JP2004221634A - Optical module, manufacturing method thereof, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical module that is small-sized and simplified. <P>SOLUTION: The optical module includes: a first board 30 on which a first wiring pattern 32 is formed; a second board 40 on which a second wiring pattern 42 is formed and placed in opposition to the first board 30; an optical chip 10 located between the first and second boards 30, 40, and including an optical part 12 and an electrode 24 electrically connected to the first wiring pattern 32; an electric connection part 60 having a projection higher than the thickness of the optical chip 10 and electrically interconnecting the first and second wiring patterns 32, 42 between the first and second boards 30, 40; and an enclosure 70 for supporting a lens 72 for collecting light to the optical part 12. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an optical module, a method for manufacturing the same, and an electronic device.
[0002]
[Prior art]
[0003]
[Patent Document 1]
Japanese Patent No. 3,207,319
BACKGROUND OF THE INVENTION
In an imaging device such as a CCD or a CMOS sensor, an optical chip and a housing are provided on a substrate. The optical chip has an optical part that allows mutual conversion of light and electrical signals. The housing is provided with a lens corresponding to the optical part.
[0005]
Conventionally, when an imaging device is mounted on a circuit board (for example, a motherboard), both are electrically connected via a flexible substrate. Since the flexible substrate is pulled out from the end of the imaging device, the planar shape is enlarged, and it is difficult to reduce the size. In addition, when a flexible substrate is used, it is necessary to provide a connector for connecting the flexible substrate, a support member for supporting the imaging device, and the like, so that the number of components and the number of processes are increased.
[0006]
An object of the present invention is to reduce the size and simplification of an optical module.
[0007]
[Means for Solving the Problems]
(1) An optical module according to the present invention includes a first substrate on which a first wiring pattern is formed, and a second substrate on which a second wiring pattern is formed and arranged to face the first substrate. An optical chip provided between the first and second substrates and including an optical part, the optical chip including an electrode electrically connected to the first wiring pattern; and the optical chip An electrical connection portion having a protrusion higher than the thickness of the first and second substrates, and electrically connecting the first and second wiring patterns between the first and second substrates;
A housing for holding a lens for condensing light on the optical portion.
According to the present invention, the electrical connection between the first and second wiring patterns is achieved by the electrical connection portion projecting between the first and second substrates. Since the first substrate on which the optical chip is mounted is opposed to the second substrate, the planar shape can be prevented from being enlarged, and the optical module can be reduced in size. In addition, since the mutual positions of the first and second substrates can be fixed by the electrical connection portion, the number of components can be omitted, and the configuration can be simplified.
(2) In this optical module, the surface of the first substrate on which the first wiring pattern is formed and the surface of the second substrate on which the second wiring pattern is formed are opposed to each other. Good.
According to this, since the surfaces of the first and second substrates on which the wiring patterns are formed face each other, it is easy to make an electrical connection between them.
(3) In this optical module, the electrical connection portion may be provided outside the optical chip mounting region of the first or second substrate.
(4) In this optical module, the optical module further includes a circuit chip provided between the first and second substrates and stacked on the optical chip, wherein the electrical connection portion includes the optical chip and the circuit chip. May have a protruding portion higher than the thickness of the laminate including According to this, high density and miniaturization can be achieved.
(5) In this optical module, the electrical connection portion is a holding portion that sandwiches an end of the first substrate, the first terminal being electrically connected to the first wiring pattern; And a second terminal electrically connected to the second wiring pattern.
(6) In this optical module, the second substrate has a through hole, a part of the second wiring pattern is provided in the through hole, and the second terminal is , May be inserted and mounted in the through hole.
According to this, downsizing and simplification can be achieved by applying the existing technology, so that the reliability is high.
(7) In this optical module, the surface of the second terminal may be opposed to the surface of the second wiring pattern, and the second terminal may be joined to the second wiring pattern. . According to this, downsizing and simplification can be achieved by applying the existing technology, so that the reliability is high.
