produce a plurality of probe assemblies for each attachment substrate 16, and then the attachment substrate 16 is attached. It can be easily manufactured by attaching each probe assembly to the support substrate 14 with a screw member 44.
[0039]
Before each mounting substrate 16 is attached to the support substrate 14, each mounting substrate 16 is positioned with respect to the support substrate 14 by the positioning pins 40 and is maintained in that state. For this reason, each attachment substrate 16 can be easily attached to the support substrate 14.
[0040]
The needle tips between the probes 18 are, for example, the same application thickness of the conductive adhesive at the time of attachment of the probe to each attachment substrate 16 for each attachment substrate 16, and then the needles of the probes 18 on the adjacent attachment substrates 16. By adjusting the screwing amount of the adjusting screw 42 into the screw hole of the support substrate 14 so that the previous height positions are aligned, and then attaching each mounting substrate 16 to the supporting substrate 14 for each mounting substrate 16, the same height is obtained. Aligned.
[0041]
Referring to FIG. 6, the electrical connection device 50 uses a connection piece 52 to connect the first and second connection portions 22 and 26.
[0042]
Each connection piece 52 is attached to the second connection portion 26 with a conductive adhesive and protrudes upward from the second connection portion 26, as with the probe 18, and the upper end of the attachment seat portion 54. The arm portion 56 that extends in a cantilever shape from the portion, and the tip portion 58 that protrudes upward from the tip portion of the arm portion 56 and is pressed by the first connection portion 22 are provided. The lower end of the attachment seat portion 54 is a flat surface corresponding to the attachment surface (lower surface) of the second connection portion 26.
[0043]
However, contrary to the above, the connection piece 52 may be in a downward state in which the attachment seat portion 54 is attached to the contact portion 22 and the distal end portion 58 is pressed by the second connection portion 26.
[0044]
In any state of the connection piece 52, the connection piece 52 is easily attached to the first or second connection portion 22 or 26 so that the height position of the tip is aligned for each attachment substrate, similarly to the probe 18. be able to.
[0045]
Referring to FIGS. 7 to 9, the electrical connection device 60 includes a contact piece 62 formed on each first connection portion 22 and a protrusion 64 formed on the upper surface of each second connection portion 26. The first connecting portions 22 and 26 are connected by pressing 64 to the contact piece 62. The support substrate 14 has a recess 66 that is smaller than the contact piece 62 and opens downward at a position where the contact piece 62 is formed.
[0046]
Each contact piece 62 is a plate-like base 70 formed in an elliptical shape integrally with the first connecting portion 22, and has a plate-like base 70 having an elliptical opening 68. And a plurality of elastically deformable contact portions 72 extending inward and contacting at least part of the outer periphery of the protrusion 64.
[0047]
In the illustrated example, each contact portion 72 is formed from a belt-like arm portion 74 extending in the longitudinal direction of the opening 68 along the inner side of the base 70, and from the distal end portion of the arm portion 74 so as to contact the outer peripheral surface of the protrusion 64. A contact piece 76 extending in an arc shape in the short axis direction of the opening 68 is provided inside the arm portion 74.
[0048]
However, each contact portion 72 may simply extend spirally from the base 70 into the opening 68. Each protrusion 64 only needs to have an appropriate shape such as a pyramid, a cone, or a hemisphere.
[0049]
The contact piece 62 and the recess 66 may be formed on the second connection portion 26, and the protrusion 64 may be formed on the lower surface of the first connection portion 22. Regardless of which the contact piece 62 and the recess 66 are provided, the wiring portions 24 and 30 are at least portions extending from the corresponding first and second connection portions 22 and 26 in the thickness direction of the substrates 14 and 16, respectively. It is a cylindrical shape.
[0050]
In the connecting device 60, the contact piece 62 and the protrusion 64 are configured such that the section 76 of the contact portion 72 is pressed by the protrusion 64, and the contact portion 72 is elastically deformed. The displacement of the mounting substrate 16 is absorbed when the height of the needle tip is adjusted.
[0051]
Since the contact piece 62 itself is planar, it can be easily manufactured together with the second contact portion 26 by using, for example, a plating technique or an etching technique using an appropriate mask such as a photoresist mask. Can do.
[0052]
The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention. For example, instead of using a plate-like blade-type probe, a needle-type probe may be used.
[Brief description of the drawings]
FIG. 1 is a front view showing an embodiment of an electrical connection device according to the present invention.
FIG. 2 is a plan view of the electrical connection device shown in FIG.
FIG. 3 is a bottom view of the electrical connection device shown in FIG. 1;
4 is an enlarged vertical sectional view of a part of the electrical connection device shown in FIG. 1;
FIG. 5 is a plan view of a portion shown in FIG. 4;
6 is a view showing another embodiment of the electrical connection device according to the present invention, and is an enlarged vertical sectional view similar to FIG. 4. FIG.
7 is a view showing still another embodiment of the electrical connecting device according to the present invention, and is an enlarged vertical sectional view similar to FIG. 4. FIG.
8 is a further enlarged longitudinal sectional view of the main part of the electrical connection device shown in FIG. 7. FIG.
9 is a plan view showing an embodiment of a contact piece used in the electrical connection device shown in FIG. 7. FIG.
[Explanation of symbols]
10, 50, 60 Electrical connection device 12 Semiconductor wafer 14 Support substrate 16 Mounting substrate 18 Probe 20 Connector 22, 26 Connection portion 24, 30 Wiring portion 28 Probe seat 32 Mounting seat portion 34 Arm portion 36 Needle tip portion 40 Positioning pin 42 Adjustment screw 44 Screw member 52 Connection piece 54 Mounting seat portion 56 Arm portion 58 Tip portion 62 Contact piece 64 Projection 66 Recess 68 Open 70 Base 72 Contact portion 74 Arm portion 76 Section portion

