KR101042725B1 - Encapsulation apparatus of exhaust hole for vacuum glass panel and encapsulation method thereof - Google Patents

Abstract

PURPOSE: A vacuum encapsulation apparatus for a vacuum glass panel, and an encapsulating method thereof are provided to improve the lifetime and the durability of the vacuum glass panel by soldering the vacuum glass panel using ultrasonic waves. CONSTITUTION: A vacuum encapsulation apparatus for a vacuum glass panel comprises the following: an ultrasonic wave iron soldering the glass panel with a vacuum cap for covering an exhaust hole of the glass panel; a body(120) supporting the ultrasonic wave iron, and supplying the transfer space for air exhausted from the exhaust hole; and an operation controller controlling the operation of the ultrasonic wave iron.

Description

Vacuum sealing device for vacuum glass panel and its sealing method {ENCAPSULATION APPARATUS OF EXHAUST HOLE FOR VACUUM GLASS PANEL AND ENCAPSULATION METHOD THEREOF}

The present invention relates to a vacuum encapsulation device for a vacuum glass panel and a method for encapsulating the same, and more particularly, to seal the exhaust hole of the vacuum glass panel under normal temperature and normal pressure by soldering using ultrasonic waves, thereby improving the life and durability of the vacuum glass panel. The present invention relates to a vacuum encapsulation device and a method for encapsulating the vacuum glass panel, which can not only improve but also reduce manufacturing costs.

In general, the vacuum glass panel is disposed opposite to each other and the frit is applied between the upper and lower glass plates spaced by the spacers, and then the frits are melted to bond the upper and lower glass plates, and formed on one side of the upper glass plate. It is manufactured through an encapsulation process of encapsulating the air inside the upper and lower glass plates bonded through the exhaust hole, and then sealing.

In this case, conventionally, a hollow connector, such as a pole, is inserted into an exhaust hole and connected to a vacuum pump to exhaust air, and when the exhaust is completed, the connector is removed, a cap is put on, and a solder is sealed by soldering using a heat iron. It became. However, this method is difficult to control the accurate soldering temperature, and the flux (flux) was used to remove the oxide layer of the soldering portion during soldering, which will cause environmental pollution due to the flux cleaning later. In addition, in the conventional method, since the exhaust process and the cap process are separated, air is introduced into the exhaust hole in the process of switching from the exhaust process to the cap process, whereby the degree of vacuum is lowered or the vacuum state is released. There is a problem that it is difficult to secure the reliability, and as time passes, the bonding force between the cap and the glass plate is gradually lowered, which leads to a decrease in durability and a shortened life of the vacuum glass panel.

On the other hand, in order to solve this conventional problem, a method of naturally forming a vacuum layer between these glass plates through a process of bonding the upper and lower glass plates in the vacuum chamber has been proposed. However, this method not only occupies a considerable amount of space, such as a vacuum chamber, but also requires expensive equipment, which leads to an increase in the manufacturing cost of the vacuum glass panel.

The present invention to solve the problems of the prior art, by sealing the exhaust hole of the vacuum glass panel at room temperature, atmospheric pressure through the soldering using ultrasonic waves, not only can improve the life and durability of the vacuum glass panel but also reduce the manufacturing cost An object of the present invention is to provide a vacuum encapsulation device for a vacuum glass panel and a method for encapsulating the same.

In order to achieve the above object, the vacuum encapsulation device of the vacuum glass panel according to the present invention, an ultrasonic iron for soldering the glass plate and the vacuum cap covering the exhaust hole of the glass plate, guides the position of the ultrasonic iron on the glass plate and the exhaust It includes a body for providing a moving space of the air discharged from the hole and discharged to the outside and a control unit for controlling the operation of the ultrasonic iron.

In the present invention, the ultrasonic soldering machine, the ultrasonic horn for soldering the glass plate and the vacuum cap with the vibration energy, the piezoelectric element for converting the electrical energy supplied to and supplied to the ultrasonic horn to the vibration energy, and delivers to the ultrasonic horn, An electrode plate connected to the ultrasonic horn in contact with the piezoelectric element and amplifying an external power source for supplying the electrical energy to the piezoelectric element may include a power amplifier for applying the electrical energy to the electrode plate.

In the present invention, the electrode plate may be interposed between the piezoelectric elements provided in pairs.

In the present invention, the piezoelectric element and the electrode plate may be formed in a ring shape and fitted to the outer circumference of the ultrasonic horn.

In the present invention, the body may be formed with at least one vacuum port connected to the external vacuum pump.

In the present invention, it may further include an undercover formed on the lower side of the body and in close contact with the glass plate to seal the inside of the body.

In the present invention, it may further include a fixing block mounted on the upper side of the body and fixed by coupling through the ultrasonic horn.

In the present invention, it may further include a metal seal coupled to the upper end of the outer periphery of the ultrasonic horn located inside the body to seal the inside of the body.

In the present invention, the body can be stretched up and down.

In the present invention, the body may be formed of a bellows type.

In the present invention, the vacuum cap may be made of galvanized or copper.

In addition, the exhaust hole sealing method of the vacuum glass panel according to the present invention, the step of applying lead-free lead around the exhaust hole formed in any one of the glass plate of the pair of glass plates facing each other and the edges bonded, the exhaust hole And disposing a vacuum cap on the lead-free lead, exhausting air between the pair of glass plates through the exhaust hole, and soldering the glass plate and the vacuum cap using ultrasonic waves.

According to the present invention, by sealing the exhaust hole of the vacuum glass panel at room temperature and atmospheric pressure through soldering using ultrasonic waves, the life and durability of the vacuum glass panel can be improved.

In addition, according to the present invention, there is no need to provide expensive equipment such as a vacuum chamber, thereby reducing the manufacturing cost.

Moreover, according to this invention, a process time can be shortened by continuing an exhaust process and a sealing process by one apparatus.

In addition, according to the present invention, since no flux is used, environmental pollution can be prevented.

Moreover, according to this invention, the sealing process for many glass plates can be progressed continuously.

1 is an exploded perspective view showing a vacuum encapsulation apparatus of a vacuum glass panel according to an embodiment of the present invention,
2 is a perspective view of the combination of FIG.
3 is a longitudinal cross-sectional view of FIG.
4 is an exemplary view showing a process of encapsulating a plurality of vacuum glass panels using a vacuum encapsulation device of a vacuum glass panel according to an embodiment of the present invention.
5 is a process flowchart showing an exhaust hole encapsulation method of a vacuum glass panel according to an exemplary embodiment of the present invention in a process order,
6A to 6C are process diagrams illustrating an exhaust hole encapsulation method of a vacuum glass panel according to an exemplary embodiment of the present invention in a process order;
7a and 7b is a view showing the exhaust hole of the vacuum glass panel according to an embodiment of the present invention,
8 is a perspective view showing various shapes of a vacuum cap according to an embodiment of the present invention,
9 is a cross-sectional view showing a vacuum glass panel manufactured according to an embodiment of the present invention.

The objects, features and advantages of the present invention will be more readily understood by reference to the accompanying drawings and the following detailed description.

Specific structural or functional descriptions are merely illustrated for the purpose of describing embodiments in accordance with the concepts of the present invention, and embodiments in accordance with the concepts of the present invention may be embodied in various forms and described in the specification or the application. It should not be construed as limited to these.

Embodiments in accordance with the concepts of the present invention can be variously modified and have a variety of forms specific embodiments will be illustrated in the drawings and described in detail in the specification or the application. However, this is not intended to limit the embodiments in accordance with the concept of the present invention to a specific disclosed form, it should be understood to include all changes, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms such as first and / or second may be used to describe various components, but the components are not limited to the terms. The terms are for the purpose of distinguishing one component from other components only, for example, without departing from the scope of the rights according to the inventive concept, the first component may be named a second component, Similarly, the second component may also be referred to as the first component.

