KR101025769B1 - CMOS image senser connected to flexible circuit board and the method for connecting them - Google Patents

Abstract

The present invention provides a CMOS image sensor module having a first housing, a second housing corresponding to the first housing, and a circuit board positioned between the first housing and the second housing. At least one of an opposing surface of the first housing opposing the second housing and an opposing surface of the second housing opposing the first housing, wherein the first housing and the second housing are coupled to each other; The circuit board is exposed to the outside at least a portion of the opposite surface provides a CMOS image sensor module, characterized in that the connecting means for connecting the circuit board and the external flexible circuit board (flexible circuit board) is formed.

Description

 CMOS image senser connected to flexible circuit board and the method for connecting them}

1 is a cross-sectional view of a CMOS image sensor module connected to the flexible circuit board according to the prior art,

2 (FIGS. 2A and 2B) are cross-sectional views of a CMOS image sensor module according to an embodiment of the present invention.

3 (FIG. 3A and FIG. 3B) are cross-sectional views of a CMOS image sensor module to which a flexible circuit board according to an embodiment of the present invention is connected.

4 (FIGS. 4A to 4D) are cross-sectional views illustrating a method of connecting a flexible circuit board to the CMOS image sensor module of FIG. 2A.

5 (FIGS. 5A to 5D) are cross-sectional views illustrating a method of connecting a flexible circuit board to the CMOS image sensor module of FIG. 2B.

Explanation of symbols on the main parts of the drawings

20: CMOS image sensor module 21: the first housing

22: second housing 23: CMOS image sensor

24: circuit board 25: flexible circuit board

The present invention relates to a CMOS image senser module, and more particularly, to a CMOS image sensor module to which a flexible circuit board is connected, and a connection method thereof.

An image sensor is a semiconductor device that converts an optical image into an electrical signal. Among them, a charged coupled device (CCD) is a charge in which individual metal-oxide-silicon (MOS) capacitors are in close proximity to each other. The carrier is a device that is stored and transported in a capacitor, and the CMOS image sensor uses CMOS technology that uses a control circuit and a signal processing circuit as a peripheral circuit to make as many MOS transistors as the number of pixels, and uses this to detect an output sequentially. A device employing a switching system. The charge coupling device has a complicated driving method, high power consumption, and a large number of mask processes, which makes the charge processing device difficult to implement in a charge coupling device chip. However, the CMOS image sensor is very advantageous for personal portable electronic devices such as mobile phones and laptops because of its simple process and very low power consumption.

1 shows a CMOS image sensor module 10 for a digital camera according to the prior art. In the CMOS image sensor module 10, a circuit board 14 is inserted between the first housing 11 and the second housing 12. One side of the circuit board 14 extends to the outside of the first housing, and the first housing covers the circuit board 14 extending to allow the circuit board 14 to be seated on the first housing. On the circuit board 14 located in the inner space formed by the first housing 11 and the second housing 12, a CMOS image sensor 13 that receives light from a lens (not shown) is positioned. Light is converted into an electrical signal by the CMOS image sensor 13.

The CMOS image sensor module 10 exchanges power or a signal with an external circuit board (not shown) or an electronic device (not shown). Since the device in which the CMOS image sensor module 10 is mainly installed is a portable electronic device, a thin space Connection is possible using a flexible circuit board 15 that can be installed on the floor and has a high flexibility. Structural connection of the flexible printed circuit board 15 and the circuit board 14 is performed by coating an anisotropic conductive film 16 on one side of the flexible printed circuit board 15 as shown in FIG. After bonding to the part of the flexible circuit board 15 which the anisotropic conductive film 16 was apply | coated to the part extended to the outside of the board | substrate 14, it apply | coats and hardens an adhesive on the upper part. The structural connection between the flexible circuit board 15 and the circuit board 14 causes the contact portion to be separated because the anisotropic conductive film 16 itself is inferior in adhesive force. Therefore, there is a possibility that a problem occurs in the stable electrical signal transmission.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a means and a connection method for stably connecting a flexible circuit board to the CMOS image sensor module.

