KR101027130B1 - 엘이디 패키지 - Google Patents
엘이디 패키지 Download PDFInfo
- Publication number
- KR101027130B1 KR101027130B1 KR1020080056863A KR20080056863A KR101027130B1 KR 101027130 B1 KR101027130 B1 KR 101027130B1 KR 1020080056863 A KR1020080056863 A KR 1020080056863A KR 20080056863 A KR20080056863 A KR 20080056863A KR 101027130 B1 KR101027130 B1 KR 101027130B1
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- South Korea
- Prior art keywords
- epoxy resin
- light emitting
- emitting device
- led package
- pigment
- Prior art date
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- 239000003822 epoxy resin Substances 0.000 claims abstract description 47
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 47
- 239000001023 inorganic pigment Substances 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 11
- 239000010703 silicon Substances 0.000 claims abstract description 11
- -1 polytetrafluoroethylene Polymers 0.000 claims description 49
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 46
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 46
- 239000000919 ceramic Substances 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 41
- 239000000049 pigment Substances 0.000 claims description 41
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 25
- 229920001296 polysiloxane Polymers 0.000 claims description 25
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 21
- 229920002050 silicone resin Polymers 0.000 claims description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 229910019589 Cr—Fe Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 239000011572 manganese Substances 0.000 claims description 4
- 241000692870 Inachis io Species 0.000 claims description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 3
- WGLNLIPRLXSIEL-UHFFFAOYSA-N [Sn].[Cr] Chemical compound [Sn].[Cr] WGLNLIPRLXSIEL-UHFFFAOYSA-N 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 241000972773 Aulopiformes Species 0.000 claims description 2
- 235000019515 salmon Nutrition 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 11
- 239000002184 metal Substances 0.000 abstract description 11
- 238000007747 plating Methods 0.000 abstract description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 51
- 239000011787 zinc oxide Substances 0.000 description 25
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 230000031700 light absorption Effects 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 229910052596 spinel Inorganic materials 0.000 description 4
- 239000011029 spinel Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 229910006404 SnO 2 Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011344 liquid material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- KHJHBFLMOSTPIC-UHFFFAOYSA-N prop-2-enylidenechromium Chemical compound C(=C)C=[Cr] KHJHBFLMOSTPIC-UHFFFAOYSA-N 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 1
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 241000083869 Polyommatus dorylas Species 0.000 description 1
- 229910006501 ZrSiO Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000001055 blue pigment Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- OBWXQDHWLMJOOD-UHFFFAOYSA-H cobalt(2+);dicarbonate;dihydroxide;hydrate Chemical compound O.[OH-].[OH-].[Co+2].[Co+2].[Co+2].[O-]C([O-])=O.[O-]C([O-])=O OBWXQDHWLMJOOD-UHFFFAOYSA-H 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(II) oxide Inorganic materials [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000006103 coloring component Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000001056 green pigment Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000001054 red pigment Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- YXZRCLVVNRLPTP-UHFFFAOYSA-J turquoise blue Chemical compound [Na+].[Na+].[Na+].[Na+].[Cu+2].NC1=NC(Cl)=NC(NC=2C=C(NS(=O)(=O)C3=CC=4C(=C5NC=4NC=4[N-]C(=C6C=CC(=CC6=4)S([O-])(=O)=O)NC=4NC(=C6C=C(C=CC6=4)S([O-])(=O)=O)NC=4[N-]C(=C6C=CC(=CC6=4)S([O-])(=O)=O)N5)C=C3)C(=CC=2)S([O-])(=O)=O)=N1 YXZRCLVVNRLPTP-UHFFFAOYSA-J 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
재료 |
함량 |
Titanium dioxide, Zinc Oxide, Lithopone(BaSO2 + ZnS) ZnS, BaSO4, SiO2, PTFE(폴리테트라플루오르에틸렌) |
5 ~ 60중량% |
실리콘 수지(Resin) |
5 ~ 30중량% |
솔벤트 등과 같은 첨가제, 에폭시 수지 등 |
20 ~ 65중량% |
Claims (16)
- 발광소자가 실장되는 영역이 형성된 캐비티를 갖춘 기판; 및상기 캐비티의 내측벽 및 저면을 덮도록 상기 캐비티에 형성되되, 상기 발광소자가 실장되는 영역을 제외한 부분에 형성된 반사층을 포함하고,상기 반사층은 상기 발광소자의 출광색에 부합되는 색상을 지닌 무기 안료 및 실리콘 에폭시 수지를 포함한 것을 특징으로 하는 엘이디 패키지.
- 청구항 1에 있어서,상기 반사층은 내향되게 라운드진 것을 특징으로 하는 엘이디 패키지.
- 발광소자가 실장되는 영역이 형성된 캐비티를 갖춘 기판; 및상기 캐비티의 저면을 덮도록 상기 캐비티에 형성되되, 상기 발광소자가 실장되는 영역을 제외한 부분에 형성된 반사층을 포함하고,상기 반사층은 상기 발광소자의 출광색에 부합되는 색상을 지닌 무기 안료 및 실리콘 에폭시 수지를 포함한 것을 특징으로 하는 엘이디 패키지.
- 청구항 3에 있어서,상기 반사층은 평탄하게 형성된 것을 특징으로 하는 엘이디 패키지.