When a component is referred to as being connected or connected to another component, it should be understood that there may be a direct connection or connection to that other component, but there may be other components in between. On the other hand, when a component is mentioned as being directly connected to or directly connected to another component, it should be understood that there is no other component in between. Other expressions for describing relationships between components, such as between and immediately between, or neighboring to and directly neighboring to, should be interpreted as well.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. The terms including or having herein are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof that is implemented, one or more other features or numbers, steps, actions, It should be understood that it does not exclude in advance the possibility of the presence or addition of components, parts or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art, and are not construed in ideal or excessively formal meanings unless expressly defined herein. Do not.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

1 to 3, the vacuum encapsulation apparatus 100 of a vacuum glass panel according to an exemplary embodiment of the present invention forms a vacuum layer V between a glass plate G and a glass plate G that face each other. , An apparatus for evacuating and sealing air between these glass plates (G) in which edges are bonded to each other, and is formed including an ultrasonic iron 110, a body 120, and a controller 130.

The ultrasonic iron 110 is an apparatus for ultrasonically soldering the glass cap G and the vacuum cap C covering the exhaust hole H formed therein. Here, the vacuum cap (C) may be made of galvanized or copper. The ultrasonic iron 110 is a device that converts electrical energy into mechanical vibration energy to solder and removes an oxide film formed on a surface of a soldering target. That is, when soldering using the ultrasonic iron 110, soldering and oxide film removal can be performed simultaneously and simply. In addition, when soldering using the ultrasonic iron 110, since it is not necessary to use the flux to remove the oxide film, it is possible to prevent the environmental pollution caused in the flux cleaning process. Here, it is preferable that a lead-free lead P in a paste state is used for soldering using the ultrasonic iron 110. The ultrasonic iron 110 according to the embodiment of the present invention is mounted on and supported by the body 120, and their coupling relationship and operation will be described in more detail below. Meanwhile, the operation of the ultrasonic iron 110 is controlled by the controller 130.

The ultrasonic iron 110 may include an ultrasonic horn 111, a piezoelectric element 112, an electrode plate 113, and a power amplifier 114.

The ultrasonic horn 111 forms an outer shape of the ultrasonic iron 110 and its cross section may be formed to have a circular shape. The ultrasonic horn 111 may be divided into a part located inside the body 120, a part mounted and coupled to the body 120, and a part connected to the piezoelectric element 112 and the electrode plate 113. Each part of the ultrasonic horn 111 may be formed by different diameters in consideration of the connection and coupling relationship with the body 120, the piezoelectric element 112, and the electrode plate 113. The ultrasonic horn 111 removes the oxide film on the surface of the lead-free lead P with vibration energy transmitted from the piezoelectric element 112 and simultaneously melts the lead-free lead P to form the glass plate G and the vacuum cap C. Will be soldered.

The piezoelectric element 112 is connected to the ultrasonic horn 111. More specifically, the piezoelectric element 112 is formed in a ring shape and fitted to the outer circumference of the ultrasonic horn 111 exposed to the outside of the body 120. Can be combined. At this time, the piezoelectric elements 112 are provided in pairs, and interposed therebetween the electrode plate 113 to receive electrical energy therefrom. The piezoelectric element 112 converts electrical energy supplied from the electrode plate 113 into vibration energy and transmits the vibration energy to the ultrasonic horn 111.

As described above, the electrode plate 113 is interposed between the pair of piezoelectric elements 112 and is connected to the ultrasonic horn 111 in a state of being in contact with them up and down. In this case, the electrode plate 113 is formed in a ring shape like the piezoelectric element 112 and may be fitted to the outer circumference of the ultrasonic horn 111. The electrode plate 113 serves as a medium for supplying electrical energy applied from the external power amplifier 114 to the piezoelectric element 112.

The power amplifier 114 is an apparatus for amplifying and outputting external power, and serves to apply the amplified electric energy to the electrode plate 113.