In order to achieve the above object and other objects, the present invention provides a first housing, a second housing corresponding to the first housing, and a circuit board positioned between the first housing and the second housing. A CMOS image sensor module comprising: a portion in which the first housing and the second housing are coupled with the circuit board interposed therebetween, the opposing surface of the first housing facing the second housing and the first housing; At least a portion of at least one opposing surface of the opposing surface of the second housing opposite to is provided with a connecting means for exposing the circuit board to the outside to connect the circuit board with an external flexible circuit board. It provides a CMOS image sensor module, characterized in that.

Preferably, the connecting means may form a step on a portion of the opposing surface of the second housing that faces the first housing.

Preferably, the connecting means may form a step on a portion of the opposing surface of the first housing that faces the second housing.

Preferably, the portable electronic device may include the CMOS image sensor module.

Further, according to another aspect of the present invention, in the method for connecting the flexible circuit board to the CMOS image sensor module, preparing a circuit board, preparing a flexible circuit board, one side of the flexible circuit board and the circuit board Bonding using an anisotropic conductive film, applying an adhesive between the connecting means and the flexible circuit board, curing the adhesive, connecting the circuit board and the flexible circuit board. Connecting a flexible circuit board to the CMOS image sensor module, the method comprising the steps of preparing a first housing and a second housing formed on opposite surfaces to which the means are coupled, and coupling the first housing to the second housing. Provide a way to.

Preferably, in the method of connecting the flexible circuit board to the CMOS image sensor module, the connecting means is the second housing of the second housing facing the first housing so that the circuit board is exposed to the outside and can be connected to the flexible circuit board It may be to form a step on a portion of the opposing surface.

Preferably, in the method for connecting the flexible circuit board to the CMOS image sensor module, the connecting means is connected to the second housing so that the circuit board is exposed to the outside and connected to the flexible circuit board. It may be to form a step on a portion of the opposing surface.

Preferably, in the method of connecting the flexible circuit board to the CMOS image sensor module, the adhesive may be a thermosetting resin.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2A, a cross-sectional view of a CMOS image sensor module 20 for a digital camera having a CMOS image sensor according to an exemplary embodiment of the present invention is shown. In the CMOS image sensor module 20, a circuit board 24 is inserted between the first housing 21 and the second housing 22 corresponding to the first housing. On the circuit board 24 located in the inner space formed by the first housing 21 and the second housing 22, a CMOS image sensor 23 that receives light from a lens (not shown) is positioned. Light is converted into an electrical signal by the CMOS image sensor 23.

In a portion where the first housing 21 and the second housing 22 face each other, a connection means 28 for exchanging power or a signal with an external circuit board (not shown) or an electronic device (not shown) is provided in the second housing ( 22). As shown in FIG. 2A, the connecting means may form a space by placing a step 28 in a part of the second housing 22 opposite to the first housing 21 to expose the circuit board 24 to the outside. With this structure, a flexible circuit board (not shown) may be used to exchange power or signals with an external circuit board through a portion of the exposed circuit board 24.

2B illustrates a cross-sectional view of a CMOS image sensor module 20 for a digital camera having a CMOS image sensor in accordance with another preferred embodiment of the present invention. In the CMOS image sensor module 20, a circuit board 24 is inserted between the first housing 21 and the second housing 22 corresponding to the first housing. The CMOS image sensor 23 is positioned on the circuit board 24 located in the inner space formed by the first housing 21 and the second housing 22.

As shown in the drawing, a step 28 is formed in a part of the first housing 21 opposite to the second housing 22 to form a space to expose the circuit board 24 to the outside. Through a portion of the circuit board 24, a flexible circuit board (not shown) may be used to exchange power or signals with an external circuit board.                     