Claims (8)

An electrical connection device for energization testing of a plurality of integrated circuit regions formed on a semiconductor wafer,
A support substrate having a plurality of first connection portions on the lower surface, and a plurality of second connection portions individually connected to the first connection portions on the upper surface and individually connected to the second connection portions. A plurality of mounting boards having a plurality of probe seats on the lower surface, the mounting board being attached to the lower side of the support board, and the plurality of probes individually attached to the probe seats in a cantilever shape ,
Each mounting substrate is assembled to the support substrate by a plurality of screw members that penetrate the support substrate in the thickness direction and are screwed into screw holes provided in the mounting substrate.
Each mounting board is provided with an electrical connection device for energization test, which includes the second connection portion and the probe seat in a number capable of performing an energization test of at least one integrated circuit region.   Each screw member includes an adjustment screw, and each mounting board includes the plurality of screw members, and a plurality of adjustment screws having penetrating the support board in the thickness direction and having tip portions in contact with the mounting board. The apparatus according to claim 1, wherein the apparatus is assembled to the support substrate.   2. The apparatus according to claim 1, wherein each mounting board is assembled to the supporting board by the plurality of screw members and the supporting board and an elastic body arranged between the mounting boards.   Each probe is attached to the probe seat and protrudes downward from the probe seat, an arm portion extending in a cantilever shape from the lower end portion of the attachment seat portion, and downward from the tip portion of the arm portion The apparatus of any one of Claim 1 to 3 provided with the needle-tip part which protrudes to.   5. The apparatus according to claim 1, further comprising a plurality of positioning pins that are inserted in the thickness direction of the support substrate and the mounting substrate in order to relatively position the support substrate and the mounting substrate. 6. The device described.   The device according to claim 1, wherein the first and second connection portions are electrically connected by a conductive adhesive.   The first and second connection portions are electrically connected by a plurality of connection pieces, and the connection pieces are attached to one of the first and second connection portions and are connected to the connection portions. A mounting seat that protrudes downward or upward, an arm that extends in a cantilevered manner from the lower end or upper end of the mounting seat, and a tip that protrudes downward or upward from the tip of the arm A device according to any one of claims 1 to 5.   One of the first and second connection portions includes a contact piece, the other includes a protrusion pressed against the contact piece, and the contact piece includes a plate-like base having an opening, and the base into the opening. The apparatus according to claim 1, further comprising at least one contact portion that is elastically deformable and extends to contact at least a part of an outer periphery of the protrusion.

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