On the other hand, when the piezoelectric element 112 and the electrode plate 113 is coupled to the outer periphery of the ultrasonic horn 111, in order to solidify the coupling force, as shown, the image by the nut 115 and the washer 116 , The lower side may be pressurized and fixed.

Body 120 is a case for supporting the ultrasonic iron 110, it is disposed on the glass plate (G) so that the exhaust hole (H) and the vacuum cap (C) covering it. That is, the body 120 guides the position of the ultrasonic iron 110 on the glass plate G. In addition, the body 120 provides a moving space of the air exhausted from the exhaust hole (H) to be discharged to the outside, more specifically, the body 120 is around the exhaust hole (H) of the upper surface of the glass plate (G) Close to And when the body 120 is disposed on the upper surface of the glass plate (G), the exhaust hole (H) is covered by the body 120 without being exposed to the outside. Here, the exhaust hole H is a hole for discharging air between the glass plates G in which the edges were mutually bonded, and is closed and sealed by the vacuum cap C after air exhaust. That is, the body 120 serves as a passage through which the air exhausted from the exhaust hole H is discharged to the outside. When the air is discharged through the body 120 in this way, the exhaust hole H is exhausted during the exhaust process. Outside air is introduced into the) to prevent the formation of a vacuum between the glass plate (G) or to prevent a decrease in the degree of vacuum, it is possible to prevent a malfunction due to the overload of the vacuum pump 140 used for forming the vacuum. .

As described above, since the air inside the body 120 is discharged by the suction action of the vacuum pump 140, for connection with the vacuum pump 140, the body 120 has at least one vacuum port 121. Is formed. At this time, the vacuum port 121 is preferably opened only when the vacuum pump 140 operates, and closed when the vacuum pump 140 stops so that external air does not flow into the body 120.

The body 120 is formed in a hollow cylindrical shape, the top of which is open to mount the ultrasonic iron 110 and the bottom of the vacuum cap (C) in an open state so as to be exposed to the ultrasonic iron 110. Is formed. The body 120 may be connected to a moving unit (not shown), and when a moving signal is applied from the control unit 130 to the moving unit (not shown), the body 120 may be accurately positioned in the exhaust hole H of the glass plate G. Can be. In this case, the operator inputs the coordinates of the glass plate G exhaust hole H to the controller 130 in advance, thereby shortening the sealing time for one glass plate G, and greatly reducing the sealing process time during mass production. You can.

Meanwhile, although the body 120 itself may be in close contact with the glass plate G, as shown, an undercover 150 may be formed below the body 120. The undercover 150 is configured to seal the inside of the body 120, and serves to prevent the air from moving to the bottom of the body 120 during the exhaust process through the vacuum pump 140, and the undercover 150. Serves to prevent the overload of the vacuum pump 150 by ensuring the airtightness inside the body 120. And since the undercover 150 is in direct contact with the glass plate (G), it is preferable that the undercover 150 is formed of a soft material such as rubber to prevent scratches or breakage of the glass plate (G).

In addition, although the ultrasonic horn 111 and the body 120 may be directly coupled to each other, as shown, may be coupled via a fixed block 160. That is, the fixing block 160 is formed in a cylindrical shape and mounted inside the upper end of the body 120, and the center of the fixing block 160 is opened to penetrate and support the ultrasonic horn 111. The fixing block 160 serves to solidify the fastening stability between the ultrasonic horn 111 and the body 120.

In addition, the body 120 forms an undercover 150 at the lower side to secure the airtightness therein, and at the top of the outer circumference of the ultrasonic horn 111 located inside the body 120, the metal seal 170. Can be combined. That is, the body 120 may secure the airtightness inside by the under cover 150 and the metal seal 170 formed on the upper and lower sides.