(8) In this optical module, the electrical connection part may be a bump.
According to this, downsizing and simplification can be achieved by applying the existing technology, so that the reliability is high.
(9) In this optical module, the electrical connection section may be a stack of a plurality of bumps. According to this, the height of the bump can be easily adjusted.
(10) In this optical module, the first substrate may have light transmittance.
(11) In this optical module, the housing has an opening, an outer shape of the second substrate is larger than an outer shape of the first substrate, and the housing has the optical device in the opening. The chip and the first substrate may be attached to the second substrate while being accommodated. This can prevent, for example, unnecessary light from being incident on the optical chip and the first substrate, thereby preventing malfunction of the optical chip.
(12) An electronic device according to the present invention includes the optical module.
(13) In the method for manufacturing an optical module according to the present invention, (a) an optical chip having an optical portion and an electrode electrically connected to the optical portion may be formed by a first chip having a first wiring pattern formed thereon. Mounting on the substrate, and electrically connecting the electrode and the first wiring pattern; (b) a second wiring pattern having a second wiring pattern on a surface of the first substrate on which the optical chip is mounted; Two substrates are opposed to each other to electrically connect the first and second wiring patterns, and (c) providing a housing for holding a lens for condensing light on the optical part. In the step (b), the first and second wiring patterns are formed between the first and second substrates by an electrical connection portion including a protrusion that is thicker than the optical chip. Make an electrical connection.
According to the present invention, the electrical connection between the first and second wiring patterns is achieved by the electrical connection portion projecting between the first and second substrates. Since the first substrate on which the optical chip is mounted is opposed to the second substrate, the planar shape can be prevented from being enlarged, and the optical module can be reduced in size. Further, since the mutual positions of the first and second substrates can be fixed by the electrical connection portion, the number of components can be omitted, and the manufacturing process can be simplified.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 are diagrams illustrating an optical module according to the present embodiment and a method for manufacturing the same, and FIGS. 3 and 4 are diagrams illustrating a modification thereof. FIG. 1 is a sectional view of the optical module, and FIG. 2 is a sectional view of the optical chip. The optical module according to the present embodiment includes an optical chip 10 and first and second substrates 30 and 40.
[0009]
The outer shape of the optical chip 10 is often rectangular, but is not limited to this. As shown in FIG. 2, the optical chip 10 has an optical part 12. The optical portion 12 is a portion where light enters or exits. The optical part 12 also converts light energy and other energy (for example, electricity). That is, the optical part 12 has a plurality of energy conversion elements (light receiving elements / light emitting elements) 14. In the present embodiment, the optical part 12 is a light receiving part. In this case, the optical chip 10 is a light receiving chip (for example, an imaging chip). The plurality of energy conversion elements (light receiving elements or image sensor elements) 14 are two-dimensionally arranged so that image sensing can be performed. That is, in the present embodiment, the optical module is an image sensor (for example, a CCD or a CMOS sensor). The energy conversion element 14 is covered with a passivation film 16. The passivation film 16 has optical transparency. When the optical chip 10 is manufactured from a semiconductor substrate (for example, a semiconductor wafer), the passivation film 16 may be formed of SiO ₂ or SiN.
[0010]
The optical part 12 may have a color filter 18. The color filter 18 is formed on the passivation film 16. Further, a flattening layer 20 may be provided on the color filter 18, and a microlens array 22 may be provided thereon.
[0011]
A plurality of electrodes 24 are formed on the optical chip 10. The electrode 24 has a bump formed on the pad, but may be a pad alone. The electrode 24 is electrically connected to the optical part 12. The electrode 24 is formed outside the optical part 12. The electrodes 24 may be arranged along a plurality of sides (for example, two or four opposing sides) or one side of the optical chip 10. In the example shown in FIG. 2, the electrode 24 is formed so as to be higher than the optical portion 12.