3A is a cross-sectional view illustrating a state in which the CMOS image sensor module 30 and the flexible circuit board 35 on which the step 38 is formed, are connected, according to an exemplary embodiment. As illustrated, the flexible circuit board 35 is inserted into a space formed by the step 38 formed in the second housing 32 of the CMOS image sensor module 30. An anisotropic conductive film 36 is inserted between the flexible circuit board 35 and the circuit board 34 to bond the two substrates 34 and 35. An adhesive 37 is applied around the bonded flexible printed circuit board 35. The adhesive 37 is filled in the space formed by the step 38 so as to press the connecting portion of the circuit board 34 and the flexible circuit board 35 when assembling the first housing 31 and the second housing 32. Because of the effect, the probability of occurrence of contact failure is significantly reduced. Thus, a reliable connection can be established between the circuit board 34 and the flexible circuit board 35.

3B is a cross-sectional view illustrating a state in which the CMOS image sensor module 30 and the flexible circuit board 35 having the step 38 formed on the first housing 31 are connected to each other according to another exemplary embodiment of the present invention. The flexible circuit board 35 is inserted into the space formed by the step 38. An anisotropic conductive film 36 is inserted between the flexible circuit board 35 and the circuit board 34 to bond the two substrates 34 and 35. An adhesive 37 is applied around the bonded flexible printed circuit board 35. The adhesive 37 is filled in the space formed by the step 38 so as to press the connecting portion of the circuit board 34 and the flexible circuit board 35 when assembling the first housing 31 and the second housing 32. Because of the effect, the probability of occurrence of contact failure is significantly reduced. Thus, as in the embodiment of FIG. 3A, a reliable connection can be established between the circuit board 34 and the flexible circuit board 35.                     

The CMOS image sensor modules 20 and 30 may be mounted and used in various electronic devices. Preferably, the digital camera (not shown) may include the CMOS image sensor modules 20 and 30.

Hereinafter, a method of connecting the CMOS image sensor module 40 and the flexible circuit board 45 for a digital camera according to an embodiment of the present invention will be described with reference to FIGS. 4A to 4D.

The method of connecting the CMOS image sensor module 40 and the flexible circuit board 45 may include preparing a circuit board 44, preparing a flexible circuit board 45, a flexible circuit board 45, and a circuit board. Bonding the 44, applying the adhesive 47, curing the adhesive 47, and preparing and bonding the first housing 41 and the second housing 42.

The preparing of the circuit board 44 is illustrated in FIG. 4A as a step of preparing the circuit board 44 included in the CMOS image sensor module 40 connected to the flexible circuit board 45.

Bonding the flexible circuit board 45 and the circuit board 44 may include bonding the circuit board 44 and the flexible circuit board 45 using the anisotropic conductive film 46 as shown in FIG. 4B. As an example, the anisotropic conductive film 46 is inserted between the two circuit boards 44 and 45 to bond the two circuit boards 44 and 45.

In the step of applying and curing the adhesive 47, as shown in FIG. 4C, the adhesive 47 is applied to the portion where the circuit board 44 and the flexible circuit board 45 are bonded, and the adhesive 47 is applied. Curing step.

Preparing and combining the first housing 41 and the second housing 42 may include a circuit board on an opposite surface to which the first housing 41 and the second housing 42 are coupled, as shown in FIG. 4D. And preparing a first housing 41 and a second housing 42 in which the means 48 for connecting the 44 and the flexible circuit board 45 are formed. Preferably, as illustrated, a step is formed on an opposite surface of the second housing 42 opposite to the first housing 41, so that the portion where the circuit board 44 and the flexible circuit board 45 are connected is stepped 48. It is inserted into the space formed by Here, the CMOS sensor 43 is positioned inside the second housing 42. After the housings 41 and 42 are prepared, the contact area between the circuit board 44 and the flexible circuit board 45 is positioned in the space formed by the step 48, and then the circuit board 44 is placed in the center. The first housing 41 and the second housing 42 are coupled to each other. At this time, since the portion where the circuit board 44 and the flexible circuit board 45 are connected to each other is obtained, the connection between the substrates 44 and 45 is secured.

Preferably, the adhesive 47 may be a thermosetting resin capable of diversifying the application shape and increasing the compression effect.