- 청구항 1 또는 청구항 3에 있어서,상기 발광소자의 출광색이 적색인 경우,상기 무기 안료는 적색 계열의 세라믹 안료이고,상기 실리콘 에폭시 수지는 TiO2, ZnO, 리소폰(Lithopone), ZnS, BaSO4, SiO2, PTFE(폴리테트라플루오르에틸렌)중에서 적어도 하나를 포함하는 것을 특징으로 하는 엘이디 패키지.
- 청구항 1 또는 청구항 3에 있어서,상기 발광소자의 출광색이 적색인 경우,상기 무기 안료는 적색 계열의 세라믹 안료이고,상기 실리콘 에폭시 수지는 TiO2, ZnO, 리소폰(Lithopone), ZnS, BaSO4, SiO2, PTFE(폴리테트라플루오르에틸렌)중에서 적어도 하나를 주재료로 포함하되 상기 주재료를 5 ~ 60wt%으로 첨가한 것을 특징으로 하는 엘이디 패키지.
- 청구항 6에 있어서,상기 실리콘 에폭시 수지는 실리콘 수지를 상기 실리콘 에폭시 수지 전체 중 5 ~ 30wt%로 하고 에폭시 수지를 상기 실리콘 에폭시 수지 전체 중 20 ~ 65wt%로 한 부재료를 상기 주재료와 함께 사용한 것을 특징으로 하는 엘이디 패키지.
- 청구항 1 또는 청구항 3에 있어서,상기 발광소자의 출광색이 녹색인 경우,상기 무기 안료는 녹색 계열의 세라믹 안료이고,상기 실리콘 에폭시 수지는 TiO2, ZnO, 리소폰(Lithopone), ZnS, BaSO4, SiO2, PTFE(폴리테트라플루오르에틸렌)중에서 적어도 하나를 포함하는 것을 특징으로 하는 엘이디 패키지.
- 청구항 1 또는 청구항 3에 있어서,상기 발광소자의 출광색이 녹색인 경우,상기 무기 안료는 녹색 계열의 세라믹 안료이고,상기 실리콘 에폭시 수지는 TiO2, ZnO, 리소폰(Lithopone), ZnS, BaSO4, SiO2, PTFE(폴리테트라플루오르에틸렌)중에서 적어도 하나를 주재료로 포함하되 상기 주재료를 5 ~ 60wt%으로 첨가한 것을 특징으로 하는 엘이디 패키지.
- 청구항 9에 있어서,상기 실리콘 에폭시 수지는 실리콘 수지를 상기 실리콘 에폭시 수지 전체 중 5 ~ 30wt%로 하고 에폭시 수지를 상기 실리콘 에폭시 수지 전체 중 20 ~ 65wt%로 한 부재료를 상기 주재료와 함께 사용한 것을 특징으로 하는 엘이디 패키지.
- 청구항 1 또는 청구항 3에 있어서,상기 발광소자의 출광색이 청색인 경우,상기 무기 안료는 청색 계열의 세라믹 안료이고,상기 실리콘 에폭시 수지는 TiO2, ZnO, 리소폰(Lithopone), ZnS, BaSO4, SiO2, PTFE(폴리테트라플루오르에틸렌)중에서 적어도 하나를 포함하는 것을 특징으로 하는 엘이디 패키지.
- 청구항 1 또는 청구항 3에 있어서,상기 발광소자의 출광색이 청색인 경우,상기 무기 안료는 청색 계열의 세라믹 안료이고,상기 실리콘 에폭시 수지는 TiO2, ZnO, 리소폰(Lithopone), ZnS, BaSO4, SiO2, PTFE(폴리테트라플루오르에틸렌)중에서 적어도 하나를 주재료로 포함하되 상기 주재료를 5 ~ 60wt%으로 첨가한 것을 특징으로 하는 엘이디 패키지.
- 청구항 12에 있어서,상기 실리콘 에폭시 수지는 실리콘 수지를 상기 실리콘 에폭시 수지 전체 중 5 ~ 30wt%로 하고 에폭시 수지를 상기 실리콘 에폭시 수지 전체 중 20 ~ 65wt%로 한 부재료를 상기 주재료와 함께 사용한 것을 특징으로 하는 엘이디 패키지.
- 청구항 1 또는 청구항 3에 있어서,상기 발광소자의 출광색이 적색인 경우,상기 무기 안료는 적색 계열의 세라믹 안료이고,상기 적색 계열의 세라믹 안료는 Zn-Al-Cr-Fe계, 망간 핑크, 크롬-알루미나 핑크, 크롬-주석 핑크, 새먼 핑크, 크롬-주석 라이락, 파이어 레드 중에서 어느 하나인 것을 특징으로 하는 엘이디 패키지.
- 청구항 1 또는 청구항 3에 있어서,상기 발광소자의 출광색이 녹색인 경우,상기 무기 안료는 녹색 계열의 세라믹 안료이고,상기 녹색 계열의 세라믹 안료는 피콕, 빅토리아 그린, 크롬-알루미나 그린 중에서 어느 하나인 것을 특징으로 하는 엘이디 패키지.
- 청구항 1 또는 청구항 3에 있어서,상기 발광소자의 출광색이 청색인 경우,상기 무기 안료는 청색 계열의 세라믹 안료이고,상기 청색 계열의 세라믹 안료는 코발트 블루, Co-Zn-Si계, 터키 청색 중에서 어느 하나인 것을 특징으로 하는 엘이디 패키지.
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