[0012]
The first substrate 30 may be a light-transmitting substrate having at least a portion (a portion corresponding to the optical portion 12) having a light-transmitting property. The first substrate 30 may be a transparent substrate such as an optical glass substrate. The first substrate 30 may be a rigid substrate. The first substrate 30 has an outer shape larger than the optical chip 10. The outer shape of the first substrate 30 may be rectangular, for example, a shape similar to the optical chip 10. The first substrate 30 may be formed of a material that is harder than the second substrate 40.
[0013]
As a modification, the first substrate 30 may have a through hole at a position corresponding to the optical part 12. In that case, the first substrate 30 does not need to be a light transmissive substrate, and may be, for example, a substrate made of resin or the like.
[0014]
The first wiring pattern 32 is formed on the first substrate 30. As shown in FIG. 1, the first wiring pattern 32 may be formed on one surface of the first substrate 30. Alternatively, the first wiring patterns 32 may be formed on both surfaces of the first substrate 30. The first wiring pattern 32 includes a plurality of wirings. The first wiring pattern 32 may have a light-transmitting property such as, for example, ITO (Indium Tin Oxide). By doing so, the first wiring pattern 32 can be formed also above the optical part 12. Alternatively, as long as the first wiring pattern 32 is not above the optical portion 12, the first wiring pattern 32 may not have light transmittance, and may be formed of, for example, metal. The first wiring pattern 32 has a plurality of terminals (first to third terminals 33, 34, and 35) serving as electrical connection parts. The first to third terminals 33, 34, 35 may be ends of the wiring or lands. At least two of the first to third terminals 33, 34, 35 may be electrically connected to each other. On the first substrate 30, first and second terminals 33 and 34 are formed at a center portion, and third terminals 35 are formed at end portions.
[0015]
As shown in FIG. 1, an optical function film 36 may be formed on the first substrate 30. The optical function film 36 is formed at a position corresponding to the optical part 12. The optical function film 36 may be formed on the surface of the first substrate 30 (for example, the surface opposite to the first wiring pattern 32). The optical function film 36 may be an antireflection film (AR coating), an infrared shielding film (IR coating), or the like. By forming the optical function film 36 on the first substrate 30, it is not necessary to provide a device having such an optical function, so that the size of the product can be reduced.
[0016]
The second substrate 40 may be formed of any of an organic, inorganic or composite structure thereof, and may be a single layer or a multilayer. The second substrate 40 has an outer shape larger than the optical chip 10 and has an outer shape larger than the first substrate 30. Various electronic components such as an active component, a passive component, a functional component, and a connection component may be mounted on the second substrate 40 in addition to the conversion component such as the optical chip 10. Various electronic components are provided outside the housing 70.
[0017]
On the second substrate 40, a second wiring pattern 42 is formed. The second wiring pattern 42 may be formed on one surface of the second substrate 40. The second wiring pattern 42 is composed of a plurality of wirings and has a plurality of terminals serving as electrical connection parts. The terminal may be a land.
[0018]
A through hole 44 for insertion mounting is formed in the second substrate 40, and a material of the second wiring pattern 42 is formed on an inner surface of the through hole 44. Part of the second wiring pattern 42 is formed in the through hole 44. A land connected to the second wiring pattern 42 is provided on the surface of the second substrate 40 and around the through hole 44. The second wiring pattern 42 in the through hole 44 is a terminal of the second wiring pattern 42.
[0019]
The first and second substrates 30 and 40 are arranged so as to face each other. The first and second substrates 30 and 40 are arranged at intervals. The surface of the first substrate 30 on which the wiring pattern 32 is formed faces the surface of the second substrate 40 on which the second wiring pattern 42 is formed. This facilitates electrical connection between the two.
[0020]
The optical chip 10 is mounted on the first substrate 30. The optical chip 10 is provided on a surface of the first substrate 30 on which the first wiring pattern 32 is formed. When the first wiring pattern 32 is formed on both surfaces of the first substrate 30, the optical chip 10 is mounted on either surface. It is preferable that the optical chip 10 is mounted on the center of the first substrate 30. The end of the first substrate 30 protrudes outside the optical chip 10.
[0021]
The optical chip 10 is provided between the first and second substrates 30 and 40. In other words, the optical chip 10 is mounted on the surface of the first substrate 30 facing the second substrate 40. The surface of the optical chip 10 on which the optical portion 12 and the electrode 24 are formed faces the first substrate 30. In the example shown in FIG. 1, the optical part 12 is covered by the first substrate 30. Thus, dust can be prevented from adhering to the optical part 12, and the reliability of the optical module can be improved. The optical part 12 may be sealed by the first substrate 30.
[0022]
The electrode 24 and the first wiring pattern 32 (specifically, the first terminal 33) are arranged so as to overlap, and both are electrically connected. The electrical connection between the two is made by using an anisotropic conductive material 26 such as an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP) to connect the conductive particles to the electrode 24 and the first terminal 33. It may be interposed between them. In that case, the optical portion 12 is not covered with the anisotropic conductive material 26. Alternatively, the electrical connection between the two may be achieved by metal bonding using Au-Au, Au-Sn, solder, or the like. The electrical connection is preferably sealed with an underfill material. Also in this case, the optical portion 12 is not covered with the underfill material.
[0023]
As shown in FIG. 1, the optical module includes a circuit chip (semiconductor chip) 50. The circuit chip 50 is electrically connected to the optical chip 10. The circuit chip 50 may process an electric signal before and after conversion with respect to the optical chip 10 (DSP: Digital Signal Processing). As shown in FIG. 1, the circuit chip 50 is stacked on the optical chip 10. That is, the optical chip 10 and the circuit chip 50 form a stack structure. According to this, since the optical chip 10 and the circuit chip 50 can be integrated, the density and size of the product can be increased. The circuit chip 50 may be mounted on the optical chip 10 so that, for example, the surface opposite to the surface on which the electrodes 52 are formed faces the optical chip 10. The circuit chip 50 is stacked on the optical chip 10 from the side opposite to the first substrate 30. That is, the circuit chip 50 is provided between the first and second substrates 30 and 40. The electrode 52 of the circuit chip 50 is electrically connected to the first wiring pattern 32 (specifically, the second terminal 34) via a wire 54. The electrodes 52 and the wires 54 are preferably sealed with a sealing material 56 such as a resin. The sealing material 56 may seal the circuit chip 50, and may be provided by applying, for example, a potting method or a transfer molding method. The sealing material 56 is provided so as to avoid the optical part 12.
[0024]
On the first substrate 30, a laminate 58 including the optical chip 10 and the circuit chip 50 is formed. The stacked body 58 is not limited to two chips and may include three or more chips (including at least the optical chip 10). In the example shown in FIG. 1, the stacked body 58 includes the sealing material 56 on the surface, and the height of the stacked body 58 matches the height of the sealing material 56.
[0025]
The optical module includes an electrical connection unit 60 that electrically connects the first and second wiring patterns 32 and 42 (specifically, the third terminal 35 and the through hole 44). The electrical connection portion 60 is provided between the first and second substrates 30 and 40 and protrudes between them. Specifically, the electrical connection portion 60 protrudes so as to be higher than the optical chip 10 provided between the first and second substrates 30 and 40. As shown in FIG. 1, when the circuit chip 50 is provided, the electrical connection portion 60 is higher than the stacked body 58 including the optical chip 10 and the circuit chip 50 (the surface of the sealing material 58 is (To exceed).
[0026]
The electrical connection part 60 may be provided on the first substrate 30 or the second substrate 40 outside the mounting area of the optical chip 10. The electrical connection portions 60 may be provided along four sides of the optical chip 10 or may be provided along two opposing sides. A plurality of electrical connection parts 60 may be separately provided for each pair of terminals in the first and second wiring patterns 32 and 42. Alternatively, a plurality of electrical connection units 60 may be integrally supported by providing a support member (insulator) (not shown) between adjacent electrical connection units 60.
[0027]
As shown in FIG. 1, the electrical connection portion 60 includes a first terminal 62 electrically connected to the first wiring pattern 32 and a second terminal 62 electrically connected to the second wiring pattern 42. And a terminal 64. In the example shown in FIG. 1, the electrical connection unit 60 is a lead. The lead is a wide linear conductive member. The lead may be formed of a metal such as copper. A lead can be formed by punching, cutting, bending, or the like on a metal plate.
[0028]
The first terminal 62 of the electrical connection part 60 is connected to the first substrate 30 by sandwiching the end of the first substrate 30. That is, the first terminal 62 may be a connector. The first terminal 62 is a holding portion for the first substrate 30. The first terminal 62 may be detachable from the first substrate 30. Alternatively, as shown in FIG. 1, the first terminal 62 may be bonded and fixed to the first substrate 30.
[0029]
In the example shown in FIG. 1, the second terminal 64 of the electrical connection unit 60 is inserted and mounted in the through hole 44. The solder 46 may be used to join the two. Alternatively, as shown in the modification of FIG. 3, the second terminal 164 of the electrical connection unit 160 may be surface-mounted. Specifically, the surface of the second terminal 164 (the surface facing the second substrate) is disposed so as to face the surface of the second wiring pattern 42 (for example, not the through hole but the surface of the land), and the two are in surface contact. May be. In this case, it is preferable that solder is interposed between the two in order to achieve good electrical connection.
[0030]
As shown in the modification of FIG. 4, the electrical connection part 260 may be at least one bump (for example, a gold bump). The bump is a conductive protrusion and may be provided on any of the first and second substrates 30 and 40, for example, may be provided on the first substrate 30. The electrical connection section 260 may be formed by stacking a plurality of bumps. According to this, the height of the electrical connection part 260 can be easily adjusted. The plurality of bumps are stacked so as to project between the first and second substrates 30 and 40, and the bump connected to the first wiring pattern 32 becomes the first terminal 262, and the second wiring pattern 42 The bump to be connected becomes the second terminal 264. The bump may be formed by a ball bump method using a wire bonding technique. Alternatively, the bumps may be formed by applying a plating technique (whether electrolytic or electroless). According to these embodiments (the embodiments shown in FIGS. 1, 3 and 4), the electrical connection can be formed by applying the existing technology, and the reliability of the optical module can be improved.
[0031]
As shown in FIG. 1, the optical module includes a housing 70. The housing 70 may be a case of the optical chip 10. The housing 70 may be a cylindrical lens barrel. The housing 70 is preferably formed of a material that does not transmit light. The housing 70 holds the lens 72. When the housing 70 and the lens 72 are used for imaging, they can be called an imaging optical system. The lens 72 is arranged at a position corresponding to the optical part 12 of the optical chip 10. The lens 72 is for condensing light on the optical part 12.
[0032]
The housing 70 has a first portion 74 serving as a lens holder and a second portion 76 serving as a mounting portion for attaching to the second substrate 40. The lens 72 is attached to the first portion 74. A first opening 78 is formed in the first portion 74, and a lens 72 is mounted in the first opening 78. The lens 72 includes a holding structure (see FIG. 1) including a holding member that can be moved in a direction along the axis of the first opening 78 using a screw (not shown) formed inside the first portion 74. (Not shown), it may be fixed in the first opening 78. The lens 72 is held at a distance from the optical part 12 of the optical chip 10.
[0033]
A second opening 80 is formed in the second portion 76. The first and second openings 78, 80 are in communication. The second opening 80 has a larger diameter (width) than the first opening 78. Outside the first portion 74 and inside the second opening 80 of the second portion 76, first and second screws 82 and 84 are formed, by which the first and second portions are formed. 74 and 76 are connected. Thus, the first and second screws 82, 84 move the first and second portions 74, 76 in a direction along the axis of the first and second openings 78, 80. Thereby, the focus of the lens 72 can be adjusted.
[0034]
In the example illustrated in FIG. 1, the optical chip 10, the first substrate 30, and the circuit chip 50 are accommodated in the second opening 80. According to this, it is possible to prevent unnecessary light from being incident on the optical chip 10 and the first substrate 30, thereby preventing malfunction of the optical chip 10. The housing 70 may be in contact with the first substrate 30 or may be non-contact.
[0035]
The housing 70 is attached to the second substrate 40. Specifically, an end of the second opening 80 of the housing 70 is fixed to the second substrate 40. As shown in FIG. 1, the housing 70 may be bonded and fixed to the second substrate 40. As a modified example, the fixing of the housing 70 to the second substrate 40 may be performed by means detachable from the second substrate 40. This facilitates removal of the housing 70 and facilitates rework of the optical module. That is, the housing 70 can be re-set so that the optical axes of the optical chip 10 and the housing 70 coincide with each other. The detachable fixing means may be a mechanical means such as hooking or caulking. For example, a pawl (not shown) may be provided at an end of the second opening 80, and the pawl may be attached to a hole (not shown) of the second substrate 40. The pawl portions are provided at a plurality of positions along the outer periphery of the second opening 80.
[0036]
Apart from the above, electronic components (conversion components, active components, passive components, functional components, connection components, etc.) may be provided on the first substrate 30 on the side opposite to the side facing the second substrate 40. . The electronic component may be a semiconductor chip. The electronic components are provided so as to avoid the optical part 12 of the optical chip 10.
[0037]
According to the optical module according to the present embodiment, the electrical connection 60 projecting between the first and second substrates 30 and 40 allows the electrical connection of the first and second wiring patterns 32 and 42 to be made. Connection is achieved. Since the first substrate 30 on which the optical chip 10 is mounted is opposed to the second substrate 40, the planar shape can be prevented from being enlarged, and the optical module can be reduced in size. Further, since the mutual positions of the first and second substrates 30 and 40 can be fixed by the electrical connection portion 60, the number of components can be omitted, and the configuration can be simplified.
[0038]
Next, a method for manufacturing the optical module according to the present embodiment will be described. The method for manufacturing the optical module includes mounting the optical chip 10 on the first substrate 30 and electrically connecting the first and second wiring patterns 32 and 42 by the electrical connection unit 60. . The electrical connection portion 60 projects from the first substrate 30 to the second substrate 40 so as to be at least higher than the optical chip 10 (specifically, the stacked body 58).
[0039]
First, the optical chip 10 and the circuit chip 50 are mounted on the first substrate 30. In the present embodiment, the optical portion 12 of the optical chip 10 is covered by the first substrate 30. According to this, the optical portion 12 is covered with the first substrate 30 before the assembling process of the first and second substrates 30 and 40 and the housing 70, so that the optical portion 12 is early in the manufacturing process. To prevent dust from entering the optical part 12.
[0040]
The electrical connection unit 60 may be fixed to the first substrate 30. Then, the first and second substrates 30 and 40 are aligned, and the first and second wiring patterns 32 and 42 are electrically connected via the electrical connection part 60. After that, the housing 70 is attached to the second substrate 40. The lens 72 may be attached after the housing 70 is attached. Other items and effects are as described in the optical module.
[0041]
As an electronic device according to an embodiment of the present invention, a notebook personal computer 1000 shown in FIG. 5 includes a camera 1100 in which an optical module is incorporated. The digital camera 2000 shown in FIG. 6 has an optical module. Further, the mobile phone 3000 illustrated in FIGS. 7A and 7B includes a camera 3100 in which an optical module is incorporated.
[0042]
The present invention is not limited to the embodiments described above, and various modifications are possible. For example, the invention includes configurations substantially the same as the configurations described in the embodiments (for example, a configuration having the same function, method, and result, or a configuration having the same object and result). Further, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. Further, the invention includes a configuration having the same operation and effect as the configuration described in the embodiment, or a configuration capable of achieving the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating an optical module according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating an optical chip of the optical module according to the embodiment of the present invention.
FIG. 3 is a diagram illustrating an optical module according to a modification of the embodiment of the present invention.
FIG. 4 is a diagram showing an optical module according to another modification of the embodiment of the present invention.
FIG. 5 is a diagram showing an electronic apparatus according to the embodiment of the present invention.
FIG. 6 is a diagram showing an electronic apparatus according to the embodiment of the present invention.
FIGS. 7A and 7B are views showing an electronic device according to an embodiment of the present invention.
[Explanation of symbols]
10 optical chips, 12 optical parts, 24 electrodes, 30 first substrate,
32 first wiring pattern, 40 second substrate, 42 second wiring pattern,
44 through hole, 50 circuit chip, 58 laminate,
60 electrical connection, 62 first terminal, 64 second terminal, 70 housing,
72 lens, 80 second opening, 160 electrical connection,
260 Electrical connection

Claims (13)

A first substrate on which a first wiring pattern is formed;
A second substrate on which a second wiring pattern is formed and which is disposed to face the first substrate;
An optical chip provided between the first and second substrates and including an optical portion, the optical chip including an electrode electrically connected to the first wiring pattern;
An electrical connection unit having a protrusion higher than the thickness of the optical chip, and electrically connecting the first and second wiring patterns between the first and second substrates;
A housing for holding a lens for condensing light on the optical portion,
Optical module including. The optical module according to claim 1,
An optical module in which a surface of the first substrate on which the first wiring pattern is formed is opposed to a surface of the second substrate on which the second wiring pattern is formed. The optical module according to claim 1 or 2,
The optical module, wherein the electrical connection unit is provided outside the optical chip mounting area of the first or second substrate. The optical module according to any one of claims 1 to 3,
A circuit chip provided between the first and second substrates, the circuit chip being stacked on the optical chip;
The optical module, wherein the electrical connection portion has a protrusion that is thicker than a thickness of a laminate including the optical chip and the circuit chip. The optical module according to any one of claims 1 to 4,
The electrical connection portion is a holding portion that sandwiches an end of the first substrate and is electrically connected to a first terminal electrically connected to the first wiring pattern and an electrical connection to the second wiring pattern. And a second terminal connected to the optical module. The optical module according to claim 5,
The second substrate has a through hole,
A part of the second wiring pattern is provided in the through hole,
The optical module, wherein the second terminal is inserted and mounted in the through hole. The optical module according to claim 5,
A surface of the second terminal is opposed to a surface of the second wiring pattern;
An optical module, wherein the second terminal is joined to the second wiring pattern. The optical module according to any one of claims 1 to 4,
The optical module, wherein the electrical connection part is a bump. The optical module according to any one of claims 1 to 4,
The optical module, wherein the electrical connection unit is formed by stacking a plurality of bumps. The optical module according to any one of claims 1 to 9,
An optical module, wherein the first substrate has optical transparency. The optical module according to any one of claims 1 to 10,
The housing has an opening,
The outer shape of the second substrate is larger than the outer shape of the first substrate,
The optical module, wherein the housing is attached to the second substrate while the optical chip and the first substrate are accommodated in the opening. An electronic device comprising the optical module according to claim 1. (A) An optical chip having an optical part and an electrode electrically connected to the optical part is mounted on a first substrate on which a first wiring pattern is formed, and the electrode and the first wiring pattern are mounted. Electrically connecting the
(B) A second substrate having a second wiring pattern is arranged on a surface of the first substrate on which the optical chip is mounted, and the first and second wiring patterns are electrically connected. Connecting to
(C) providing a housing for holding a lens for condensing light on the optical portion;
Including
In the step (b), the first and second wiring patterns are electrically connected between the first and second substrates by an electrical connection portion including a protrusion that is thicker than the optical chip. Of manufacturing optical module.

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