On the other hand, the ultrasonic iron 110 generates a vibration during operation, the vibration is transmitted to the body 120 for supporting the ultrasonic iron 110 to move the ultrasonic iron 110 out of position or with the body 120 Leak is generated between the glass plates G so that air may flow into the body 120. Therefore, in order to prevent this, the body 120 according to the embodiment of the present invention may be formed to be stretched up and down. Through this, the body 120 absorbs the vibration generated from the ultrasonic iron 110, and serves to assist the more sophisticated soldering process. Here, the upper and lower stretch of the body 120 may be implemented in a variety of structures and materials, for example, may be formed of a bellows type.

Then, the operation of the vacuum encapsulation device of the vacuum glass panel according to the embodiment of the present invention will be described.

First, the lead-free lead P in a paste state is applied along the periphery of the exhaust hole H of the glass plate G, and then, in the state where the vacuum cap C is placed thereon, the exhaust hole H is the body 120. When the vacuum encapsulation device 100 is positioned so as to be hidden by the inside, the space between the upper and lower glass plates G having the edges joined is in communication with the inside of the body 120 through the exhaust hole H. In this state, when the vacuum port 121 of the body 120 is opened and the vacuum pump 140 is connected and pumped, the air in the space between the upper and lower glass plates G opens the exhaust hole H. Exhausted through and sucked into the vacuum pump 140 through the body 120 is discharged to the outside. At this time, in order to smoothly exhaust the air, the vacuum cap (C) and the lead-free (P) may be arranged in a predetermined spaced apart state. Then, when the operation of the vacuum pump 140 is stopped and the vacuum port 121 is closed, the space between the inside of the body 120 and the upper and lower glass plates G is evacuated. In this state, when a driving signal is applied from the control unit 130 to the ultrasonic iron 110, the ultrasonic iron 110 converts the electrical energy into mechanical vibration energy to solder the glass plate (G) and the vacuum cap (C). Conduct. In this case, the ultrasonic iron 110 performs soldering and oxide film removal at the same time. At this time, the vibration generated from the ultrasonic iron 110 may be offset by the body 120 is stretched up and down. After the soldering is completed, if the ultrasonic iron 110 is removed from the glass plate G, the sealing process for the exhaust hole H of the glass plate G is completed, whereby a vacuum layer is formed between the upper and lower glass plates G. (V) is formed and the vacuum glass panel 10 is manufactured. At this time, the vacuum layer V is held by the spacer S formed in plural in a predetermined pattern between the upper and lower glass plates G.

Here, as shown in FIG. 4, a magazine having a plurality of compartments 51 capable of independently accommodating a plurality of glass plates G, for example, the upper and lower glass plates G to be encapsulated ( 50), the vacuum encapsulation device 100 is connected to the top of the magazine 50, and each compartment 51 containing the glass plate G is lifted at regular intervals using the lift device 52. Next, the encapsulation process may be performed sequentially and continuously through the vacuum encapsulation apparatus 100. That is, such a continuous encapsulation process does not require a vacuum chamber, and the exhaust process and the encapsulation process can be carried out continuously without replacing the equipment, and the vacuum encapsulation apparatus 100 according to the embodiment of the present invention can be miniaturized.

Hereinafter, a method of encapsulating a vacuum glass panel according to an embodiment of the present invention will be described with reference to FIGS. 5 to 6C.

5 is a process flow chart showing the exhaust hole sealing method of the vacuum glass panel according to an embodiment of the present invention in a process order, Figures 6a to 6c is a process for sealing the exhaust hole of the vacuum glass panel according to an embodiment of the present invention It is a process chart shown in order.

5 to 6C, the sealing method of the vacuum glass panel according to the embodiment of the present invention, the lead-free application step (S1), vacuum cap arrangement step (S2), exhaust step (S3) and soldering step (S4) ).

First, as shown in Figure 6a, in the lead-free application step (S1) of the exhaust hole (H) formed on one side of the upper glass plate (G) of the upper and lower glass plates (G) facing each other, the edges are joined. Lead-free lead is applied around the perimeter.

Next, as shown in Figure 6b, in the vacuum cap arrangement step (S2) to arrange the vacuum cap (C) to cover the exhaust hole (H) and lead-free lead (P). At this time, the vacuum cap (C) and the lead-free lead (P) is preferably arranged to be spaced apart so that the air between the upper and lower glass plates (G) through the exhaust step (S3) that is a subsequent process smoothly. On the other hand, as shown in Figure 7a to 8, according to the shape and structure of the exhaust hole (H), the vacuum cap (C) for sealing it may be formed correspondingly. And the upper surface of the vacuum cap (C) may be parallel to the peripheral glass plate (G) after sealing or protruding than the peripheral glass plate (G), this structure is determined according to the processing form of the exhaust hole (H).

Next, as shown in Fig. 6C, in the exhaust step (S3), the air inside the upper and lower glass plates (G) is exhausted to the outside through the exhaust hole (H). Here, the exhaust hole sealing method according to an embodiment of the present invention can be implemented through the vacuum encapsulation device 100 according to an embodiment of the present invention, will be described below with reference to this. That is, in the evacuation step S3, the body 120 on which the ultrasonic iron 110 is mounted is brought into close contact with the glass plate G so that the exhaust hole H and the vacuum cap C are covered. Then, by operating the vacuum pump 140 is connected to the vacuum port 121 of the body 120, the air inside the upper and lower glass plates (G) to the exhaust hole (H), the internal space of the body 120 and Discharge to the outside through the vacuum port 121. At this time, when the vacuum pump 140 operates, the inside and the outside of the body 120 are completely blocked by the metal seal 10 and the undercover 150 which are coupled to the upper and lower sides of the body 120 to exhaust. The airtightness inside the body 120 is secured during the step S3. In this way, if the airtightness is secured while the exhausting step S3 is in progress, the overload of the vacuum pump 140 may be prevented, and even if the operation of the vacuum pump 140 is stopped, the body 120 may be up, down, and down. The vacuum of the space between the glass plates G can be maintained continuously. On the other hand, when all the air in the space between the upper and lower glass plates (G) is removed, the operation of the vacuum pump 140 is stopped and then the vacuum port 121 is closed.

Next, in the soldering step (S4) is performed to solder the glass plate (G) and the vacuum cap (C) by using ultrasonic waves. Here, the vacuum encapsulation apparatus 100 according to the embodiment of the present invention may continuously perform the exhaust step (S3) and the soldering step (S4). Accordingly, by using the vacuum encapsulation device 100, it is possible to prevent the vacuum release and the degree of vacuum degradation that can be generated during each step of device replacement. That is, in the soldering step (S4), a driving signal is applied from the controller 130 to the ultrasonic iron 110, and the ultrasonic iron 110 receiving the driving signal converts the electrical driving signal into mechanical vibration energy to obtain a glass plate G. ) And the oxide film on the surface of the lead-free lead (P) between the vacuum cap (C) and the vacuum cap (C). As such, when the ultrasonic iron 110 is used, the flux conventionally used for removing the oxide film is unnecessary, and thus, environmental pollution due to the flux cleaning can be prevented. In addition, since the position of the ultrasonic iron 110 is guided by the body 120, a more accurate and precise soldering process may be performed. As such, when the soldering step S4 through the ultrasonic waves is completed, as shown in FIG. 9, the vacuum glass panel 10 having the vacuum layer V spaced by the spacer S therein is completed. .

As described above, the present invention is a vacuum that can improve the life and durability of the vacuum glass panel 10 by sealing the exhaust hole (H) of the vacuum glass panel 10 at room temperature and atmospheric pressure through the soldering using ultrasonic waves. Provided is a vacuum encapsulation device 100 of a glass panel and a method of encapsulating the same. In addition, since the present invention does not require expensive equipment such as a vacuum chamber, manufacturing cost can be reduced, and the process time can be shortened by continuously performing the exhaust process and the sealing process in one device, and the flux can be reduced. By not using, it provides a vacuum sealing apparatus 100 and a sealing method of the vacuum glass panel that can prevent environmental pollution. In addition, the present invention provides a vacuum encapsulation device 100 and a method for encapsulating the vacuum glass panel that can significantly reduce the process time by continuously performing the encapsulation process for a plurality of glass plates (G).

