KR101033987B1 - Method of repairing semiconductor device - Google Patents
Method of repairing semiconductor device Download PDFInfo
- Publication number
- KR101033987B1 KR101033987B1 KR1020080097129A KR20080097129A KR101033987B1 KR 101033987 B1 KR101033987 B1 KR 101033987B1 KR 1020080097129 A KR1020080097129 A KR 1020080097129A KR 20080097129 A KR20080097129 A KR 20080097129A KR 101033987 B1 KR101033987 B1 KR 101033987B1
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- South Korea
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- fuse
- conductive layer
- abandoned
- semiconductor device
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Abstract
The present invention relates to a repair method of a semiconductor device, and to form a central portion of the fuse in a spaced apart state, and to damage the neighboring fuse by electrically connecting to the fuse corresponding to the normal cell or the defective cell by using a conductive layer. Disclosed is a technique capable of preventing the residue from remaining.
Repair, Fuse
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a repair method for a semiconductor device, and more particularly, to a repair method for a semiconductor device using a fuse.
In general, in the manufacture of a semiconductor device, especially a memory device, if any one of a number of fine cells is defective, the semiconductor device does not function as a memory and thus is treated as a defective product.
However, even though only a few cells in the memory have failed, discarding the entire device as defective is an inefficient method of processing in terms of yield.
Therefore, the current yield is improved by replacing a defective cell in which a defect has occurred by using a redundancy cell previously installed in the memory device.
A repair method using a spare cell typically includes a defective cell in which defects are generated by preliminarily providing a spare word line provided to replace a normal word line and a spare bit line provided to replace a normal bit line for each cell array. The normal word line or the normal bit line is replaced with a spare word line or a spare bit line.
In detail, when a defect cell is selected through a test after wafer processing is completed, a program is executed in an internal circuit to replace an address corresponding to the defective cell with an address of a spare cell. Therefore, when the address signal corresponding to the defective cell is input in actual use, the data of the spare cell replaced in correspondence with the defective cell is accessed.
The most widely used method as described above is to blow a fuse with a laser beam to blow, thereby replacing a path of an address. Therefore, a conventional memory device includes a fuse unit capable of replacing an address path by irradiating a laser with a fuse to blow the laser. Here, the wiring broken by the laser irradiation is called a fuse, and the broken part and the surrounding area are called a fuse box.
The fuse part includes a plurality of fuse sets, and one fuse set may replace one address path. The number of fuse sets provided in the fuse unit is determined corresponding to the number of spare word lines or spare bit lines included in the memory device.
1 is a view showing a method for manufacturing a semiconductor device according to the prior art, (a) is a plan view, (b) and (c) is a cross-sectional view taken along the line AA 'of (a). Here, (b) shows a state before cutting the fuse, and (c) shows a state where the fuse corresponding to the defective cell is cut.
Referring to FIG. 1, a first
Next, a second
Subsequently, a
Then, a blowing process is performed to irradiate a laser to the
2 is a photograph showing a problem of a method of manufacturing a semiconductor device according to the prior art.
Referring to FIG. 2, when the
In addition to these problems, when the
In addition, as the
The present invention has the following object.
First, by forming the center portion of the fuse spaced apart, and electrically connected to the fuse corresponding to the normal cell or the defective cell by using a conductive layer to prevent damage to the neighboring fuses or to leave the residue. The purpose is.
Second, by contacting the fuse by depositing the same material as the barrier metal layer of the fuse to minimize the contact resistance, it is possible to prevent the spiking of the junction between silicon and aluminum during the subsequent package process.
Third, there is no need for an additional etching process to make the thickness of the fuse thin, which simplifies the process and prevents the oxidation of the fuse.
Fourth, the repair process can be performed irrespective of the state of the chip in the wafer, and thus the reliability of the process can be improved.
Fifth, the conductive layer deposition process for connecting the fuse is deposited in a desired area by using a nozzle, so that a separate mask process is not required, and thus the process can be simplified.
Repairing method of a semiconductor device according to the invention is formed in the form of a line on the semiconductor substrate, forming a fuse having a spaced portion; And selectively depositing a conductive layer on the spaced portion.