A method of connecting the CMOS image sensor module 50 and the flexible circuit board 55 for a digital camera according to another embodiment of the present invention will be described with reference to FIGS. 5A to 5D.

The method of connecting the CMOS image sensor module 50 and the flexible circuit board 55 may include preparing the circuit board 54, preparing the flexible circuit board 55, and the flexible circuit board 55 as described above. ) And bonding the circuit board 54, applying the adhesive 57, curing the adhesive 57, preparing and combining the first housing 51 and the second housing 52. Equipped.

The preparing of the circuit board 54 is illustrated in FIG. 5A as a step of preparing the circuit board 54 included in the CMOS image sensor module 50 connected to the flexible circuit board 55. Bonding the substrate 55 and the circuit board 54 is anisotropically bonding the circuit board 54 and the flexible circuit board 55 using the anisotropic conductive film 56 as shown in FIG. 5B. The conductive film 56 is inserted between the two circuit boards 54 and 55 to bond the two circuit boards 54 and 55.

In the step of applying and curing the adhesive 57, the adhesive 57 is applied to the portion where the circuit board 54 and the flexible circuit board 55 are bonded as shown in FIG. 5C, and the adhesive 57 is applied. Curing step.

Preparing and combining the first housing 51 and the second housing 52 may include a circuit board 54 and a flexible circuit board 55 on opposite surfaces to which the first housing 51 and the second housing 52 are coupled. ) Preparing a first housing 51 and a second housing 52 in which means 58 are connected, the first of which is opposed to the second housing 52 as shown in FIG. 5D. A step 58 is formed on the opposite surface of the housing 51 so that the portion where the circuit board 54 and the flexible circuit board 55 are connected is inserted into the space formed by the step 58. Here, the CMOS sensor 53 is positioned inside the second housing 52. After the two housings 51 and 52 are prepared, the part where the circuit board 54 and the flexible circuit board 55 contact each other is placed in the space formed by the step 58, and then the circuit board 54 is centered. The first housing 51 and the second housing 52 are coupled to each other. At this time, since the portion where the circuit board 54 and the flexible circuit board 55 are connected to each other is obtained, the connection between the substrates 54 and 55 is secured.

Preferably, the adhesive 57 may be a thermosetting resin capable of diversifying the application shape and increasing the compression effect.

Like reference numerals in the drawings shown above indicate the same members.

According to the present invention as described above has the following advantages.

First, the CMOS image sensor module according to the present invention forms a connection means for connecting the flexible circuit board to the housing of the CMOS image sensor module, so that the connection part is crimped by the housing when connected to the flexible circuit board. The likelihood of occurrence is significantly reduced.

Second, when the connecting means is formed on the opposite surface of the housing stepped, it is effective because it can be formed without the need for a separate complicated manufacturing process.

Third, when the CMOS image sensor module and the flexible circuit board are connected by the present invention, as described above, the connection part has the effect of being compressed by both housings, thereby significantly reducing the possibility of contact failure.

Fourth, when the thermosetting resin is used as the adhesive when connecting the CMOS image sensor module and the flexible circuit board, the application shape of the adhesive can be diversified, and the pressurization effect is increased.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (8)

A CMOS image sensor module having a first housing, a second housing corresponding to the first housing, and a circuit board positioned between the first housing and the second housing, A portion in which the first housing and the second housing are coupled with the circuit board interposed therebetween, the opposing surface of the first housing facing the second housing and the second housing opposing the first housing. A CMOS image sensor module, characterized in that a connection means is formed on at least a portion of at least one opposing surface of the surface to connect the circuit board to the outside to connect the circuit board with an external flexible circuit board. CMOS image senser module). The CMOS image sensor module according to claim 1, wherein the connecting means has a step formed on a portion of an opposing surface of the second housing that faces the first housing. The CMOS image sensor module according to claim 1, wherein the connecting means has a step formed on a portion of an opposing surface of the first housing that faces the second housing. delete delete delete delete delete

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