As described above, with reference to the preferred embodiment of the present invention, those skilled in the art will be variously modified and modified within the scope of the present invention without departing from the spirit and scope of the present invention described in the claims below. It will be appreciated that it can be changed.

100: vacuum encapsulation device 110: ultrasonic iron
111: ultrasonic horn 112: piezoelectric element
113: electrode plate 114: power amplifier
115: nut 116: washer
120: body 121: vacuum port
122: O-ring 123: fixing member
130: control unit 140: vacuum pump
150: undercover 160: fixed block
170: metal seal 180: heater
181: power supply line G: glass plate
H: exhaust hole C: vacuum cap
P: Lead free V: Vacuum layer
S: spacer 50: magazine
51: compartment 52: lift device
10: vacuum glass panel

Claims (15)

An ultrasonic iron for soldering a glass cap and a vacuum cap covering the exhaust hole of the glass sheet,
A body supporting the ultrasonic iron on the glass plate and providing a moving space of air exhausted from the exhaust hole and discharged to the outside;
An operation control unit controlling an operation of the ultrasonic iron
Vacuum sealing device of the vacuum glass panel comprising a.
The method of claim 1,
The ultrasonic iron is,
Ultrasonic horn for soldering the glass plate and the vacuum cap with vibration energy,
At least one piezoelectric element connected to the ultrasonic horn and converted into electrical vibration energy to be transmitted to the ultrasonic horn;
An electrode plate connected to the ultrasonic horn in contact with the piezoelectric element and supplying the electrical energy to the piezoelectric element
Vacuum sealing apparatus of the vacuum glass panel comprising a.
The method of claim 2,
The operation control unit is a vacuum encapsulation device of a vacuum glass panel including a power amplifier for amplifying an external power to apply the electrical energy to the electrode plate.
The method of claim 2,
The electrode plate is in close contact with the upper and lower sides of the piezoelectric element, respectively, the upper and lower electrodes of the vacuum encapsulation device of the vacuum glass panel are opposite to each other.
The method according to any one of claims 2 to 4,
The piezoelectric element and the electrode plate is formed in a ring shape vacuum sealing apparatus of the vacuum glass panel which is fitted to the outer periphery of the ultrasonic horn.
The method of claim 1,
And at least one vacuum port connected to an external vacuum pump is formed on the body.
The method of claim 1,
The ultrasonic soldering machine, the vacuum encapsulation device of the vacuum glass panel further comprises a heater disposed on the outer peripheral side of the ultrasonic horn.
The method of claim 7, wherein
A vacuum encapsulation device of the vacuum glass panel formed on the lower side of the body and in close contact with the glass plate to seal the inside of the body and guide the heater.
The method of claim 8,
The vacuum encapsulation device of the vacuum glass panel to which the power line flowing through the under cover is connected to the heater.
The method of claim 2,
Mounted on the upper side of the body and the vacuum sealing apparatus of the vacuum glass panel further comprising a fixing block for fixing by penetrating the ultrasonic horn.
The method of claim 2,
And a metal seal coupled to an outermost periphery of the ultrasonic horn positioned inside the body to seal the inside of the body.
The method of claim 1,
The body is a vacuum sealing device of the vacuum glass panel is stretched up and down.
The method of claim 12,
The body is a vacuum sealing apparatus of the vacuum glass panel is formed of bellows type.
The method of claim 1,
The vacuum cap is a vacuum encapsulation device of a vacuum glass panel made of galvanized or copper.
Applying lead-free lead around an exhaust hole formed in one of the pair of glass plates opposed to each other and edge-joined,
Disposing a vacuum cap on the exhaust hole and the lead-free lead,
Exhausting air between the pair of glass plates through the exhaust hole; and
Soldering the glass plate and the vacuum cap using ultrasonic waves
Exhaust hole sealing method of a vacuum glass panel comprising a.

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