Here, the spacing is located in the center of the fuse, the spacing is located in a zigzag and the spacing of the adjacent fuse, the conductive layer is deposited on the spacing of the fuse corresponding to the normal cell or defective cell And the conductive layer is formed of any one selected from the group consisting of TiN, TiW, and TiAlN, and the conductive layer is formed of WN.
The conductive layer is formed to a thickness of 100 ~ 500Å, the conductive layer deposition process is performed using a nozzle, the conductive layer deposition process is performed using a connection ion beam device, the fuse forming step Thereafter, the method may further include forming a guard ring structure exposing the fuse.
The present invention provides the following effects.
First, by forming the center portion of the fuse in a spaced apart state, and electrically connected to the fuse corresponding to the normal cell or the defective cell by using a conductive layer to damage the neighboring fuse or to prevent the phenomenon that remains. Provide effect.
Second, by contacting the fuse by depositing the same material as the barrier metal layer of the fuse to minimize the contact resistance, it provides an effect to prevent the junction spiking between silicon and aluminum in the subsequent package process.
Third, no additional etching process is required to make the fuse thinner, which simplifies the process and provides an effect of preventing the oxidation of the fuse.
Fourth, the repair process can be performed regardless of the state of the chip in the wafer, thereby providing an effect of improving the process reliability.
Fifth, the conductive layer deposition process for connecting the fuse is deposited in a desired area by using a nozzle, thereby providing an effect of simplifying the process by eliminating a separate mask process.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
3 is a view showing a method of manufacturing a semiconductor device according to the present invention, (a) is a plan view, (b) and (c) is a cross-sectional view taken along the cut line D-D 'of (a). Here, (b) shows a state before cutting the fuse, and (c) shows a state where the fuse corresponding to the defective cell is cut.
Referring to FIG. 3, a first
In addition, the
Next, a second
Subsequently, a
Next, the
In addition, the
As described above, the present invention is to cut the
It will be apparent to those skilled in the art that various modifications, additions, and substitutions are possible, and that various modifications, additions and substitutions are possible, within the spirit and scope of the appended claims. As shown in Fig.
1 is a view showing a method for manufacturing a semiconductor device according to the prior art.
Figure 2 is a photograph showing a problem of the manufacturing method of a semiconductor device according to the prior art.
3 is a view showing a method of manufacturing a semiconductor device according to the present invention.
4 is a diagram illustrating a method of manufacturing a semiconductor device in accordance with another embodiment of the present invention.
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080097129A KR101033987B1 (en) | 2008-10-02 | 2008-10-02 | Method of repairing semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080097129A KR101033987B1 (en) | 2008-10-02 | 2008-10-02 | Method of repairing semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100037826A KR20100037826A (en) | 2010-04-12 |
KR101033987B1 true KR101033987B1 (en) | 2011-05-11 |
Family
ID=42214884
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080097129A KR101033987B1 (en) | 2008-10-02 | 2008-10-02 | Method of repairing semiconductor device |
Country Status (1)
Country | Link |
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KR (1) | KR101033987B1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0179283B1 (en) * | 1996-07-31 | 1999-04-15 | 문정환 | Semiconductor device and manufacture thereof |
KR100618891B1 (en) * | 2005-04-08 | 2006-09-01 | 삼성전자주식회사 | Semiconductor apparatus having patterns for protecting fuses |
KR100703983B1 (en) * | 2006-02-07 | 2007-04-09 | 삼성전자주식회사 | Semiconductor device and method for fabricating the same |
-
2008
- 2008-10-02 KR KR1020080097129A patent/KR101033987B1/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0179283B1 (en) * | 1996-07-31 | 1999-04-15 | 문정환 | Semiconductor device and manufacture thereof |
KR100618891B1 (en) * | 2005-04-08 | 2006-09-01 | 삼성전자주식회사 | Semiconductor apparatus having patterns for protecting fuses |
KR100703983B1 (en) * | 2006-02-07 | 2007-04-09 | 삼성전자주식회사 | Semiconductor device and method for fabricating the same |
Also Published As
Publication number | Publication date |
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KR20100037826A (en) | 2010-04-12 |
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J201 | Request for trial against refusal decision | ||
B701 | Decision to grant | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |